KR101064146B1 - Surface mount light emitting unit array, repair method thereof and light emitting unit for repair - Google Patents
Surface mount light emitting unit array, repair method thereof and light emitting unit for repair Download PDFInfo
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- KR101064146B1 KR101064146B1 KR1020100018040A KR20100018040A KR101064146B1 KR 101064146 B1 KR101064146 B1 KR 101064146B1 KR 1020100018040 A KR1020100018040 A KR 1020100018040A KR 20100018040 A KR20100018040 A KR 20100018040A KR 101064146 B1 KR101064146 B1 KR 101064146B1
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- South Korea
- Prior art keywords
- light emitting
- circuit board
- sub
- emitting unit
- repair
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/225—Correcting or repairing of printed circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/49105—Connecting at different heights
- H01L2224/49107—Connecting at different heights on the semiconductor or solid-state body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10106—Light emitting diode [LED]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/17—Post-manufacturing processes
- H05K2203/176—Removing, replacing or disconnecting component; Easily removable component
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Led Device Packages (AREA)
Abstract
Disclosed are a surface mount type light emitting unit array, a repair method thereof, and a repair light emitting unit having a structure that can be repaired by replacing a defective light emitting chip among a plurality of light emitting chips mounted on a surface of a substrate.
The disclosed surface mount type light emitting unit array repair method includes puncturing a predetermined mounting area in which a bad light emitting chip is mounted among a plurality of light emitting chips mounted on a main circuit board, separating the bad light emitting chip on the main circuit board, and repairing a repair hole. Forming; Preparing a preliminary light emitting unit including a sub base, a sub circuit board formed on the sub base and having a predetermined pattern of sub electrodes, and a preliminary light emitting chip mounted on the sub circuit board and electrically connected to the sub electrodes; ; Inserting and bonding the preliminary light emitting unit into the repair hole; And electrically connecting the sub circuit board and the main circuit board.
Description
The present invention relates to a light emitting unit array, a repair method thereof, and a repair light emitting unit, and more particularly, a surface mount type of a structure which can be repaired by replacing a defective light emitting chip among a plurality of light emitting chips mounted on a surface of a substrate. A light emitting unit array, a repair method thereof, and a light emitting unit for repair are provided.
In general, a surface mount light emitting unit array has a structure in which a plurality of light emitting chips are mounted on a surface of a printed circuit board, and each of the plurality of light emitting chips is electrically connected to a printed circuit board using a wire. Since the surface mount light emitting unit array has a configuration in which a plurality of light emitting chips are arranged on the surface of the substrate, it is possible to easily realize a surface light source, so that the surface-mounted light emitting unit array can be used in industrial fields such as a backlight light source of a liquid crystal display, lighting fixtures, traffic signals, etc. It has the advantage of being widely applicable.
The surface-mounted light emitting unit array takes a method of removing the light emitting chip from the substrate and mounting a new light emitting chip in the reverse order of the manufacturing process in order to repair the damage if at least one of the plurality of light emitting chips mounted on the substrate is damaged. It should be noted that there is a disadvantage in that it takes more time, cost and effort to repair damaged light emitting chips than replacing with a new light emitting unit array.
As a way to solve the above problems, the Republic of Korea Patent Publication No. 10-2009-0019510 (published: February 25, 2009) has been disclosed a COB type LED package and a recovery method of the structure is easy to recover. .
The disclosed LED package includes a plurality of mounting regions on which a light emitting chip is mounted on a substrate, a plurality of cutouts penetrating through an outer edge of the mounting region, and a light emitting connection between the cutouts and other adjacent cutouts. And a plurality of cutouts that are cut so as to separately separate the mounting area where the chip is mounted from the substrate. Accordingly, the mounting area including the defective light emitting chip can be easily removed along the cutting portion, and the replacement area can be easily replaced with the mounting area on which the good light emitting chip is mounted.
On the other hand, since the LED package has a configuration in which a cutout is formed along the outer edge of the mounting area, heat dissipation efficiency may be lowered by restricting the heat generated during the operation of the light emitting chip to expand to the periphery. In addition, when mounting the light emitting chip on the metal substrate in consideration of the heat dissipation characteristics, the cutout may not be easily cut, so it may not be easy to remove the bad light emitting chip. Furthermore, when the defective light emitting chip is removed and a good quality light emitting chip is to be bonded, durability may be greatly reduced since the bonding part is limited.
The present invention has been made in view of the above-described points, and the surface of the structure in which the defective light emitting chip is easily removed from the plurality of light emitting chips mounted on the surface of the substrate, and the replaced light emitting chip is firmly mounted on the substrate. An object of the present invention is to provide a mounted light emitting unit array and a repair method thereof.
Another object of the present invention is to provide a light emitting unit for a repair which is used to repair a surface mount light emitting unit array.
In order to achieve the above object, the present invention provides a main base, a main circuit board formed on the main base and having a predetermined pattern of electrodes, and mounted on the main circuit board to be spaced apart from each other at predetermined intervals. In the repair method of a surface-mount light emitting unit array comprising a plurality of light emitting chips connected to each other and irradiated with light,
Drilling a predetermined mounting area on the main circuit board on which the bad light emitting chip is mounted among the plurality of light emitting chips, separating the bad light emitting chip on the main circuit board, and forming a repair hole; A preliminary light emitting unit includes a sub base, a sub circuit board formed on the sub base and having a sub electrode having a predetermined pattern, and a preliminary light emitting chip mounted on the sub circuit board and electrically connected to the sub electrode. Making a step; Inserting and bonding the preliminary light emitting unit into the repair hole; And electrically connecting the sub circuit board and the main circuit board.
The sub base may include a first sub base bonded to the repair hole by an adhesive and made of a metal or an insulator material; The sub-circuit board is formed on the first sub-base so that a portion thereof extends on the main circuit board, and includes a second sub-base formed of an insulator material and patterned on the upper part of the sub-circuit board. It is electrically insulated from the circuit board and the first sub base.
The sub base is made of an insulator material and is bonded by an adhesive in the repair hole, and the sub circuit board is formed on the sub base to be positioned in the repair hole.
The sub base is made of an insulator material, and is bonded to the repair hole by an adhesive, and the sub circuit board is formed on the sub base so that a part of the sub circuit board extends onto the main circuit board, and the preliminary light is emitted to the repair hole. When the unit is inserted, the main circuit board and the sub circuit board are electrically connected directly.
The repair hole may be tapered or stepped, and the preliminary light emitting unit may have a shape corresponding to the repair hole. When the preliminary light emitting unit is inserted into the repair hole, the preliminary light emitting unit may be caught in the repair hole. It is supposed to be.
The electrically connecting the sub circuit board and the main circuit board may be performed by at least one of soldering, conductive ink application, and wire bonding between the sub circuit board and the main circuit board.
The surface mounted light emitting unit array may further include a first wavelength converting member which is coated on each of the plurality of light emitting chips and converts wavelengths of light emitted from each of the plurality of light emitting chips.
The preliminary light emitting unit may further include a second wavelength conversion member which is coated on the preliminary light emitting chip and converts the wavelength of light irradiated from the preliminary light emitting chip.
In addition, the surface-mounted light emitting unit array according to the present invention for achieving the above object, the base; A main circuit board formed on the base and having an electrode having a predetermined pattern; And a plurality of light emitting chips mounted on the main circuit board to be spaced apart from each other at predetermined intervals and electrically connected to the electrodes to irradiate light, respectively, wherein the main circuit board is mounted and electrically mounted on each of the plurality of light emitting chips. A plurality of light emitting chip mounting units to be connected; A plurality of dummy mounting parts which are formed with respect to each of the plurality of light emitting chip mounting parts, and in which a preliminary light emitting chip that replaces the bad light emitting chip is mounted and electrically connected when a failure occurs in at least one light emitting chip of the plurality of light emitting chips; Wow; It characterized in that it comprises a connecting portion for electrically connecting each of the plurality of light emitting chip mounting portion.
The dummy mounting part may be formed between the connection part and the light emitting chip mounting part.
In addition, the present invention may further include a wavelength conversion member which is respectively applied on the plurality of light emitting chips, and converts the wavelength of light irradiated from each of the plurality of light emitting chips.
In order to achieve the above object, the present invention also provides a main base, a main circuit board formed on the main base and having a predetermined pattern of electrodes, and the main circuit. A light emitting unit for repairing a defective light emitting chip of a surface mount light emitting unit array including a plurality of light emitting chips mounted on a substrate spaced apart from each other at predetermined intervals and electrically connected to the electrodes to irradiate light. A sub circuit board formed on the sub base and having a sub electrode having a predetermined pattern and electrically connected to the main circuit board; And a preliminary light emitting chip mounted on the sub circuit board and electrically connected to the sub electrode, and coupled to a repair hole formed in a predetermined mounting area on the main circuit board on which a bad light emitting chip is mounted among the plurality of light emitting chips. It is characterized by.
The sub base may include a first sub base bonded to the repair hole by an adhesive and made of a metal or an insulator material; A part may be formed on the first sub base so as to extend on the main circuit board, and may include a second sub base made of an insulator material and patterned on the upper part of the sub circuit board.
The sub base may be made of an insulator material and bonded to the repair hole by an adhesive, and the sub circuit board may be formed on the sub base to be positioned in the repair hole.
The sub base is made of an insulator material, and is bonded to the repair hole by an adhesive, and the sub circuit board is formed on the sub base such that a part of the sub circuit board extends onto the main circuit board. The main circuit board and the sub circuit board are electrically connected directly.
The repair hole may be tapered or stepped, and the preliminary light emitting unit may have a shape corresponding to the repair hole so that the preliminary light emitting unit may be caught in the repair hole when the preliminary light emitting unit is inserted into the repair hole. Can be.
The present invention may further include a wavelength conversion member which is coated on the preliminary light emitting chip and converts the wavelength of light irradiated from the preliminary light emitting chip.
In another aspect, the present invention may further include a reinforcing member formed on one surface of the sub base to bond the main base and the sub base.
The surface mount light emitting unit array repair method according to the present invention configured as described above forms a repair hole by removing a component in a predetermined region including the light emitting chip in a puncturing manner when a defective light emitting chip is found in the light emitting unit array. The surface mount type light emitting unit array can be easily repaired by inserting, bonding, and connecting a preliminary light emitting unit separately manufactured to the formed repair hole.
In addition, the surface-mounted light emitting unit array according to the present invention provides a dummy mounting unit in parallel with the light emitting chip mounting unit, and easily mounts a preliminary light emitting chip on the dummy mounting unit when a defect occurs in the light emitting chip on the light emitting chip mounting unit. There is an advantage that the mounted light emitting unit array can be repaired.
In addition, since the repair light emitting unit according to the present invention has a configuration suitable for the light emitting unit array in which the defective light emitting chip is removed by a puncturing method, the repair light emitting unit can be easily installed and electrically connected to the repair hole provided in the light emitting unit array. have.
1 is a partial cross-sectional view showing a surface-mount light emitting unit array according to an embodiment of the present invention.
2 is a plan view showing a surface-mount light emitting unit array according to an embodiment of the present invention.
Figure 3 is a partial cross-sectional view for explaining a repair process of the surface-mount light emitting unit array according to an embodiment of the present invention.
4 and 5 are each a partial plan view for explaining a repair process of the surface-mount light emitting unit array according to an embodiment of the present invention.
Figure 6a is a schematic cross-sectional view showing a preliminary light emitting unit for a repair according to the first embodiment of the present invention.
6B is a partial cross-sectional view showing a surface-mounted light emitting unit array repaired by a repairing light emitting unit according to a first embodiment of the present invention.
Figure 7a is a schematic cross-sectional view showing a preliminary light emitting unit for a repair according to a second embodiment of the present invention.
7B is a partial cross-sectional view showing a surface mounted light emitting unit array repaired by a repairing preliminary light emitting unit according to a second embodiment of the present invention.
8 is a cross-sectional view illustrating an example in which a sub electrode of a repair preliminary light emitting unit and a main electrode of a main circuit board are connected by using wires.
9 is a cross-sectional view illustrating an example in which a sub-electrode of a repair preliminary light emitting unit and a main electrode of a main circuit board are connected by using conductive lines.
10A is a schematic cross-sectional view showing a preliminary light emitting unit for a repair according to a third embodiment of the present invention.
10B is a partial cross-sectional view showing a surface mounted light emitting unit array repaired by a repairing preliminary light emitting unit according to a third embodiment of the present invention.
FIG. 11 is a partial cross-sectional view of another example of a surface mounted light emitting unit array repaired by a repairing preliminary light emitting unit according to a third embodiment of the present invention; FIG.
12 is a partial cross-sectional view of a surface mounted light emitting unit array showing an example in which side surfaces and repair holes forming sub-bases of a preliminary light emitting unit are formed in a corresponding tapered shape;
13 is a plan view showing a portion of a surface mounted light emitting unit array according to another embodiment of the present invention.
FIG. 14 is a view illustrating a preliminary light emitting chip mounted on a dummy mounting unit. FIG.
Hereinafter, a surface mounted light emitting unit array, a repair method thereof, and a repair light emitting unit according to embodiments of the present invention will be described in detail with reference to the accompanying drawings.
1 is a partial cross-sectional view showing a surface mounted light emitting unit array according to an embodiment of the present invention, Figure 2 is a plan view showing a part of a surface mounted light emitting unit array according to an embodiment of the present invention.
Referring to the drawings, the surface-mount type light emitting
Each of the plurality of
In addition, the light emitting unit according to the present invention may further include a
The surface-mounted light emitting unit array configured as described above can be slimmed down to approximately 1/5 level as compared with the conventional light emitting chip package. In addition, by omitting the light emitting chip package process, the price can be reduced to about 1/10, and there is an advantage that the process can be simplified and the yield can be increased.
On the other hand, the surface-mounted light emitting unit array configured as described above may damage at least one of the plurality of light emitting chips during the manufacturing process or during use. Hereinafter, a repair method will be described in detail when the light emitting chip constituting the surface mount light emitting unit array configured as described above is damaged.
3 and 4, a repair hole H is formed by drilling a predetermined mounting area A on the
Thereafter, as shown in FIG. 5, a preliminary
As described above, when a defective light emitting chip is found, a repair hole H is formed by removing a component in a predetermined area A including the light emitting chip in a puncturing manner, and a preliminary fabricated separately in the formed repair hole H. By inserting, bonding, and connecting the
Hereinafter, a repair preliminary light emitting unit according to an embodiment of the present invention will be described in detail.
6A and 6B, the repair preliminary
The
Referring to FIG. 6B, the repair preliminary
7A and 7B, the repair preliminary
Referring to FIG. 7B, the preliminary
In addition, the electrical connection may be performed by a conductive ink coating method, a wire method, or a conductive wire method, in addition to soldering using a conductive paste.
8 is a cross-sectional view illustrating an example in which the sub-electrode 135a of the repair preliminary
9 illustrates an example in which the sub-electrode 135a of the repair preliminary
Referring to FIG. 9, the
10A and 10B, the repair preliminary
Referring to FIG. 10B, the repair preliminary
In addition, the preliminary
In addition, in forming the repair preliminary
FIG. 13 is a plan view showing a portion of a surface mounted light emitting unit array according to another embodiment of the present invention, and FIG. 14 is a view showing a preliminary light emitting chip mounted on a dummy mounting unit.
Referring to the drawings, the surface-mounted light emitting
Each of the plurality of main
The surface mount light emitting unit array according to the present embodiment is compared with the surface mount light emitting unit array according to the first embodiment, and the mounting of the repair light emitting unit in the repair process through the shape deformation of the
The
In the
The defective
When a malfunction occurs when power is applied, removal of the defective
As described above, the configured light emitting unit array includes a
The above embodiments are merely exemplary, and various modifications and equivalent other embodiments are possible to those skilled in the art. Accordingly, the true scope of protection of the present invention should be determined by the technical idea of the invention described in the following claims.
10, 200: surface mount light emitting unit array
11, 210: main base 13: insulation adhesive layer
15, 220:
20:
30:
100, 110, 130, 150, 170: preliminary light emitting unit
111, 131, 151, 171: subbase 112: first subbase
113:
115a, 135a, 155a: sub-electrodes 117, 137, 157, 175, 310: preliminary light emitting chip
119, 139, 159: second
145: wire 147: conductive wire
148: conductive adhesive 161: first adhesive
163: second adhesive 165: reinforcing member
221: light emitting chip mounting portion 225: dummy mounting portion
227: connection portion 250: the main light emitting chip
H: Repair Hall
Claims (18)
Drilling a predetermined mounting area on the main circuit board on which the bad light emitting chip is mounted among the plurality of light emitting chips, separating the bad light emitting chip on the main circuit board, and forming a repair hole;
A preliminary light emitting unit includes a sub base, a sub circuit board formed on the sub base and having a sub electrode having a predetermined pattern, and a preliminary light emitting chip mounted on the sub circuit board and electrically connected to the sub electrode. Making a step;
Inserting and bonding the preliminary light emitting unit into the repair hole;
And electrically connecting the sub circuit board and the main circuit board to each other.
The sub-base
A first sub base bonded to the repair hole by an adhesive and made of a metal or an insulator material;
The sub-circuit board is formed on the first sub-base so that a portion thereof extends on the main circuit board, and includes a second sub-base formed of an insulator material and patterned on the upper part of the sub-circuit board. The repair method of a surface-mount light emitting unit array, characterized in that the circuit board and the first sub-base is electrically insulated.
The sub base is made of an insulator material, and bonded to the repair hole by an adhesive,
And the sub circuit board is formed on the sub base so as to be located in the repair hole.
The sub base is made of an insulator material, and bonded to the repair hole by an adhesive,
The sub circuit board is formed on the sub base so that a portion thereof extends on the main circuit board,
And the main circuit board and the sub circuit board are electrically connected to each other when the preliminary light emitting unit is inserted into the repair hole.
The repair hole is tapered or stepped, the preliminary light emitting unit is formed in a shape corresponding to the repair hole,
When the preliminary light emitting unit is inserted into the repair hole, the preliminary light emitting unit can be caught in the repair hole.
The step of electrically connecting the sub circuit board and the main circuit board,
The method of repairing a surface mount type light emitting unit array, wherein the sub-circuit board and the main circuit board are performed by at least one of soldering, conductive ink coating, and wire bonding.
The surface mount light emitting unit array,
And a first wavelength conversion member coated on the plurality of light emitting chips, the first wavelength conversion member converting wavelengths of light irradiated from each of the plurality of light emitting chips.
The preliminary light emitting unit,
And a second wavelength conversion member applied on the preliminary light emitting chip and converting wavelengths of light irradiated from the preliminary light emitting chip.
A subbase;
A sub circuit board formed on the sub base and having a sub electrode having a predetermined pattern and electrically connected to the main circuit board;
And a preliminary light emitting chip mounted on the sub circuit board and electrically connected to the sub electrode, and coupled to a repair hole formed in a predetermined mounting area on the main circuit board on which a bad light emitting chip is mounted among the plurality of light emitting chips. Repair light emitting unit, characterized in that.
The sub-base
A first sub base bonded to the repair hole by an adhesive and made of a metal or an insulator material;
The light emitting unit for a repair which is formed on the first sub-base so that a portion thereof extends on the main circuit board, the second sub-base is formed of an insulator material, and the sub-circuit board is patterned thereon. .
The sub base is made of an insulator material, and bonded to the repair hole by an adhesive,
And the sub circuit board is formed on the sub base so as to be located in the repair hole.
The sub base is made of an insulator material, and bonded to the repair hole by an adhesive,
The sub circuit board is formed on the sub base so that a portion thereof extends on the main circuit board,
The light emitting unit for a repair, characterized in that the main circuit board and the sub-circuit board are electrically connected directly when inserted into the repair hole.
The repair hole is tapered or stepped, the preliminary light emitting unit is formed in a shape corresponding to the repair hole,
When the preliminary light emitting unit is inserted into the repair hole, the preliminary light emitting unit can be caught in the repair hole.
The light emitting unit for a repair applied to the preliminary light emitting chip, and further comprising a wavelength conversion member for converting the wavelength of light irradiated from the preliminary light emitting chip.
The light emitting unit for a repair is formed on one surface of the sub base, further comprising a reinforcing member for joining the main base and the sub base.
A base;
A main circuit board formed on the base and having an electrode having a predetermined pattern;
A plurality of light emitting chips mounted on the main circuit board to be spaced apart from each other at predetermined intervals and electrically connected to the electrodes to irradiate light, respectively;
The main circuit board,
A plurality of light emitting chip mounting parts to which each of the plurality of light emitting chips is mounted and electrically connected;
A plurality of dummy mounting parts which are formed with respect to each of the plurality of light emitting chip mounting parts, and in which a preliminary light emitting chip that replaces the bad light emitting chip is mounted and electrically connected when a failure occurs in at least one of the light emitting chips; Wow;
And a connection part electrically connecting each of the plurality of light emitting chip mounting parts to each other.
And the dummy mounting portion is formed between the connection portion and the light emitting chip mounting portion.
And a wavelength conversion member applied to each of the plurality of light emitting chips and converting wavelengths of light emitted from each of the plurality of light emitting chips.
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
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KR1020100018040A KR101064146B1 (en) | 2010-02-26 | 2010-02-26 | Surface mount light emitting unit array, repair method thereof and light emitting unit for repair |
PCT/KR2010/005736 WO2011105670A1 (en) | 2010-02-26 | 2010-08-26 | Surface-mounted light-emitting unit array, method for repairing same, and light-emitting unit for repairing same |
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KR1020100018040A KR101064146B1 (en) | 2010-02-26 | 2010-02-26 | Surface mount light emitting unit array, repair method thereof and light emitting unit for repair |
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KR101064146B1 true KR101064146B1 (en) | 2011-09-16 |
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JP6064584B2 (en) * | 2012-12-22 | 2017-01-25 | 日亜化学工業株式会社 | Light emitting device and manufacturing method thereof |
JP6065586B2 (en) * | 2012-12-28 | 2017-01-25 | 日亜化学工業株式会社 | Light emitting device and manufacturing method thereof |
KR101324987B1 (en) * | 2013-04-09 | 2013-11-04 | 주식회사현진라이팅 | Printed circuit board providing radiant heat function and steady illuminance function and lighting apparatus using the same |
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JP2005158957A (en) * | 2003-11-25 | 2005-06-16 | Matsushita Electric Works Ltd | Light emitting device |
KR100744906B1 (en) * | 2006-06-12 | 2007-08-01 | 삼성전기주식회사 | Separable board and light emitting device module using the same |
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- 2010-02-26 KR KR1020100018040A patent/KR101064146B1/en not_active IP Right Cessation
- 2010-08-26 WO PCT/KR2010/005736 patent/WO2011105670A1/en active Application Filing
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KR20110002892A (en) * | 2009-06-29 | 2011-01-11 | 서울반도체 주식회사 | Light emitting module |
Cited By (3)
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US20140177177A1 (en) * | 2012-12-25 | 2014-06-26 | National Taipei University Of Technology | Electronic device and fabrication method thereof |
US9155205B2 (en) * | 2012-12-25 | 2015-10-06 | National Taipei University Of Technology | Electronic device and fabrication method thereof |
CN113054070A (en) * | 2019-12-26 | 2021-06-29 | 深圳市洲明科技股份有限公司 | Integrated packaging display module, repairing method thereof and display device |
Also Published As
Publication number | Publication date |
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KR20110098421A (en) | 2011-09-01 |
WO2011105670A1 (en) | 2011-09-01 |
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