KR101109730B1 - Chiller apparatus for semiconductor process and Method for controlling temperature in the same - Google Patents

Chiller apparatus for semiconductor process and Method for controlling temperature in the same Download PDF

Info

Publication number
KR101109730B1
KR101109730B1 KR1020100044969A KR20100044969A KR101109730B1 KR 101109730 B1 KR101109730 B1 KR 101109730B1 KR 1020100044969 A KR1020100044969 A KR 1020100044969A KR 20100044969 A KR20100044969 A KR 20100044969A KR 101109730 B1 KR101109730 B1 KR 101109730B1
Authority
KR
South Korea
Prior art keywords
temperature
refrigerant
path
expansion valve
compressor
Prior art date
Application number
KR1020100044969A
Other languages
Korean (ko)
Other versions
KR20110125441A (en
Inventor
안상영
Original Assignee
유니셈(주)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 유니셈(주) filed Critical 유니셈(주)
Priority to KR1020100044969A priority Critical patent/KR101109730B1/en
Publication of KR20110125441A publication Critical patent/KR20110125441A/en
Application granted granted Critical
Publication of KR101109730B1 publication Critical patent/KR101109730B1/en

Links

Images

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Air Conditioning Control Device (AREA)
  • Devices That Are Associated With Refrigeration Equipment (AREA)

Abstract

A refrigerant path through which the refrigerant circulates in the chiller device and the process chamber, and a condenser and an expansion valve are sequentially installed on the refrigerant path, connecting a rear end of the compressor and a rear end of the expansion valve. A branch path is installed, and the branch path is branched into a first sub path for low temperature operation and a second sub path for high temperature operation such that a low temperature hot gas bypass valve is installed in the first sub path and the first sub path is provided. A high temperature solenoid valve and a high temperature hot gas bypass valve are respectively installed in the path, and the opening degree of the low temperature and high temperature hot gas bypass valve is adjusted based on the temperature detected by the main temperature sensor installed in the process chamber. A chiller apparatus for a semiconductor process is disclosed.

Description

Chiller apparatus for semiconductor process and method for controlling temperature in the same}

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a chiller apparatus for a semiconductor process, and more particularly to a technique for controlling temperature by directly exchanging a refrigerant without using a cooling fluid.

In the process of manufacturing a semiconductor, the semiconductor processing equipment must maintain a constant temperature inside the chamber at all times, and the equipment that serves to maintain the temperature is a semiconductor chiller.

1 shows a cooling system diagram of a chiller apparatus for a conventional semiconductor process.

As shown, a compressor 10, a condenser 20, an expansion valve 25 and an evaporator 31 are basically required to perform a refrigeration cycle.

In order to supply a cooling fluid of a predetermined temperature to the chamber of the semiconductor processing equipment 40, as shown in Figure 1, the cooling fluid is fixed to the cooling fluid through heat exchange with the evaporator 31 and the cooling fluid heater 33 It needs to be kept at temperature.

This will be described in detail as follows.

The evaporator 31 has a pair of refrigerant inlets and outlets, and another pair of cooling fluid inlets and outlets so that the refrigerant and the cooling fluid can be heat exchanged with each other. 31 and the cooling fluid heater 33 are separated by the tank inner separator 32.

The cooling fluid introduced from the semiconductor processing equipment 40 into the cooling fluid inlet pipe 42 enters the evaporator 31, reaches a temperature below the cooling fluid temperature set by heat exchange with the refrigerant pipe, and then into the cooling fluid tank 30. Discharged.

The cooling fluid cooled below the set temperature is heat-exchanged with the cooling fluid heater 33 in the lower part of the tank inner separator 32 to be set to the set temperature, and then the semiconductor processing equipment through the cooling fluid outlet pipe 41. Flows into (40).

At this time, in order to keep the cooling fluid temperature constant within the deviation range of the set temperature, the cooling fluid heater 33 is turned on / off by PID (proportional, integral, derivative) control.

The above process was a process for maintaining a constant temperature of the cooling fluid, and when raising the set temperature of the cooling fluid to a high temperature outside the existing set temperature deviation range, only the cooling fluid heater 33 without performing a refrigeration cycle. It continues to operate and raises to the changed set temperature, and when the set temperature of the cooling fluid is lowered to a low temperature outside the range of the existing set temperature deviation, only the refrigeration cycle is performed without operating the cooling fluid heater 33 to bring it down to the changed set temperature. .

However, the conventional chiller apparatus has the following problems.

The use of the cooling fluid has a fundamental problem that the pipe is corroded or the cooling fluid itself is acidified.

In addition, in some cases, since a cooling fluid heater for heating the cooling fluid is used, power consumption is large.

In particular, the circulating pump is used to circulate the cooling fluid, and the circulating pump has frequently failed due to the increase of the low temperature and the circulating pressure, and there is a problem that the power consumption is large due to the operation of the circulating pump.

Accordingly, an object of the present invention is to provide a chiller apparatus for a semiconductor process that can solve problems such as pipe corrosion and acidification of the cooling fluid by not using a cooling fluid.

Another object of the present invention is to provide a chiller apparatus for a semiconductor process that can reliably reduce power consumption.

The above object includes a refrigerant path through which a refrigerant circulates through a chiller device and a process chamber, and a condenser and an expansion valve are sequentially installed on the refrigerant path, starting from a compressor, and being at the rear end of the compressor and the rear end of the expansion valve. One branch path is connected to each other, and the branch path is branched into a first sub path for low temperature operation and a second sub path for high temperature operation, and the low temperature hot gas bypass valve is installed in the first sub path. And a high temperature solenoid valve and a high temperature hot gas bypass valve are respectively installed in the first sub path, and the low temperature and high temperature hot gas bypass is based on a temperature detected by a main temperature sensor installed in the process chamber. It is achieved by a chiller apparatus for semiconductor processing in which the opening degree of the valve is controlled.

Preferably, another branch path is formed to connect the rear end of the condenser and the front end of the compressor, and an expansion valve for controlling the suction temperature for controlling the suction temperature of the refrigerant sucked into the compressor may be installed in the other branch path. .

In addition, the front end of the compressor is provided with a refrigerant suction temperature sensor for detecting the temperature of the refrigerant sucked into the compressor, the opening degree of the expansion valve for controlling the suction temperature is adjusted based on the temperature detected by the refrigerant suction temperature sensor. .

Preferably, the expansion valve may be an electronic expansion valve.

The above object includes a refrigerant path through which a refrigerant circulates in a chiller device and a process chamber, wherein the refrigerant evaporates in the process chamber, and on the refrigerant path, a condenser and an expansion valve are sequentially installed starting from a compressor. A temperature control method applied to a chiller device, wherein in a low temperature operation, a high temperature refrigerant flowing along a path connecting the expansion valve at the rear end of the compressor and a refrigerant passing through the expansion valve are mixed and temperature controlled. Is achieved by a temperature control method of a chiller device for a semiconductor process in which a high temperature refrigerant flowing along a different path and a refrigerant passing through the expansion valve are mixed with temperature in addition to the high temperature refrigerant flowing through one path. .

Preferably, the suction temperature of the refrigerant sucked into the compressor may be controlled by adjusting the opening degree of the expansion valve installed in another path connecting the rear end of the condenser and the front end of the compressor.

In addition, the opening degree adjustment may be made based on the temperature detected from the refrigerant suction temperature sensor installed in the front of the compressor.

Preferably, the amount of the high temperature refrigerant flowing through the one path and the other path may be controlled by hot gas bypass valves installed in the respective paths.

According to the above structure, since the heat exchanger is removed and the refrigerant which is the primary cooling fluid is directly evaporated in the process chamber without using the secondary cooling fluid, the temperature response force is improved and the efficiency is improved.
In addition, since the low-temperature and high-temperature hot gas bypass valves are used and the high-temperature refrigerant discharged from the compressor is used as the heat source, the heater can be removed, thereby reducing the power consumption. In addition, precise control is possible by using an electronic expansion valve.
In addition, since the secondary cooling fluid is not used, problems such as corrosion of the pipe and acidification of the cooling fluid can be eliminated.
In addition, since the circulation pump is not used, there is no problem for failure and the power consumption can be reduced to increase the energy saving effect.

1 shows a cooling system diagram of a chiller apparatus for a conventional semiconductor process.
2 shows a cooling system diagram of a chiller apparatus for a semiconductor process of the present invention.
3 shows a refrigerant circulation path during low temperature operation.
4 shows a refrigerant circulation path during high temperature operation.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

2 shows a cooling system diagram of a chiller apparatus for a semiconductor process of the present invention.

Referring to FIG. 2, the chiller device 100 and the process chamber 200 are condenser 102, the receiver 103, and the electronic expansion valve starting from the compressor 101 on the refrigerant path 120 through which the refrigerant circulates. 104 is sequentially installed, and the liquid separator 110 is installed at the outlet exiting the chamber 200.

In addition, based on the flow of the refrigerant is a branch path 130 for connecting the rear end of the compressor 101 and the rear end of the electronic expansion valve 104 is installed, the branch path 130 is again divided into two and one of them The high temperature solenoid valve 107 and the high temperature hot gas bypass valve 105 are respectively provided in the branch path 132, and the low temperature hot gas bypass valve 106 is provided in the other branch path 134.

In addition, the branch path 140 connecting the rear end of the liquid separator 110 starting from the rear end of the receiver 103 is provided with an electronic expansion valve 108 for suction temperature control.

Meanwhile, a main temperature sensor 201 is installed in the process chamber 200 for temperature control, and a refrigerant suction temperature sensor 109 is installed between the liquid separator 110 and the compressor 101.

Therefore, in the present invention, the heat exchanger applied to the conventional chiller apparatus is removed and the chamber 200 is applied as an evaporator.

The refrigerant applied in this embodiment is, for example, R-404A refrigerant, and is directly heat exchanged with the process chamber 200 to maintain the temperature. The process temperature range of the process chamber 200 is -20 ° C to 60 ° C, the low temperature operation temperature band is -20 ° C to 10 ° C, and the high temperature operation temperature band is divided into 20 ° C to 60 ° C.

Therefore, the circulation path of the refrigerant circulates in two ways according to the low temperature operation and the high temperature operation.

Refrigerant circulation path at low temperature operation

3 shows a refrigerant circulation path during low temperature operation.

The refrigerant that maintains the temperature of the process chamber 200 is heat exchanged with the coolant flowing inside the condenser 102 at a high temperature and high pressure state through the compressor 101, and a part of the refrigerant is stored in the receiver 103 in a high pressure liquid state. The refrigerant of the through passes through the electronic expansion valve (104).

In addition, some of the high temperature refrigerant from the compressor 101 flows along the branch path 130 and the branch path 134 to pass through the low temperature hot gas bypass valve 106 to supply a predetermined amount of the high temperature refrigerant according to the set pressure. Mix with cold refrigerant from the electronic expansion valve (104).

The mixed refrigerant passes through the process chamber 200 and is sucked back into the compressor 101 through the liquid separator 110.

Refrigerant circulation path at high temperature

4 shows a refrigerant circulation path during high temperature operation.

The refrigerant circulation path in the high temperature operation is circulated from the compressor 101 to the electronic expansion valve 104 in the same manner as in the low temperature operation.

Meanwhile, as the high temperature solenoid valve 107 is opened, the high temperature refrigerant passes through the branch path 130 and the branch paths 132 and 134 for the low temperature hot gas bypass valve 106 and the high temperature hot gas bypass valve 105. ) Is mixed with the refrigerant from the electronic expansion valve 104 flows into the process chamber 200 and is again sucked into the compressor 101 via the liquid separator 110.

Hereinafter, the operation and the temperature control method of the chiller apparatus of the present invention at low and high temperatures will be described.

Temperature control method at low temperature

Temperature control at low temperature is performed by the operation of the electronic expansion valve 104 and the low temperature hot gas bypass valve 106.

The electronic expansion valve 104 is adjusted through the PID control of the main controller (not shown) fed back to the main temperature sensor 201 installed in the process chamber 200.

The electronic expansion valve 104 may be configured with a total of 500 steps of gears, and the maximum number of steps used is adjusted according to the freezing capacity. For example, if the refrigeration capacity is small, the electronic expansion valve 104 does not need to adjust the opening degree through the gear of the entire 500 steps, so the program to limit this limit the maximum number of operating steps to 250 steps and the remaining 250 Steps can be disabled. Therefore, depending on the freezing capacity, the maximum number of operating steps can be changed from time to time by the restriction program.

Meanwhile, the temperature of the process chamber 200 may be lowered through the electronic expansion valve 104 after receiving feedback from the main temperature sensor 200, but a heat source such as a heater is required to maintain the temperature. To this end, in the present invention, the high temperature refrigerant gas discharged from the compressor 101 through the low temperature hot gas bypass valve 106 is mixed with the cold refrigerant from the electronic expansion valve 104 to maintain a proper temperature.

Temperature control method at high temperature

In order to control the temperature at high temperature, the electronic expansion valve 104 operates in the same way as the temperature control method at low temperature. At the same time, the high temperature solenoid valve 107 is opened and the high temperature refrigerant gas discharged from the compressor 101 through the high temperature hot gas bypass valve 105 is mixed with the cold refrigerant from the electronic expansion valve 104 to be set. To maintain the temperature.

In order to perform the temperature control at a high temperature, since a large amount of heat source is required to increase the temperature, the opening degree of the valve is largely set by using the hot gas bypass valve 105 for high temperature so that a large amount of high temperature refrigerant flows to the process chamber 200. Keep the temperature at In other words, by setting the opening degree of the high temperature hot gas bypass valve 105 larger than the opening degree of the low temperature hot gas bypass valve 106, the hot refrigerant flows more.

On the other hand, when the temperature of the process chamber 200 is a high temperature to receive the temperature feedback from the refrigerant suction temperature sensor 109 installed in front of the compressor 101 to prevent the temperature of the refrigerant sucked into the compressor 101 rises The opening degree of the electronic expansion valve 108 for suction temperature control is adjusted to maintain the suction set temperature.

As described in the above embodiments, since the heat exchanger is removed and the refrigerant which is the primary cooling fluid is directly evaporated in the process chamber without using the secondary cooling fluid, the temperature response force is improved and the efficiency is improved.

In addition, since the low-temperature and high-temperature hot gas bypass valves are used and the high-temperature refrigerant discharged from the compressor is used as the heat source, the heater can be removed, thereby reducing the power consumption. In addition, precise control is possible by using an electronic expansion valve.

In addition, since the secondary cooling fluid is not used, problems such as corrosion of the pipe and acidification of the cooling fluid can be eliminated.

In addition, since the circulation pump is not used, there is no problem for failure and the power consumption can be reduced to increase the energy saving effect.

In the above description, the embodiment of the present invention has been described, but various changes and modifications can be made at the level of those skilled in the art. Therefore, the scope of the present invention should not be construed as being limited to the above embodiments but should be interpreted by the claims described below.

100: chiller device
101: compressor
102: condenser
103: receiver
104: electronic expansion valve
105: high temperature hot gas bypass valve
106: low temperature hot gas bypass valve
107: high temperature solenoid valve
108: electronic expansion valve for suction temperature control
109: refrigerant suction temperature sensor
110: liquid separator
200: process chamber
201: main temperature sensor

Claims (8)

The chiller device and the process chamber are sequentially installed from the compressor on the refrigerant path through which the refrigerant circulates, and a condenser and an electronic expansion valve are sequentially installed, and the refrigerant output from the expansion valve is supplied to the process chamber.
One branch path connecting the rear end of the compressor and the rear end of the expansion valve is installed, and the branch path is branched into a first sub path for low temperature operation and a second sub path for high temperature operation, thereby providing the first sub path. A low temperature hot gas bypass valve is installed in the first sub-path, and a high temperature solenoid valve and a high temperature hot gas bypass valve are respectively installed in the first sub path.
And the opening degree of the low temperature and high temperature hot gas bypass valves is adjusted based on the temperature sensed by the main temperature sensor installed in the process chamber. The method according to claim 1,
Another branch path is formed between the rear end of the condenser and the front end of the compressor, and the expansion valve for controlling the suction temperature for controlling the suction temperature of the refrigerant sucked into the compressor is provided in the other branch path. Process chiller device. The method according to claim 2,
In front of the compressor is provided a refrigerant suction temperature sensor for sensing the temperature of the refrigerant sucked into the compressor,
And the opening degree of the expansion valve for controlling the suction temperature is adjusted based on the temperature sensed by the refrigerant suction temperature sensor. delete The chiller device and the process chamber are sequentially installed on the refrigerant path through which the refrigerant circulates, and a condenser and an electronic expansion valve are sequentially installed, and the refrigerant output from the expansion valve is applied to the semiconductor chiller device supplied to the process chamber. As a temperature control method,
In the low temperature operation, a high temperature refrigerant flowing along one path connecting the expansion valve at the rear end of the compressor and the refrigerant passing through the expansion valve are mixed and temperature controlled.
In the high temperature operation, in addition to the high temperature refrigerant flowing through the one path, the high temperature refrigerant flowing along the other path and the refrigerant passing through the expansion valve are mixed and temperature controlled.
The amount of the high temperature refrigerant flowing through the one path and the other path is controlled by controlling the opening degree of the hot gas bypass valve installed in each path based on the temperature sensed by the main temperature sensor installed in the process chamber. The temperature control method of the chiller apparatus for semiconductor processes. The method according to claim 5,
The temperature control method of the chiller device for a semiconductor process characterized in that for controlling the suction temperature of the refrigerant sucked into the compressor by adjusting the opening degree of the expansion valve installed in another path connecting the rear end of the condenser and the front end of the compressor. The method of claim 6,
The opening degree control is a temperature control method of a chiller device for a semiconductor process, characterized in that made on the basis of the temperature detected from the refrigerant suction temperature sensor installed in the front of the compressor. delete
KR1020100044969A 2010-05-13 2010-05-13 Chiller apparatus for semiconductor process and Method for controlling temperature in the same KR101109730B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020100044969A KR101109730B1 (en) 2010-05-13 2010-05-13 Chiller apparatus for semiconductor process and Method for controlling temperature in the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020100044969A KR101109730B1 (en) 2010-05-13 2010-05-13 Chiller apparatus for semiconductor process and Method for controlling temperature in the same

Publications (2)

Publication Number Publication Date
KR20110125441A KR20110125441A (en) 2011-11-21
KR101109730B1 true KR101109730B1 (en) 2012-02-24

Family

ID=45394888

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020100044969A KR101109730B1 (en) 2010-05-13 2010-05-13 Chiller apparatus for semiconductor process and Method for controlling temperature in the same

Country Status (1)

Country Link
KR (1) KR101109730B1 (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101354474B1 (en) 2013-11-25 2014-01-27 일신네오(주) Chiller apparatus for working process equipment
KR101478175B1 (en) * 2013-03-04 2014-12-31 우범제 Pump down system of temperature controlling apparatus of gas chiller for semiconductor and LCD manufacturing process
KR101523228B1 (en) * 2013-09-26 2015-05-29 우범제 System and method for charging refrigerant of temperature control system for semiconductor manufacturing process facilities using an intermediation of gas
KR101523227B1 (en) * 2013-09-26 2015-05-29 우범제 System and method for checking refrigerant leakage of temperature control system for semiconductor manufacturing process facilities using an intermediation of gas
KR102290890B1 (en) 2020-07-06 2021-08-20 주식회사 에프에스티 Mixed chiller system used in semiconductor processing equipment
KR102425290B1 (en) 2022-02-10 2022-07-27 주식회사 에프에스티 Wide-range rapid temperature control system using multi-stage cascade refrigeration cycle

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101426886B1 (en) * 2013-01-30 2014-08-06 우범제 Controlling method and system for temperature of gas chiller for semiconductor and LCD manufacturing process
KR101426884B1 (en) * 2013-01-30 2014-08-06 우범제 Controlling method and system for temperature of gas chiller for semiconductor and LCD manufacturing process
KR101501176B1 (en) * 2013-07-11 2015-03-11 유니셈(주) Chiller device for seminconductor process
KR101501175B1 (en) * 2013-07-11 2015-03-11 유니셈(주) Method for controlling temperature in chiller device
KR101862074B1 (en) * 2016-01-04 2018-07-06 (주) 예스티 Cooling System and Processing Apparatus comprising the system and Processing Method using the apparatus
KR101993204B1 (en) * 2017-08-14 2019-06-27 (주)피티씨 Chiller apparatus for semiconductor process
KR101970289B1 (en) * 2018-09-21 2019-04-18 (주)공영엔지니어링 Cooling presse air supply apparatus and method for fabricating semiconductor device
KR102370179B1 (en) * 2020-12-21 2022-03-07 (주)본씨앤아이 A Single cooling system for semiconductor equipment

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20060124012A (en) * 2005-05-30 2006-12-05 삼성전자주식회사 Temperature adjusting unit, apparatus for treating substrate having the adjusting unit, and method for controlling temperature of the apparatus
KR100754842B1 (en) * 2006-11-01 2007-09-04 (주)피티씨 Chiller apparatus for semiconductor equipment and method controlling the same
JP2008034409A (en) 2006-07-26 2008-02-14 Hitachi High-Technologies Corp Plasma treating apparatus

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20060124012A (en) * 2005-05-30 2006-12-05 삼성전자주식회사 Temperature adjusting unit, apparatus for treating substrate having the adjusting unit, and method for controlling temperature of the apparatus
JP2008034409A (en) 2006-07-26 2008-02-14 Hitachi High-Technologies Corp Plasma treating apparatus
KR100754842B1 (en) * 2006-11-01 2007-09-04 (주)피티씨 Chiller apparatus for semiconductor equipment and method controlling the same

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101478175B1 (en) * 2013-03-04 2014-12-31 우범제 Pump down system of temperature controlling apparatus of gas chiller for semiconductor and LCD manufacturing process
KR101523228B1 (en) * 2013-09-26 2015-05-29 우범제 System and method for charging refrigerant of temperature control system for semiconductor manufacturing process facilities using an intermediation of gas
KR101523227B1 (en) * 2013-09-26 2015-05-29 우범제 System and method for checking refrigerant leakage of temperature control system for semiconductor manufacturing process facilities using an intermediation of gas
KR101354474B1 (en) 2013-11-25 2014-01-27 일신네오(주) Chiller apparatus for working process equipment
KR102290890B1 (en) 2020-07-06 2021-08-20 주식회사 에프에스티 Mixed chiller system used in semiconductor processing equipment
KR102425290B1 (en) 2022-02-10 2022-07-27 주식회사 에프에스티 Wide-range rapid temperature control system using multi-stage cascade refrigeration cycle

Also Published As

Publication number Publication date
KR20110125441A (en) 2011-11-21

Similar Documents

Publication Publication Date Title
KR101109730B1 (en) Chiller apparatus for semiconductor process and Method for controlling temperature in the same
KR101739369B1 (en) Temperature Control System for Chiller of Semiconductor Device
KR101169706B1 (en) Heat pump system for heating water
TWI794317B (en) Liquid temperature adjustment device and temperature adjustment method using the same
KR101354474B1 (en) Chiller apparatus for working process equipment
KR101405271B1 (en) Instant hot water possible Heat pump type hot water supplier
JP2012172869A (en) Heat pump device
US20130291575A1 (en) Cooling system and method for operating same
KR101923433B1 (en) Dual cooling system for semiconductor parts cooling
KR101425989B1 (en) Performance Test System for Heat Pump
JP5762493B2 (en) Circulating fluid temperature control method using area-specific parameter control hybrid chiller
CN103294086A (en) Constant-temperature liquid circulating device and temperature-controlling method
KR101966137B1 (en) Heating and cooling system with heat pump
JP2009168403A (en) Chiller device
KR101501175B1 (en) Method for controlling temperature in chiller device
KR20150007555A (en) Chiller device for seminconductor process
KR101993204B1 (en) Chiller apparatus for semiconductor process
JP4871800B2 (en) Chiller device
KR100927391B1 (en) Chiller device for semiconductor process equipment and its control method
JP2003130428A (en) Connection type cold/hot water device
JP2020525746A (en) Liquid temperature control device and method
EP3026364B1 (en) Heat pump type heating and hot water supply apparatus
JP6320897B2 (en) Temperature control method
KR101438182B1 (en) Attachment for controlling the flow rate and temperature of brine
CN209085106U (en) A kind of refrigeration system

Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
E701 Decision to grant or registration of patent right
GRNT Written decision to grant
FPAY Annual fee payment

Payment date: 20150120

Year of fee payment: 4

FPAY Annual fee payment

Payment date: 20160119

Year of fee payment: 5

FPAY Annual fee payment

Payment date: 20170106

Year of fee payment: 6

FPAY Annual fee payment

Payment date: 20171228

Year of fee payment: 7