KR101049610B1 - 코일 부품 및 그 제조방법 - Google Patents
코일 부품 및 그 제조방법 Download PDFInfo
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- KR101049610B1 KR101049610B1 KR1020067000863A KR20067000863A KR101049610B1 KR 101049610 B1 KR101049610 B1 KR 101049610B1 KR 1020067000863 A KR1020067000863 A KR 1020067000863A KR 20067000863 A KR20067000863 A KR 20067000863A KR 101049610 B1 KR101049610 B1 KR 101049610B1
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- H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
- H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
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- H01F2017/048—Fixed inductances of the signal type with magnetic core with encapsulating core, e.g. made of resin and magnetic powder
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- H—ELECTRICITY
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y10T29/49032—Fabricating head structure or component thereof
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Coils Or Transformers For Communication (AREA)
- Manufacturing Cores, Coils, And Magnets (AREA)
Abstract
Description
Claims (14)
- 제 1 자성기판의 주면(主面)상의 전체 면에 성막된 임피던스값 조정용 절연층과,상기 임피던스값 조정용 절연층 상에 교대로 성막된 코일 패턴 및 절연층과,상기 코일 패턴에 둘러싸이는 중앙영역과 상기 코일 패턴의 외주영역의 한쪽 또는 양쪽의 상기 절연층 부분을 제거하여 형성되고, 상기 임피던스값 조정용 절연층이 노출되는 절연층 제거부와,최상층의 상기 절연층상 및 상기 절연층 제거부에 형성된 자분(磁粉)함유 수지와,상기 자분함유 수지 상에 형성된 접착층을 통해 접착된 제 2 자성기판을 갖는 것을 특징으로 하는 코일 부품.
- 제 1항에 있어서,상기 임피던스값 조정용 절연층의 두께는, 1 미크론으로부터 20 미크론인 것을 특징으로 하는 코일 부품.
- 제 1항 또는 제 2항에 있어서,상기 임피던스값 조정용 절연층은, 폴리이미드로 이루어지는 것을 특징으로 하는 코일 부품.
- 제 1항 또는 제 2항에 있어서,상기 코일 패턴이 복수개 형성되는 것을 특징으로 하는 코일 부품.
- 제 1 자성기판의 주면상에 임피던스값 조정용 절연층을 전체 면에 성막하는 제 1 성막 공정과,상기 임피던스값 조정용 절연층상에 코일 패턴과 절연층을 교대로 성막하는 제 2 성막 공정과,상기 임피던스값 조정용 절연층 이외의 각 절연층의 상기 코일 패턴에 둘러싸이는 중앙영역과 상기 코일 패턴 외주영역의 한쪽 또는 양쪽의 절연층 부분을 제거하는 에칭 공정과,최상층의 절연층상에 자분함유 수지를 도포함과 동시에 상기 절연층의 제거부에도 상기 자분함유 수지를 매립 도포하는 도포 공정과,상기 자분함유 수지의 경화후에 해당 자분함유 수지면을 연마하여 평탄화하는 연마 공정과,상기 자분함유 수지의 평탄화된 면에 접착제를 통해 제 2 자성기판을 접착하는 접착 공정을 구비하는 것을 특징으로 하는 코일 부품의 제조방법.
- 자성재료로 형성된 제 1 자성기판과,상기 제 1 자성기판상의 전체 면에 형성된 제 1 절연층과,상기 제 1 절연층 상에 형성된 제 2 절연층과,상기 제 2 절연층 중에 매립되고, 나선형상으로 형성된 도전성 코일 도체와,상기 코일 도체의 내주측 및 외주측에 형성되고, 상기 제 1 절연층이 노출되는 개구부와,적어도 상기 개구부를 매립하여 형성된 자성층과,상기 자성층 상에 고착되고, 자성재료로 형성된 제 2 자성기판과,상기 코일 도체의 단자부에 접속되고, 상기 제 1 및 제 2 자성기판의 측면을 가로질러 배치된 전극단자를 갖는 것을 특징으로 하는 코일 부품.
- 제 6항에 있어서,상기 자성층과 상기 제 2 자성기판과의 사이에 제 3 절연층이 더 형성되는 것을 특징으로 하는 코일 부품.
- 제 6항 또는 제 7항에 있어서,상기 제 1 절연층은, 상기 전극단자의 근방에 형성되는 것을 특징으로 하는 코일 부품.
- 제 6항 또는 제 7항에 있어서,상기 제 1 절연층은 Al2O3로 형성되는 것을 특징으로 하는 코일 부품.
- 제 6항 또는 제 7항에 있어서,상기 코일 도체는 절연막을 끼고 복수층 형성되는 것을 특징으로 하는 코일 부품.
- 자성재료로 형성된 제 1 자성기판상의 전체 면에 제 1 절연층을 형성하고,상기 제 1 절연층상에 제 2 절연층의 일부가 되는 절연막을 형성하고,상기 절연막 상에 나선형상으로 도전성 코일 도체를 형성하고,상기 코일 도체상에 제 2 절연층의 일부가 되는 절연막을 더 형성하고,상기 코일 도체의 내주측 및 외주측에 제 1 절연층이 노출되는 개구부를 형성하고,적어도 상기 개구부를 매립하는 자성층을 형성하고,상기 자성층 상에 자성 재료로 형성된 제 2 자성기판을 고착하고,상기 코일 도체의 단자부에 접속되고, 상기 제 1 및 제 2 자성기판의 측면을 가로질러 대치되는 전극단자를 형성하는 것을 특징으로 하는 코일 부품의 제조방법.
- 제 11항에 있어서,상기 자성층과 상기 제 2 자성기판과의 사이에 제 3 절연층을 더 형성하는 것을 특징으로 하는 코일 부품의 제조방법.
- 제 11항 또는 제 12항에 있어서,스퍼터링법으로 상기 제 1 절연층을 형성하는 것을 특징으로 하는 코일 부품의 제조방법.
- 제 11항 또는 제 12항에 있어서,상기 코일 도체를 프레임 도금법으로 형성하는 것을 특징으로 하는 코일 부품의 제조방법.
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
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JP2003202154A JP3912601B2 (ja) | 2003-07-28 | 2003-07-28 | コモンモードチョークコイル及びその製造方法並びにコモンモードチョークコイルアレイ |
JPJP-P-2003-00202154 | 2003-07-28 | ||
JPJP-P-2003-00307372 | 2003-08-29 | ||
JP2003307372A JP2005079323A (ja) | 2003-08-29 | 2003-08-29 | コイル部品及びその製造方法 |
PCT/JP2004/010731 WO2005010899A1 (ja) | 2003-07-28 | 2004-07-28 | コイル部品及びその製造方法 |
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KR20060052814A KR20060052814A (ko) | 2006-05-19 |
KR101049610B1 true KR101049610B1 (ko) | 2011-07-14 |
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KR1020067000863A KR101049610B1 (ko) | 2003-07-28 | 2004-07-28 | 코일 부품 및 그 제조방법 |
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US (2) | US7145427B2 (ko) |
KR (1) | KR101049610B1 (ko) |
CN (1) | CN100592440C (ko) |
TW (1) | TWI380328B (ko) |
WO (1) | WO2005010899A1 (ko) |
Families Citing this family (56)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4238097B2 (ja) * | 2003-09-04 | 2009-03-11 | Tdk株式会社 | コイル部品の製造方法 |
JP3995253B2 (ja) * | 2004-09-28 | 2007-10-24 | Tdk株式会社 | 感光性ポリイミドパターンの形成方法及び該パターンを有する電子素子 |
JP4317107B2 (ja) * | 2004-09-30 | 2009-08-19 | Tdk株式会社 | 有機材料系絶縁層を有する電子素子及びその製造方法 |
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JP4424298B2 (ja) * | 2005-10-26 | 2010-03-03 | Tdk株式会社 | 電子部品 |
JP4737199B2 (ja) * | 2006-08-07 | 2011-07-27 | 株式会社村田製作所 | 積層コイル部品 |
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JP4683026B2 (ja) * | 2007-09-07 | 2011-05-11 | Tdk株式会社 | コモンモードチョークコイル及びその製造方法 |
US7987581B2 (en) * | 2008-05-28 | 2011-08-02 | Flextronics Ap, Llc | High power manufacturing friendly transformer |
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TW201201523A (en) * | 2010-06-28 | 2012-01-01 | Inpaq Technology Co Ltd | Thin type common mode filter and method of manufacturing the same |
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US8601673B2 (en) | 2010-11-25 | 2013-12-10 | Cyntec Co., Ltd. | Method of producing an inductor with a high inductance |
KR101214749B1 (ko) * | 2011-04-25 | 2012-12-21 | 삼성전기주식회사 | 적층형 파워 인덕터 |
TWI447753B (zh) * | 2011-07-07 | 2014-08-01 | Inpaq Technology Co Ltd | 具異質疊層之共模濾波器及其製造方法 |
TW201303920A (zh) * | 2011-07-11 | 2013-01-16 | Inpaq Technology Co Ltd | 多層螺旋結構之共模濾波器及其製造方法 |
TWI441205B (zh) | 2011-09-23 | 2014-06-11 | Inpaq Technology Co Ltd | 多層螺旋結構之共模濾波器及其製造方法 |
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KR101541570B1 (ko) | 2011-09-30 | 2015-08-04 | 삼성전기주식회사 | 코일 부품 및 그 제조방법 |
KR101514491B1 (ko) * | 2011-12-08 | 2015-04-23 | 삼성전기주식회사 | 코일 부품 및 그 제조방법 |
KR20130101849A (ko) * | 2012-03-06 | 2013-09-16 | 삼성전기주식회사 | 박막형 공통 모드 필터 |
KR101514499B1 (ko) * | 2012-03-15 | 2015-04-22 | 삼성전기주식회사 | 공통모드필터 제조방법 및 공통모드필터 |
CN103578687B (zh) * | 2012-08-08 | 2016-03-23 | 佳邦科技股份有限公司 | 薄膜式共模滤波器 |
US10312007B2 (en) * | 2012-12-11 | 2019-06-04 | Intel Corporation | Inductor formed in substrate |
KR20140081224A (ko) * | 2012-12-21 | 2014-07-01 | 삼성전기주식회사 | 신호보상 기능을 갖는 공통 모드 필터 |
JP2015144219A (ja) * | 2014-01-31 | 2015-08-06 | 株式会社村田製作所 | 電子部品及びその製造方法 |
KR20150114799A (ko) * | 2014-04-02 | 2015-10-13 | 삼성전기주식회사 | 적층 어레이 전자부품 및 그 제조방법 |
DE102014210013A1 (de) * | 2014-05-26 | 2015-11-26 | Schaeffler Technologies AG & Co. KG | Magnetische Platine und Verfahren zu deren Herstellung |
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KR101630083B1 (ko) * | 2014-12-03 | 2016-06-13 | 삼성전기주식회사 | 코일 부품 |
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DE102015206173A1 (de) * | 2015-04-07 | 2016-10-13 | Würth Elektronik eiSos Gmbh & Co. KG | Elektronisches Bauteil und Verfahren zum Herstellen eines elektronischen Bauteils |
US11227825B2 (en) * | 2015-12-21 | 2022-01-18 | Intel Corporation | High performance integrated RF passives using dual lithography process |
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US10103703B2 (en) * | 2016-05-20 | 2018-10-16 | Qualcomm Incorporated | Double-sided circuit |
US20180061569A1 (en) * | 2016-08-26 | 2018-03-01 | Analog Devices Global | Methods of manufacture of an inductive component and an inductive component |
US11239019B2 (en) | 2017-03-23 | 2022-02-01 | Tdk Corporation | Coil component and method of manufacturing coil component |
DE102018113765B4 (de) | 2017-06-09 | 2023-11-02 | Analog Devices International Unlimited Company | Transformator mit einer durchkontaktierung für einen magnetkern |
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JP6720945B2 (ja) * | 2017-09-12 | 2020-07-08 | 株式会社村田製作所 | コイル部品 |
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JP7115235B2 (ja) * | 2018-11-08 | 2022-08-09 | 株式会社村田製作所 | 電子部品及び電子部品の製造方法 |
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KR102167361B1 (ko) * | 2020-02-17 | 2020-10-20 | 한국과학기술원 | 투명 미세 전극 및 이의 제조 방법 |
CN111246659B (zh) * | 2020-02-24 | 2021-08-17 | 西安易朴通讯技术有限公司 | Pcb及电子设备 |
JP7230850B2 (ja) * | 2020-02-26 | 2023-03-01 | 株式会社村田製作所 | インダクタ部品 |
JP7322833B2 (ja) * | 2020-08-05 | 2023-08-08 | 株式会社村田製作所 | コモンモードチョークコイル |
DE102020134823A1 (de) | 2020-12-23 | 2022-06-23 | P-Duke Technology Co., Ltd. | Hochisolierter mehrschichtiger Planartransformator und Leiterplattenintegration davon |
US20230116340A1 (en) * | 2021-10-08 | 2023-04-13 | Wits Co., Ltd. | Method of manufacturing wireless charging coil module coated with magnetic material on surface of coil |
AU2023207082A1 (en) * | 2022-01-13 | 2024-07-11 | H3X Technologies Inc. | Electrical winding |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100281937B1 (ko) | 1997-08-04 | 2001-04-02 | 무라타 야스타카 | 코일 부품 |
US20030076211A1 (en) | 2001-10-23 | 2003-04-24 | Murata Manufacturing Co., Ltd. | Coil device |
Family Cites Families (25)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4781306A (en) * | 1981-02-19 | 1988-11-01 | Minnesota Mining And Manufacturing Company | Stack of sheet material |
JPS63173213A (ja) * | 1987-01-13 | 1988-07-16 | Hitachi Ltd | 薄膜磁気ヘツドの製造方法 |
US4907825A (en) * | 1987-06-03 | 1990-03-13 | Minnesota Mining And Manufacturing Company | Sheet and dispenser package therefor |
US4770320A (en) * | 1987-06-03 | 1988-09-13 | Minnesota Mining And Manufacturing Company | Sheet and dispenser package therefor |
US5856898A (en) * | 1988-02-29 | 1999-01-05 | Nec Corporation | Spiral coil pattern including same layer spiral patterns suitable for use in a thin film head |
JPH0346107A (ja) * | 1989-07-13 | 1991-02-27 | Fuji Photo Film Co Ltd | 薄膜磁気ヘッド |
DE4117878C2 (de) * | 1990-05-31 | 1996-09-26 | Toshiba Kawasaki Kk | Planares magnetisches Element |
US6090461A (en) * | 1992-09-11 | 2000-07-18 | 3M Innovative Properties Company | Temporary display device |
JPH0722241A (ja) * | 1993-07-05 | 1995-01-24 | Matsushita Electric Ind Co Ltd | 平面インダクターとその製造方法 |
JPH0722242A (ja) | 1993-07-06 | 1995-01-24 | Matsushita Electric Ind Co Ltd | 平面インダクターおよびその製造方法 |
US5872693A (en) * | 1993-08-10 | 1999-02-16 | Kabushiki Kaisha Toshiba | Thin-film magnetic head having a portion of the upper magnetic core coplanar with a portion of the lower magnetic core |
US5769270A (en) * | 1993-11-25 | 1998-06-23 | Minnesota Mining And Manufacturing Company | Tape or sheet dispenser |
JP3601619B2 (ja) | 1995-01-23 | 2004-12-15 | 株式会社村田製作所 | コモンモードチョークコイル |
US5683194A (en) * | 1995-06-22 | 1997-11-04 | Minnesota Mining And Manufacturing Company | Attaching strips for documents |
JP3580054B2 (ja) | 1996-10-29 | 2004-10-20 | 富士電機デバイステクノロジー株式会社 | 薄膜磁気素子およびその製造方法 |
US5876817A (en) * | 1996-10-31 | 1999-03-02 | Minnesota Mining And Manufacturing Company | Adhesive clip |
US6038110A (en) * | 1996-12-06 | 2000-03-14 | International Business Machines Corporation | Dual header tape head design |
US5875080A (en) * | 1997-09-05 | 1999-02-23 | International Business Machines Corporation | Write head with second coil above pole having coil density less electrically connected first coil below the pole |
US5870802A (en) * | 1997-09-09 | 1999-02-16 | Goldman; William A. | Banded paper clip |
JPH11284471A (ja) | 1998-03-31 | 1999-10-15 | Tdk Corp | 回路部品とその製造方法 |
JP2000182834A (ja) | 1998-12-10 | 2000-06-30 | Tokin Corp | 積層型インダクタンス素子及びその製造方法 |
JP2000322709A (ja) | 1999-05-13 | 2000-11-24 | Alps Electric Co Ltd | 薄膜素子およびその製造方法 |
JP2001217126A (ja) | 1999-11-22 | 2001-08-10 | Fdk Corp | 積層インダクタ |
JP4702581B2 (ja) | 2001-01-09 | 2011-06-15 | 日立金属株式会社 | 積層型多連トランスおよびこれを用いた差動伝送ケーブル |
JP3284130B1 (ja) * | 2001-04-25 | 2002-05-20 | ティーディーケイ株式会社 | 磁気抵抗効果装置およびその製造方法、薄膜磁気ヘッドおよびその製造方法、ヘッドジンバルアセンブリならびにハードディスク装置 |
-
2004
- 2004-07-20 US US10/894,045 patent/US7145427B2/en active Active
- 2004-07-28 TW TW093122651A patent/TWI380328B/zh active
- 2004-07-28 WO PCT/JP2004/010731 patent/WO2005010899A1/ja active Application Filing
- 2004-07-28 KR KR1020067000863A patent/KR101049610B1/ko active IP Right Grant
- 2004-07-28 CN CN200410058746A patent/CN100592440C/zh not_active Expired - Lifetime
-
2006
- 2006-10-24 US US11/585,098 patent/US7905008B2/en active Active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100281937B1 (ko) | 1997-08-04 | 2001-04-02 | 무라타 야스타카 | 코일 부품 |
US20030076211A1 (en) | 2001-10-23 | 2003-04-24 | Murata Manufacturing Co., Ltd. | Coil device |
Also Published As
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US7145427B2 (en) | 2006-12-05 |
US20070033798A1 (en) | 2007-02-15 |
US20050068148A1 (en) | 2005-03-31 |
CN1577648A (zh) | 2005-02-09 |
US7905008B2 (en) | 2011-03-15 |
CN100592440C (zh) | 2010-02-24 |
TW200515432A (en) | 2005-05-01 |
KR20060052814A (ko) | 2006-05-19 |
WO2005010899A1 (ja) | 2005-02-03 |
TWI380328B (en) | 2012-12-21 |
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