KR101007638B1 - 개선된 웨이퍼 이송장치를 갖는 반도체 제조장치 - Google Patents
개선된 웨이퍼 이송장치를 갖는 반도체 제조장치 Download PDFInfo
- Publication number
- KR101007638B1 KR101007638B1 KR1020100037497A KR20100037497A KR101007638B1 KR 101007638 B1 KR101007638 B1 KR 101007638B1 KR 1020100037497 A KR1020100037497 A KR 1020100037497A KR 20100037497 A KR20100037497 A KR 20100037497A KR 101007638 B1 KR101007638 B1 KR 101007638B1
- Authority
- KR
- South Korea
- Prior art keywords
- wafer
- semiconductor manufacturing
- blade
- manufacturing apparatus
- area
- Prior art date
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J11/00—Manipulators not otherwise provided for
- B25J11/0095—Manipulators transporting wafers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J15/00—Gripping heads and other end effectors
- B25J15/009—Gripping heads and other end effectors with pins for accurately positioning the object on the gripping head
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68757—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a coating or a hardness or a material
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S414/00—Material or article handling
- Y10S414/135—Associated with semiconductor wafer handling
- Y10S414/141—Associated with semiconductor wafer handling includes means for gripping wafer
Landscapes
- Engineering & Computer Science (AREA)
- Robotics (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Chemical Vapour Deposition (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
Description
도 2는 본 발명의 반도체 제조장치의 웨이퍼 이송장치의 개략 평면도.
도 3은 도 2의 A-A선 단면도.
도 4는 도 3의 B-B선 단면도.
도 5는 도 2의 사시도.
구분 | 색상 | 경도 (Hv) |
마찰 계수 |
막두께 (편측) (㎛) |
내열 온도(℃) |
부식 저항 |
산화 저항 |
마모 저항 |
소착 저항 |
충격 저항 |
TiCN | 회색 | 2,700 ~3,000 |
0.2 | 2~4 | 400 | O | O | O | O | O |
TiAlN | 어두운 회색 |
3,000 ~3,300 |
0.5~0.7 | 2~5 | 800~900 | O | O | O | O | O |
12, 13, 14, 15 : 접촉부
Claims (4)
- 삭제
- 삭제
- 삭제
- 반도체 제조를 위해 웨이퍼를 일정위치로 이송하는 블레이드(10)에 웨이퍼(W)가 안정되게 유지되도록 일정면적을 갖는 웨이퍼재치부(11); 및
상기 웨이퍼재치부(11)에 웨이퍼(W)가 접촉되는 면적을 최소화하도록 중심으로부터 외주쪽으로 일정각도 상향 경사지게 돌출 형성되고, 그 바깥부분이 일정 중심각을 갖는 곡률이 형성된 접촉부(12)(13)(14)(15)로 구성된 반도체 제조장치에 있어서,
상기 웨이퍼재치부(11)와 접촉부(12)(13)(14)(15)는 전기가 통하여 플라즈마 이온의 외부 방출이 용이하게 이루어짐으로써 웨이퍼의 손상을 방지하도록 Ti 70%, C 20%, N 10%로 배합한 TiCN 코팅 혹은 Ti 45%, Al 45%, N 10%로 배합한 TiAlN 코팅 중 어느 하나를 400℃ ~ 500℃에서 PVD 코팅으로 실시한 것을 특징으로 하는 개선된 웨이퍼 이송장치를 갖는 반도체 제조장치.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020100037497A KR101007638B1 (ko) | 2010-04-22 | 2010-04-22 | 개선된 웨이퍼 이송장치를 갖는 반도체 제조장치 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020100037497A KR101007638B1 (ko) | 2010-04-22 | 2010-04-22 | 개선된 웨이퍼 이송장치를 갖는 반도체 제조장치 |
Publications (1)
Publication Number | Publication Date |
---|---|
KR101007638B1 true KR101007638B1 (ko) | 2011-01-21 |
Family
ID=43616178
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020100037497A KR101007638B1 (ko) | 2010-04-22 | 2010-04-22 | 개선된 웨이퍼 이송장치를 갖는 반도체 제조장치 |
Country Status (1)
Country | Link |
---|---|
KR (1) | KR101007638B1 (ko) |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20010074921A (ko) * | 1998-09-02 | 2001-08-09 | 추후제출 | 각각의 웨이퍼를 처리하기 위한 장치 및 방법 |
JP2003168717A (ja) * | 2001-12-03 | 2003-06-13 | Yaskawa Electric Corp | ウェハ搬送フォーク |
-
2010
- 2010-04-22 KR KR1020100037497A patent/KR101007638B1/ko active IP Right Grant
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20010074921A (ko) * | 1998-09-02 | 2001-08-09 | 추후제출 | 각각의 웨이퍼를 처리하기 위한 장치 및 방법 |
JP2003168717A (ja) * | 2001-12-03 | 2003-06-13 | Yaskawa Electric Corp | ウェハ搬送フォーク |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US11043400B2 (en) | Movable and removable process kit | |
CN107112265B (zh) | 基板传送机构 | |
EP1348230B1 (en) | Susceptor pocket profile to improve process performance | |
CN107924821B (zh) | 外延成长装置、外延晶片的制造方法以及外延成长装置用顶升销 | |
KR101774213B1 (ko) | 기판 프로세스 챔버용 2 피스 셔터 디스크 조립체 | |
US8911151B2 (en) | Substrate support bushing | |
KR20070097296A (ko) | 오염물을 감소시키는 기판 이송 및 지지 시스템 | |
KR101333356B1 (ko) | 반송 기구 | |
KR20180085822A (ko) | 기판에 걸친 온도 프로파일을 최소화하기 위한 홈들을 갖는 평판형 서셉터 | |
EP1396879B1 (en) | Method of fabricating semiconductor wafer | |
KR102343265B1 (ko) | 자가-센터링 페데스탈 가열기 | |
KR101007638B1 (ko) | 개선된 웨이퍼 이송장치를 갖는 반도체 제조장치 | |
US20220076988A1 (en) | Back side design for flat silicon carbide susceptor | |
KR20210118797A (ko) | 기판을 처리하는 방법 | |
CN103824796A (zh) | 用于led外延制程的石墨承载盘及其配套衬底 | |
US9431279B2 (en) | Heater block and a substrate treatment apparatus | |
US20040001206A1 (en) | Z-axis monitoring apparatus for robot blade | |
US20220098724A1 (en) | Vacuum system and method to deposit a compound layer | |
KR20120120102A (ko) | 진공처리장치 및 진공처리방법 | |
JP2005064509A (ja) | 半導体ウェハ取扱用のロボットのブレード | |
KR102035300B1 (ko) | 기판 처리 장치 | |
JP2012109409A (ja) | 基板搬送トレイ | |
EP3184666A1 (en) | System and method for gas phase deposition | |
KR20060111066A (ko) | 반도체 제조장비에서의 히터블록 구조 | |
US20160035604A1 (en) | Substrate Processing Device and Substrate Processing Device-Use Coupling Member |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
A302 | Request for accelerated examination | ||
E902 | Notification of reason for refusal | ||
E90F | Notification of reason for final refusal | ||
E701 | Decision to grant or registration of patent right | ||
GRNT | Written decision to grant | ||
FPAY | Annual fee payment |
Payment date: 20131018 Year of fee payment: 4 |
|
FPAY | Annual fee payment |
Payment date: 20141017 Year of fee payment: 5 |
|
FPAY | Annual fee payment |
Payment date: 20151022 Year of fee payment: 6 |
|
FPAY | Annual fee payment |
Payment date: 20161108 Year of fee payment: 7 |
|
FPAY | Annual fee payment |
Payment date: 20171212 Year of fee payment: 8 |
|
FPAY | Annual fee payment |
Payment date: 20181218 Year of fee payment: 9 |
|
FPAY | Annual fee payment |
Payment date: 20191209 Year of fee payment: 10 |