KR101001360B1 - printed circuit board electrically connected to the ground of electronic device - Google Patents

printed circuit board electrically connected to the ground of electronic device Download PDF

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Publication number
KR101001360B1
KR101001360B1 KR20080056346A KR20080056346A KR101001360B1 KR 101001360 B1 KR101001360 B1 KR 101001360B1 KR 20080056346 A KR20080056346 A KR 20080056346A KR 20080056346 A KR20080056346 A KR 20080056346A KR 101001360 B1 KR101001360 B1 KR 101001360B1
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KR
South Korea
Prior art keywords
ground
layer
printed circuit
circuit board
electronic device
Prior art date
Application number
KR20080056346A
Other languages
Korean (ko)
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KR20090130631A (en
Inventor
강경일
이용구
Original Assignee
(주)기가레인
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Priority to KR20080056346A priority Critical patent/KR101001360B1/en
Priority to PCT/KR2008/006904 priority patent/WO2009154335A1/en
Publication of KR20090130631A publication Critical patent/KR20090130631A/en
Application granted granted Critical
Publication of KR101001360B1 publication Critical patent/KR101001360B1/en

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0215—Grounding of printed circuits by connection to external grounding means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/07—Electric details
    • H05K2201/0707—Shielding
    • H05K2201/0715—Shielding provided by an outer layer of PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/0989—Coating free areas, e.g. areas other than pads or lands free of solder resist
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structure Of Printed Boards (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)

Abstract

Disclosed is a printed circuit board electrically connected to the ground of an electronic device. The printed circuit board according to the embodiment of the present invention, the first ground layer extending in one direction; A first dielectric layer stacked on the first ground layer and extending in the same direction as the first ground layer; A signal transmission line stacked on the first dielectric layer and extending in the same direction as the first dielectric layer; And a cover layer covering the first ground layer. A portion of the cover layer is removed and a portion of the first ground layer is exposed through the removed portion, and the exposed portion of the first ground layer is in electrical contact with the ground of the electronic device.

Description

Printed circuit board electrically connected to the ground of electronic device

Embodiments of the present invention relate to a printed circuit board, for example, to a printed circuit board electrically connected to the ground of an electronic device.

In the conventional coaxial cable, in order to form the ground, the sheath of the coaxial cable was covered with a metal body and then electrically connected with the ground of the mobile phone.

On the other hand, internal circuits of wireless communication devices are generally implemented in a printed circuit board (PCB). Such printed circuit board technology is rapidly developing, and nowadays, flexible printed circuit boards (FPCBs) capable of free movement as well as conventional rigid printed circuit boards are widely used.

An object of the present invention is to provide a printed circuit board electrically connected to the ground of an electronic device.

Another object of the present invention is to provide a printed circuit board in which a part of the ground layer is exposed by removing a part of the cover layer.

A printed circuit board according to an embodiment of the present invention for achieving the above technical problem, the first ground layer extending in one direction; A first dielectric layer stacked on the first ground layer and extending in the same direction as the first ground layer; A signal transmission line stacked on the first dielectric layer and extending in the same direction as the first dielectric layer; And a cover layer covering the first ground layer. A portion of the cover layer is removed and a portion of the first ground layer is exposed through the removed portion, and the exposed portion of the first ground layer is in electrical contact with the ground of the electronic device.

The printed circuit board according to the embodiment of the present invention, the bonding sheet disposed on the signal transmission line; A second dielectric layer disposed on the bonding sheet; And a second ground layer disposed on the second dielectric layer.

The printed circuit board according to the exemplary embodiment of the present invention may further include a conductive material disposed between the exposed portion of the first ground layer and the ground of the electronic device.

According to another aspect of the present invention, a printed circuit board includes: a printed circuit board coupled to an electronic device, the first ground layer extending in one direction; A first dielectric layer stacked on the first ground layer and extending in the same direction as the first ground layer; And a signal transmission line stacked on the first dielectric layer and extending in the same direction as the first dielectric layer, wherein the first ground layer is in electrical contact with the ground of the electronic device.

In accordance with still another aspect of the present invention, a printed circuit board includes: a printed circuit board coupled to an electronic device, the first ground layer extending in one direction; A first dielectric layer stacked on the first ground layer and extending in the same direction as the first ground layer; A signal transmission line stacked on the first dielectric layer and extending in the same direction as the first dielectric layer; And a cover layer covering the first ground layer, wherein a portion of the cover layer is removed and a portion of the first ground layer is exposed through the removed portion, and an exposed portion of the first ground layer is exposed. It is in electrical contact with the ground of the component mounted on the electronic device.

According to another embodiment of the present invention, a printed circuit board includes: a substrate unit extending in a first direction; And at least one ground unit protruding from a side of the long side of the substrate unit, wherein the at least one ground unit comprises: a first ground layer; A first dielectric layer stacked on the first ground layer; And a signal transmission line stacked on the first dielectric layer, wherein the first ground layer of the one or more ground units is electrically connected to the ground of the electronic device.

The printed circuit board according to the embodiment of the present invention has an advantage of being able to set a stable ground of the printed circuit board by being electrically connected to the ground of the electronic device.

In addition, by removing a part of the cover layer, a part of the ground layer is exposed, and the exposed area of the ground layer is electrically contacted with the ground of the electronic device. Accordingly, there is an advantage that can set a stable ground of the printed circuit board.

DETAILED DESCRIPTION In order to fully understand the present invention, the operational advantages of the present invention, and the objects achieved by the practice of the present invention, reference should be made to the accompanying drawings which illustrate preferred embodiments of the present invention and the contents described in the drawings.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings. Like reference numerals in the drawings denote like elements.

The printed circuit board (PCB) disclosed herein may be a general printed circuit board or a flexible printed circuit board.

1 is a view showing a printed circuit board according to a first embodiment of the present invention.

Referring to FIG. 1, the printed circuit board 100 according to the first embodiment of the present invention includes a cover layer 110, a first ground layer 120, a first dielectric layer 130, and a signal transmission line ( 140). The cover layer 110, the first ground layer 120, the first dielectric layer 130, and the signal transmission line 140 are sequentially stacked and extended in the same direction.

The cover layer 110 covers one surface of the first ground layer 120. A portion of cover layer 110 is removed. Hereinafter, the removed region is referred to as a cover layer removal region 115. A portion of the first ground layer 120 is exposed through the cover layer removal region 115. The exposed area of the first ground layer 120 may be in electrical contact with the ground of the electronic device. As a result, the first ground layer 120 serves as a ground of the printed circuit board 100. The exposed area of the first ground layer 120 is in electrical contact with the ground of the electronic device will be described later.

The first ground layer 120 is made of a metallic material (eg, copper) and is connected to ground. The first dielectric layer 130 is made of a dielectric material (eg, poly-imide). The signal transmission line 140 is made of a metallic material (for example, copper).

2 is a view showing a printed circuit board according to a second embodiment of the present invention.

2, the printed circuit board 200 according to the second embodiment of the present invention includes a cover layer 210, a first ground layer 220, a first dielectric layer 230, and a signal transmission line 240. ), A bonding sheet 250, a second dielectric layer 270, and a second ground layer 280.

The cover layer 210 covers one side of the first ground layer 220. A portion of the cover layer 210 is removed, thereby forming a cover layer removal region 215. A portion of the first ground layer 220 is exposed through the cover layer removal region 215. The exposed area of the first ground layer 220 may be in electrical contact with the ground of the electronic device. As a result, the first ground layer 220 serves as a ground of the printed circuit board 200. The exposed area of the first ground layer 220 is in electrical contact with the ground of the electronic device will be described later.

On the other hand, compared to the printed circuit board 100 shown in FIG. 1, the printed circuit board 200 shown in FIG. 2 has a bonding sheet 250, a second dielectric layer 270, and a second ground layer 280. It is further provided. The second ground layer 280 is made of a metallic material (eg, copper) and is connected to ground. Second dielectric layer 270 is made of a dielectric material (eg, poly-imide). The bonding sheet 250 bonds the second dielectric layer 270 and the second ground layer 280 to the signal transmission line 240.

3 is a view showing a printed circuit board according to a third embodiment of the present invention.

Referring to FIG. 3, the printed circuit board 300 according to the third embodiment of the present invention may include a cover layer 310, a first ground layer 320, a first dielectric layer 330, and a signal transmission line 340. , A bonding sheet 350, a second dielectric layer 370, and a second ground layer 380.

The cover layer 310 covers one side of the first ground layer 320. A portion of the cover layer 310 is removed, thereby forming a cover layer removal region 315. A portion of the first ground layer 320 is exposed through the cover layer removal region 315.

The printed circuit board 300 according to the third embodiment of the present invention further includes a via hole 390. The via hole 390 penetrates the first dielectric layer 330 and the second dielectric layer 370 to electrically connect the first ground layer 320 and the second ground layer 380.

Since the remaining components correspond to the components shown in FIG. 2, description thereof will be omitted.

A portion of the first ground layer 320 exposed through the cover layer removal region 315 may be electrically contacted with the ground of the electronic device. As a result, the first ground layer 320 may serve as a ground of the printed circuit board 300. In this case, since the second ground layer 380 is electrically connected to the first ground layer 320 through the via hole 390, the second ground layer 380 may also serve as a ground.

Alternatively, the second ground layer 380 may be electrically contacted with the ground of the electronic device without contacting the exposed area of the first ground layer 320 with the ground of the electronic device. Even in this case, due to the via hole 390, both the first ground layer 320 and the second ground layer 380 may serve as grounds.

Alternatively, both the exposed area of the first ground layer 320 and the second ground layer 380 may be in contact with the ground of the electronic device.

1 to 3, an embodiment in which a printed circuit board includes a cover layer is illustrated. However, the printed circuit board according to another exemplary embodiment of the present invention may not include a cover layer.

A printed circuit board according to another embodiment of the present invention includes the remaining components except for the cover layer 110 in the printed circuit board 100 of FIG. 1, and the first ground layer 120 is connected to the ground of the electronic device. Can be electrically connected

In addition, the printed circuit board according to another embodiment of the present invention, the remaining components other than the cover layer 210 in the printed circuit board 200 of Figure 2, the first ground layer 220 and / or The second ground layer 280 may be electrically connected to the ground of the electronic device.

In addition, the printed circuit board according to another embodiment of the present invention, the remaining components other than the cover layer 310 in the printed circuit board 300 of Figure 3, the first ground layer 320 and / or The second ground layer 380 may be electrically connected to the ground of the electronic device.

4 illustrates a state in which the printed circuit board 100 of FIG. 1 is electrically connected to the ground 420 of the electronic device 400.

Referring to FIG. 4A, as a portion of the cover layer 110 is removed, a portion of the first ground layer 120 of the printed circuit board 100 is exposed. Referring to FIG. 4B, the printed circuit board 100 is placed on the electronic device 400 with the exposed area of the first ground layer 120 facing downward. The exposed area of the first ground layer 120 is in direct contact with the ground 420 of the electronic device 400.

Meanwhile, the exposed area of the first ground layer 120 and the ground 420 of the electronic device 400 do not need to be in direct contact as long as they are electrically contacted. For example, a conductive material (not shown) may be disposed between the exposed area of the first ground layer 120 and the ground 420 of the electronic device 400. The conductive material (not shown) electrically connects the exposed area of the first ground layer 120 and the electronic device 400 to thereby more securely connect the first ground layer 120 to the ground. Accordingly, the first ground layer 120 may be completely grounded. Examples of the conductive material (not shown) may include conductive silicon pieces or elastic bodies.

Further, in addition to the structure using the conductive material, a structure for electrically connecting the exposed area of the first ground layer 120 and the ground 420 of the electronic device 400 may be modified and implemented by those skilled in the art. Therefore, detailed description of various modifications is omitted.

5 illustrates a state in which the printed circuit board 100 of FIG. 1 is electrically connected to the ground of a component mounted on the electronic device 500.

4 illustrates that the exposed area of the first ground layer 120 contacts the ground 420 of the electronic device 400. In contrast, FIG. 5 illustrates a state in which the exposed area of the first ground layer 120 contacts the ground 570 of the component 550 mounted on the electronic device 500.

Referring to FIG. 5A, as a portion of the cover layer 110 is removed, a portion of the first ground layer 120 of the printed circuit board 100 is exposed. In addition, the ground 570 is formed in the component 550 mounted on the electronic device 500. Referring to FIG. 5B, a printed circuit board 100 is placed on the electronic device 500. The printed circuit board 100 is placed on the electronic device 500 with the exposed area of the first ground layer 120 facing upward. The component 550 is placed on the printed circuit board 100 with the ground 570 down. The exposed area of the first ground layer 120 is in direct contact with the ground 570 of the component 550.

Meanwhile, the exposed area of the first ground layer 120 and the ground 570 of the component 550 do not need to be in direct contact as long as they are electrically contacted. For example, a conductive material (not shown) may be disposed between the exposed area of the first ground layer 120 and the ground 570 of the component 550. A conductive material (not shown) electrically connects the first ground layer 120 to the ground by electrically connecting the exposed area of the first ground layer 120 and the ground 570 of the component 550. Accordingly, the first ground layer 120 may be completely grounded. Examples of the conductive material (not shown) may include conductive silicon pieces or elastic bodies.

Furthermore, in addition to the structure using the conductive material, a structure for electrically connecting the exposed area of the first ground layer 120 and the ground 570 of the component 550 may be modified and implemented by those skilled in the art.

The electronic devices 400 and 500 illustrated in FIGS. 4 and 5 may be mobile phones, and the component 550 illustrated in FIG. 5 may be batteries installed in the mobile phones. However, those skilled in the art will recognize that the mobile phone and the battery are merely examples. That is, the printed circuit board 100 exposing a part of the first ground layer 120 may be connected to various electronic devices as well as a mobile phone.

4 and 5 illustrate that the printed circuit board 100 of FIG. 1 is connected to the ground 420 of the electronic device 400 or the ground 570 of the component 550, but the printed circuit of FIG. 2 is illustrated. The substrate 200 may also be electrically connected to the ground 420 of the electronic device 400 or the ground 570 of the component 550.

For example, the printed circuit board 200 illustrated in FIG. 2 may be placed on the electronic device 400 with the exposed area of the first ground layer 220 facing downward. The exposed area of the first ground layer 220 may be in direct contact with the ground 420 of the electronic device 400 or may be electrically contacted through a conductive material (not shown). The printed circuit board 200 illustrated in FIG. 2 may be placed on the electronic device 500 with the exposed area of the first ground layer 220 facing upward. Component 550 may be placed on printed circuit board 200 with ground 570 down. The exposed area of the first ground layer 220 may be in direct contact with the ground 570 of the component 550 or may be in electrical contact through a conductive material (not shown).

In addition, the printed circuit board 300 of FIG. 3 may also be electrically connected to the ground 420 of the electronic device 400 or the ground 570 of the component 550. To this end, the exposed areas of the first ground layer 320 and / or the second ground layer 380 are in direct contact with the ground 420 of the electronic device 400 or the ground 570 of the component 550. Alternatively, electrical contact may be made through a conductive material (not shown).

In addition, the printed circuit board according to another embodiment of the present invention without the cover layer may be electrically connected to the ground 420 of the electronic device 400 or the ground 570 of the component 550.

6 illustrates a state in which a printed circuit board is electrically connected to an electronic device according to another embodiment of the present invention.

Referring to FIG. 6, a printed circuit board 600 according to another embodiment of the present invention includes a substrate unit 605 and one or more ground units 662 and 664. The number of ground units 662 and 664 may be one or more. 6 illustrates an example in which the number of the grounding units 662 and 664 is two. The ground units 662 and 664 may be electrically connected to the ground 720 of the electronic device 700. The ground units 662 and 664 may be directly contacted or connected to the ground 720 of the electronic device 700 through a conductive material (not shown).

The substrate unit 605 extends in the first direction. Ground units 662 and 664 are connected to both sides of the long side of substrate unit 605, respectively. That is, the ground units 662 and 664 extend from the side of the long side of the substrate unit 605. On the other hand, if the number of grounding units is one, one grounding unit (eg, 662) will be connected to one side of the substrate unit 605. The substrate unit 605 may have a rectangular shape. The ground units 662 and 664 may be connected to sides of both long sides of the substrate unit 605 having a rectangular shape, respectively.

The substrate unit 605 has a structure similar to that of the printed circuit board 200 shown in FIG. 2. However, a portion of the cover layer 210 is removed from the printed circuit board 200 shown in FIG. 2, while a cover layer (not shown) is not removed from the substrate unit 605 shown in FIG. 6, or It does not have a cover layer (not shown). The substrate unit 605 will be described later with reference to FIG. 7.

Ground units 662 and 664 have via holes 692 and 694, respectively. The via holes 692 and 694 are formed through the ground units 662 and 664, and electrically connect the uppermost layer and the lowermost layer of the ground units 662 and 664. Ground units 662 and 664 and via holes 692 and 694 are described below with reference to FIG. 7.

FIG. 7 is a side view of the printed circuit board of FIG. 6.

Referring to FIG. 7, the substrate unit 605 may include a cover layer 610, a first ground layer 620, a first dielectric layer 630, a signal transmission line 640, a bonding sheet 650, and a second dielectric. A layer 670, and a second ground layer 680. The ground units 662 and 664 have a form in which the layers 620, 630, 650, 670, and 680 of the substrate unit 605 except for the cover layer 610 extend. That is, the ground unit (eg, 662) may also have layers 622, 632, 652, 672, and 682 sequentially stacked and extending in the same direction, and the ground unit (eg, 664) may also be present. Layers 624, 634, 654, 674, 684 stacked sequentially and extending in the same direction may be provided.

The via holes 692 and 694 pass through the ground units 662 and 664 so that the first ground layers 622 and 624 and the second ground layers 682 and 684 of the ground units 662 and 664 are formed. Is electrically connected. Accordingly, when the ground is connected to only one of the first ground layers 622 and 624 and the second ground layers 682 and 684, the ground may be connected to the other side. In addition, since the via holes 692 and 694 are not formed in the substrate unit 605 serving as a signal transmission, the via holes 692 and 694 do not affect the signal transmission function of the printed circuit board 600. That is, the via holes 692 and 694 may be used to easily ground both the first ground layers 622 and 624 and the second ground layers 682 and 684 without affecting the signal transmission function.

Meanwhile, the printed circuit board 600 may not include the via holes 692 and 694. In this case, the first ground layers 622 and 624 and the second ground layers 682 and 684 may or may not be connected to ground as necessary.

A portion of cover layer 610 is preferably not removed. However, as long as the ground units 662 and 664 are provided, the cover layer 610 may be included in the substrate unit 605. Alternatively, although the substrate unit 605 is illustrated as having the cover layer 610 in FIG. 7, the substrate unit 605 may not have the cover layer.

Meanwhile, the printed circuit board 600 shown in FIG. 7 has a strip line structure. In contrast, the printed circuit board may have a micro strip line structure. That is, the substrate unit and the ground unit of the printed circuit board may include a first ground layer, a first dielectric layer, and a signal transmission line. The first ground layer of the ground unit may be electrically connected to the ground of the electronic device.

In addition, the printed circuit board having the micro strip line structure may further include a cover layer covering the first ground layer. The cover layer may have a form in which some regions are removed or may have a form in which some regions are not removed.

8 is a view showing a printed circuit board according to another embodiment of the present invention.

Referring to FIG. 8, the printed circuit board 800 according to another embodiment of the present invention may include a cover layer 810, a first ground layer 820, a first dielectric layer 830, and a signal transmission line 840. ), One or more connection patterns 842, 844, and one or more via holes 892, 894. The cover layer 810, the first ground layer 820, the first dielectric layer 830, the signal transmission line 840, and the one or more connection patterns 842 and 844 are sequentially stacked and extended in the same direction. .

The cover layer 810 covers one side of the first ground layer 820. A portion of cover layer 810 is removed. Hereinafter, the removed region is referred to as a cover layer removal region 815. A portion of the first ground layer 820 is exposed through the cover layer removal region 815.

In contrast to the printed circuit board 100 shown in FIG. 1, the printed circuit board 800 shown in FIG. 8 further includes one or more connection patterns 842 and 844 and one or more via holes 892 and 894. do.

One or more connection patterns 842 and 844 extend in the same direction at a predetermined distance apart from each other in the short direction of the signal transmission line 840 and are formed on the same layer as the signal transmission line 840. One or more connection patterns 842 and 844 may have the same material as the signal transmission line 840. One or more via holes 892 and 894 penetrate the first dielectric layer 830 to electrically connect the connection patterns 842 and 844 and the first ground layer 820.

In FIG. 8, the number of connection patterns 842 and 844 is illustrated as two, but the number of connection patterns may be one or three or more. Depending on the number of connection patterns, the number of via holes may also vary.

As described above, optimal embodiments have been disclosed in the drawings and the specification. Although specific terms have been used herein, they are used only for the purpose of describing the present invention and are not intended to limit the scope of the invention as defined in the claims or the claims. Therefore, those skilled in the art will understand that various modifications and equivalent other embodiments are possible therefrom. Therefore, the true technical protection scope of the present invention will be defined by the technical spirit of the appended claims.

BRIEF DESCRIPTION OF THE DRAWINGS In order to better understand the drawings cited in the detailed description of the invention, a brief description of each drawing is provided.

1 is a view showing a printed circuit board according to a first embodiment of the present invention.

2 is a view showing a printed circuit board according to a second embodiment of the present invention.

3 is a view showing a printed circuit board according to a third embodiment of the present invention.

FIG. 4 illustrates a state in which the printed circuit board of FIG. 1 is electrically connected to the ground of the electronic device.

FIG. 5 illustrates a state in which the printed circuit board of FIG. 1 is electrically connected to a ground of a component mounted on an electronic device.

6 illustrates a state in which a printed circuit board is electrically connected to an electronic device according to another embodiment of the present invention.

FIG. 7 is a side view of the printed circuit board of FIG. 6.

8 is a view showing a printed circuit board according to another embodiment of the present invention.

Claims (27)

In a printed circuit board coupled to an electronic device, A first ground layer extending in one direction; A first dielectric layer stacked on the first ground layer and extending in the same direction as the first ground layer; A signal transmission line stacked on the first dielectric layer and extending in the same direction as the first dielectric layer; And A cover layer covering the first ground layer, A portion of the cover layer is removed and a portion of the first ground layer is exposed through the removed portion. The method of claim 1, wherein the printed circuit board, A bonding sheet disposed on the signal transmission line; A second dielectric layer disposed on the bonding sheet; And The printed circuit board further comprises a second ground layer disposed on the second dielectric layer. The method according to claim 1 or 2, The exposed portion of the first ground layer is Printed circuit board, characterized in that the electrical contact with the ground of the electronic device. The method of claim 2, wherein the printed circuit board, And a via hole penetrating through the first dielectric layer and the second dielectric layer to electrically connect the first ground layer and the second ground layer. The method of claim 4, wherein The exposed portion of the first ground layer or the second ground layer is in electrical contact with the ground of the electronic device, The exposed portion of the first ground layer and the second ground layer, the printed circuit board, characterized in that the electrical contact with the ground of the electronic device. The method of claim 5, wherein the printed circuit board, And a conductive material disposed between the exposed portion of the first ground layer and the ground of the electronic device. The method of claim 5, wherein the exposed portion of the first ground layer, Printed circuit board, characterized in that in direct contact with the ground of the electronic device. The method of claim 1, wherein the printed circuit board, One or more connection patterns extending in the same direction at a predetermined distance apart from each other in a shorter direction of the signal transmission line and formed on the same layer as the signal transmission line; And And a via hole penetrating the first dielectric layer to electrically connect the connection pattern and the first ground layer. And wherein the exposed portion of the first ground layer is in electrical contact with the ground of the electronic device. In a printed circuit board coupled to an electronic device, A first ground layer extending in one direction; A first dielectric layer stacked on the first ground layer and extending in the same direction as the first ground layer; And A signal transmission line stacked on the first dielectric layer and extending in the same direction as the first dielectric layer, And the first ground layer is in electrical contact with the ground of the electronic device. The method of claim 9, wherein the printed circuit board, A bonding sheet disposed on the signal transmission line; A second dielectric layer disposed on the bonding sheet; And The printed circuit board further comprises a second ground layer disposed on the second dielectric layer. The method of claim 10, wherein the printed circuit board, And a via hole penetrating through the first dielectric layer and the second dielectric layer to electrically connect the first ground layer and the second ground layer. The method of claim 11, The first ground layer or the second ground layer is in electrical contact with the ground of the electronic device, And the first ground layer and the second ground layer are in electrical contact with the ground of the electronic device. In a printed circuit board coupled to an electronic device, A first ground layer extending in one direction; A first dielectric layer stacked on the first ground layer and extending in the same direction as the first ground layer; A signal transmission line stacked on the first dielectric layer and extending in the same direction as the first dielectric layer; And A cover layer covering the first ground layer, A portion of the cover layer is removed and a portion of the first ground layer is exposed through the removed portion, and the exposed portion of the first ground layer is in electrical contact with the ground of the component mounted to the electronic device. Printed circuit board characterized in that. The method of claim 13, wherein the printed circuit board, A bonding sheet disposed on the signal transmission line; A second dielectric layer disposed on the bonding sheet; And The printed circuit board further comprises a second ground layer disposed on the second dielectric layer. The method according to claim 13 or 14, wherein the component, Printed circuit board comprising a battery (battery). The method of claim 15, The electronic device is a mobile phone, The component is a printed circuit board comprising a mobile phone battery. The method of claim 13 or 14, wherein the printed circuit board, And a conductive material disposed between the exposed portion of the first ground layer and the ground of the electronic device. A substrate unit extending in a first direction; And One or more grounding units protruding from a side of the long side of the substrate unit, The substrate unit and the at least one ground unit, A first ground layer; A first dielectric layer stacked on the first ground layer; And And a signal transmission line stacked on the first dielectric layer, The first ground layer of the at least one ground unit, the printed circuit board, characterized in that electrically connected to the ground of the electronic device. The method of claim 18, The substrate unit and the at least one ground unit, A bonding sheet disposed on the signal transmission line; A second dielectric layer disposed on the bonding sheet; And And a second ground layer disposed on the second dielectric layer. The method of claim 18 or 19, wherein the substrate unit, The printed circuit board further comprises a cover layer covering the first ground layer. The method of claim 19, wherein the ground unit, Via holes penetrating the first dielectric layer, the bonding sheet, and the second dielectric layer of the ground unit to electrically connect the first ground layer and the second ground layer of the ground unit. Printed circuit board, characterized in that it further comprises. The method of claim 19 or 21, The first ground layer or the second ground layer of the at least one ground unit is electrically connected to the ground of the electronic device, The first ground layer and the second ground layer of the at least one ground unit, the printed circuit board, characterized in that electrically connected to the ground of the electronic device. The method of claim 22, wherein the printed circuit board, And a conductive material disposed between the ground unit and the ground of the electronic device. 19. The printed circuit board of any one of claims 1, 9, 13, and 18, wherein: A printed circuit board, characterized in that it is a flexible printed circuit board. The method of claim 3, wherein the printed circuit board, And a conductive material disposed between the exposed portion of the first ground layer and the ground of the electronic device. The method of claim 3, wherein the exposed portion of the first ground layer, Printed circuit board, characterized in that in direct contact with the ground of the electronic device. 21. The method of claim 20, The first ground layer or the second ground layer of the at least one ground unit is electrically connected to the ground of the electronic device, The first ground layer and the second ground layer of the at least one ground unit, the printed circuit board, characterized in that electrically connected to the ground of the electronic device.
KR20080056346A 2008-06-16 2008-06-16 printed circuit board electrically connected to the ground of electronic device KR101001360B1 (en)

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PCT/KR2008/006904 WO2009154335A1 (en) 2008-06-16 2008-11-21 Printed circuit board electrically connected to the ground of electronic device

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Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013103253A1 (en) * 2012-01-06 2013-07-11 주식회사 기가레인 Printed circuit board having shielding member for reducing dielectric loss
TWI681969B (en) 2014-01-23 2020-01-11 美商再生元醫藥公司 Human antibodies to pd-1
LT3356411T (en) 2015-10-02 2021-09-10 F. Hoffmann-La Roche Ag Bispecific antibodies specific for pd1 and tim3
KR20170088046A (en) 2016-01-22 2017-08-01 엘지전자 주식회사 Circuit structure and mobile terminal
US9839117B2 (en) * 2016-04-11 2017-12-05 Microsoft Technology Licensing, Llc Flexible printed circuit with enhanced ground plane connectivity
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EP4204592A1 (en) 2020-08-26 2023-07-05 Regeneron Pharmaceuticals, Inc. Methods of treating cancer by administering a pd-1 inhibitor
WO2022204672A1 (en) 2021-03-23 2022-09-29 Regeneron Pharmaceuticals, Inc. Methods of treating cancer in immunosuppressed or immunocompromised patients by administering a pd-1 inhibitor
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WO2023159102A1 (en) 2022-02-17 2023-08-24 Regeneron Pharmaceuticals, Inc. Combinations of checkpoint inhibitors and oncolytic virus for treating cancer

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100274782B1 (en) * 1996-04-04 2001-01-15 윤종용 Printed circuit board
KR100278609B1 (en) * 1998-10-08 2001-01-15 윤종용 Printed circuit board
KR100578312B1 (en) * 1998-11-13 2006-09-14 삼성전자주식회사 Printed circuit board having a direct interface structure and a liquid crystal display device employing the same
KR100512738B1 (en) * 2003-05-31 2005-09-07 삼성전자주식회사 Printed circuit board and electronic machine using thereof

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2017099508A1 (en) * 2015-12-11 2017-06-15 엘지이노텍 주식회사 Sensor device for detecting pressure
US10648873B2 (en) 2015-12-11 2020-05-12 Lg Innotek Co., Ltd. Sensor device for detecting pressure
US10440816B2 (en) 2018-01-25 2019-10-08 Gigalane Co., Ltd. Flexible circuit board with improved bonding position accuracy
US10440815B2 (en) 2018-01-25 2019-10-08 Gigalane Co., Ltd. Flexible circuit board with improved bonding position accuracy
US10512158B2 (en) 2018-01-25 2019-12-17 Gigalane Co., Ltd. Flexible circuit board with improved bonding position accuracy

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