KR101173203B1 - Manufacturing method of adhesive board and the adhesive board made by the method - Google Patents

Manufacturing method of adhesive board and the adhesive board made by the method Download PDF

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Publication number
KR101173203B1
KR101173203B1 KR1020090033160A KR20090033160A KR101173203B1 KR 101173203 B1 KR101173203 B1 KR 101173203B1 KR 1020090033160 A KR1020090033160 A KR 1020090033160A KR 20090033160 A KR20090033160 A KR 20090033160A KR 101173203 B1 KR101173203 B1 KR 101173203B1
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South Korea
Prior art keywords
board
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adhesive
pressure
sensitive adhesive
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KR1020090033160A
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Korean (ko)
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KR20100114669A (en
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김한슬
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김한슬
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C09J5/06—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving heating of the applied adhesive
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/13—Phenols; Phenolates
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2400/00—Presence of inorganic and organic materials
    • C09J2400/10—Presence of inorganic materials
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2475/00—Presence of polyurethane
    • C09J2475/003—Presence of polyurethane in the primer coating

Abstract

본 발명은 점착식 보드판의 제작방법 및 그 방법에 의하여 제작된 점착식 보드판에 관한 것으로, 더욱 상세하게는 별도의 접착 매개체 없이 각종 게시물과 정보지 등을 장기간 반복적으로 탈, 부착하면서도 부착 면이 손상되거나 잔유물이 남지 않는 점착식 보드판의 제작방법 및 그 방법에 의하여 제작된 점착식 보드판에 관한 것이다.The present invention relates to a method of manufacturing a pressure-sensitive adhesive board and to a pressure-sensitive adhesive board produced by the method, and more specifically, the attachment surface is damaged while repeatedly detaching and attaching various posts and information sheets for a long time without a separate adhesive medium or The present invention relates to a method for producing a pressure-sensitive adhesive board without residue and to a pressure-sensitive adhesive board produced by the method.

본 발명은 종래 기존 제품의 제반 문제점을 개선하여 고안한 것으로 보드 판에 정보지를 접착 매개체 없이 간단히 탈, 부착 하는 것이 용이하며 본 발명의 점착식 보드판을 다양한 합지 대상물에 점착 합지하여 사용할 수 있으며, 상기 보드판에 정보지를 탈, 부착 하거나, 상기 합지 대상물에 상기 점착식 보드판을 합지 및 제거 시에 표면에 잔유물이 남지 않고, 손상이 없는 장점이 있다.   The present invention has been devised to improve the problems of the conventional products, it is easy to simply remove and attach the information sheet to the board plate without an adhesive medium, the adhesive board board of the present invention can be used by adhesive lamination to various laminated objects, There is an advantage that no residue remains on the surface when removing or attaching the information sheet to the board, or laminating and removing the adhesive board to the lamination object, there is no damage.

점착식 보드판, 점착제 층, 프라이머코팅, 엠보싱, 보호필름, 이형지   Adhesive board, adhesive layer, primer coating, embossing, protective film, release paper

Description

점착식 보드판의 제작방법 및 그 방법에 의하여 제작된 점착식 보드판{Manufacturing method of adhesive board and the adhesive board made by the method}Manufacturing method of adhesive board and adhesive board made by the method {Manufacturing method of adhesive board and the adhesive board made by the method}

본 발명은 점착식 보드판의 제작방법 및 그 방법에 의하여 제작된 점착식 보드판에 관한 것으로, 더욱 상세하게는 별도의 접착 매개체 없이 각종 게시물과 정보지 등을 장기간 반복적으로 탈, 부착하면서도 부착 면이 손상되거나 잔유물이 남지 않는 점착식 보드판의 제작방법 및 그 방법에 의하여 제작된 점착식 보드판에 관한 것이다. The present invention relates to a method of manufacturing a pressure-sensitive adhesive board and to a pressure-sensitive adhesive board produced by the method, and more specifically, the attachment surface is damaged while repeatedly detaching and attaching various posts and information sheets for a long time without a separate adhesive medium or The present invention relates to a method for producing a pressure-sensitive adhesive board without residue and to a pressure-sensitive adhesive board produced by the method.

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일반적으로 보드판(게시판)은 두꺼운 나무나 코르크, 융, 금속 등으로 제조되는 것이 보통이며 이 같은 보드판은 주로 사람들의 왕래가 잦은 공공장소, 영업장소, 교육기관의 로비 혹은 사무실 및 책상 앞에 설치되어 소정의 정보가 표시된 종이 또는 알림 소재(이하 '정보지'라 함)를 부착하여 사용한다.In general, boards (boards) are usually made of thick wood, cork, metal, metal, etc. These boards are usually installed in public places, business places, the lobby of educational institutions, or in front of offices and desks. Attach a paper or notification material (hereinafter referred to as 'information sheet') on which information is displayed.

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기존 보드판에 정보지를 부착하기 위해서는 압핀, 풀, 테이프, 자석 등과 같은 별도의 접착 매개체가 반드시 필요하였으며 이러한 접착매개체가 준비되어 있지 않은 경우에는 보드판에 정보지를 부착할 수가 없었다. In order to attach the information sheet to the existing board, a separate adhesive medium such as a push pin, glue, tape, magnet, etc. is required.

또한 풀이나 테이프를 이용하여 정보지를 보드판에 부착시키고 난 후 일정시간이 경과하여 보드판으로부터 정보지를 떼어내려고 할 경우에는 풀이나 테이프의 접착특성으로 인해 정보지가 찢어지거나 보드판이 손상되고 잔유물이 남았으며, 보드판을 설치면에 못, 테이프 등으로 설치하면 보드 판과 설치면이 손상되거나 잔유물이 남는 문제점이 있었다.In addition, if a certain time has elapsed after attaching the information sheet to the board using glue or tape, the adhesive sheet of the tape or the tape may be torn or the board may be damaged due to the adhesive property of the paste or tape. If the board board is installed on the mounting surface with nails, tapes, etc., there was a problem that the board board and the mounting surface are damaged or residues remain.

한편 종이로 된 일부분에 점착제를 도포한 소위 포스트잇이라는 상품이 널리 사용되고 있으나 이는 점착력이 비교적 낮아 설치 면으로부터 쉽게 이탈될 뿐만 아니라 포스트잇 외에 별도의 정보지를 부착할 수 없고 점착수명이 짧은 단점이 있다.  On the other hand, a so-called post-it product coated with a pressure-sensitive adhesive on a portion of paper is widely used, but it is relatively low in adhesive strength and easily detached from the installation surface.

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본 발명은 종래 기존 제품의 제반 문제점을 개선하여 고안한 것으로 보드판에 정보지를 접착 매개체 없이 간단히 탈, 부착 하는 것이 용이하고, 본 발명의 점착식 보드판을 다양한 합지 대상물에 합지하여 사용할 수 있으며, 상기 보드판에 정보지를 탈, 부착 하거나, 상기 합지 대상물에 상기 점착식 보드판을 합지 및 제거 시에 표면에 잔유물이 남지 않고, 손상이 없는 장점이 있는 점착식 보드판의 제작방법 및 그 방법에 의하여 제작된 점착식 보드판을 제공하는데 목적이 있다.The present invention has been devised to improve the problems of the conventional products, it is easy to simply remove and attach the information sheet to the board without an adhesive medium, the adhesive board board of the present invention can be used by laminating a variety of laminated objects, the board board A method of manufacturing a pressure-sensitive adhesive board and a pressure-sensitive adhesive prepared by the method, in which the residue is not left on the surface when the information sheet is removed or attached, or when the pressure-sensitive adhesive board is laminated and removed from the lamination object, and there is no damage. The purpose is to provide a board board.

본 발명에 의한 점착식 보드판은, 보드판을 디자인하고 인쇄하는 제1단계; 상기 제1단계에서 마련된 보드판의 코팅을 위한 제판을 제작하는 제2단계; 상기 제2단계에서 제판된 보드판의 표면에 프라이머코팅을 하는 제3단계; 상기 제3단계에서 프라이머코팅된 보드판의 표면에 점착물질을 엠보싱코팅하는 제4단계; 상기 제4단계에서 코팅된 점착물질을 건조 및 경화하는 제5단계; 상기 제5단계에서 건조 및 경화된 점착물질에 보호필름을 합지하는 제6단계; 상기 제6단계까지 마련된 보드판을 재단하는 제7단계; 상기 제7단계에서 마련된 보드판에 결합부재를 구비하는 제8단계;를 포함하는 제작방법에 의하여 제작되는 것을 특징으로 할 수 있다.Adhesive board according to the present invention, the first step of designing and printing a board board; A second step of manufacturing a plate for coating the board plate provided in the first step; A third step of primer coating on the surface of the board plate made in the second step; A fourth step of embossing an adhesive material on the surface of the board coated with the primer in the third step; A fifth step of drying and curing the adhesive material coated in the fourth step; A sixth step of laminating the protective film on the adhesive material dried and cured in the fifth step; A seventh step of cutting the board board provided up to the sixth step; And an eighth step of providing a coupling member on the board plate provided in the seventh step.

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본 발명은 종래 제품의 제반 문제점을 개선하여 고안한 것으로 보드판에 정보지를 접착 매개체 없이 간단히 탈, 부착 하는 것이 용이하며 본 발명의 점착식 보드판을 다양한 합지 대상물에 합지하여 사용할 수 있으며, 상기 보드판에 정보지를 탈, 부착 하거나, 상기 합지 대상물에 상기 점착식 보드판을 합지 및 제거 시에 표면에 잔유물이 남지 않고, 손상이 없는 장점이 있다.The present invention has been devised to improve the problems of the conventional products, it is easy to remove and attach the information sheet to the board board without the adhesive medium, it is possible to use the adhesive board board of the present invention laminated on various laminated objects, the information on the board board When removing or attaching paper or laminating and removing the adhesive board to the lamination object, there is an advantage that no residue remains on the surface and there is no damage.

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이하에서 본 발명에 따른 점착식 보드판의 제작방법 및 그 방법에 의하여 제작된 점착식 보드판에 대하여 도 1내지 도 7을 참고하여 상세히 설명한다.
Hereinafter, a method of manufacturing an adhesive board according to the present invention and an adhesive board manufactured by the method will be described in detail with reference to FIGS. 1 to 7.

도 1은 본 발명에 따른 점착식 보드판의 설치상태 사시도,1 is a perspective view of an installation state of a pressure-sensitive adhesive board according to the invention,

도 2는 점착제층, 보드판, 결합부재의 단면도,2 is a cross-sectional view of the pressure-sensitive adhesive layer, board plate, the coupling member,

도 3은 점착제층, 프라이머코팅층, 인쇄층, 보드판, 결합부재의 단면도,3 is a cross-sectional view of the pressure-sensitive adhesive layer, primer coating layer, printed layer, board board, the coupling member,

도 4는 보호필름, 점착제층, 인쇄층, 보드판, 결합부재의 단면도,4 is a cross-sectional view of a protective film, an adhesive layer, a printing layer, a board plate, a coupling member,

도 5는 결합부재인 양면 테이프에 점착코팅이 된 것을 나타내는 단면도,Figure 5 is a cross-sectional view showing that the adhesive coating on the double-sided tape that is the coupling member,

도 6 은 보드판 및 엠보싱층이 포함된 투명패드에 배면 점착 코팅이 된 것을 나타내는 단면도,6 is a cross-sectional view showing a back adhesive coating on a transparent pad including a board and an embossed layer;

도 7은 투명필름에 프라이머코팅과 배면 점착코팅이 된 것을 나타내는 단면도이다.Figure 7 is a cross-sectional view showing that the primer coating and the back adhesive coating on the transparent film.

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상기 점착식 보드판(10)을 제작함에 있어서는, 보드판 재료로 종이 등의 소재를 마련하고, 이 소재에 원하는 내용의 디자인을 인쇄 한 후, 인쇄면에 점착물질을 코팅하여 점착제층(20)을 형성하여 점착식 보드판(10)을 제작하는 방법이 있으며, 또 다른 방법으로는 점착식 보드판(10) 소재로 투명필름(25)을 마련하고, 이 투명필름(25) 앞면에 점착물질을 코팅하여 점착제층(20)을 형성하고, 투명필름(25) 뒷면에 점착물질을 코팅하여 점착식 투명필름을 완성한 후 원하는 합지 대상물에 투명필름(25) 뒷면을 합지하여 제작하는 방법이 있다. In manufacturing the pressure-sensitive adhesive board 10, a material such as paper is provided as a board material, and after printing the design of the desired content on the material, the pressure-sensitive adhesive layer 20 is formed by coating an adhesive material on the printing surface. There is a method for producing a pressure-sensitive adhesive board 10, another method is to prepare a transparent film 25 of the pressure-sensitive adhesive board 10, the adhesive film is coated on the front surface of the transparent film 25 After forming the layer 20, coating the adhesive material on the back of the transparent film 25 to complete the pressure-sensitive transparent film, there is a method of manufacturing by laminating the back of the transparent film 25 to the desired laminated object.

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상기 점착제층(20)이 상기 보드판(10) 표면에서 분리 탈락되는 것을 방지하고, 상기 보드판(10) 표면에 점착층이 미립자로 적층되게 하기 위해 상기 점착제층(20) 코팅 공정 전 단계로 프라이머 코팅(초벌 코팅) 공정을 수행할 수 있다.In order to prevent the pressure-sensitive adhesive layer 20 from being separated off from the surface of the board plate 10 and to deposit the adhesive layer on the surface of the board plate 10 as fine particles, a primer coating is performed before the pressure-sensitive adhesive layer 20 coating process. (Primary coating) process can be performed.

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상기 프라이머코팅은 코팅물질이 안착될 수 없을 정도의 표면장력 상태가 낮은 소재에 코팅된 물질의 탈락을 방지하여 코팅된 점착물질이 장기간 기능을 유지할 수 있도록 하는 것이다.The primer coating is to prevent the falling off of the material coated on the material having a low surface tension such that the coating material can not be seated so that the coated adhesive material can maintain the function for a long time.

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상기 점착식 보드판(10)의 소재는 PET(Polyethylene terephthalate), 유포지, 특수지, 종이, 목재, 콜크, 유리, 섬유, 플라스틱, 아크릴, 금속, 피이폼(PE foam), 고무, 우드락, 석유화학수지류, 폴리프로필렌, 폴리에칠렌, 폴리카보네이트, 폴리우레탄, PVC, 아크릴 폼 중 어느 하나로 된 형성된 것으로 한다.The adhesive board 10 is made of polyethylene terephthalate (PET), diffusion paper, specialty paper, paper, wood, cork, glass, fiber, plastic, acrylic, metal, PE foam, rubber, wood rock, petrochemical water It is formed of any one of paper, polypropylene, polyethylene, polycarbonate, polyurethane, PVC, and acrylic foam.

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상기 점착식 보드판(10) 면의 점착제층(20)을 보호하기 위하여 점착제층 (20)상으로 보호필름(50)을 합지하는데, 이에 사용되는 보호필름(50)은 폴리프로필렌, PET, OPP(Oriented polypropylene) PVC 중 하나를 선택하여 필름 표면에 코팅을 하여 마련한다. In order to protect the pressure-sensitive adhesive layer 20 of the surface of the pressure-sensitive adhesive board 10, the protective film 50 is laminated on the pressure-sensitive adhesive layer 20. The protective film 50 used therein is polypropylene, PET, OPP ( Oriented polypropylene) Select one of the PVC and coat it on the film surface.

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상기 점착식 보드판(10) 설치를 위한 결합부재(30)를 마련함에 있어서, 결합부재(30)로는 양면 테이프(60) 등을 이용할 수 있는데, 양면 테이프(60) 결합부재는 피이폼, 폴리우레판, 아크릴폼 중 어느 하나로 형성된 것을 사용하고, 양면 테이프(60)의 일면은 접착력이 강한 접착물질로 하고, 타면은 점착제층(20)을 형성하여, 접착면은 강력한 결합 접착 시에 사용하며, 점착면은 보드판 제거 시 또는 이동 부착 시 흔적을 남지 않게 하기 위하여 사용한다.In providing the coupling member 30 for installing the adhesive board 10, the coupling member 30 may be a double-sided tape 60, etc., the double-sided tape 60, the coupling member is P-form, polyurethane Using one formed of a plate or acrylic foam, one side of the double-sided tape 60 is used as a strong adhesive material, the other side forms an adhesive layer 20, the adhesive surface is used for strong bonding adhesion, The adhesive surface is used to remove traces when removing board or attaching the board.

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상기 점착식 보드판(10)은 사용 용도와 목적에 따라 인쇄를 위한 디자인을 한다.The adhesive board 10 is designed for printing according to the intended use and purpose.

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또한 상기 디자인을 선정한 보드판(10) 재료에 인쇄 공정을 수행한다.Also, a printing process is performed on the board 10 material of the design.

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또한 상기 보드판(10) 면에 점착 또는 접착 코팅 시, 두께를 형성하고 형상별 및 부분 점착 코팅 또는 엠보싱 코팅을 위한 코팅용 제판 제작을 한다. In addition, when the adhesive or adhesive coating on the surface of the board plate 10, the thickness is formed and the plate-making for coating for the shape-specific and partial adhesive coating or embossing coating.

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상기 점착제층(20)은 사용 조건에 따라 보드판(10)의 전체에 코팅을 하거나 또는 부분적으로 코팅을 할 수 있다.The pressure-sensitive adhesive layer 20 may be coated or partially coated on the entire board plate 10 according to the use conditions.

상기 보드판(10)을 합지 대상물에 합지 또는 설치면(80)에 설치 할 수 있도록 보드판(10)에 배면 점착제층(72)을 형성하는데 배면 점착제층(72)은, 보드판(10)을 합지 대상물 및 설치면(80)에서 제거 시 또는 이동 부착 시 흔적을 남지 않게 하기 위하여는 점착물질을 사용하며, 합지대상물과 완전 합지를 원할 때에는 접착력이 강한 접착물질을 사용한다.The back pressure-sensitive adhesive layer 72 is formed on the board board 10 so that the board board 10 may be laminated on the lamination object or installed on the mounting surface 80. And in order not to leave a trace when removed or removed from the installation surface 80, the adhesive material is used, the adhesive material having a strong adhesive strength is used when the complete object and the lamination.

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상기 양면 테이프(60)의 일면은 점착제층(20)을, 또 다른 일면은 접착제층을 형성하여 상기 양면 테이프(60) 사용 시 강한 접착력이 요구되는 설치면(80)에는 접착제층을 형성하고, 약한 점착력이 요구되는 설치면(80)에는 점착제층(20)을 형성한다.One side of the double-sided tape 60 forms an adhesive layer 20, and the other side forms an adhesive layer to form an adhesive layer on the installation surface 80 where strong adhesive force is required when the double-sided tape 60 is used. An adhesive layer 20 is formed on the installation surface 80 where weak adhesive force is required.

상기 점착물질 및 접착물질 코팅층 형성을 엠보싱 코팅 처리하여 보호필름(50), 이형지(73) 또는 합지대상물에 합지 및 제거를 보다 더 편리하게 할 수 있다.Embossing coating treatment to form the adhesive material and the adhesive material coating layer can be more conveniently laminated and removed on the protective film 50, the release paper 73 or the object to be laminated.

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상기 보드판(10) 면에 점착제층(20) 형성을 위한 코팅 시 일반적 재료를 사용할 경우에는 프라이머 코팅의 필요성이 없지만, 목재, 콜크, 유리, 섬유, 프라스틱, 아크릴, 금속, 고무 등 재료 표면이 점착제가 안착될 수 없을 정도로 표면장력 상태가 낮은 소재에 코팅 시에는 점착제의 탈락을 방지하고 결합을 확고히 하여 점착제층(20)이 장기간 유지될 수 있도록 프라이머코팅을 할 필요가 있다.When using a general material for coating to form the pressure-sensitive adhesive layer 20 on the board 10, there is no need for primer coating, but the surface of the material such as wood, cork, glass, fiber, plastic, acrylic, metal, rubber, etc. When coating on a material having a low surface tension so that it cannot be seated, it is necessary to coat the primer so that the adhesive layer 20 can be maintained for a long time by preventing dropping of the adhesive and firmly bonding.

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상기 점착제 코팅 후에는 보드판(10)의 변형이나 손상을 막고 보드판(10) 면에 코팅된 점착제 중 용제 성분을 증발 건조시키어 점착제의 원료 성분만 보드판(10) 표면에 미립자로 적층될 수 있도록 건조 또는 경화 처리를 한다.After the pressure-sensitive adhesive coating to prevent deformation or damage of the board board 10 and to evaporate to dry the solvent component of the pressure-sensitive adhesive coated on the surface of the board board 10 so that only the raw material of the pressure-sensitive adhesive is laminated on the surface of the board board 10 as fine particles or Hardening treatment is performed.

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상기 점착식 보드판(10)에 보호필름(50), 이형지(73), 또는 합지 대상물을 합지함에 있어서는 보드판 전면 점착제층(20) 상으로 상기 보호필름(50)을 합지하고 보드판(10) 후면 점착제층(20) 상으로 이형지(73)를 합지한다.In laminating the protective film 50, the release paper 73, or the object to be laminated on the adhesive board 10, the protective film 50 is laminated onto the board adhesive front adhesive layer 20, and the adhesive backing the board board 10. The release paper 73 is laminated onto the layer 20.

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상기 점착식 보드판(10)을 설치면(80)에 결합시키기 위하여 보드판(10) 후면에 점착제를 도포하여 사용할 수 있는데, 보드판(10) 설치 시 탈, 부착을 보다 용이하게 하고, 부착 시 기포 발생 방지를 위해 보드판 점착 코팅 표면에 엠보싱 처리를 할 수 있다.In order to bond the adhesive board 10 to the installation surface 80, an adhesive may be applied to the back of the board 10, and the board board 10 may be easily detached and attached, and bubbles may be generated when the board 10 is installed. To prevent this, the board adhesive coating surface can be embossed.

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상기 점착식 보드판(10)을 설치면에 결합시키기 위한 결합부재(30)로는 양면 테이프(60)를 이용할 수 있는데, 상기 양면 테이프(60)의 접착제층 또는 점착제층(20)은, 합지재와 완전 합지를 원할 때에는 접착력이 강한 접착제층을 사용하고, 점착제층(20)은 보드판 제거 또는 이동 부착 시 흔적을 남지 않게 하기 위하여 사용한다.A double-sided tape 60 may be used as the coupling member 30 for coupling the adhesive board 10 to the installation surface, and the adhesive layer or the adhesive layer 20 of the double-sided tape 60 may be formed of a laminated material. When full lamination is desired, a strong adhesive layer is used, and the pressure-sensitive adhesive layer 20 is used so as not to leave a trace when the board is removed or moved.

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상기 보드판(10)의 재단 시에는 보드판(10)의 균열, 파손, 휨 현상 등에 의한 손상 없이 상기 점착식 보드판(10)을 사용 용도에 맞는 규격과 형상으로 만들기 위해 톰슨재단 공정을 수행한다.When cutting the board 10, the Thomson Foundation process is performed in order to make the adhesive board 10 with a size and shape suitable for the intended use without being damaged by cracks, breaks, or warpage of the board 10.

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도 1은 본 발명에 따른 점착식 보드판의 설치상태 사시도,1 is a perspective view of an installation state of a pressure-sensitive adhesive board according to the invention,

도 2는 점착제층, 보드판, 결합부재의 단면도,2 is a cross-sectional view of the pressure-sensitive adhesive layer, board plate, the coupling member,

도 3은 점착제층, 프라이머코팅층, 인쇄층, 보드판, 결합부재의 단면도,3 is a cross-sectional view of the pressure-sensitive adhesive layer, primer coating layer, printed layer, board board, the coupling member,

도 4는 보호필름, 점착제층, 인쇄층, 보드판, 결합부재의 단면도,4 is a cross-sectional view of a protective film, an adhesive layer, a printing layer, a board plate, a coupling member,

도 5는 결합부재인 양면 테이프에 점착코팅이 된 것을 나타내는 단면도,Figure 5 is a cross-sectional view showing that the adhesive coating on the double-sided tape that is the coupling member,

도 6 은 보드판 및 엠보싱층이 포함된 투명패드에 배면 점착 코팅이 된 것을 나타내는 단면도,6 is a cross-sectional view showing a back adhesive coating on a transparent pad including a board and an embossed layer;

도 7은 투명필름에 프라이머코팅과 배면 점착코팅이 된 것을 나타내는 단면도.Figure 7 is a cross-sectional view showing that the primer coating and the back adhesive coating on the transparent film.

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[부호의 설명] [Description of Symbols]

10 : 보드판 15 : 프라이머코팅층  10: board 15: primer coating layer

20 : 점착제 층 21 : 정보지  20: adhesive layer 21: information sheet

25 : 투명필름 30 : 결합부재
25: transparent film 30: bonding member

40 : 인쇄층 50 : 보호필름
40: printed layer 50: protective film

60 : 양면 테이프 70 : 투명패드60: double-sided tape 70: transparent pad

71 : 엠보싱층 72 : 배면 점착제층 73 : 이형지 80 : 설치면71: embossed layer 72: back pressure-sensitive adhesive layer 73: release paper 80: mounting surface

Claims (18)

삭제delete 삭제delete 삭제delete 보드판을 디자인하고 인쇄하는 제1단계;A first step of designing and printing a board; 상기 제1단계에서 마련된 보드판의 코팅을 위한 제판을 제작하는 제2단계;A second step of manufacturing a plate for coating the board plate provided in the first step; 상기 제2단계에서 제판된 보드판의 표면에 프라이머코팅을 하는 제3단계;A third step of primer coating on the surface of the board plate made in the second step; 상기 제3단계에서 프라이머코팅된 보드판의 표면에 점착물질을 엠보싱코팅하는 제4단계;A fourth step of embossing an adhesive material on the surface of the board coated with the primer in the third step; 상기 제4단계에서 코팅된 점착물질을 건조 및 경화하는 제5단계;A fifth step of drying and curing the adhesive material coated in the fourth step; 상기 제5단계에서 건조 및 경화된 점착물질에 보호필름을 합지하는 제6단계;A sixth step of laminating the protective film on the adhesive material dried and cured in the fifth step; 상기 제6단계까지 마련된 보드판을 재단하는 제7단계;A seventh step of cutting the board board provided up to the sixth step; 상기 제7단계에서 마련된 보드판에 결합부재를 구비하는 제8단계;An eighth step of providing a coupling member on the board plate provided in the seventh step; 를 포함하는 제작방법에 의하여 제작되는 것을 특징으로 하는 점착식 보드판.Adhesive board, characterized in that produced by the manufacturing method comprising a. 삭제delete 삭제delete 삭제delete 삭제delete 삭제delete 삭제delete 삭제delete 삭제delete 삭제delete 삭제delete 삭제delete 삭제delete 삭제delete 삭제delete
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