KR101096506B1 - Wafer mounter - Google Patents

Wafer mounter Download PDF

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Publication number
KR101096506B1
KR101096506B1 KR1020100086834A KR20100086834A KR101096506B1 KR 101096506 B1 KR101096506 B1 KR 101096506B1 KR 1020100086834 A KR1020100086834 A KR 1020100086834A KR 20100086834 A KR20100086834 A KR 20100086834A KR 101096506 B1 KR101096506 B1 KR 101096506B1
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KR
South Korea
Prior art keywords
mounter
roller
wafer
ring frame
adhesive sheet
Prior art date
Application number
KR1020100086834A
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Korean (ko)
Inventor
강원순
Original Assignee
주식회사 에스엔티
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Priority to KR1020100086834A priority Critical patent/KR101096506B1/en
Application granted granted Critical
Publication of KR101096506B1 publication Critical patent/KR101096506B1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

The present invention relates to a wafer mounter, and more particularly, to bond the adhesive sheet while restraining the movement of the ring frame and the adhesive sheet when adhering the adhesive sheet to the wafer while positioning the wafer at the center of the ring frame. The present invention relates to a wafer mounter that accurately cuts an adhesive sheet along an edge of a ring frame and guarantees a cutter life.

Description

Wafer Mounter {WAFER MOUNTER}

The present invention relates to a wafer mounter, and more particularly, to bond the adhesive sheet while restraining the movement of the ring frame and the adhesive sheet when adhering the adhesive sheet to the wafer while positioning the wafer at the center of the ring frame. The present invention relates to a wafer mounter that accurately cuts an adhesive sheet along an edge of a ring frame and guarantees a cutter life.

In general, a semiconductor package includes a sawing process of separating a wafer on which a semiconductor circuit is formed into individual chips, a die bonding process of picking up and attaching each individual chip to a substrate, and connecting the chip to a circuit pattern of the substrate. And a molding process for protecting chips and wires for molding.

In the manufacture of such a semiconductor package, the wafer is densely formed at the same semiconductor circuit at equal intervals, and is separated into individual semiconductor circuits by an sawing process to form individual chips. Here, in order to prevent individual chips from falling after the sawing process, the wafer is placed in the center of the ring frame prior to the sawing process and the adhesive sheet is adhered to the back surface. Thus, the adhesive sheet is bonded to the back surface of the wafer with the ring frame as the edge. This device is called a wafer mounter. Then, the individual chips that are sawed and separated after the wafer is processed with the wafer mounter are left in the state where the individual chips adhere to the ring frame-based adhesive sheet, thereby facilitating the die-bonding process, which is a post process. .

Conventional technologies related to such a wafer mounter have been disclosed in Korean Patent Application Laid-Open Nos. 10-1999-0034139, 10-2007-0028341, and 10-2006-0046443.

However, the prior art uses an air pump as a means for fixing the ring frame, has a complex configuration, and had to be more complicated because the air inlet also rotates when the turntable on which the ring frame is placed rotates. As a result, the adsorption power of the air pump has to be increased.

In addition, the prior art is suitable for an automated process for producing a semiconductor package, it was inefficient in the size and complexity of the product (LED) package process for mounting and mounting the cut adhesive sheet on the wafer and ring frame. . That is, the prior art is to be fixed to the wafer and the ring frame, and pushed to the roller and rollers by pulling the adhesive sheet wound on the roller without the configuration to hold the adhesive sheet, so that the device for supplying the adhesive sheet must be further provided. .

In addition, the prior art did not present an effective shape for the cutter blade for neatly cutting the adhesive sheet.

KR 10-1999-0034139 A 1999.05.15. KR 10-2007-0028341 A 2007.03.12. KR 10-2006-0046443 A 2006.05.17.

Accordingly, it is an object of the present invention to provide a wafer mounter that does not use a separate power unit and can still seat the ring frame stably without shaking.

Another object of the present invention is to provide a wafer mounter having a cutter blade capable of firmly bonding the wafer while keeping the adhesive sheet in a stable state without shaking, and neatly processing the cut surface of the adhesive sheet.

The present invention for achieving the above object, the mounter 10 is provided to put the adhesive sheet 3 over the wafer 1 and the ring frame 2 with the wafer 1 in the center of the ring frame (2) ); A roller unit 20 capable of pressing the upper surface of the mounter unit 10 by moving the rollers 21, which are rotated relative to the axis in the width direction, in the front-rear direction; Forward and backward means for moving the cutter blade 31, the height adjusting means 32 for moving the position of the cutter blade 31 up and down, and the height adjusting means 32 on which the cutter blade 31 is mounted, in the front-rear direction. 34, including a cutter unit 30; A body 41 is mounted to mount the mounter 10, the roller 20, and the cutter 30, and a body for rotatably supporting the mounter 10 to the table 41. 40); The roller unit 20 is operated to press the adhesive sheet 3 with the roller 21, and the cutter unit 30 is operated to advance the cutter blade 31 to the upper portion of the ring frame 2 and then lower it. And a controller 50 for contacting the adhesive sheet 3 attached to the upper surface of the ring frame 2 and then rotating the mounter 10.

The mounter 10 has a groove formed along the circumferential direction in the ring frame seating surface 112 on which the ring frame 2 is to be inserted to insert the O-ring 113, and at the bottom of the ring frame seating surface 112. It is characterized in that the magnet 114 is embedded.

The mounter portion 10 forms the inlet groove 115a on the upper surface near the rear side in the initial state before the rotation, and forms the inlet port 115 in any one of the inlet groove 115a to open the inlet port 115. By allowing the air to be sucked through, the wafer seating portion 12 on which the wafer 1 is seated is formed to be separated so that the bottom surface of the wafer seating portion 12 is supported by the elastic body 122.

The cutter blade 31 is formed in the shape of a truncated cone and mounted on the height adjusting means 32 so as to rotate in the front-rear direction, characterized in that the smaller diameter of the vertical section is mounted facing forward.

The roller portion 20 is formed on both sides of the mounter portion 10 and has a long through-hole 43 facing the front and rear direction, and then the vertical support (for each through-hole 43) 23) upright, and fix the lower end of the vertical support 23 protruding to the bottom of the table 41 at both ends of the horizontal support 24, both ends of the roller 21 to the top of the table 41 By supporting the roller connector 22 at the upper end of the protruding vertical support 23, it is configured to move the roller 21 by the forward and backward movement of the horizontal support 24,

The roller connector 22, the fixing member 222 is fixed to the upper end of the vertical support 23 to protrude toward the roller 21; A moving member 221 coupled to the roller 21 at an end thereof, the movable member 221 being disposed at the bottom of the fixing member 222 protruding toward the roller 21 with an elastic body 224 interposed therebetween; The screw is formed only at the lower part, and the distance between the screw and the bolt head is larger than the thickness of the fixing member 222, and the upper screw head is caught on the upper surface of the moving member 221 by passing through the fixing member 222, A bolt 223 threaded with a screw to the moving member 221; Characterized in that configured to include.

The mounter unit 10 is characterized in that a plurality of guides 111 coming into contact with the edge of the ring frame 2 is mounted on the outer side of the ring frame seating surface 112 along the circumferential direction.

According to the present invention, the ring frame 2 is held without shaking by the friction force of the O-ring 113 and the magnetic force of the magnet 114, so that the structure thereof is simple, and a separate power device is also provided. It does not need to have advantages in terms of manufacturing cost and maintenance.

In addition, the present invention sucks the adhesive sheet 3 into the suction port 115 which is a local part, and furthermore, the suction port 115 is communicated with the recess groove 115a, so that the suction area is small but the width at which suction is made long, Even if the air pump 119 with low pumping capability is employed, the adhesive sheet 3 can be effectively grasped, and in this state, the adhesive sheet 3 can be pushed and pressed with a roller to improve the adhesion state.

In addition, the present invention is configured to elastically support the wafer seating portion 12 on which the wafer 1 is seated at the bottom, and slightly lifts the wafer 1 after pressing with a roller, thereby further increasing the adhesive sheet on the wafer 1. Good adhesion can be achieved.

In addition, according to the present invention, the cutter blade 31 is mounted so as to be free to rotate, and as the conical shape is inclined in the wafer direction, the cut surface of the adhesive sheet is neatly formed.

1 is a perspective view of a wafer mounter according to an embodiment of the present invention.
2 is a perspective view of the roller 21 in a state in which the roller 21 is advanced in the wafer mounter according to the embodiment of the present invention.
3 is a view showing a top surface of the mounter unit 10 in the wafer mounter according to the embodiment of the present invention.
4 is a view showing a wafer mounting process by a wafer mounter according to an embodiment of the present invention.
5 is a front perspective view of the wafer mounter according to the embodiment of the present invention, in which only the table 41 and the mounter portion 10 are processed in cross-sectional view.
FIG. 6 is a side perspective view of the wafer mounter according to the embodiment of the present invention, in which only the table 41 and the mounter portion 10 are processed in a cross-sectional view. FIG.
7 is an exploded perspective view (a) and a combined perspective view (bc) of the roller connector 22 in the wafer mounter according to the embodiment of the present invention.
8 is a view showing the mounting form of the cutter blade 31 in the wafer mounter according to the embodiment of the present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings. In the following description of the present invention, if it is determined that a detailed description of a related known function or known configuration may unnecessarily obscure the subject matter of the present invention, the detailed description thereof will be omitted.

1 is a perspective view of a wafer mounter according to an embodiment of the present invention, Figure 2 is a perspective view of a state in which the roller 21 is advanced.

1 and 2, the wafer mounter according to the embodiment of the present invention may mount the mounter 10, the roller 20, and the cutter 30 on the table 41 of the body 40. , The cutter blade 31 of the roller 21 of the roller portion 20 and the cutter portion 30 with the wafer 1, the ring frame 2, and the adhesive sheet 3 mounted on the mounter 10. To individually move toward the mounter 10. Here, the mounter 10 is rotatably mounted to the seating hole 42 formed through the table 41.

And, the front surface of the body 40 is provided with a button 46 for the user's operation, the rails 44 are fixed to the front and rear directions on both sides of the table 41, respectively, the cover 45 rail 44 It is mounted so that it can be guided and moved. Here, the cover 45 is formed to cover the entire upper surface of the table 41 on which the mounter 10, the roller 20, and the cutter 30 are mounted.

Specifically, the wafer mounter initially has the wafer 1 and the ring frame with the roller 21 of the roller portion 20 and the cutter blade 31 of the cutter portion 30 on the rear side of the table 41. (2) and the adhesive sheet (3) on the mounter 10, and then move the roller 21 to the front side as shown in Figure 2 to move the adhesive sheet (3) to the wafer (1) and ring It adheres to the frame 2, and then moves the roller 21 to the rear side and moves the cutter blade 31 to the ring frame 2 position as shown in FIG. The wafer mounter rotates the mounter 10 to cut the adhesive sheet 3 with the cutter blade 31.

On the other hand, the control unit 50 for controlling the operation of the mounter unit 10, the roller unit 20 and the cutter unit 30 in accordance with the operation of the button 46 is accommodated in the body 40.

Hereinafter, the mounter unit 10, the roller unit 20, the cutter unit 30, the body 40, and the controller 50 will be described in detail with reference to the accompanying drawings.

3 is a view showing a top surface of the mounter unit 10 in the wafer mounter according to the embodiment of the present invention, FIG. 4 is a view showing a wafer mounting process,

5 is a front perspective view showing only the table 41 and the mounter 10 in cross-sectional view in a wafer mounter according to an embodiment of the present invention, and FIG. 6 shows only the table 41 and the mounter 10 in a cross-sectional view. One side perspective view.

3 and 4, only the structure of the upper surface is illustrated, and it is to be noted that FIG. 5 except for the rotation means 13 is illustrated.

The body 40 is configured to include a table 41 in the form of a plate for mounting the mounter portion 10, the roller portion 20 and the cutter portion 30. Specifically, the table 41 has a seating hole 42 formed by penetrating a portion biased to the front side up and down, and a long through hole 43 which is formed on both sides of the seating hole 42 and faces the front-back direction. Equipped. Here, the seating hole 42 is for mounting the mounter 10, the long through-hole 43 is a configuration for mounting the roller portion 20. Then, the cutter unit 30 is mounted on the rear side of the table 41. In addition, the seating port 42 is not limited to the form of the figure shown by the Example of this invention. That is, the seating hole 42 is formed in accordance with the shape of the mounter 10 so as to mount the mounter 10 to be seated, but do not fall out, and to mount the mounter 10 to be described later to be rotated The bearing 14 may also be mounted.

The mounter 10 is formed in a short cylindrical shape that closes the lower end and opens the upper end so that the wafer 1 can be placed on the wafer 1 in such a manner that the edge of the wafer 1 touches the upper end 121. 12; A cylindrical groove 118 to which the wafer seating part 12 is to be inserted is provided on the upper surface, and a ring frame 2 is placed on the cylindrical groove 118, and the seating hole 42 of the table 41 is provided. A turntable 11 rotatably mounted; Rotating means 13 for rotating the turn cable 11 in accordance with the control of the control unit 50;

Specifically, the turntable 11 is fitted to the seating port 42 in a state in which the lower part is inserted into the seating hole 42 of the table 41 and the bearing 14 is extrapolated to the lower part, and is rotatable. A pulley 116 mounted on the bottom surface of the table 41 to be exposed is provided to enable the belt 117 wound on the pulley 116 to be rotated by the pivoting means 13.

And, the upper surface structure of the turntable 11 will be described with reference to FIGS. 3 and 4, the wafer seating portion 12 is fitted to the cylindrical groove 118 on the upper surface of the turntable 11 and the In the state in which the wafer 1 is placed on the wafer seating portion 12, a ring frame seating surface 112 for placing a ring frame around the wafer 1 is provided, and an outer portion of the ring frame seating surface 112 is provided. A plurality of guides 111 and 111 'are mounted along the circumferential direction such that the edge of the ring frame 2 touches the inside of the guides 111 and 111'. Accordingly, the ring frame 2 is not moved by the plurality of guides 111 and 111 ′ mounted around the ring frame 2. On the other hand, it is preferable that the ring frame 2 is configured to rotate together in accordance with the rotation of the turntable 11, so in the embodiment of the present invention, a ring having an edge formed in a form in which a part of the circle is cut in a straight line 2b The frame 2 is used, and any one of the plurality of guides 111 and 111 ′ has a portion 111a ′ in contact with the ring frame 2 and a cutout 2b of the ring frame 2. It is formed in accordance with the shape and the remaining guides 111 are formed in a circular arc shape to match the circular frame of the ring frame (2) 111a contacting the ring frame (2).

In addition, the ring frame seating surface 112 of the turntable 11, after forming the groove along the circumferential direction of the cylindrical groove 118, the O-ring 113 is inserted, the lower side of the ring frame seating surface 112 After forming a plurality of grooves in the circumferential direction on the bottom surface of the turntable 11 corresponding to the magnets 114 are inserted into the grooves on the bottom surface, respectively. Accordingly, the ring frame seating surface 112 is provided with an O-ring 113 and the magnet 114 is embedded in the bottom.

Further, in the upper surface of the turntable 11 near the rear side in the initial state before the mounter 10 is rotated, the yaw groove 115a is formed and one of the yaw grooves 115a is penetrated up and down. The suction port 115 is formed. In the embodiment shown in Figures 3 and 4, the inlet port 115 is formed in the middle of the jangyo groove 115a, and, at the both ends of the jangyo groove 115, a portion where the 'U'-shaped groove 115b is opened The compositions face in opposite directions to each other. Here, the suction port 115, the yaw groove 115a and the 'U'-shaped groove 115b is on the outer side of the ring frame seating surface 112.

In addition, the suction port 115 communicates with the air pump 119 mounted on the table 41 in an initial state before the mounter unit 10 is rotated. Referring to FIG. 6, in the initial state before the mounter 10 is rotated, the space 118 at a portion where the portion of the table 41 on which the air pump 119 is mounted and the lower portion of the turntable 11 meet each other. ') And the space 118' is in communication with the suction port 115.

The turntable 11 configured as described above can prevent the movement of the ring frame 2 by the friction force with the O-ring 113 and the magnetic force of the magnet 114. Here, the ring frame 2 is made of a magnetic body.

In addition, the turntable 11 may cover the wafer 1 and the ring frame 2 by operating the air pump 119 to suck air through the suction port 115 formed in the turntable 11. Since the adhesive sheet 3 is to be caught, the movement of the adhesive sheet 3 can be prevented. The operation time of the air pump 119 is when the roller 21 is moved forward as shown in FIG. 2.

In addition, the bottom of the turntable 11 is equipped with a bent 151 that is bent in the bottom direction of the table 41, and the bottom of the table 41 is mounted with the bent 151 when the turntable 11 is rotated. Mount the photosensor 15 to detect the passage of the). That is, the photosensor 15 is configured to detect whether the turntable 11 is rotated one time. On the other hand, since the rotation of the turntable 11 by one more rotation with a slight rotational angle can make the cutting surface of the adhesive sheet 3 clean, the bending 151 and the photosensor 15 are further provided one by one. It is preferable to install at the rotation angle position which is further rotated.

5 and 6 attached to explain the embodiment of the present invention, the pulley 116 and the bending 151 are shown as being integrally formed on the turntable 11, but are manufactured separately for convenience of manufacturing. Can then be combined.

The wafer seating portion 12 of the mounter 10 is formed to be separated from the turntable 11 and is fitted into the cylindrical groove 118 formed on the top surface of the turntable 11. At this time, the wafer seating portion 12 is the cylindrical groove 118 through a plurality of elastic bodies 122 between the bottom surface of the wafer seating portion 12 facing each other and the bottom surface of the cylindrical groove 118. ) To be fitted while being elastically supported. In addition, grooves are formed so that the upper and lower portions of the elastic body 122 penetrate into the bottom surface of the wafer seating portion 12 and the bottom surface of the cylindrical groove 118, respectively, thereby preventing the inertia body 122 from tilting.

Here, the upper end 121 of the wafer seating portion 12 is a ring frame seating surface 112 when the wafer 1 is pressed downward while the wafer 1 is placed on the wafer seating portion 12. The upper surface of the ring frame (2) placed on the horizontal surface, and when the release is to be slightly higher than the upper surface of the ring frame (2), it is appropriate to increase only about 1mm. Accordingly, after pressing the adhesive sheet 3 with the roller 21 to be described later, the wafer 1 rises slightly higher than the ring frame 2, so that the adhesive sheet 3 bonded to the wafer 1 is taut. It is possible to improve the adhesion state by pulling.

The roller unit 20 constituting the embodiment of the present invention, the roller 21 is disposed in the width direction on the upper portion of the table 41; Vertical support 23 which is vertically inserted into two long through holes 43 formed in the table 41 so that the upper end is exposed to the upper part of the table 41 and the lower end is exposed to the lower part of the table 41. Wow; A roller connector 22 fixed to each upper end of the vertical supports 23 and supporting both ends of the roller 21; Horizontal supports 24 fixed at both ends of lower ends of the vertical supports 23; It comprises a; roller starting means 25 for moving the horizontal support 24 in the front and rear direction.

In addition, the vertical support 23 mounts the slide 231 on the side exposed to the lower portion of the table 41, and the rail 232 for guiding the slide 231 of the vertical support 23 to the table Mounted on the bottom of 41, the vertical support 23 does not tilt when moving back and forth.

In addition, in the embodiment of the present invention, the roller starting means 25 is configured as a rodless cylinder so as to occupy less space in the body 40. That is, the roller starting means 25 is a cylinder 252 configured to drive the piston (not shown) back and forth by the drive device 253 and is coupled to the piston (not shown) by magnetic force. Consists of a slider 251 that slides along the piston (not shown), the slider 251 is fixed to the horizontal support 24.

The roller connector 22 will be described with reference to FIG. 7.

7 is an exploded perspective view (a) and a combined perspective view (b.c) of the roller connector 22 in the wafer mounter according to the embodiment of the present invention.

Referring to FIG. 7, the roller connector 22 is a fixing member 222 fixed to the vertical support 23 and a lower side of the fixing member 222 and corresponding to the side of the vertical support 23. And a bolt (223) mounted on the fixing member (222) to elastically support the movable member (221) in a downward direction but limit the moving range of the movable member (221) disposed at a position.

Specifically, the fixing member 222 is placed on the top of the vertical support 23, but is deflected in the direction of the roller (21), thinning the portion that comes in contact with the top of the vertical support 23 and bolts ( Through 225 (225a) is fixed to the upper end of the vertical support 23 by the screw 225b of the bolt 225. Therefore, the fixing member 222 is fixed in the form of protruding toward the roller 21 based on the vertical support (23).

The moving member 221 is coupled to the end of the bearing 211 to the roller 21, it is disposed under the portion protruding toward the roller 21 from the fixing member 222. At this time, an elastic body 224 is interposed between the bottom portion of the fixing member 222 protruding toward the roller 21 and the upper surface of the moving member 221, and the elastic body 224 to prevent the elastic body 224 from being separated. Grooves 224a and 224b are formed such that upper and lower ends of the upper and lower ends of the upper and lower ends thereof are fitted to the fixing member 222 and the moving member 221.

The bolt 223 has a screw formed only at the lower part, and the gap between the screw and the bolt head is larger than the thickness of the fixing member 222 protruding toward the roller 21, and penetrates the fixing member 222 ( 223a) and the lower screw is mounted to the moving member 222 to be coupled to the screw 223b.

Therefore, the movable member 221 is elastically supported by the fixing member 222 in the downward direction by the elastic body 224, and, as shown in (b) of FIG. 223 is limited by the head and the movement in the upper direction is limited by the fixing member 222 as shown in (c) of FIG.

Cutter portion 30 constituting an embodiment of the present invention, the cutter blade 31, the height adjusting means 32 for moving the position of the cutter blade 31 up and down, and the cutter blade 31 is mounted It comprises a forward and backward means 34 for moving the height adjustment means 32 in the front-rear direction, and is mounted on the rear side upper surface of the table 41.

Here, the cutter blade 31 is formed in the shape of a truncated cone, and is mounted to the height adjusting means 32 to rotate in the front and rear direction, the shaft is mounted with the diameter of the vertical cross section facing forward.

In the embodiment of the present invention, the forward and backward means 34 and the height adjustment means 32 is composed of a pneumatic cylinder. In detail, the height adjustment means 32 stands the cylinder 32 to raise and lower the piston rod 323 in the vertical direction from the bottom, and attaches the rail 321 to the front of the cylinder 32, the piston rod The 'L'-shaped moving body 323a fixed to the lower end of the 323 is guided along the rail 321 to be raised and lowered. In addition, an auxiliary body 323b for mounting the cutter 31 is mounted on the front surface of the movable body 323a.

The mounting structure of the cutter blade 31 will be described with reference to FIG. 8.

8 is a view showing the mounting form of the cutter blade 31 in the wafer mounter according to the embodiment of the present invention.

Referring to FIG. 8, the cutter blade 31 inserts a bearing 314 in which the rotary shaft rod 316 is inserted into the hollow of the cutter blade 31 and rotates the rotary shaft rods of the front and rear portions of the bearing 314. The rear end of the rotary shaft rod 316 is fixed to the front surface of the auxiliary body 323b in the state where the spacer 315 is inserted into the 316. On the other hand, in order to firmly fix the rotary shaft rod 316, after placing the fixture 311 on the front side, the front end of the rotary shaft rod 316 is fixed to the fixture 311, the upper end of the fixture 311 The rear end of the protruding portion protrudes backward so as to fit into the groove 323c of the auxiliary body 323b, and through the fixing body 311 with a separate bolt 312 (311a) through the auxiliary body ( Screw 324d to 323b).

On the other hand, the bearing 314 is provided with a locking flange 314a larger than the hollow diameter of the cutter blade 31, and provided with two to interpolate into the hollow of the cutter blade 31, one before and after each, Since the engaging flanges 314a are caught on the front and rear surfaces of the cutter blade 31, only a part of the bearing 314 is inserted into the hollow of the cutter blade 31. In other words, the locking flange 314a prevents the cutter blade 31 from moving forward and backward. In addition, a spacer ring 313 is interposed between the front side of the bearing 314 and the cutter blade 31 on the front side, for adjusting the separation distance between the bearings 314.

The mounting unit 10, the roller unit 20, the cutter unit 30, and the body 40 of the wafer mounter according to the embodiment of the present invention have been described above, and a mounting process according to the operation of the controller 50 is described. The following description mainly refers to FIG. 4.

Before performing the mounting process, the roller 21 and the cutter blade 31 are placed on the rear side of the table 41, and the wafer 1 and the ring frame as shown in FIGS. 4A and 4B are shown. (2) is placed on the mounter portion 10 and the adhesive sheet 3 covering the wafer 1 and the ring frame 2 is put on and then the button 46 is inputted. 10) to control the roller part 20 and the cutter part 30 to perform a mounting operation.

That is, the controller 50 advances the cover 45 to cover the table 41 including the mounter 10, and operates the air pump 119 to suck air through the suction port 115 to intake the air inlet 115. Hold the adhesive sheet (3) corresponding to the position, and then press the adhesive sheet (3) while moving the roller starting means (25) to advance the roller (21), and reverse the roller (21) that has been advanced. To the rear side of the table 41.

Next, the control unit 50 operates the forward and backward means 34 to move the cutter blade 31 to the upper portion of the ring frame 2 and to operate the height adjusting means 32 so that the cutter blade 31 adheres to the adhesive sheet. Have them dig into (3). Here, the ring frame (2) is provided with a groove (2a) formed in the circumferential direction in the area where the cutter blade 31 is in contact, the cutter blade 31 is through the adhesive sheet 3 to reach the groove (2a). .

Next, the control unit 50 rotates the mounter 10 by operating the rotation means 13, and stops the rotation of the mounter 10 according to the detection signal of the photosensor 15. At this time, the cutter blade 31 also rotates in place.

Next, the control unit 50 moves the cutter blade 31 to the rear of the table 41 by operating the height adjusting means 32 to raise the cutter blade 31 and then operating the forward and backward means 34. In addition, the cover 45 is also reversed so that the mounted wafer can be taken out. As shown in (c) of FIG. 4, the mounted wafer is in a state in which only the adhesive sheet 3 ′ having the groove 2a of the ring frame 2 is bounded.

Although illustrated and described in the specific embodiments to illustrate the technical spirit of the present invention, the present invention is not limited to the same configuration and operation as the specific embodiment as described above, within the limits that various modifications do not depart from the scope of the invention It can be carried out in. Therefore, such modifications should also be regarded as belonging to the scope of the present invention, and the scope of the present invention should be determined by the claims below.

1 wafer 2 ring frame 3 adhesive sheet
10: mounter portion 11: turntable 111,111 ': guide
112: ring frame seating surface 113: O-ring 114: magnet
115: inlet 116: pulley 117: belt
12: wafer seating portion 121: top 122: elastic body
13 rotation means 14 bearing 15 photosensor
20: roller 21: roller 22: roller connector
23: vertical support 24: horizontal support 25: roller starting means
30: cutter part 31: cutter blade 32: height adjustment means
34: forward and backward means 40: body 41: table
42: seating hole 43: long through hole 50: control unit

Claims (5)

delete A mounter 10 provided with an adhesive sheet 3 on the wafer 1 and the ring frame 2 with the wafer 1 at the center of the ring frame 2;
A roller unit 20 capable of pressing the upper surface of the mounter unit 10 by moving the roller 21 in the width direction in the front-rear direction;
Forward and backward means for moving the cutter blade 31, the height adjusting means 32 for moving the position of the cutter blade 31 up and down, and the height adjusting means 32 on which the cutter blade 31 is mounted, in the front-rear direction. 34, including a cutter unit 30;
A body 41 is mounted to mount the mounter 10, the roller 20, and the cutter 30, and a body for rotatably supporting the mounter 10 to the table 41. 40);
The roller unit 20 is operated to press the adhesive sheet 3 with the roller 21, and the cutter unit 30 is operated to advance the cutter blade 31 to the upper portion of the ring frame 2 and then lower it. A control unit 50 which contacts a portion of the adhesive sheet 3 attached to the upper surface of the ring frame 2, and then rotates the mounter unit 10;
And,
The mounter 10,
The grooves are formed in the ring frame seating surface 112 on which the ring frame 2 is to be mounted along the circumferential direction to insert the O-ring 113, and the magnet 114 is embedded in the bottom of the ring frame seating surface 112.
In the initial state before rotation, the Jangyo groove 115a is formed on the upper surface close to the rear side, and the suction port 115 is formed at any one of the Jangyo groove 115a to allow the air to be sucked through the suction port 115. ,
The wafer mounter, characterized in that the wafer seating portion (12) on which the wafer (1) is seated to be separated so that the bottom surface of the wafer seating portion (12) is supported by the elastic body (122).
The method of claim 2,
The cutter blade 31,
Wafer mounter is formed in a truncated conical shape is mounted to the height adjusting means so as to rotate in the front and rear direction in the axial direction, the diameter of the vertical cross section is mounted facing the front.
4. The method according to claim 2 or 3,
The roller unit 20,
After forming the long through holes 43 located on both sides of the mounter 10 and facing in the front-rear direction on the table 41, the vertical supports 23 are vertically inserted into the respective through holes 43, and the vertical supports are placed. The lower end of the 23 is fixed to both ends of the horizontal support 24, and both ends of the roller 21 are supported by the roller connector 22 at the upper end of the vertical support 23, so that the horizontal support 24 moves forward and backward. It is configured to move the roller 21,
The roller connector 22,
A fixing member 222 fixed to an upper end of the vertical support 23 to protrude toward the roller 21;
A moving member 221 coupled to the roller 21 at an end thereof, the movable member 221 being disposed at the bottom of the fixing member 222 protruding toward the roller 21 with an elastic body 224 interposed therebetween;
A bolt 223 for forming a screw only at the lower part, making a gap between the screw and the bolt head larger than the thickness of the fixing member 222, and penetrating the fixing member 222 to screw the lower screw to the moving member 221;
Wafer mounter, characterized in that configured to include.
The method of claim 4, wherein
The mounter 10,
Wafer mounter, characterized in that a plurality of guides 111 which are in contact with the edge of the ring frame (2) is mounted in the outer periphery of the ring frame seating surface 112 along the circumferential direction.
KR1020100086834A 2010-09-06 2010-09-06 Wafer mounter KR101096506B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020100086834A KR101096506B1 (en) 2010-09-06 2010-09-06 Wafer mounter

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Application Number Priority Date Filing Date Title
KR1020100086834A KR101096506B1 (en) 2010-09-06 2010-09-06 Wafer mounter

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KR101096506B1 true KR101096506B1 (en) 2011-12-20

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116653031A (en) * 2023-06-09 2023-08-29 深圳市博辉特科技有限公司 Be used for blue membrane of wafer to cut membrane mechanism

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6351244A (en) 1986-08-20 1988-03-04 Disco Abrasive Syst Ltd Magnet method tape frame positioning device
JP2009206166A (en) * 2008-02-26 2009-09-10 Renesas Technology Corp Method of manufacturing semiconductor device

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6351244A (en) 1986-08-20 1988-03-04 Disco Abrasive Syst Ltd Magnet method tape frame positioning device
JP2009206166A (en) * 2008-02-26 2009-09-10 Renesas Technology Corp Method of manufacturing semiconductor device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116653031A (en) * 2023-06-09 2023-08-29 深圳市博辉特科技有限公司 Be used for blue membrane of wafer to cut membrane mechanism

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