KR101248514B1 - Led package and its fabricating method, and dish reflector used for the same - Google Patents
Led package and its fabricating method, and dish reflector used for the same Download PDFInfo
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- KR101248514B1 KR101248514B1 KR1020060095657A KR20060095657A KR101248514B1 KR 101248514 B1 KR101248514 B1 KR 101248514B1 KR 1020060095657 A KR1020060095657 A KR 1020060095657A KR 20060095657 A KR20060095657 A KR 20060095657A KR 101248514 B1 KR101248514 B1 KR 101248514B1
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- led chip
- led
- chip
- reflector
- dish reflector
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Abstract
The present invention relates to a LED (Light Emitting Diode) package, and to provide an LED package having a means for reflecting and sending light to the outside of the package body at a close proximity to the LED chip.
To this end, the LED package according to the present invention includes a package body in which the internal space in which the LED chip is installed is opened in the light emitting direction, and a chip support member installed in the internal space of the package body to support the LED chip; And a dish reflector disposed on the chip support member, the dish reflector having an inclined side reflector surrounding the periphery of the LED chip placed inwardly through the opening and the bottom.
Dish Reflector, Heat Sink, Molding Lens, LED Chip, Fluorescent Resin
Description
1 is a perspective view showing an LED package according to an embodiment of the present invention,
2 is an exploded perspective view showing an LED package according to an embodiment of the present invention with the molding lens removed;
3 is a cross-sectional view showing an LED package according to an embodiment of the present invention,
4 is a view for explaining the operation of the LED package according to an embodiment of the present invention,
5 to 7 are views for explaining the manufacturing method of the LED package according to an embodiment of the present invention.
(A brief description of the main symbols in the drawings)
10: package body 20: heat sink (or chip support member)
22: protrusion 30: lead frame
40: dish reflector 44: side reflector
442: wire groove 442: opening
52: fluorescent resin 60: molding lens
2: LED chip
The present invention relates to the field of LED (Light Emitting Diode) package, and more particularly, to an LED package having a dish reflector and a method of manufacturing the same.
In general, the LED package has a structure in which the LED chip for generating light by p-n junction inside the package body. The package body is opened in the light emitting direction of the LED chip through the opening, through which the light generated by the LED chip is emitted to the outside. In addition, the LED package includes a lens (especially a molding lens) covering the LED chip to increase the light emission efficiency within a certain direction angle of light. The lens is formed to cover the opening of the package body and is convex from the opening of the package body.
In a typical LED package, a large amount of light generated by the LED chip is not emitted to the outside through the lens, there is a problem of light loss that is lost inside the lens. This loss of light is mainly caused by the presence of light that does not direct to the lens covering the opening and the presence of light that hits the lens and then returns back.
Accordingly, there have been many studies to increase the amount of light directed to the lens. As a result of such research, a technique has been conventionally proposed in which the inner wall of the package body is formed to be inclined and the reflecting material is coated or the reflector is formed on the inclined inner wall. 61304 and the like. In prior art LED packages, the reflective inner wall in the package body reflected some of the light that was not directed to the lens towards the lens, thereby contributing to some extent reducing the light loss of the LED package.
However, in the conventional LED package, the distance between the reflective inner wall and the LED chip is far, so that the reflection efficiency of the light is inferior, and it is difficult to set the inclination angle of the reflective inner wall. In particular, the package is formed due to the installation of other components. Since it is limited to the upper part of the body, there is a limit in the reflection of light toward the side or the bottom of the LED chip. Furthermore, in conventional LED packages, in order to increase the light emission efficiency using the reflective inner wall, an extended design of the reflective inner wall is inevitable, which causes the compact size and structure of the LED package.
The technical problem of the present invention is to provide an LED package having a means for reflecting and sending light to the outside of the package body in close proximity to the LED chip.
Another technical problem of the present invention is to provide a method of manufacturing an LED package for disposing a means in the package body to reflect the light to the outside of the package body at a close proximity to the LED chip.
Another technical problem of the present invention is to provide a structure that can effectively reflect the light to the outside of the package body to the LED chip at a close distance.
According to an aspect of the present invention, an LED package includes a package body in which an internal space in which an LED chip is to be installed is opened in a light emitting direction, a chip support member installed in an inner space of the package body to support the LED chip, and the chip support. And a dish reflector positioned on the member, the dish reflector having an inclined side reflector surrounding the periphery of the LED chip placed inwardly through the opening. In the present specification, the term 'plate reflector' refers to a reflector having a substantially dish shape, and the present invention is not limited by the term.
The chip support member may be any means already known to support the LED chip, for example, lead frame, lead electrode, etc., but the heat from the LED chip is transferred to the outside while directly supporting the LED chip in a high power LED package. It is preferred to consist of a heatsink used to discharge.
At this time, the heat sink is preferably provided with a protruding end that is fitted to the opening of the dish reflector. Most preferably, the protruding end of the heat sink and the opening of the dish reflector are formed in a shape and size corresponding to each other to fix the rotational movement of the dish reflector. Here, the shape is preferably a polygon, such as a square, triangle, pentagon, hexagon, etc., but may be a variety of geometric shapes that are fitted to each other to limit the rotational direction relative to each other.
According to a preferred embodiment of the present invention, the protruding end has a flat end surface to which the LED chip is attached, and a fluorescent resin surrounding the LED chip is defined on the end surface. In addition, at least one wire groove is formed in the side reflector of the dish reflector to allow the passage of the bonding wire from the LED chip. The dish reflector is provided to cover the opening of the package body as a whole, and a convex molding lens made of a resin material is formed to cover an upper portion of the dish reflector. At this time, since the dish reflector covers the opening part as a whole, light is prevented from reaching the inner wall of the package body where light loss is likely to occur, and since it is located below the convex portion of the molding lens, it is easy to design a large overall height. Do.
According to another aspect of the present invention, a method of manufacturing an LED package including a package body in which the internal space in which the LED chip is to be installed is opened in the light emitting direction, and a chip support member installed in the internal space of the package body to support the LED chip. The manufacturing method includes a dish reflector having a bottom opening and an inclined side reflector, and the dish reflector being mounted on the chip support member such that the side reflector surrounds the periphery of the LED chip on the chip support member. It includes deploying.
Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. In the following description of the embodiment, it will be described as an example of an LED package including a heat sink that is used for the emission of heat generated from the LED chip as a chip support member for supporting the LED chip. However, the LED package including the heat sink described below does not limit the present invention, and the present invention may be limited only by the matters described in the claims.
Example
1 is a perspective view showing an LED package according to an embodiment of the present invention, Figure 2 is a perspective view showing a partially disassembled LED package according to an embodiment of the present invention with the molding lens removed, Figure 3 Is a cross-sectional view of the LED package shown in FIG.
2 and 3, the
In addition, a
The
The
Meanwhile, the
The
An
In addition, the
As mentioned above, the
As shown in FIGS. 1 and 3, a
A part of the light generated by the
4 is a view for explaining the operation of the
Hereinafter, a manufacturing method of the
As shown in FIG. 5, the
Then, each electrode of the
In the position where the
In the foregoing embodiments, it has been described that the
While the present invention has been particularly shown and described with reference to specific embodiments thereof, it will be understood by those skilled in the art that various changes and modifications may be made without departing from the spirit and scope of the present invention as defined by the appended claims. And should not be construed as limiting the scope of the present invention, but rather should be construed as exemplifying the invention.
According to the embodiment of the present invention, by adopting a dish reflector reflecting light to the outside of the package body in a position close to the LED chip, it is possible to minimize the amount of light loss in the package body. In addition, in the LED package according to the embodiment of the present invention, since the LED chip is surrounded by the fluorescent resin inside the dish reflector, almost all of the light converted into white light by the fluorescent resin can be emitted to the outside of the package body without light loss. That has the advantage.
Claims (14)
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020060095657A KR101248514B1 (en) | 2006-09-29 | 2006-09-29 | Led package and its fabricating method, and dish reflector used for the same |
PCT/KR2007/004727 WO2008039010A1 (en) | 2006-09-29 | 2007-09-27 | Led package |
US12/443,293 US8053799B2 (en) | 2006-09-29 | 2007-09-27 | LED package |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020060095657A KR101248514B1 (en) | 2006-09-29 | 2006-09-29 | Led package and its fabricating method, and dish reflector used for the same |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20080029471A KR20080029471A (en) | 2008-04-03 |
KR101248514B1 true KR101248514B1 (en) | 2013-04-04 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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KR1020060095657A KR101248514B1 (en) | 2006-09-29 | 2006-09-29 | Led package and its fabricating method, and dish reflector used for the same |
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Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101021245B1 (en) * | 2008-08-07 | 2011-03-11 | 이동규 | Led device |
KR101068651B1 (en) * | 2009-06-10 | 2011-09-28 | (주) 아모엘이디 | Method of manufacturing a LED package |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004023099A (en) * | 2002-06-12 | 2004-01-22 | Lumileds Lighting Us Llc | Semiconductor light-emitting device with fluoropolymer lens |
JP2004521506A (en) * | 2001-04-10 | 2004-07-15 | オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツング | Conductive frames and housings for radiation-emitting components, radiation-emitting components and methods for manufacturing the components |
-
2006
- 2006-09-29 KR KR1020060095657A patent/KR101248514B1/en active IP Right Grant
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004521506A (en) * | 2001-04-10 | 2004-07-15 | オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツング | Conductive frames and housings for radiation-emitting components, radiation-emitting components and methods for manufacturing the components |
JP2004023099A (en) * | 2002-06-12 | 2004-01-22 | Lumileds Lighting Us Llc | Semiconductor light-emitting device with fluoropolymer lens |
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Publication number | Publication date |
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KR20080029471A (en) | 2008-04-03 |
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