KR101064013B1

KR101064013B1 - Light emitting module

Info

Publication number: KR101064013B1
Application number: KR1020090103347A
Authority: KR
Inventors: 박상재
Original assignee: 엘지이노텍 주식회사
Priority date: 2009-10-29
Filing date: 2009-10-29
Publication date: 2011-09-08
Also published as: KR20110046728A

Abstract

The embodiment relates to a light emitting module.

The light emitting module according to the embodiment may include a circuit board including a first electrode terminal and a second electrode terminal and a heat dissipation member embedded between the first and second electrode terminals; And at least one light emitting diode electrically connected to the first electrode terminal and the second electrode terminal and disposed on the heat dissipation member.

Board, LED, Heat Dissipation

Description

Light emitting module {LIGHT EMITTING MODULE}

The embodiment relates to a light emitting module.

In general, a circuit board is a circuit pattern formed of a conductive material such as copper on an electrically insulating board, and refers to a board immediately before mounting an electronic component related heating element. Such a circuit board includes a semiconductor device and a heating device such as a light emitting diode (LED), and the like, in particular, a device such as a light emitting diode emits serious heat. Therefore, when heat is not processed in the circuit board on which the heating element is mounted as described above, the temperature of the circuit board on which the heating element is mounted is increased to cause the inoperability and malfunction of the heating element, as well as to reduce the reliability of the product. do.

The embodiment provides a light emitting module having an embedded heat dissipation member.

The embodiment provides a light emitting module in which a light emitting diode is in contact with a heat radiating member provided on a circuit board.

The embodiment provides a light emitting module for contacting a lead electrode of a light emitting diode to an upper surface of a heat radiation member including a thermally conductive resin and a conductive via.

The embodiment can improve the heat radiation efficiency of the light emitting diode.

The embodiment can improve the reliability of the light emitting module.

In describing the above embodiments, each layer, region, pattern, or structure may be placed on or under a substrate, each layer, region, pad, or pattern. When described as being formed, "on" and "under" include both the meanings of "directly" and "indirectly". In addition, the criteria for the top or bottom of each layer will be described with reference to the drawings. In the drawings, the thickness or size of each layer is exaggerated, omitted, or schematically illustrated for convenience and clarity of description. In addition, the size of each component does not necessarily reflect the actual size. Technical features of each embodiment are not limited to each embodiment and may be selectively applied to other embodiments.

1 is a perspective view illustrating a light emitting module according to an embodiment, and FIG. 2 is a partial side cross-sectional view of FIG. 1.

Referring to FIG. 1, the light emitting module 300 includes a circuit board 200 having a heat dissipation member 260 and a light emitting diode 100 on the circuit board 200.

The light emitting module 300 has a structure in which a plurality of light emitting diodes 100 are arrayed at predetermined intervals on the circuit board 200, and the plurality of light emitting diodes 100 may be arranged in one or more columns, and may be arranged with each other. It can be connected in series or in parallel. Such technical features may be changed within the technical scope of the embodiment.

The light emitting module 300 may be used as a light source for an indicator device, a display device, an illumination device, and the like, but is not limited thereto.

The circuit board 200 includes a metal plate 210, a plurality of insulating layers 230 and 250, and a plurality of copper foil layers 220 and 240. The circuit board 200 includes, but is not limited to, a metal PCB or a substrate having the metal plate 210 attached thereto.

The metal plate 210 of the circuit board 200 may include at least one selected from Cu, Al, Ti, and Mg as a base of the circuit board 200, and may have a predetermined thickness for heat dissipation and support. , 1mm ± 0.5mm may be formed, but is not limited to this thickness.

The first copper foil layer 220 is disposed on the uppermost side of the circuit board 200, and a first insulating layer 230 is disposed below the first copper foil layer 220, and the first insulating layer 230 is disposed. A second copper foil layer 240 is disposed below, and a second insulating layer 250 is disposed below the second copper foil layer 240. The embodiment has a structure in which two copper foil layers 220 and 240 and two insulating layers 230 and 250 are disposed for convenience of description, but is not limited thereto. In addition, the terminology of the copper foil layers 220 and 240 is an example for describing an embodiment, and may be defined as a circuit layer or a metal layer having electrical conductivity. The copper foil layer thickness is between 20 ~ 50um, the thickness of the insulating layer may be formed about 80 ~ 120um, but is not limited thereto.

The first and second copper foil layers 220 and 240 may be formed using a material selected from, for example, Cu, Al, Ti, and Mg. Preferably, the first and second copper foil layers 220 and 240 may be formed using Cu, and other materials may be formed on the surface of the Cu. It may be further coated and changed within the technical scope of the embodiment.

The first and second copper foil layers 220 and 240 may include electrode terminals 222 and 224 that are selectively connected, and the electrode terminals 222, 224 and 225 may be configured as an optional circuit according to an internal circuit pattern. Here, the electrode terminals 222, 224, 225 of the first copper foil layer 220 and the second copper foil layer 240 may be connected to each other through a via structure, but is not limited thereto.

The electrode terminals 222 and 224 of the first copper layer 220 may be divided into first electrode terminals 222 and second electrode terminals 224 having different polarities, and the first electrode terminal 222 may be one or more. A plurality of second electrode terminals 224 may be provided. The first electrode terminal 222 and the second electrode terminal 224 are spaced apart from each other, the interval may be disposed within the length (width of one side) of the light emitting diode 100. An upper surface of the first copper foil layer 220 may have a photo solder resist (PSR) or the like in an area except for the electrode terminals 222 and 224 and the heat dissipation member 260, but is not limited thereto.

The first insulating layer 230 is disposed between the first copper foil layer 220 and the second copper foil layer 240 to electrically insulate it. The second insulating layer 250 is disposed between the metal plate 210 and the second copper foil layer 240 to electrically insulate the two layers. The material of the first and second insulating layers 230 and 250 may be formed of any one of an epoxy series, a silicon series, and a prepreg series. The first and second insulating layers 230 and 250 may function as adhesive members for bonding between two adjacent layers. In addition, the adhesive layer may be bonded between the layers and the layers using an adhesive, but is not limited thereto. In addition, a material of the insulating layers 230 and 250 may be formed around the electrode terminals 222 and 224 in the copper foil layers 220 and 240 by a compression molding process.

The heat dissipation member 260 may be disposed inside the circuit board 200, that is, under the light emitting diode mounting region. The heat dissipation member 260 is formed in an embedded form on the circuit board 200, an upper portion of the heat dissipation member 260 is exposed to or protrudes from an upper surface of the circuit board 200, and a lower portion is formed in the circuit board 200. do.

The heat dissipation member 260 may have an upper surface shape of a circular shape or a polygonal shape, and a side cross section may have a polygonal shape or a rhombus shape, and the shape may be variously changed within the technical scope of the embodiment.

At least one upper portion of the heat dissipation member 260 is disposed between the first electrode terminal 222 and the second electrode terminal 224 of the circuit board 200. An upper portion of the heat dissipation member 260 may be disposed closer to the first electrode terminal 222 than the second electrode terminal 224, which is the heat dissipation member 260 in the surface mount technology (SMT) process. Electrical contact with the second electrode terminal 224 can be prevented. An upper portion of the heat dissipation member 260 may be spaced apart from and electrically separated from the first electrode terminal 222 and the second electrode terminal 224. This electrically separates the first electrode terminal 222, the heat dissipation member 260, and the second electrode terminal 224 for the SMT process. In addition, the heat dissipation member 260 may perform heat dissipation more effectively when the heat dissipation member 260 is not in contact with an electrode terminal through which current flows.

As shown in FIG. 2, the heat dissipation member 260 is formed to a depth from the upper surface of the circuit board 200 to the second copper foil layer 240 or to a depth not in contact with the metal plate 210. Can be formed.

The heat dissipation member 260 may use a conductive resin such as resin, such as epoxy, silicone, plastic, PVC resin, and the like, but is not limited thereto.

The heat dissipation member 260 may include metal particles such as silver in the conductive resin, thereby improving heat conduction characteristics.

The heat dissipation member 260 includes at least one conductive via 262, and the conductive via 262 may be formed using a conductive metal, for example, gold. The conductive via 262 may be formed as a via hole or a via structure. One or more conductive vias 262 may be formed to improve heat dissipation efficiency. The plurality of conductive vias 262 may be spaced apart from each other and exposed or protruded from the surface of the conductive resin. Two or more conductive vias 262 may be disposed in a cluster.

The surface area of the heat dissipation member 260 may be formed in a size of about 8 to 15% of the lower area of the light emitting diode 200, and the size of the area becomes a contact area with the light emitting diode 200. The heat dissipation surface area can be.

The conductive via 262 may be formed at the height of the heat dissipation member 260 or more or less, but is not limited thereto. The conductive via 262 may have a diameter of about 100 μm to about 400 μm, but is not limited thereto. The height of the conductive via 262 is about 200 ~ 300um, this height may vary depending on the multilayer structure of the circuit board.

The heat dissipation member 260 may be in contact with the first polar terminal of the second copper foil layer 240 therein. In addition, when the heat dissipation member 260 has three or more layers, the heat dissipation member 260 may be in contact with the inner copper foil layer, and the contact may be changed in consideration of heat dissipation and electrical efficiency.

The heat dissipation member 260 may increase the heat dissipation efficiency of the light emitting diode 100 by using the thermal conductive resin and the conductive via 262.

On the other hand, the light emitting diode 100 is provided in the body portion 120, the first lead electrode 111 and the second lead electrode 113 provided in the body portion 120 and the body portion 120 The light emitting device 130 may be electrically connected to the first lead electrode 111 and the second lead electrode 113, and the molding member 150 may surround the light emitting device 130.

The body part 120 may include a silicon material, a synthetic resin material, or a metal material, and an inclined surface may be formed around the light emitting device 130.

The first lead electrode 111 and the second lead electrode 113 may be implemented as a lead frame or a plating layer, are electrically separated from each other, and provide power to the light emitting device 130. In addition, the first lead electrode 111 and the second lead electrode 113 may increase light efficiency by reflecting the light generated from the light emitting device 130, and heat generated from the light emitting device 130. It may also play a role in discharging it to the outside.

A portion of the first lead electrode 111 and the second lead electrode 113 is disposed under the body portion 120, and the first lead electrode 111 is a first portion of the circuit board 200. Bonded on the electrode terminal 222, the second lead electrode 113 is bonded to the second electrode terminal 224 of the circuit board 200. The length and width of the first lead electrode 111 of the light emitting diode 100 may be formed to cover the first electrode terminal 222 and the heat dissipation member 260 of the circuit board 200.

The light emitting device 130 may be installed on the body portion 120 or on the first lead electrode 111 or the second lead electrode 113.

The light emitting device 130 may be electrically connected to the second lead electrode 113 through a wire, and may be connected to the first lead electrode 111 in an adhesive or die bonding form.

The molding member 150 may be made of silicon or epoxy, and may surround the light emitting device 130 to protect the light emitting device 130. In addition, the molding member 150 may include a phosphor to change the wavelength of light emitted from the light emitting device 130.

The body portion 120 includes a cavity area inside the reflection cup at an upper portion thereof, one end of the lead electrodes 111 and 113 is disposed on a bottom surface thereof, and the light emitting device 130 and the molding member 150 are disposed. to be.

The light emitting diode 100 is mounted on an upper layer of the circuit board 200. The first lead electrode 111 and the second lead electrode 113 of the light emitting diode 100 are formed on the circuit board 200. The first electrode terminal 222 and the second electrode terminal 224 are bonded.

The distance between the first electrode terminal 222 and the second electrode terminal 224 in the circuit board 200 depends on the size of the light emitting diode 100, and the first adjacent adjacent between the heat dissipation member 260. The distance between the electrode terminal 222 and the second electrode terminal 224 may vary depending on the pitch of the light emitting diode 100.

The heat dissipation member 260 may be in contact with a pattern of at least one of the first copper foil layer 220 and the second copper foil layer 240 in the circuit board 200, and the polarity of the contact pattern may be It may be the same as the first polarity. In addition, since the heat dissipation member 260 is electrically spaced apart from the metal plate 210, the heat dissipation member 260 may prevent electrical shorts caused by the heat dissipation member 260.

The heat dissipation member 260 is connected to the bottom surface of the first electrode terminal 222 of the light emitting diode 100 by bonding or surface contact, so that heat generated from the light emitting diode 100 is transferred to the heat dissipation member 260. Conductive through the heat dissipation member 260 through the heat conductive resin and the heat dissipation via 262 to the heat dissipation. The heat dissipation member 260 may dissipate heat generated from the light emitting diodes 100, thereby improving reliability of the light emitting module 300.

The light emitting module 300 includes a plurality of light emitting diodes 100, which can effectively dissipate heat generated through the plurality of light emitting diodes 100, thereby providing a display device having a light emitting module 300. It is possible to improve the reliability of the indicating device, the lighting device and the like.

3 is a side sectional view showing a light emitting module according to a second embodiment. In describing the second embodiment, the same parts as in the first embodiment are referred to the first embodiment, and redundant descriptions thereof will be omitted.

Referring to FIG. 3, the light emitting module 300A may radiate heat generated from the light emitting diodes 100A through the heat dissipation member 260A and the metal plate 210 of the circuit board 200.

The light emitting diode 100A includes a first lead electrode 111, a second lead electrode 113, and a support frame 115 inside the body 120. The first lead electrode 111, the second lead electrode 113, and the support frame 115 may be implemented as a lead frame.

The support frame 115 is disposed between the first lead electrode 111 and the second lead electrode 113, and is electrically separated from the lead electrodes 111 and 113 by the separator 114.

The support frame 115 is disposed on the bottom surface of the cavity area of the body portion 120. The light emitting device 130A is attached to the support frame 115 with an adhesive, and is connected to the first lead electrode 111 and the second lead electrode 113 by a wire.

Since the first lead electrode 111, the support frame 115, and the second lead electrode 113 of the light emitting diode 100A are disposed on the bottom surface of the body part 120, the light emitting diode 115 may be disposed on the bottom surface of the light emitting diode 100A. It is mounted on the circuit board 200.

The first lead electrode 111 of the light emitting diode 100A is bonded to the first electrode terminal 222 of the circuit board 200, and the second lead electrode 113 is a second electrode of the circuit board 200. Bonded to terminal 224. The support frame 115 of the light emitting diode 100A may be attached to the heat dissipation member 260A of the circuit board 200 with a conductive adhesive or the like.

The lower end of the heat dissipation member 260A may or may not be in electrical contact with the metal plate 210 of the circuit board 200, which may be changed in consideration of electrical characteristics and heat dissipation efficiency of the light emitting module 300A. Can be.

In the light emitting module 300A, heat generated from the light emitting device 130A of the light emitting diode 100A is conducted to the support frame 115 thereunder, and the support frame 115 has a heat dissipation member 260A thereunder. ), The heat dissipation member 260A performs its own heat dissipation, and conducts heat dissipation to the metal plate 210 under the heat dissipation.

The plurality of conductive vias 262 of the heat dissipation member 260A may be arranged at equal intervals, or two or more of them may be arranged in a group. The conductive via 262 may be plated with the same material as the first and second electrode terminals 111 and 113.

When the lower end of the heat dissipation member 260A is in contact with the metal plate 210, the heat dissipation member 260A may be electrically separated from the circuit patterns of the other copper foil layers 220 and 240.

4 is a side cross-sectional view illustrating a light emitting module according to a third embodiment. In describing the third embodiment, the same parts as those in the second embodiment are referred to the second embodiment, and redundant description thereof will be omitted.

Referring to FIG. 4, the light emitting module 300B may radiate heat generated from the light emitting diode 100A through the insulating layer 250 of the circuit board 200 through the heat radiating member 260A. In addition, the heat dissipation member 260A may indirectly radiate heat through the metal plate 210 of the circuit board 200, but is not limited thereto.

5 is a side sectional view showing a light emitting module according to a fourth embodiment. In the description of the fourth embodiment, the same parts as those in the first embodiment are referred to the first embodiment, and redundant description thereof will be omitted.

Referring to FIG. 5, the light emitting module 300D may radiate heat generated from the light emitting diodes 100 through the lower plate 210A through the heat radiating member 260B. When the lower plate 210A is made of a metal material, the lower plate 210A may be configured as a heat dissipation plate having an electrically open circuit, so that the lower plate 210A may be disposed without contact with the first lead electrode 111 of the light emitting diode 100. . Here, the lower plate 210 may be used as a non-conductive material and a thermally conductive material.

Although the present invention has been described above with reference to the embodiments, these are merely examples and are not intended to limit the present invention. Those skilled in the art to which the present invention pertains should be provided within the scope not departing from the essential characteristics of the present invention. It will be appreciated that various modifications and applications are not possible.

For example, each component shown in detail in the embodiment of the present invention may be modified. And differences relating to such modifications and applications will have to be construed as being included in the scope of the invention defined in the appended claims.

1 is a perspective view of a light emitting module according to a first embodiment.

2 is a partial side cross-sectional view of FIG. 1.

3 is a side cross-sectional view of a light emitting module according to a second embodiment.

4 is a side cross-sectional view of a light emitting module according to a third embodiment.

5 is a side cross-sectional view of a light emitting module according to a fourth embodiment.

Claims

A circuit board including a first electrode terminal and a second electrode terminal and a heat dissipation member disposed in an area between the first and second electrode terminals; And

A first lead electrode disposed on the circuit board and corresponding to the first electrode terminal of the circuit board; A second lead electrode corresponding to the second electrode terminal of the circuit board and spaced apart from the first lead electrode; At least one light emitting diode including a light emitting device disposed on the first lead electrode,

The heat dissipation member of the circuit board is disposed under the first lead electrode.

A first lead electrode disposed on the circuit board and corresponding to the first electrode terminal of the circuit board; A second lead electrode corresponding to the second electrode terminal and spaced apart from the first lead electrode; A support frame disposed between the first and second lead electrodes; And at least one light emitting diode disposed on the support frame and including a light emitting device electrically connected to the first and second lead electrodes.

The heat dissipation member of the circuit board is disposed under the support frame of the light emitting diode.

The heat dissipation member of claim 1, wherein the heat dissipation member comprises: a thermally conductive resin having a via structure to which a first metal is added; And a plurality of conductive vias comprising a second metal in the thermally conductive resin.

The light emitting module of claim 1 or 2, wherein the light emitting diode further comprises a body portion in which the first and second lead electrodes are disposed.

The light emitting module according to claim 1 or 2, wherein the circuit board includes a copper foil layer having a plurality of first electrode terminals and a second electrode terminal, and an insulating layer alternately disposed under the copper foil layer at least once.

The light emitting module of claim 5, wherein the circuit board comprises a metal plate under a lowermost insulating layer.

The heat dissipation device of claim 1, wherein the first electrode terminal of the circuit board is spaced apart from the heat dissipation member in a first direction and is disposed below the first lead electrode, and the second electrode terminal is disposed in the first direction from the heat dissipation member. The light emitting module spaced apart in the opposite direction and disposed under the second lead electrode.

The method of claim 7, wherein a plurality of light emitting diodes are arranged on the circuit board,

At least one heat dissipation member is disposed under each of the light emitting diodes.

The heat dissipation member of claim 5, wherein the heat dissipation member is embedded in at least three layers from an upper surface of the circuit board in a region between the first and second electrode terminals of the circuit board. The light emitting module is in contact with the insulating layer disposed on the.

The light emitting module of claim 6, wherein a lower portion of the heat dissipation member is in contact with an upper surface of the metal plate.

The light emitting module according to claim 1 or 2, wherein an upper surface area of the heat dissipation member is about 8-15% of a lower area of the light emitting diode.

The light emitting module of claim 3, wherein the thermally conductive resin includes metal particles including silver, and the conductive via includes gold (Au).

The light emitting module of claim 3, wherein upper surfaces of the conductive vias and the thermally conductive resin are exposed on an upper portion of the circuit board.

The light emitting module of claim 3, wherein the conductive via has a diameter of about 100 μm to about 400 μm.

The light emitting module of claim 2, wherein the support frame is disposed between the light emitting element and the heat dissipation member.

The light emitting module of claim 1, wherein the heat dissipation member is disposed closer to the first electrode terminal than the second electrode terminal.

The method of claim 6, wherein the metal plate comprises aluminum,

The insulating layer is a light emitting module of epoxy or prepreg (prepreg).