KR101093188B1 - 유기 은 착체 화합물, 이의 제조방법 및 이를 이용한박막형성방법 - Google Patents
유기 은 착체 화합물, 이의 제조방법 및 이를 이용한박막형성방법 Download PDFInfo
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- KR101093188B1 KR101093188B1 KR1020070043501A KR20070043501A KR101093188B1 KR 101093188 B1 KR101093188 B1 KR 101093188B1 KR 1020070043501 A KR1020070043501 A KR 1020070043501A KR 20070043501 A KR20070043501 A KR 20070043501A KR 101093188 B1 KR101093188 B1 KR 101093188B1
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- C07F1/00—Compounds containing elements of Groups 1 or 11 of the Periodic System
- C07F1/10—Silver compounds
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- C07—ORGANIC CHEMISTRY
- C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
- C07F1/00—Compounds containing elements of Groups 1 or 11 of the Periodic System
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- C07—ORGANIC CHEMISTRY
- C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
- C07C211/00—Compounds containing amino groups bound to a carbon skeleton
- C07C211/65—Metal complexes of amines
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- C07—ORGANIC CHEMISTRY
- C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
- C07C271/00—Derivatives of carbamic acids, i.e. compounds containing any of the groups, the nitrogen atom not being part of nitro or nitroso groups
- C07C271/02—Carbamic acids; Salts of carbamic acids
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- C07—ORGANIC CHEMISTRY
- C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
- C07F1/00—Compounds containing elements of Groups 1 or 11 of the Periodic System
- C07F1/005—Compounds containing elements of Groups 1 or 11 of the Periodic System without C-Metal linkages
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- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/30—Inkjet printing inks
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- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/52—Electrically conductive inks
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- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
- C09D5/24—Electrically-conducting paints
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
- C23C18/08—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of metallic material
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- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/46—Electroplating: Baths therefor from solutions of silver
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/105—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by conversion of non-conductive material on or in the support into conductive material, e.g. by using an energy beam
Abstract
Description
Claims (15)
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- 하기의 화학식 2로부터 선택되는 하나 이상의 은 화합물 및 하기 화학식 3 내지 화학식 5로부터 선택되는 하나 이상의 암모늄 카바메이트계 화합물 또는 암모늄 카보네이트계 화합물을 반응시켜 제조된 은과 암모늄 카바메이트계 화합물 또는 암모늄 카보네이트계 화합물로 이루어진 하기 화학식 1의 은 착체화합물을 알코올, 글리콜, 아세테이트, 에테르, 케톤, 지방족탄화수소, 방향족탄화수소 및 할로겐화 탄화수소로부터 선택되는 용매에 용해하여 제조한 은 착체 화합물 용액을 이용하여 박막을 형성한 후, 열 처리를 하여 은 박막을 형성하는 방법.[화학식 1]Ag[A]m[A는 화학식 3 내지 화학식 5 화합물이며, m은 0.7 내지 2.5이다.][화학식 2]AgnX[n은 1~4의 정수이고, X는 산소, 황, 할로겐, 시아노, 시아네이트, 카보네이트, 니트레이트, 나이트라이트, 설페이트, 포스페이트, 티오시아네이트, 클로레이트, 퍼클로레이트, 테트라플로로보레이트, 아세틸아세토네이트, 카복실레이트 및 그 유도체로 구성된 군에서 선택되는 치환기이다.][화학식 3][화학식 4][화학식 5][상기 R1, R2 , R3, R4, R5 및 R6는 서로 독립적으로 각각 수소, 지방족 또는 지환족 (C1-C30)알킬기, 아릴기, 아랄킬(aralkyl)기, 관능기가 치환된 (C1-C30)알킬기, 관능기가 치환된 아릴기, 고분자화합물기, 헤테로고리화합물 및 그들의 유도체에서 선택되는 치환기이거나, 서로 독립적으로 R1과 R2, R4와 R5는 서로 헤테로 원자가 포함되거나 포함되지 않은 알킬렌으로 연결되어 고리를 형성할 수 있다.]
- 제 10항에 있어서,상기 박막은 기판 상에 상기 은 착체 화합물 용액을 도포하여 형성하는 것을 특징으로 하는 은 박막을 형성하는 방법.
- 제 11항에 있어서,상기 기판은 유리, 실리콘, 폴리에스테르, 폴리이미드 또는 종이에서 선택되는 것을 특징으로 하는 은 박막을 형성하는 방법.
- 제 10항에 있어서,상기 열처리는 공기, 질소, 아르곤, 수소, 또는 이들의 혼합 가스 조건에서 진행시 키는 것을 특징으로 하는 은 박막을 형성하는 방법.
- 제 11항에 있어서,상기 도포는 스핀 코팅, 롤 코팅, 스프레이 코팅, 딥 코팅, 플로우 코팅으로부터 선택되는 도포방법인 것을 특징으로 하는 은 박막을 형성하는 방법.
- 제 11항에 있어서,상기 도포는 잉크젯 프린팅, 옵셋 프린팅, 스크린프린팅, 그라비아 프린팅, 플렉소 프린팅에서 선택되는 프린팅 방법에 의해 이루어지는 것을 특징으로 하는 은 박막을 형성하는 방법.
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
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KR1020050011478 | 2005-02-07 | ||
KR20050011478 | 2005-02-07 | ||
KR1020050011631 | 2005-02-11 | ||
KR20050011631 | 2005-02-11 |
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KR1020060011083A Division KR100727466B1 (ko) | 2005-02-07 | 2006-02-06 | 유기 은 착체 화합물, 이의 제조방법 및 이를 이용한박막형성방법 |
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KR20070052258A KR20070052258A (ko) | 2007-05-21 |
KR101093188B1 true KR101093188B1 (ko) | 2011-12-13 |
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KR1020060011083A KR100727466B1 (ko) | 2005-02-07 | 2006-02-06 | 유기 은 착체 화합물, 이의 제조방법 및 이를 이용한박막형성방법 |
KR1020070043436A KR100727459B1 (ko) | 2005-02-07 | 2007-05-04 | 유기 은 착체 화합물 용액, 이의 제조방법 및 이를 이용한 박막형성방법 |
KR1020070043484A KR101093186B1 (ko) | 2005-02-07 | 2007-05-04 | 유기 은 착체 화합물, 이의 제조방법 및 이를 이용한박막형성방법 |
KR1020070043501A KR101093188B1 (ko) | 2005-02-07 | 2007-05-04 | 유기 은 착체 화합물, 이의 제조방법 및 이를 이용한박막형성방법 |
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KR1020060011083A KR100727466B1 (ko) | 2005-02-07 | 2006-02-06 | 유기 은 착체 화합물, 이의 제조방법 및 이를 이용한박막형성방법 |
KR1020070043436A KR100727459B1 (ko) | 2005-02-07 | 2007-05-04 | 유기 은 착체 화합물 용액, 이의 제조방법 및 이를 이용한 박막형성방법 |
KR1020070043484A KR101093186B1 (ko) | 2005-02-07 | 2007-05-04 | 유기 은 착체 화합물, 이의 제조방법 및 이를 이용한박막형성방법 |
Country Status (13)
Country | Link |
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US (4) | US8226755B2 (ko) |
EP (1) | EP2995620B1 (ko) |
JP (2) | JP5001860B2 (ko) |
KR (4) | KR100727466B1 (ko) |
CN (1) | CN102702237B (ko) |
BR (1) | BRPI0606147B1 (ko) |
CA (1) | CA2817918C (ko) |
IL (1) | IL185049A (ko) |
MX (1) | MX2007009542A (ko) |
NZ (1) | NZ560417A (ko) |
RU (1) | RU2386635C2 (ko) |
TW (1) | TWI326680B (ko) |
ZA (1) | ZA200707504B (ko) |
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