KR101184476B1 - Coating system for led module - Google Patents

Coating system for led module Download PDF

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Publication number
KR101184476B1
KR101184476B1 KR1020110099953A KR20110099953A KR101184476B1 KR 101184476 B1 KR101184476 B1 KR 101184476B1 KR 1020110099953 A KR1020110099953 A KR 1020110099953A KR 20110099953 A KR20110099953 A KR 20110099953A KR 101184476 B1 KR101184476 B1 KR 101184476B1
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KR
South Korea
Prior art keywords
led module
coating
coating system
curing
liquid
Prior art date
Application number
KR1020110099953A
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Korean (ko)
Inventor
백선영
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백선영
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Priority to KR1020110099953A priority Critical patent/KR101184476B1/en
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Publication of KR101184476B1 publication Critical patent/KR101184476B1/en

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
    • B05C5/001—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work incorporating means for heating or cooling the liquid or other fluent material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
    • B05C5/002—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the work consisting of separate articles
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1306—Details
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • H01L21/0274—Photolithographic processes

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  • Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Optics & Photonics (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)

Abstract

PURPOSE: A light emitting diode(LED) module coating system is provided to reduce the failure rate of products and to process plenty of the products for a short period of time by shortening times required for a coating operation. CONSTITUTION: An LED module coating system includes a liquid discharging and coating unit(1), a transferring conveyor(2), a curing unit(3), and a controlling unit(4). The transferring conveyor transfers an LED module with a plurality of LEDs. The curing unit cures coating liquid coated on the LED module by being installed at the middle of the transferring conveyor. The controlling unit controls the operation of each unit. The liquid discharging and coating unit includes two or more storing tanks(11), two or more controlled volume pumps, a mixer, and a spraying nozzle.

Description

LED module coating system {Coating system for LED module}

The present invention relates to an LED module coating system, and in particular, the coating process of applying a liquid coating agent and the curing process of curing the coated liquid coating agent can be performed at a time, thereby reducing the time required for coating the LED module. The present invention relates to an LED module coating system.

In particular, the present invention is configured so that the process of coating the coating and the process of curing the coated coating can be carried out in one line can reduce the cost of the device configuration and shorten the coating time as well as short time The present invention relates to an LED module coating system that can process a large amount of material and reduce a defect rate.

Moreover, the present invention relates to an LED module coating system that allows the silicon applied to the LED module to be applied more evenly.

As the electric and electronic business develops, various battery electronic products have been developed and provided.

Among such electrical and electronic products, the use of LEDs is rapidly increasing due to low power, durability, and the like.

The lighting device or the display board using such LEDs is generally configured by installing one or more LED modules, and the LED modules are arranged in a plurality of LEDs and constitute a circuit so that the LEDs simultaneously emit EH sequentially. The LED (Light Emitting Diode) constituting such an LED module is a semiconductor device that emits light when a voltage is applied in the forward direction, and its life is considerably longer than that of an incandescent lamp, and the emission color varies depending on the material used. In the visible light, infrared light emitting can be manufactured to be used as a light source and a display device to replace the fluorescent lamp or light bulb.

In order to increase the durability of the electronic device constituting the module and to guarantee a certain level of product performance during the process of producing such LED module, a coating agent (commonly used "silicone", hereinafter referred to as "silicone") is applied The coating process to harden is performed.

That is, looking at the process of manufacturing a conventional LED module,

Step 1-Manual cleaning of PCB with LED, if the foreign matter on PCB is not removed, then the applied silicon will not be cured

Second Process-Primary Silicon Coating

3rd process-The operator does not spread evenly after the 1st silicone application

4th process-The operator hardens the primary crucible by putting the LED module in or out of the crucible manually.

5th process-manually tilt the LED after the 1st hardening work

Step 6-Apply Secondary Silicone

Step 7-Apply Silicon Uniformly on Uneven Coating Surface After Secondary Silicon Coating

8th process-secondary curing

The conventional LED module coating process made by the above process is caused by the artificial semi-finished product carrying process, the quality deterioration factor such as the LED is inclined, and the worker often performs frequent semi-finished product transport lumps, so that the workers suffer from musculoskeletal disorders This can cause it. In addition, since many processes are performed manually, there is a limit to increase production when the demand of the product is high, and the production and production efficiency of the product is low compared to the manpower and working hours, as well as a lot of energy waste, There is a concern that safety accidents may occur due to deterioration of work efficiency and frequent operation of high temperature electric crucibles.

In addition, since the coating apparatus and the curing apparatus for performing the above process must be configured separately, the apparatus occupies a lot of space and has a disadvantage in that a large amount of equipment is required.

In addition, the method of curing silicon using an electric crucible is limited in the capacity of an electric crucible that can be cured at a time. Therefore, when curing a large number of LED modules, the electric crucible must be opened and closed several times. According to the opening and closing of the crucible, there was a problem that the performance due to severe temperature changes in the crucible.

The present invention was developed to solve the problems of the prior art as described above, the process of coating the coating and the process of curing the coated coating can be made in one line and in the process of transporting the coating coated LED module It is possible to solve the defects caused by the uneven coating generated, and to be able to perform the coating process and the curing process on the same line in the same space, to reduce the cost of the device configuration and to reduce the coating time. In addition, it is an object of the present invention to provide an LED module coating system that can save a large amount in a short time and reduce the defective rate.

Furthermore, it is an object of the present invention to provide an LED module coating system which enables the silicon coated on the LED module to be evenly spread.

LED module coating system according to the present invention for achieving this purpose is (A) two or more storage tanks for storing the main and auxiliary materials, two or more metering pumps for quantitatively transferring the materials of the storage tanks, the metering pump A liquid discharge and coating device including a mixer for mixing and discharging the main material and the auxiliary material conveyed by the sprayer, and a spray nozzle for quantitatively discharging the coating liquid mixed by the mixer; (B) a transfer conveyor for transferring an LED module including a plurality of LEDs; (C) a curing apparatus installed in the middle of the conveying conveyor to cure in the coating liquid coated on the LED module; (D) a control device for controlling the driving of each device.

The liquid discharge and coating device constituting the LED module coating system according to the present invention may further include an automatic washing device for washing the material and auxiliary materials remaining in each device, and the LED module at the entrance of the curing device of the transfer conveyor. The flattening device for supplying air so that the coating liquid applied to the evenly spread may be further installed.

In addition, the coating system according to the present invention may further include a weight sensing means to detect the amount of the applied silicon by sensing the weight of the LED module before and after the silicon is applied.

Preferred curing apparatus may comprise a plurality of far infrared heaters and a hot air supply.

The present invention is a non-uniformity of silicon generated in the process of transporting the silicon-coated LED module because the coating device and the curing device for applying the silicon is installed in one line and the coating operation is made in one line without carrying the LED module There is an effect that can solve the application problem.

Furthermore, by flattening the silicon liquid using a flattening device before the silicon is cured, it is possible to provide an LED module having a good flatness.

In addition, the coating process and the curing process can be performed on the same line in the same space, which can reduce the cost of constructing the device, reduce the coating time, and can process a large amount in a short time. As a result, the defect rate can be reduced.

1 is a perspective view showing an example of the LED module coating system according to the present invention,
Figure 2 is a side cross-sectional view of the conveyor and curing device constituting the LED module coating system according to the present invention,
Figure 3 is a circuit diagram showing an example of the liquid discharge and coating apparatus constituting the LED module coating system according to the present invention,
Figure 4 is a cross-sectional view showing a part of the transfer cup bay provided in the LED module coating system according to the present invention,
5 is a perspective view showing an example of a nozzle installed in the LED module coating system according to the present invention,
6 is a perspective view showing another example of a nozzle installed in the LED module coating system according to the present invention.

Hereinafter, the present invention will be described in more detail with reference to the accompanying drawings. It should be understood, however, that the appended drawings illustrate only the contents and scope of technology of the present invention, and the technical scope of the present invention is not limited thereto. In addition, it will be apparent to those skilled in the art that various modifications and changes can be made within the scope of the present invention based on these examples.

In the LED module coating system according to the present invention, the coating liquid (commonly referred to as "silicone", hereinafter referred to as "silicon") is applied to the LED module on a single space and a single line so that the silicon can be applied and cured evenly. As well as to simplify the apparatus and to reduce the time or manpower required for the coating operation, the liquid discharge and coating to mix and discharge the main and auxiliary materials of silicon applied to the LED module Apparatus 1, a conveying conveyor 2 for conveying the LED module, and a curing apparatus 3 for curing the liquid silicone are included.

In addition, the LED module coating system of the present invention includes a control device (4) for controlling the driving of the above-mentioned various devices.

The liquid discharging and dispensing apparatus 1 is capable of discharging two or more kinds of liquids more precisely and wisely. The liquid discharging and dispensing apparatus 1 includes two or more storage tanks 11 for storing a main material and an auxiliary material, and the storage tank 11. At least two metering pumps 12 for quantitatively transporting the materials of the pumps, a mixer 13 for mixing and discharging the main and auxiliary materials transported by the metering pumps 12, and a coating liquid mixed by the mixers. And a spray nozzle 14 for quantitatively discharging.

The silicone applied by the system of the present invention is typically used by mixing a silicon stock solution, which is a main material, and an auxiliary material, which is a curing agent. As the auxiliary material, materials having various functions may be further mixed.

The tank 11 has a pair of at least one main material tank and at least one auxiliary material tank, and each tank 11 is provided with a stirrer to prevent the materials stored in the tank from hardening or agglomeration. Can be. As shown in FIG. 3, the stirrer may include a motor 11a installed on the tank and a stirring blade 13b rotating by the motor 11a.

The tanks 11 are preferably made of stainless steel such as metal or synthetic resin that can withstand high pressure or high vacuum. In addition, the flow rate gauge can be installed to check the remaining amount of the material and automatically replenish when the remaining amount of material is insufficient, it is preferable to have a defoaming function to discharge the air mixed in the material. In addition, heating means (not shown) may be further provided to heat the material to maintain the viscosity of the liquid material.

The dosing pump 12 is a means for transferring the main material and auxiliary material stored in the tank 11 to the mixer 13, as shown in FIG. Can be. That is, when distributing and discharging materials stored in one tank 11 through a plurality of nozzles, two or more mixers 13 should be connected to the tank, and in this case, the metering pump 12 is the number of mixers 13. Should be installed. Of course, this may also be the case when there are several tanks.

In FIG. 3, four metering pumps 12 are installed as a system for discharging a pair of tanks 11 with two nozzles. The metering pump 12 may be configured by various modifications, but it is preferable that the metering pump 12 is configured as a gear pump that is highly durable by high-frequency heat treatment, and that precision gears are engaged to rotate to rotate quantitatively. In addition, it is preferable that the gear housing be manufactured in a form without a seal to increase durability.

The mixer 13 was able to mix and discharge the low viscosity and high viscosity liquid phase in a short time, and can be manufactured in a separate or integral type to easily separate from the drive device. In addition, the housing of the mixer 3 is processed by acetal and new material to increase the durability.

The nozzle 14 is provided with a valve as a means for quantitatively discharging the mixed material, and is opened and closed by the control of the controller 4.

In the liquid discharge and coating device 1 configured as described above, when the material is discharged to a desired place, the mixing and discharging is completed. If the material remains in the device after the operation is finished, it is desirable to control the remaining material as the material hardens to clog the lines between the device as well as the device. To this end, it is preferable that an automatic washing device 15 is further installed in the mixed discharging system configured as described above to wash away the material and auxiliary materials remaining in each device.

The automatic washing device 15 is made of a metal or synthetic resin of stainless steel, trichloro ethylene is stored as a washing liquid, and one side is provided with a level gauge for checking the remaining amount of the washing liquid. Of course, a pump for delivering the washing liquid at high pressure is provided. As shown in FIG. 3, the automatic washing device 15 is connected to a plurality of washing liquid supply lines to the nozzles 14 so that the washing liquids sent by the driving of the pump are flowed back to the respective apparatuses through the nozzles f 14. The material left in the lines and devices is cleaned.

In addition, the liquid discharge and coating device 1 may be further provided with a pressure sensor 16 for detecting and notifying whether excessive pressure is applied to the transfer line of the material and the auxiliary material. Excessive pressure on the line when the amount of material discharged from the metering pump and the amount of material discharged from the nozzle are unbalanced when the amount of material discharged from the metering pump 12 is discharged to the nozzle 14 through the mixer 13. This may cause bubbles in the material due to jamming or low pressure, so that the proper pressure is maintained by detecting the pressure on the line, thereby smoothly discharging the material and protecting the equipment.

In addition, since the silicon discharged from the liquid discharge and coating device 1 can vary the amount or discharged area according to the LED module to be coated, the nozzle 14 is a single furnace as shown in FIG. Alternatively, as shown in FIG. 5, the nozzle box 140 may include a plurality of nozzles provided with a plurality of nozzles 14.

The LED module coated with silicon discharged by the liquid discharge and coating device 1 configured as described above is transferred by the transfer conveyor 2.

1 and 2, the transfer conveyor 2 may be a belt to support both ends of the LED module, the belt is rotated by a drive means such as a motor.

The conveying conveyor is composed of a plurality of layers, as shown in Figs. That is, it is configured by installing a soft fabric belt (2b) on the outside of the metal belt (2a) rotated by a plurality of rollers. With this configuration, the metal belt 2a is firmly supported so that the LED module does not shake, and the fabric belt 2b is capable of preventing the LED module from slipping.

The feed rate of the LED module plays an important role in matching the drying conditions on the line. In other words, if the transfer speed is high, the silicone curing is less performed, and if it is too slow, the production quantity is small. Therefore, the feeding speed should be set in consideration of the silicone curing and the temperature condition production quantity. The feed rate can be adjusted by controlling it.

The curing apparatus 3 includes a plurality of far infrared heaters 31 and a plurality of hot air supply 32 as a means for curing the silicon coated on the LED module is installed in the middle of the conveying conveyor (2).

That is, as shown in FIG. 2, the curing device 3 is provided with a plurality of far-infrared heaters 31 and hot air supply 32 installed in a duct (box) having a space where the LED module passes. Heat was applied to the silicone applied to the silicone to allow the silicone to cure in a short time.

If the heat generated from the curing device 3 is too high, bubbles may be generated in the silicon, so that the silicon is cured by controlling the driving of the far-infrared heater 31 and the hot air supply 32 using the control device 4. The temperature shall be controlled to a temperature suitable for

It is also possible to further install a fan that can discharge the humid air inside.

If the amount of silicon to be applied to the LED module using the LED module coating system configured as described above is too large to cover the LED, the illuminance may be lowered, so the silicon should be applied to a suitable thickness. The weight sensing means 6 is further installed as a means for sensing the amount of silicon applied in this way.

1 and 2, the weight sensing means 6 is installed in the middle of the conveying conveyor consisting of two rows, the module tray 61 is lifted up and down by the driving means and the LED module is mounted on the upper portion. And a load cell 62 for sensing the weight of the LED module including the module tray.

The load cell 62 senses the weight of the LED module to detect the coating amount of silicon. That is, the weight is detected when the silicon is not applied to the module tray 61 is transmitted to the control device 4, the control device is a liquid discharge and coating device is applied when the silicon of the predetermined weight The driving of (1) is stopped so that an appropriate amount of silicon is applied to the LED module.

In the LED module coating system configured as described above, the silicon coated on the LED module by the liquid discharge and coating device 1 is preferably to maintain a uniform smoothness, as shown in FIG. 2, the curing device 3. The flattening device 5 can be further installed at the inlet of.

The flattening device 5 is applied to the surface of the silicon that is applied to the LED module and not cured to supply air at a constant pressure so that the surface of the silicon has a constant thickness and smoothness, the same width as that of the LED module. A blower or the like may be used to supply wind to the furnace.

1: liquid discharge and coating device
11: storage tank
12: metering pump
13: mixer
14: nozzle 140: nozzle box
15: automatic washing device
16 pressure sensor
2: conveying conveyor 2a: metal belt 2b: fabric belt
3: curing device
31: far infrared sitter
32: hot air supply
4: controller
5: flattening device
6: weight sensing means
61: module tray
62: load cell

Claims (6)

(A) at least two storage tanks 11 for storing the main and auxiliary materials, at least two metering pumps 12 for quantitatively transporting the materials of the storage tanks 11, and by the metering pumps 12 A liquid discharge and coating device 1 including a mixer 13 for mixing and discharging the conveyed main material and the auxiliary material, and a spray nozzle 14 for quantitatively discharging the coating liquid mixed by the mixer;
(B) a transfer conveyor (2) for transporting the LED module including a plurality of LEDs;
(C) a curing device (3) installed in the middle of the conveying conveyor (2) to cure the coating liquid coated on the LED module;
(D) the control device 4 for controlling the drive of each device;
LED module coating system comprising a. The method of claim 1,
LED liquid coating system, characterized in that the liquid discharge and coating device (1) is further provided with an automatic washing device (15) for washing the remaining material and auxiliary materials remaining in each device. The method according to claim 1 or 2,
On one side of the conveying conveyor (2) LED module coating system, characterized in that the weight sensing means for detecting the weight of the input LED module (6) is further installed. The method of claim 3, wherein
The curing device (3) is a LED module coating system, characterized in that it comprises a plurality of far infrared heaters (31), hot air supply (32). The method of claim 4, wherein
LED module coating system, characterized in that the flattening device (5) is further installed at the inlet of the curing device (3) of the transfer conveyor (2) to spread the coating liquid applied to the LED module evenly. The method of claim 5, wherein
The flattening device (5) is a LED module coating system, characterized in that the blower for supplying air to the surface of the uncured silicon.
KR1020110099953A 2011-09-30 2011-09-30 Coating system for led module KR101184476B1 (en)

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Application Number Priority Date Filing Date Title
KR1020110099953A KR101184476B1 (en) 2011-09-30 2011-09-30 Coating system for led module

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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101466662B1 (en) 2014-01-22 2014-11-28 한솔라이팅 (주) LED-UV light firearms for painting
KR101772690B1 (en) * 2015-12-31 2017-08-29 김종구 Automatic multi-spray coating system
US10251224B2 (en) 2016-06-10 2019-04-02 Samsung Electronics Co., Ltd. Display module and method for coating the same
CN112742663A (en) * 2021-01-27 2021-05-04 深圳市卓林欣贸易有限公司 High-efficient throttle position sensor molding equipment
KR102351370B1 (en) * 2021-05-24 2022-01-18 (주)더서울테크 Resin composition coating and drying device of LED module of electric signboard

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4520295B2 (en) 2002-05-29 2010-08-04 シュミット リナー アーゲー How to apply a coating to a surface

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4520295B2 (en) 2002-05-29 2010-08-04 シュミット リナー アーゲー How to apply a coating to a surface

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101466662B1 (en) 2014-01-22 2014-11-28 한솔라이팅 (주) LED-UV light firearms for painting
WO2015111858A1 (en) * 2014-01-22 2015-07-30 한솔라이팅㈜ Led-uv curing equipment for coating and painting
KR101772690B1 (en) * 2015-12-31 2017-08-29 김종구 Automatic multi-spray coating system
US10251224B2 (en) 2016-06-10 2019-04-02 Samsung Electronics Co., Ltd. Display module and method for coating the same
US10560988B2 (en) 2016-06-10 2020-02-11 Samsung Electronics Co., Ltd. Display module and method for coating the same
CN112742663A (en) * 2021-01-27 2021-05-04 深圳市卓林欣贸易有限公司 High-efficient throttle position sensor molding equipment
KR102351370B1 (en) * 2021-05-24 2022-01-18 (주)더서울테크 Resin composition coating and drying device of LED module of electric signboard

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