KR101127884B1 - Flipping apparatus for semiconductor chip - Google Patents

Flipping apparatus for semiconductor chip Download PDF

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KR101127884B1
KR101127884B1 KR1020090076764A KR20090076764A KR101127884B1 KR 101127884 B1 KR101127884 B1 KR 101127884B1 KR 1020090076764 A KR1020090076764 A KR 1020090076764A KR 20090076764 A KR20090076764 A KR 20090076764A KR 101127884 B1 KR101127884 B1 KR 101127884B1
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semiconductor chip
flip
picker
chip
inverted
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KR20110019160A (en
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류기웅
박덕수
이상률
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주식회사 쎄크
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67796—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations with angular orientation of workpieces
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67784—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations using air tracks
    • H01L21/67787—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations using air tracks with angular orientation of the workpieces
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0408—Incorporating a pick-up tool

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

반도체 칩 반전장치에 관한 것으로, 웨이퍼로부터 반도체 칩을 흡착하여 180도 반전 이동시키는 플립부; 상기 플립부에 의해 반전된 반도체 칩을 상기 플립부로부터 흡착하여 재반전시키는 넌플립부; 및, 상기 플립부 또는 넌플립부로부터 반도체 칩을 흡착하는 수직픽커를 구비하고, 상기 수직픽커에 의해 흡착된 반도체 칩 마운터로 이송하는 버스에 안착시키기 위한 픽커부;를 포함하며, 상기 플립부에 의해 반전된 반도체 칩은 상기 넌플립부에 의해 선택적으로 재반전되는 것을 특징으로 한다.A semiconductor chip reversing apparatus, comprising: a flip unit for absorbing a semiconductor chip from a wafer and inverting the substrate by 180 degrees; A non-flip portion for absorbing and reversing the semiconductor chip inverted by the flip portion from the flip portion; And a picker unit having a vertical picker for adsorbing the semiconductor chip from the flip part or the non-flip part, for picking up a bus to be transported to the semiconductor chip mounter adsorbed by the vertical picker. The semiconductor chip inverted by is selectively reinverted by the non-flip portion.

플립칩, 반도체 칩, 진공흡착, 반전, 재반전, 플립핑, 넌플립핑 Flip Chip, Semiconductor Chip, Vacuum Suction, Invert, Re-Invert, Flipping, Non-Fliping

Description

반도체 칩 반전장치{Flipping apparatus for semiconductor chip}Flipping apparatus for semiconductor chip

본 발명은 반도체 칩의 반전장치 및 이를 이용한 방법에 관한 것으로, 특히 웨이퍼의 반도체 칩을 진공흡착하여 플립 또는 넌플립 상태로 반전 또는 재반전시킨 후 칩 마운터로 반도체 칩을 이송하는 셔틀에 안착시키는 반도체 칩의 반전장치 및 이를 이용한 방법에 관한 것이다.BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor chip inverting apparatus and a method using the same. In particular, a semiconductor chip is vacuum-adsorbed to a flip or non-flip state to be inverted or reinverted and then mounted on a shuttle for transferring the semiconductor chip to a chip mounter. It relates to a chip inversion device and a method using the same.

일반적으로, 쏘잉(sawing) 작업을 거쳐 다수의 반도체 칩으로 분할된 웨이퍼는 칩 반전장치를 통해 각각의 반도체 칩을 순차적으로 픽업하여 소정 장치 예를 들면, 칩 마운터 등으로 이송된다.In general, a wafer divided into a plurality of semiconductor chips through a sawing operation is sequentially picked up through the chip reversing apparatus and transferred to a predetermined device, for example, a chip mounter.

이와 같은 종래의 반도체 칩을 반전하기 위한 반전장치는 통상 소정의 진공압을 이용하여 반도체 칩을 흡착하되, 각 다이본딩방식에 따라 반도체 칩이 반전된 상태로 배치되어 칩 마운터로 이송할 필요가 있다.Such a conventional inverting device for inverting the semiconductor chip is usually used to suck the semiconductor chip using a predetermined vacuum pressure, it is necessary to transfer the semiconductor chip in the inverted state in accordance with each die bonding method to the chip mounter. .

이에 따라 작업장에서는 다이본딩방식에 대응하여 반도체 칩을 반전상태로 픽업하는 반전장치와, 재반전상태 즉, 웨이퍼로부터 반전시키지 않고 그대로 픽업하는 장치를 함께 구비하였다.Accordingly, in the workshop, an inverting apparatus for picking up a semiconductor chip in an inverted state corresponding to the die bonding method is provided, and a device for picking up the inverted state as it is without inverting it from the wafer.

그런데, 이와 같이 최소 2종류의 장비를 함께 구비해야 하므로, 장비의 구매비용이 증가할 뿐만 아니라, 이와 같은 장비 들을 단일 라인 상에 설치해야하므로 공간이 협소한 작업장에서는 설치가 곤란한 문제점이 있었다.However, since at least two types of equipment must be provided as described above, the purchase cost of the equipment is increased, and such equipment must be installed on a single line.

상기 문제점을 해결하기 위해, 본 발명은 단일 장치에서 와이어 본딩 및 플립칩 본딩 등 적용되는 각 다이본딩방식에 대응하여 반도체 칩을 선택적으로 플립 또는 넌플립상태로 반전시킬 수 있는 반도체 칩의 반전장치를 제공하는 데 목적이 있다.In order to solve the above problems, the present invention provides a semiconductor chip inversion apparatus capable of selectively inverting the semiconductor chip into a flip or non-flip state corresponding to each die bonding method applied to wire bonding and flip chip bonding in a single device. The purpose is to provide.

또한, 본 발명의 다른 목적은 단일장치 내에서 반도체 칩을 선택적으로 플립 또는 넌플립 동작을 신속하게 변경가능한 반도체 칩의 반전/재반전방법을 제공하는 데 있다.Another object of the present invention is to provide a method for inverting / reversing a semiconductor chip capable of rapidly changing a flip or non-flip operation of a semiconductor chip in a single device.

상기 목적을 달성하기 위해, 본 발명은 웨이퍼로부터 반도체 칩을 흡착하여 180도 반전 이동시키는 플립부; 상기 플립부에 의해 반전된 반도체 칩을 상기 플립부로부터 흡착하여 재반전시키는 넌플립부; 및, 상기 플립부 또는 넌플립부로부터 반도체 칩을 흡착하는 수직픽커를 구비하고, 상기 수직픽커에 의해 흡착된 반도체 칩 마운터로 이송하는 버스에 안착시키기 위한 픽커부;를 포함하며, 상기 플립부에 의해 반전된 반도체 칩은 상기 넌플립부에 의해 선택적으로 재반전되는 것을 특징으로 하는 반도체 칩 반전장치를 제공한다.In order to achieve the above object, the present invention provides a flip portion for absorbing the semiconductor chip from the wafer 180 degrees reverse movement; A non-flip portion for absorbing and reversing the semiconductor chip inverted by the flip portion from the flip portion; And a picker unit having a vertical picker for adsorbing the semiconductor chip from the flip part or the non-flip part, for picking up a bus to be transported to the semiconductor chip mounter adsorbed by the vertical picker. The semiconductor chip inverted by the present invention provides a semiconductor chip inverting device which is selectively inverted by the non-flip part.

상기 넌플립부는, 상기 플립부에 의해 반전된 칩을 흡착한 후 180도 회전하는 흡착로터; 및, 상기 수직픽커가 칩을 흡착하는 제1 위치와 제1 위치로부터 벗어난 제2 위치 중 어느 한 곳으로 상기 흡착로터를 이동시키는 가동브라켓;을 포함할 수 있다.The non-flip unit may include: a suction rotor rotating 180 degrees after absorbing the chip inverted by the flip unit; And a movable bracket for moving the suction rotor to any one of a first position in which the vertical picker sucks the chip and a second position deviating from the first position.

이 경우, 상기 가동브라켓은 상기 플립부 측으로 수평방향으로 전후진하는 것이 바람직하다.In this case, the movable bracket is preferably moved back and forth in the horizontal direction toward the flip portion.

본 발명은 (a) 웨이퍼의 반도체 칩을 픽업하는 단계; (b) 상기 반도체 칩을 반전시키는 단계; (c) 반전된 상기 반도체 칩을 선택적으로 재반전시키는 단계; 및 (d) 반전 또는 재반전된 상기 반도체 칩을 픽업하는 단계;를 포함하는 것을 특징으로 하는 반도체 칩 반전/재반전방법을 제공함으로써, 상기 목적을 달성할 수 있다. The present invention includes the steps of (a) picking up the semiconductor chip of the wafer; (b) inverting the semiconductor chip; (c) selectively reversing the inverted semiconductor chip; And (d) picking up the inverted or reinverted semiconductor chip, thereby providing the semiconductor chip inverting / reversing method.

상기한 바와 같이 본 발명에 있어서는, 단일 장치 내에 플립부와 넌플립부를 함께 구비함으로써, 각 다이본딩방식에 대응하는 반도체 칩 반전장치를 별도로 구비할 필요없이 플립 및 넌플립 동작을 구현할 수 있으므로 불필요한 장비의 구매비용을 절감시킬 수 있는 이점이 있다.As described above, in the present invention, since the flip part and the non-flip part are provided together in a single device, flip and non-flip operations can be implemented without the need for a separate semiconductor chip reversing device corresponding to each die bonding method. There is an advantage to reduce the purchase cost of.

아울러 본 발명은 2종류의 반전장치를 단일화함에 따라 전체적인 크기를 줄임으로써 비교적 협소한 공간에도 설치가 가능하므로 작업장 내의 공간활용을 효과적으로 행할 수 있다.In addition, the present invention can be installed in a relatively narrow space by reducing the overall size by unifying the two types of inverting device can effectively use the space in the workplace.

더욱이, 본 발명은 각 다이본딩방식에 대응하여 신속하게 플립 또는 넌플립작동을 변경함에 따라, 작업의 유연성을 향상시킬 수 있다.Moreover, the present invention can improve the flexibility of the work by quickly changing the flip or non-flip operation in correspondence with each die bonding method.

이하, 본 발명의 일 실시예에 따른 반도체 칩의 반전장치의 구성을 첨부된 도면을 참고하여 설명한다.Hereinafter, the configuration of a semiconductor chip inversion apparatus according to an embodiment of the present invention will be described with reference to the accompanying drawings.

본 실시예의 반도체 칩 반전장치는 웨이퍼(1)로부터 일정 규격으로 미리 쏘잉(sawing)된 반도체 칩(3)을 처리하는 플립부(10)와, 플립부(10)에 의해 반전된 반도체 칩(3)을 재반전하기 위한 넌플립부(30)와, 플립부(10) 또는 넌플립부(30)로부터 반도체 칩(3)을 취하여 칩 마운터(80) 측으로의 이송을 돕는 픽커부(50)를 포함한다. The semiconductor chip reversing apparatus of this embodiment includes a flip portion 10 for processing a semiconductor chip 3 previously sawed from the wafer 1 to a predetermined standard, and a semiconductor chip 3 inverted by the flip portion 10. ), The non-flip part 30 for reversing the) and the picker part 50 which takes the semiconductor chip 3 from the flip part 10 or the non-flip part 30 and assists the transfer to the chip mounter 80 side. Include.

플립부(10)는 지지블록(11), 선회픽커(13) 및 제1 구동모터(15) 및 제1 동력전달수단(17)을 포함한다.The flip portion 10 includes a support block 11, a pivot picker 13, a first drive motor 15, and a first power transmission unit 17.

지지블록(11)은 수직 프레임(12)의 제1 가이드 레일(12a)을 따라 승강하는 가동플레이트(12b)에 설치된다. 이와 같이 승강 가능하게 설치된 지지블록(11)은 선회픽커(13)를 웨이퍼(1)의 반도체 칩(3)을 진공흡착하도록 소정 거리 하강시키고, 또한 흡착한 반도체 칩(3)을 흡착로터(33) 또는 수직픽커(53)로 전달할 수 있는 위치인 제1 위치(P1)로 소정 거리 상승시킨다.The support block 11 is installed on the movable plate 12b that moves up and down along the first guide rail 12a of the vertical frame 12. The support block 11 provided in such a manner as to be capable of lifting and lowering lowers the pivot picker 13 by a predetermined distance so as to vacuum suck the semiconductor chip 3 of the wafer 1, and further, the suction chip 33 holds the sucked semiconductor chip 3. Or a predetermined distance is raised to the first position P1 which is a position that can be transmitted to the vertical picker 53.

선회픽커(13)는 일측으로 편향된 회전 중심(C)이 지지블록(11)의 일부에 회전 가능하게 설치된다. 이와 같은 선회픽커(13)는 흡착면(13a)을 통해 웨이퍼(1)의 반도체 칩(3)을 흡착하여 180도 선회함으로써 반도체 칩(3)을 180도로 플립핑(flipping)하여 반전(反轉) 상태로 이송한다. The pivot picker 13 is rotatably installed at a part of the support block 11 with the rotational center C deflected to one side. The pivot picker 13 sucks the semiconductor chip 3 of the wafer 1 through the adsorption surface 13a and pivots 180 degrees, thereby flipping the semiconductor chip 3 by 180 degrees and inverting it. Transfer to) state.

제1 구동모터(15)는 선회픽커(13)로 회전력을 제공하며, 지지블록(11)에 고정 설치된다. 이때 제1 구동모터(15)는 지지블록(11)의 승강 동작 시 가이드 레일(12a)에 간섭되지 않도록 제1 가이드 레일(12a)로부터 멀어진 위치의 지지블록(11) 일부에 설치된다. 이와 함께 제1 구동모터(15)는 선회픽커(13)와의 거리도 소정 간격으로 이격되므로, 제1 동력전달수단(17)을 매개로 하여 선회픽커(13)로 제1 구동모터(15)의 회전력을 전달한다.The first driving motor 15 provides a rotational force to the pivot picker 13 and is fixedly installed on the support block 11. In this case, the first driving motor 15 is installed at a part of the support block 11 at a position away from the first guide rail 12a so as not to interfere with the guide rail 12a during the lifting operation of the support block 11. In addition, since the first drive motor 15 is also spaced apart from the pivot picker 13 at a predetermined interval, the first drive motor 15 is connected to the pivot picker 13 via the first power transmission means 17. Transmit torque.

제1 동력전달수단(17)은 제1 구동모터(15)의 구동축에 설치되는 구동풀리(17a)를 구비하고, 선회픽커(13)와 함께 회전하도록 선회픽커(13)의 회전 중심에 고정 설치된 종동풀리(17b)를 구비한다. 상기 한쌍의 풀리(17a,17b)는 구동벨트(17c)로 상호 연결된다.The first power transmission means 17 has a drive pulley 17a installed on the drive shaft of the first drive motor 15 and is fixedly installed at the rotation center of the swing picker 13 to rotate together with the swing picker 13. The driven pulley 17b is provided. The pair of pulleys 17a and 17b are connected to each other by a drive belt 17c.

넌플립부(30)는 제2 가이드 레일(31), 가동브라켓(32), 흡착로터(33), 제2 구동모터(35) 및 제2 동력전달수단(37)을 포함한다.The non-flip part 30 includes a second guide rail 31, a movable bracket 32, a suction rotor 33, a second drive motor 35, and a second power transmission means 37.

제2 가이드 레일(31)은 수직프레임(12) 일측에 소정 간격을 두고 배치된다. 가동브라켓(32)은 제2 가이드 레일(31)을 따라 수직프레임(12) 측으로 수평방향으로 전진 및 후진한다.The second guide rail 31 is disposed at a predetermined interval on one side of the vertical frame 12. The movable bracket 32 moves forward and backward in the horizontal direction along the second guide rail 31 toward the vertical frame 12.

흡착로터(33)는 흡착로터(33)의 중심에 설치된 회전축(34)을 통해 가동브라켓(32)의 일측에 회전 가능하게 설치된다. 또한 흡착로터(33)는 가동브라켓(32)에 의해 제1 위치(P1)로 이동하며, 이와 같이 흡착로터(33)는 제1 위치(P1)로 이동로 이동하는 경우, 선회픽커(13)에 의해 반전된 상태의 반도체 칩(3)을 흡착면(33a)을 통해 흡착하여 180도 자전함으로써 반도체 칩(3)을 180도로 플립핑하여 재반전(再反轉) 상태로 이송한다.The suction rotor 33 is rotatably installed on one side of the movable bracket 32 through the rotating shaft 34 installed at the center of the suction rotor 33. In addition, when the suction rotor 33 moves to the first position P1 by the movable bracket 32, and thus the suction rotor 33 moves to the first position P1, the pivot picker 13 The semiconductor chip 3 in the inverted state is sucked through the adsorption surface 33a and rotated 180 degrees, thereby flipping the semiconductor chip 3 to 180 degrees and transferring it to the reversal state.

또한, 반도체 칩(3)의 종류에 따라 선회픽커(13)에 의해 이송된 반도체 칩(3)을 재반전할 필요가 없는 경우, 흡착로터(33)는 가동브라켓(32)의 후진에 의해 제2 위치(P2)로 이동하여 대기한다. 이와 같이 흡착로터(33)는 필요에 따라 선택적으로 제1 및 제2 위치(P1,P2)로 이동하여 반도체 칩(3)을 재반전시킬 수 있다.In addition, when it is not necessary to reinvert the semiconductor chip 3 transferred by the swing picker 13 according to the type of the semiconductor chip 3, the suction rotor 33 is moved by reversing the movable bracket 32. Move to position P2 and wait. As described above, the suction rotor 33 may selectively move to the first and second positions P1 and P2 to reinvert the semiconductor chip 3 as necessary.

제2 구동모터(35)는 가동브라켓(32)에 설치되며, 제2 동력전달수단(37)을 통해 흡착로터(33)로 회전력을 전달한다.The second drive motor 35 is installed on the movable bracket 32 and transmits the rotational force to the suction rotor 33 through the second power transmission means 37.

제2 동력전달수단(37)은 제2 구동모터(35)의 구동축에 설치되는 구동풀리(37a)를 구비하고, 흡착로터(33)의 회전축(34)에 고정 설치되는 종동풀리(37b)를 구비한다. 상기 한쌍의 풀리(37a,37b)는 구동벨트(37c)로 상호 연결된다.The second power transmission means 37 includes a drive pulley 37a installed on the drive shaft of the second drive motor 35 and has a driven pulley 37b fixedly installed on the rotation shaft 34 of the suction rotor 33. Equipped. The pair of pulleys 37a and 37b are interconnected by drive belts 37c.

픽커부(50)는 수직가이드 블록(51), 수직픽커(53), X 및 Y축방향 구동부(55,57)을 포함한다.The picker unit 50 includes a vertical guide block 51, a vertical picker 53, and X and Y axis drivers 55 and 57.

수직가이드 블록(51)은 X축방향 구동부(55) 일측에 고정 설치되며, 수직픽커(53)를 승강 가능하게 지지한다.The vertical guide block 51 is fixedly installed at one side of the X-axis driving unit 55, and supports the vertical picker 53 to be elevated.

수직픽커(53)는 선회픽커(13) 또는 흡착로터(33)에 의해 제1 위치로 이송된 반도체 칩(3)을 수직픽커(53)의 흡착면(53a)으로 흡착한다.The vertical picker 53 sucks the semiconductor chip 3 transferred to the first position by the swing picker 13 or the suction rotor 33 to the suction surface 53a of the vertical picker 53.

X 및 Y축방향 구동부(55,57)는 반도체 칩(3)을 흡착한 상태의 수직픽커(53)를 칩 마운터(80)로 반도체 칩을 이송할 버스(75,77)로 안내한다. 이 경우 수직픽커(53)는 X 및 Y축방향 구동부(55,57)에 의해 버스(75,77) 상측까지 이동하면, 소정 거리 하강하여 반도체 칩(3)을 버스(75,77)에 안착시킨다.The X and Y axis drivers 55 and 57 guide the vertical pickers 53 in the state where the semiconductor chips 3 are adsorbed to the bus mounts 75 and 77 to transfer the semiconductor chips to the chip mounter 80. In this case, when the vertical picker 53 moves to the upper side of the buses 75 and 77 by the X and Y-axis driving units 55 and 57, the vertical picker 53 descends a predetermined distance and seats the semiconductor chip 3 on the buses 75 and 77. Let's do it.

이와 같이 구성된 본 발명의 일 실시예에 따른 반도체 칩 반전장치의 작동을 설명한다.The operation of the semiconductor chip inversion device according to the embodiment of the present invention configured as described above will be described.

첨부된 도 3은 본 발명의 일 실시예에 따른 반도체 칩 반전장치의 반도체 칩의 반전 동작을 나타내는 개략사시도로써, 재반전을 위한 넌플립부는 생략하였고, 도 4a 및 도 4b는 본 발명의 일 실시예에 따른 반도체 칩 반전장치의 반도체 칩의 재반전 동작을 나타내는 개략사시도이다.3 is a schematic perspective view illustrating an inversion operation of a semiconductor chip of a semiconductor chip inversion apparatus according to an embodiment of the present invention, and a non-flip portion for reversal is omitted, and FIGS. 4A and 4B illustrate an embodiment of the present invention. It is a schematic perspective view which shows the reinversion operation of the semiconductor chip of the semiconductor chip inversion apparatus which concerns on an example.

먼저 도 1 및 도 3을 참고하면, 웨이퍼 이송대(60)에 안착된 웨이퍼(1)는 다수의 반도체 칩(3)으로 쏘잉된 상태이다. 이 경우 웨이퍼 이송대(60)는 전후좌우로 평면방향으로 이동하면서 매번 픽업될 해당 반도체 칩(3)이 선회픽커(13)의 흡착면(13a)에 대응하도록 그 위치를 변경한다.First, referring to FIGS. 1 and 3, the wafer 1 seated on the wafer carrier 60 is sawed by a plurality of semiconductor chips 3. In this case, the wafer transfer table 60 moves in the planar direction from front to back, left and right, and changes its position so that the semiconductor chip 3 to be picked up each time corresponds to the suction surface 13a of the swing picker 13.

반도체 칩(3)이 선회픽커(13)의 흡착면(13a)과 상호 대응하는 위치에 세팅되면, 지지블록(11)은 소정 거리 하강하게 되고 선회픽커(13)는 흡착면(13a)에 발생하는 진공압을 이용하여 반도체 칩(3)을 흡착한다.When the semiconductor chip 3 is set at a position corresponding to the suction surface 13a of the swing picker 13, the support block 11 is lowered by a predetermined distance and the swing picker 13 is generated on the suction surface 13a. The semiconductor chip 3 is adsorbed using the vacuum pressure.

이 상태에서, 선회픽커(13)는 180도 선회하여 반도체 칩(3)을 반전시킨다. 그 후, 지지블록(11)이 미리 설정된 거리만큼 상승하여 선회픽커(13)를 제1 위치(P1)로 이동시킨다.In this state, the turning picker 13 turns 180 degrees to invert the semiconductor chip 3. Thereafter, the support block 11 rises by a predetermined distance to move the pivot picker 13 to the first position P1.

수직픽커(53)는 상기 선회픽커(13)의 상승과 함께, 제1 위치(P1)로 하강하여, 반전된 반도체 칩(3)을 선회픽커(13)로부터 흡착한다. 계속해서 수직픽커(53)는 소정 거리 상승한 뒤 X축 및 Y축방향 구동부(55,57)의 작동에 따라 제1 셔틀(71)의 로딩위치에 배치된 버스(75)가 대기하는 곳으로 이동한다.The vertical picker 53 descends to the first position P1 with the rising of the swing picker 13, and the inverted semiconductor chip 3 is sucked from the swing picker 13. Subsequently, the vertical picker 53 rises a predetermined distance and moves to a place where the bus 75 arranged at the loading position of the first shuttle 71 waits according to the operation of the X-axis and Y-axis driving units 55 and 57. do.

이어서, 수직픽커(53)는 소정 거리 하강하여 반도체 칩(3)을 버스(75)에 안 착시킨다.Subsequently, the vertical picker 53 descends a predetermined distance to seat the semiconductor chip 3 on the bus 75.

본 실시예의 반도체 칩 반전장치는 상기와 같은 과정을 반복적으로 행하여 버스(75)의 로딩 개수에 해당하는 만큼 반도체 칩(3)을 안착시킨다.In the semiconductor chip inverting apparatus of the present embodiment, the above-described process is repeatedly performed to seat the semiconductor chip 3 corresponding to the number of loadings of the bus 75.

그 후, 버스(75)는 제1 셔틀(71)을 따라 제1 셔틀(71)의 언로딩위치로 이동하고, 칩 마운터(80)의 헤드(79)는 버스(75)의 다수의 반도체 칩(3)을 흡착하여 칩 마운터(80)의 소정위치로 이동시킨다.Thereafter, the bus 75 moves along the first shuttle 71 to the unloading position of the first shuttle 71, and the head 79 of the chip mounter 80 moves a plurality of semiconductor chips of the bus 75. (3) is attracted and moved to the predetermined position of the chip mounter 80.

본 실시예에서는 셔틀(71,73)과 버스(75,77)를 각각 한 쌍씩 설치한 것을 예로 들어 설명하였으며, 이러한 한쌍의 버스(75,77)는 서로 각 셔틀(71,73)의 로딩/언로딩위치로 교대로 이동하면서, 수직픽커(53)에 의해 반전된 상태의 반도체 칩(3)을 칩 마운터(80) 측으로 이송한다.In the present exemplary embodiment, a pair of shuttles 71 and 73 and buses 75 and 77 are installed as an example, and the pair of buses 75 and 77 loads / loads each shuttle 71 and 73 to each other. While alternately moving to the unloading position, the semiconductor chip 3 in an inverted state by the vertical picker 53 is transferred to the chip mounter 80 side.

한편, 도 2, 도 4a 및 도 4b를 참고하면, 본 실시예의 반전장치는 웨이퍼(1)의 반도체 칩(3)을 최종적으로 재반전시킨 상태 즉, 넌플립핑(non flipping)된 상태로 한쌍의 버스(75,77)에 안착시킬 수 있다.2, 4A, and 4B, the inverting apparatus of this embodiment is a pair in which the semiconductor chip 3 of the wafer 1 is finally inverted, that is, non- flipped. It can be seated on the bus (75, 77).

반도체 칩(3)을 재반전하는 경우, 도 2와 같이, 가동브라켓(32)이 플립부(10) 측을 향해 전진하여 흡착로터(33)를 제2 위치(P2)에서 제1 위치(P1)로 수평 이동한다.When the semiconductor chip 3 is reversed, as shown in FIG. 2, the movable bracket 32 is advanced toward the flip portion 10 to move the suction rotor 33 from the second position P2 to the first position P1. To move horizontally.

이 상태에서, 도 4a를 참고하면, 상술한 본 실시예의 반전 동작과 같이 선회픽커(13)가 반도체 칩(3)을 흡착하여, 180도 선회함으로써 반도체 칩(3)을 반전시킨다. 이어서 지지블록(11)이 미리 설정된 거리만큼 상승하여 선회픽커(13)를 제1 위치(P1)로 이동시키되 흡착로터(33) 하측까지 이동한다.In this state, referring to FIG. 4A, the turning picker 13 sucks the semiconductor chip 3 and turns the semiconductor chip 3 by turning it 180 degrees as in the inversion operation of the present embodiment described above. Subsequently, the support block 11 rises by a predetermined distance to move the pivot picker 13 to the first position P1 but to the lower side of the suction rotor 33.

이미 제1 위치(P1)에서 대기하고 있는 흡착로터(33)는, 도 4b와 같이, 흡착면(33a)를 통해 선회픽커(13)로부터 반전된 상태의 반도체 칩(3)을 흡착한 후, 회전축(34)을 중심으로 180도 회전하여 반도체 칩(3)을 재반전시킨다.The suction rotor 33 already waiting at the first position P1 sucks the semiconductor chip 3 inverted from the swing picker 13 through the suction surface 33a as shown in FIG. 4B. The semiconductor chip 3 is reversed by rotating 180 degrees about the rotation shaft 34.

이때 수직픽커(53)는 상기 흡착로터(33)의 회전과 함께 제1 위치(P1)로 하강하여 재반전된 반도체 칩(3)을 흡착픽커(13)로부터 흡착한다. 상기 반전 동작의 설명과 마찬가지로 수직픽커(53)는 소정 거리 상승한 뒤 X축 및 Y축방향 구동부(55,57)의 작동에 따라 제1 셔틀(71)의 로딩위치에 배치된 제1 버스(75)가 대기하는 곳으로 이동하여, 반도체 칩(3)을 재반전된 상태로 버스(75)에 안착시킨다.At this time, the vertical picker 53 descends to the first position P1 with the rotation of the suction rotor 33 and sucks the re-inverted semiconductor chip 3 from the suction picker 13. As described in the inversion operation, the vertical picker 53 is first bus 75 disposed at a loading position of the first shuttle 71 according to the operation of the X-axis and Y-axis driving units 55 and 57 after a predetermined distance rises. ) Moves to a waiting position, and seats the semiconductor chip 3 on the bus 75 in a state of being inverted again.

이에 따라, 한쌍의 버스(75,77)를 통해 재반전된 상태의 반도체 칩(3)을 칩 마운터(80)로 제공할 수 있다.Accordingly, the semiconductor chip 3 in a state of reversal may be provided to the chip mounter 80 through the pair of buses 75 and 77.

상기한 본 발명은, 단일 장치 내에 플립부(10)와 넌플립부(30)를 함께 구비함으로써, 각 다이본딩방식에 대응하는 반도체 칩 반전장치를 별도로 구비할 필요없이 플립 및 넌플립 동작을 구현할 수 있으므로 불필요한 장비의 구매비용을 절감시킬 수 있다.According to the present invention, the flip unit 10 and the non-flip unit 30 are provided together in a single device, so that flip and non-flip operations can be implemented without having to separately provide a semiconductor chip inverting device corresponding to each die bonding method. This can reduce the cost of purchasing unnecessary equipment.

아울러 본 발명은 2종류의 반전장치를 단일화함에 따라 전체적인 크기를 줄임으로써 비교적 협소한 공간에도 설치가 가능하므로 작업장 내의 공간활용을 효과적으로 행할 수 있다.In addition, the present invention can be installed in a relatively narrow space by reducing the overall size by unifying the two types of inverting device can effectively use the space in the workplace.

도 1은 본 발명의 일 실시예에 따른 반도체 칩 반전장치를 나타내는 것으로, 흡착로터가 제2 위치에 세팅된 상태를 나타내는 도면,1 is a view showing a semiconductor chip reversing apparatus according to an embodiment of the present invention, showing a state in which a suction rotor is set at a second position;

도 2는 본 발명의 일 실시예에 따른 반도체 칩 반전장치를 나타내는 것으로, 흡착로터가 반도체 칩의 재반전을 위해 제1 위치에 세팅된 상태를 나타내는 도면,2 is a view showing a semiconductor chip reversing apparatus according to an embodiment of the present invention, wherein the adsorption rotor is set to a first position for reversal of the semiconductor chip;

도 3은 본 발명의 일 실시예에 따른 반도체 칩 반전장치의 반전 동작을 나타내는 개략사시도,3 is a schematic perspective view showing an inversion operation of a semiconductor chip inversion device according to an embodiment of the present invention;

도 4a 및 도 4b는 본 발명의 일 실시예에 따른 반도체 칩 반전장치의 재반전 동작을 나타내는 개략사시도이다.4A and 4B are schematic perspective views illustrating a reversal operation of a semiconductor chip inversion device according to an embodiment of the present invention.

* 도면 내 주요 부분에 대한 부호 설명 *Explanation of symbols on the main parts of the drawing

10: 플립부 13: 선회픽커10: flip part 13: swing picker

30: 넌플립부 33: 흡착로터30: non-flip part 33: adsorption rotor

50: 픽커부 53: 수직픽커50: picker part 53: vertical picker

Claims (4)

웨이퍼로부터 반도체 칩을 흡착하여 180도 반전 이동시키는 플립부;A flip unit which sucks the semiconductor chip from the wafer and inverts the substrate 180 degrees; 상기 플립부에 의해 반전된 반도체 칩을 상기 플립부로부터 흡착하여 재반전시키는 넌플립부; 및,A non-flip portion for absorbing and reversing the semiconductor chip inverted by the flip portion from the flip portion; And, 상기 플립부 또는 넌플립부로부터 반도체 칩을 흡착하는 수직픽커를 구비하고, 상기 수직픽커에 의해 흡착된 반도체 칩을 칩 마운터로 이송하는 버스에 안착시키기 위한 픽커부;를 포함하며,And a picker unit having a vertical picker for adsorbing the semiconductor chip from the flip or non-flip part, for picking up the semiconductor chip adsorbed by the vertical picker onto a bus for transferring the chip to the chip mounter. 상기 플립부에 의해 반전된 반도체 칩은 상기 넌플립부에 의해 선택적으로 재반전되고,The semiconductor chip inverted by the flip portion is selectively inverted by the non-flip portion, 상기 넌플립부는, 상기 플립부에 의해 반전된 칩을 흡착한 후 180도 회전하는 흡착로터; 및, 상기 수직픽커가 칩을 흡착하는 제1 위치와 제1 위치로부터 벗어난 제2 위치 중 어느 한 곳으로 상기 흡착로터를 이동시키는 가동브라켓;을 포함하는 것을 특징으로 하는 반도체 칩 반전장치.The non-flip unit may include: a suction rotor rotating 180 degrees after absorbing the chip inverted by the flip unit; And a movable bracket for moving the suction rotor to any one of a first position at which the vertical picker sucks the chip and a second position deviating from the first position. 삭제delete 제1항에 있어서, 상기 가동브라켓은 상기 플립부 측으로 수평방향으로 전후진하는 것을 특징으로 하는 반도체 칩 반전장치.The semiconductor chip inverting apparatus according to claim 1, wherein the movable bracket is moved back and forth in the horizontal direction toward the flip portion. 삭제delete
KR1020090076764A 2009-08-19 2009-08-19 Flipping apparatus for semiconductor chip KR101127884B1 (en)

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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5952841A (en) * 1996-02-19 1999-09-14 Kabushiki Kaisha Toshiba Bare chip prober device
US20030161711A1 (en) * 2002-01-30 2003-08-28 Kwan Yim Bun Patrick Chip removal apparatus, chip removal system, fitting system and method of removing chips from a wafer
KR20070059654A (en) * 2005-12-07 2007-06-12 세크론 주식회사 Pick and place system and the method thereof

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5952841A (en) * 1996-02-19 1999-09-14 Kabushiki Kaisha Toshiba Bare chip prober device
US20030161711A1 (en) * 2002-01-30 2003-08-28 Kwan Yim Bun Patrick Chip removal apparatus, chip removal system, fitting system and method of removing chips from a wafer
KR20070059654A (en) * 2005-12-07 2007-06-12 세크론 주식회사 Pick and place system and the method thereof

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