KR101251796B1

KR101251796B1 - Substrate manufacturing method, substrate, and light emitting diode type lighting lamp fixture with the same

Info

Publication number: KR101251796B1
Application number: KR1020110062032A
Authority: KR
Inventors: 재 동 윤
Original assignee: 재 동 윤
Priority date: 2011-06-27
Filing date: 2011-06-27
Publication date: 2013-04-08
Also published as: KR20130001356A; WO2013002526A3; WO2013002526A2

Abstract

The present invention discloses a substrate manufacturing method, a substrate and a device for an LED type lamp having the same. The substrate manufacturing method includes the step of injecting the resin into the hopper of the extrusion molding machine to guide into the heater provided on one side of the hopper to melt the resin through the heater (S200); Extruding the molten resin to the outside through a molding part provided on one side of the heater part (S210); The extruded resin material is passed along the rollers of the roller unit in which the rollers of one roller and the rollers of the other roller rotate at different speeds to be stretched into a plate to form a plurality of small spaces in the resin. Step S220; And forming cross-links between molecular chains in the resin material by irradiating ultraviolet rays or electron beams to the resin material in the form of a plate having a plurality of pores (S230). The present invention enables the fabrication of an excellent substrate that is structurally compact and capable of performing both support, heat and reflection functions, and makes it possible to apply such an excellent substrate to an LED type lighting fixture. Therefore, the LED type lighting fixture can perform all the supporting, heat and reflection functions through the excellent substrate.

Description

SUBSTRATE MANUFACTURING METHOD, SUBSTRATE, AND LIGHT EMITTING DIODE TYPE LIGHTING LAMP FIXTURE WITH THE SAME}

The present invention relates to a method for manufacturing a substrate, a substrate and an apparatus for an LED type lighting lamp having the same, and more particularly, a method for manufacturing a substrate, a substrate, and a substrate, which are structurally simple and can perform both support, heat and reflection functions. A LED type lighting fixture is related.

In general, the lighting fixtures are installed on the ceiling, walls, etc. in the building for lighting, and the lighting fixtures are incandescent, fluorescent, or LED according to the use of the space and / or the user's preference. The same lamp is used to fit.

The incandescent lamp is inexpensive to manufacture, but generates a lot of heat in the process of converting electrical energy into light energy, the power consumption is high. The fluorescent lamp has a higher energy conversion efficiency than the incandescent lamp and thus consumes less power, but takes a long time for lighting. The LED lamp consumes less power than the incandescent lamp and has a shorter time required for lighting than the fluorescent lamp, and its use has been widely increased. In addition, the LED light can be easily obtained light that does not contain ultraviolet rays or infrared rays and is used to illuminate cultural properties or works of art sensitive to ultraviolet rays.

1 is a schematic diagram showing the overall configuration of the LED type lighting fixture according to the prior art.

As shown in FIG. 1, the LED type lighting fixture 1 according to the prior art includes a casing part 2, a substrate 3 installed in the casing part 2, and the substrate 3. A metal circuit layer 4 which is deposited on one surface of the substrate and forms an electric circuit of a predetermined pattern including a back connection part 4a, and an insulating coating for insulation on the metal circuit layer 4 other than the back connection part 4a. LEDs mounted on the layer 5, the aluminum layer 6 coated on the remaining portion of the substrate 3 except for the back connection portion 4a, and the back connection portions 4a of the metal circuit layer 4. The lamp 7 and the lamp protection case 8 is fixed to the rim of the casing part 2 by screws or the like so as to protect the LED lamps 7 from the outside.

In addition, a through hole 3a is formed in the center portion of the substrate 3 facing each back connection portion 4a, and the LED lamp 7 is formed in the other surface of the substrate 3 and the through hole 3a, respectively. The heat transfer layer 9 is coated and buried so as to discharge the generated heat to the outside. A heat dissipation member 10 having a plurality of heat emitting fins is installed on an outer surface of the heat transfer layer 9. The LED lamp 7 is mounted directly on the back connecting portion 4a of the substrate 3 or used by being attached to the back connecting portion 4a of the substrate 3 via a separate socket 11.

Therefore, the LED lamp 7 is inserted into the socket 11 provided at each of the back connection portions 4a of the substrate 3 in the casing portion 2, and the manual or automatic on / off switch (not shown) is positioned in the on state. When the power is applied to the LED lamp 7, the light generated from the LED lamp 7 can be diffused into a predetermined external space through the lamp protection case 8.

At this time, most of the light generated from the LED lamp (7) is diffused directly through the lamp protection case 8 as described above, but some of them hit the inner surface of the lamp protection case (8) and then the substrate ( After being reflected by the aluminum layer 6 of 3), it can be irradiated to the outside through the lamp protection case 8 again.

In addition, heat generated from the LED lamp 7 is embedded in the through hole 3a on the side of the back connection portion 4a of the substrate 3, and the heat transfer layer 9 coated on the other surface of the substrate 3 is provided. It is transmitted to the heat radiation member 10 through it can be discharged to the outside.

However, although the LED type lighting device 1 according to the related art configured as described above can faithfully perform the lighting function, the aluminum layer 6 and the aluminum layer 6 are disposed on one surface of the substrate 3. The insulating layer 5 is included between the corresponding metal circuit layers 4. Therefore, the LED type lighting fixture 1 according to the prior art not only has a structural complexity as described above, but also has a problem in that it is accompanied by difficulties in manufacturing.

In addition, the LED type lighting fixture 1 according to the prior art does not have a high reflectance of the aluminum layer 6, so that a lot of light hitting the inner wall of the lamp protection case 8 is absorbed and disappears, and as a result, the LED lamp There is a problem of lowering the efficiency of (7).

As another example, the LED type lighting fixture 1 according to the prior art is a resin sheet (not shown) attached to the resin via an adhesive instead of the aluminum layer 6 is coated on one side of the substrate (3) In some cases. However, the reflective sheet has a problem in that the adhesive is melted or dropped by heat generated from the LED lamp 7 over time, or the shape is deformed by repeated thermal stress.

Accordingly, the present invention has been made to solve the problems described above, an object of the present invention is to provide a method of manufacturing a substrate that can be structurally compact and perform all of the support, heat resistance and reflection function, the substrate and the LED having the same It is to provide a type lighting fixtures.

Another object of the present invention is to provide a method of manufacturing a substrate, a substrate, and an LED type lighting device having the same, which simplifies the manufacturing process, and is very convenient to handle and install.

In order to achieve the above object, the present invention according to the first embodiment comprises the steps of melting the resin through the heater by introducing the resin into the hopper of the extrusion molding machine hopper;

Extruding the molten resin to the outside through a molding part provided on one side of the heater part;

The extruded resin material is passed along the rollers of the roller unit in which the rollers of one roller and the rollers of the other roller rotate at different speeds to be stretched into a plate to form a plurality of small spaces in the resin. step; And

It provides a substrate manufacturing method comprising a; forming a cross-link between the molecular chains in the resin material by irradiating ultraviolet or electron beams to the resin in the form of a plate formed with a plurality of pores.

On the other hand, the present invention according to the second embodiment is a step of injecting the resin into the hopper of the extrusion molding machine to guide into the heater provided on one side of the hopper to melt the resin through the heater;

Irradiating the extruded resin material with ultraviolet rays or electron beams to form cross-links between molecular chains in the resin material; And

The resin material having crosslinked molecular chains is passed along the rollers of the roller unit in which the rollers of one roller and the rollers of the other roller rotate at different speeds, and are stretched in a plate form to form a plurality of pores ( It provides a substrate manufacturing method comprising a; forming a small space).

On the other hand, the present invention according to the third embodiment is made of a resin material according to the substrate manufacturing method according to the first embodiment or the second embodiment, it is made in the form of a plate of a certain thickness having a supporting function, Provided is a substrate including a plurality of small spaces formed through stretching to form cross-links between molecular chains in the resin material to have a function, and to have a curved surface performing a light reflection function.

In addition, the present invention further provides the following specific embodiments with respect to the basic embodiments of the present invention above.

The resin is characterized in that it is made of any one of a group consisting of poly ethylene (PE), poly propylene (PP), or poly ethylene terephthalate (PET).

On the other hand, the present invention according to the fourth embodiment the casing;

It is installed in the casing portion, made of a resin material and in the form of a plate of a predetermined thickness having a supporting function, and cross-link between the molecular chains in the resin material is formed to have a heat-resistant function and the light reflection function A substrate including a plurality of small spaces formed through stretching to have a curved surface to perform;

A metal circuit layer provided on one surface of the substrate and including a back connection part to form an electric circuit of a predetermined pattern;

A heat transfer layer embedded and coated in each of the through-holes and the other surface of the substrate, the through-holes formed in the center portion facing each back connection portion of the substrate;

A heat dissipation member attached to an outer surface of the heat transfer layer and having a plurality of heat dissipation fins;

An LED lamp mounted on each lamp connector of the metal circuit layer; And

It provides an LED type lighting fixture including a; lamp protection case that is fixed via a fastener to the rim of the casing portion so as to protect each LED from the outside.

In addition, an adhesive PE (Poly Ethylene) resin layer may be further provided on the outer surface of the substrate.

In addition, each of the back connection portion of the metal circuit layer is characterized in that it further comprises a socket for detachably receiving the LED.

The present invention enables the fabrication of an excellent substrate that is structurally compact and capable of performing both support, heat and reflection functions, and makes it possible to apply such an excellent substrate to an LED type lighting fixture. Therefore, the LED type lighting fixture can perform all the supporting, heat and reflection functions through the excellent substrate.

In addition, the present invention simplifies the manufacturing process of the substrate compared to the conventional and facilitates the handling of the substrate, it is possible to install the substrate in the LED type lighting fixtures very conveniently, furthermore the LED type through the compact substrate It makes it possible to simplify the structure of lighting fixtures.

Figure 1 is a schematic diagram showing the overall configuration of the LED type lighting fixture according to the prior art.
2 is a manufacturing flowchart for explaining a substrate manufacturing method according to a first embodiment of the present invention.
3 is a manufacturing flowchart for explaining a substrate manufacturing method according to a second embodiment of the present invention.
Figure 4 is a schematic diagram for explaining the internal structure of the substrate according to the third embodiment of the present invention.
Figure 5 is a schematic diagram showing the overall configuration of the LED type lighting fixtures according to a fourth embodiment of the present invention.

Hereinafter, a first embodiment to a fourth embodiment of a method for manufacturing a substrate, a substrate, and an LED type lighting fixture having the same according to the present invention will be described with reference to FIGS. 2 to 5 as follows.

As shown in Figure 2, the substrate manufacturing method according to an embodiment of the present invention is as follows.

First, the resin is introduced into the hopper of the extrusion machine to guide into the heater provided on one side of the hopper to melt the resin through the heater (S200).

Subsequently, the molten resin is extruded out through a molding part provided on one side of the heater part (S210).

Then, the extruded resin material is passed along the rollers of the roller unit having different rotational speeds of the one roller part and the other roller part to be drawn in a plate shape to form a plurality of small spaces in the resin material (S220). ). Here, the roller unit is composed of one roller portion having two or more rollers and the other roller portion having two or more rollers. Since the technology of the roller unit itself of such a configuration is widely known, further description thereof will be omitted.

Subsequently, ultraviolet rays or electron beams are irradiated onto the resin material in the form of a plate having a plurality of pores to form cross-links between molecular chains in the resin material (S230).

On the other hand, as another embodiment, as shown in Figure 3, the substrate manufacturing method according to a second embodiment of the present invention is as follows.

First, the resin is introduced into the hopper of the extrusion machine to guide into the heater provided on one side of the hopper to melt the resin through the heater (S300).

Subsequently, the molten resin is extruded to the outside through a molding part provided on one side of the heater part (S310).

Then, the extruded resin material is irradiated with ultraviolet rays or electron beams to form cross-links between molecular chains in the resin material (S320).

Subsequently, the resin material in which the crosslinks are formed between the molecular chains is passed along the rollers of the roller unit having different rotation speeds of one roller part and the other roller part, and stretched in a plate form to form a plurality of small spaces in the resin material. To form (S330). Here, the roller unit is composed of one roller portion having two or more rollers and the other roller portion having two or more rollers, and the description of such a roller unit itself is well known, and thus, further description thereof will be omitted.

On the other hand, the substrate 20 manufactured by the substrate manufacturing method of the first embodiment or the second embodiment as described above is made of a resin material as shown in Figure 4, in the form of a plate having a constant thickness with a supporting function It comprises a plurality of pores (21a) is formed through the stretching to form a cross-link (cross-link) between the molecular chains in the resin material 21 to have a heat-resistant function and to have a reflective function. The resin 21 may be made of any one of a group consisting of poly ethylene (PE), poly propylene (PP), or poly ethylene terephthalate (PET). The PE, PP, or PET is excellent in physical strength properties, exhibits dimensional stability after molding, and is durable, heat resistant, and environmentally friendly.

Meanwhile, as shown in FIG. 5, the LED type lighting device 1A having the above substrate includes a casing portion 2, a substrate 20, a metal circuit layer 4, a heat transfer layer 9, and heat dissipation. The member 10, the LED lamp 7 and the lamp protection case 8 is configured to include.

Here, the substrate 20 is made of a resin material and a plate of a predetermined thickness having a supporting function, cross-link between the molecular chains in the resin material 21 is formed to have a heat-resistant function It has a plurality of pores 21a formed through stretching to have a reflective function. The metal circuit layer 4 is provided on one surface of the substrate 20 by a deposition or etching method to form an electric circuit of a predetermined pattern, and includes a back connection portion 4a. The heat transfer layer 9 is embedded and coated in the through-hole 20a formed in the center portion facing each back connection portion 4a of the substrate 20 and the other surface of the substrate 20, respectively. The heat dissipation member 10 is attached to the outer surface of the heat transfer layer 9 and has a plurality of heat dissipation fins. The LED lamp 7 is mounted on each lamp connection part 4a of the metal circuit layer 4. The lamp protection case 8 may be fixed to the edge of the casing portion 2 by fasteners such as screws to protect the LEDs 7 from the outside.

In addition, an adhesive PE (Poly Ethylene) resin layer (not shown) may be further provided on an outer surface (upper surface and / or lower surface) of the substrate 20. Here, the adhesive PE resin layer may be provided in a state of being heat-sealed with the substrate 20. Since the substrate 20 and the adhesive PE resin layer are both resin materials, the bonding force between the adhesive PE resin layers is large. The adhesive PE resin layer may be exposed to long-term exposure to the heat generated from the LEDs 7 and / or the poor ambient environment (eg, hot air temperature, high humidity, etc.) by the metal circuit layer 4 and / or the heat transfer layer 9. It is possible to prevent them from being separated or separated from the substrate 20.

In addition, in the LED type lighting fixture 1A, each lamp connection part 4a of the metal circuit layer 4 may be further provided with a socket 11 for detachably accommodating the LED lamp 7. This socket structure facilitates replacement with a new one when the LED lamp 7 reaches its end of life.

The present invention described above is not limited to the above-described embodiments and the accompanying drawings, and simple substitution, modification and alteration within the technical spirit of the present invention will be apparent to those skilled in the art.

2: casing part 4a: back connection part
4: metal circuit layer 7: led light
8: lamp protection case 9: heat transfer layer
10: heat radiation member 11: socket
20: substrate 20a: through hole
21: resin 21a: pores

Claims

Injecting the resin into a hopper of an extrusion machine and guiding the resin into a heater provided on one side of the hopper to melt the resin through the heater;
Extruding the molten resin to the outside through a molding part provided on one side of the heater part;
The extruded resin material is passed along the rollers of the roller unit in which the rollers of one roller and the rollers of the other roller rotate at different speeds to be stretched into a plate to form a plurality of small spaces in the resin. step; And
Irradiating ultraviolet or electron beams to the resin in the form of a plate having a plurality of pores to form cross-links between molecular chains in the resin;
Substrate manufacturing method comprising a.

Injecting the resin into a hopper of an extrusion machine and guiding the resin into a heater provided on one side of the hopper to melt the resin through the heater;
Extruding the molten resin to the outside through a molding part provided on one side of the heater part;
Irradiating the extruded resin material with ultraviolet rays or electron beams to form cross-links between molecular chains in the resin material; And
The resin material having crosslinked molecular chains is passed along the rollers of the roller unit in which the rollers of one roller and the rollers of the other roller rotate at different speeds, and are stretched in a plate form to form a plurality of pores ( forming a small space;
Substrate manufacturing method comprising a.

Made of a resin material according to the method of manufacturing a substrate according to claim 1 or 2, made of a plate of a predetermined thickness having a supporting function, cross-linking between molecular chains in the resin material to have a heat-resistant function (cross- A substrate comprising a plurality of small spaces formed by stretching so that the link is formed and has a curved surface that performs a light reflection function.

The method of claim 3, wherein
The resin material is a substrate consisting of any one of a group consisting of poly ethylene (PE), poly propylene (PP), or poly ethylene terephthalate (PET).

A casing portion;
It is installed in the casing portion, made of a resin material and in the form of a plate of a predetermined thickness having a supporting function, and cross-link between the molecular chains in the resin material is formed to have a heat-resistant function and the light reflection function A substrate including a plurality of small spaces formed through stretching to have a curved surface to perform;
A metal circuit layer provided on one surface of the substrate and including a back connection part to form an electric circuit of a predetermined pattern;
A heat transfer layer embedded and coated in each of the through-holes and the other surface of the substrate, the through-holes formed in the center portion facing each back connection portion of the substrate;
A heat dissipation member attached to an outer surface of the heat transfer layer and having a plurality of heat dissipation fins;
An LED lamp mounted on each lamp connector of the metal circuit layer; And
A lamp protection case fixed to the rim of the casing by a fastener so as to protect each LED from the outside;
LED type lighting fixtures comprising a.

The method of claim 5, wherein
LED-type lighting fixtures are further provided with an adhesive PE (Poly Ethylene) resin layer on the outside of the substrate.

The method of claim 5, wherein
Each lamp connector of the metal circuit layer further comprises a socket for detachably accommodating the LED lamp.