KR100991489B1 - Mobile communication terminal having for stack memory structure - Google Patents

Mobile communication terminal having for stack memory structure Download PDF

Info

Publication number
KR100991489B1
KR100991489B1 KR1020100024864A KR20100024864A KR100991489B1 KR 100991489 B1 KR100991489 B1 KR 100991489B1 KR 1020100024864 A KR1020100024864 A KR 1020100024864A KR 20100024864 A KR20100024864 A KR 20100024864A KR 100991489 B1 KR100991489 B1 KR 100991489B1
Authority
KR
South Korea
Prior art keywords
communication modem
application processor
storage module
module
system code
Prior art date
Application number
KR1020100024864A
Other languages
Korean (ko)
Inventor
이장규
Original Assignee
주식회사 텔레칩스
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 주식회사 텔레칩스 filed Critical 주식회사 텔레칩스
Priority to KR1020100024864A priority Critical patent/KR100991489B1/en
Application granted granted Critical
Publication of KR100991489B1 publication Critical patent/KR100991489B1/en

Links

Images

Classifications

    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F13/00Interconnection of, or transfer of information or other signals between, memories, input/output devices or central processing units
    • G06F13/38Information transfer, e.g. on bus
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F9/00Arrangements for program control, e.g. control units
    • G06F9/06Arrangements for program control, e.g. control units using stored programs, i.e. using an internal store of processing equipment to receive or retain programs
    • G06F9/22Microcontrol or microprogram arrangements
    • G06F9/24Loading of the microprogram
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04BTRANSMISSION
    • H04B1/00Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
    • H04B1/38Transceivers, i.e. devices in which transmitter and receiver form a structural unit and in which at least one part is used for functions of transmitting and receiving
    • H04B1/40Circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Software Systems (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Signal Processing (AREA)
  • Telephone Function (AREA)

Abstract

PURPOSE: A mobile communication terminal having a stack memory structure is provided to reduce the internal space of the mobile communication terminal by stacking a memory used in a communication modem in an application processor. CONSTITUTION: An application processor unit couples a temporary storage module(243) for communication modem to an application processor(241) in an MCP(Multi-Chip Package) stack structure. The temporary storage module for the communication modem temporally stores the data generated from the communication modem. A memory unit comprises: a system code storage module(251) which stores a system code for the communication modem and the application processor; and a temporary storage module(253) for application which temporally stores the data generated from the application processor.

Description

Mobile communication terminal having stack memory structure

The present invention relates to a stack memory structure technology of a wireless communication terminal, and to a technology for stacking a memory used in a communication modem in an application processor.

In general, a wireless communication terminal supporting wireless communication is largely a communication module such as an application processor (RF) module, a radio frequency (RF) module, a global positioning system (GPS) module, and the like that controls an application module including a camera module and an LCD module. It consists of a communication modem that controls and processes wireless communication data.

1 is a diagram illustrating the structure of a communication modem and an application processor included in a conventional wireless communication terminal.

Referring to FIG. 1, a conventional wireless communication terminal includes a communication modem 110, a communication modem memory unit 120, a communication module 130, an application processor 140, an application memory unit 150, and an application. Module 160. In this case, the communication modem 110 and the application processor 140 are matched with dedicated memory units 120 and 150, respectively.

The communication modem memory unit 120 includes a system code storage module 121 for a NAND communication modem in which system codes necessary for the operation of the communication modem 110 are stored, and the communication modem 110 includes a communication module 130. ) Is configured to include a temporary storage module 123 for a communication modem of the DRAM method for temporarily storing data generated in the process of controlling.

The memory 150 for the application processor 150 includes a system code storage module 151 for an NAND type application processor in which system codes necessary for the operation of the application processor 140 are stored, and the application processor 140 controls the application module 160. And a temporary storage module 153 for temporarily storing data generated in the process.

As described above, the conventional communication modem 110 and the application processor 140 have a structure in which the memory units 120 and 150 having similar functions are matched and connected to each other, thereby increasing the manufacturing cost of the wireless communication terminal and the wireless communication terminal. The inefficiency problem occurs due to the structure that takes up a lot of internal space.

Therefore, there is a need for a method capable of efficiently reducing the space occupied in the wireless communication terminal and lowering the manufacturing cost while maintaining the function of the wireless communication terminal as in the prior art.

An object of the present invention relates to a technique for reducing the internal space of a wireless communication terminal by stacking a memory used in the communication modem in the application processor.

In order to achieve the technical problem, the present invention, a communication modem for controlling a wireless communication module; An application processor unit electrically connected to the communication modem and including a temporary storage module for temporarily storing data generated while controlling a wireless communication module in the communication modem, and an application processor controlling at least one or more application modules; And a system code storage module electrically connected to the application processor unit and storing a system code for a communication modem and a system code for an application processor, and a temporary storage module for temporarily storing data generated while the application processor controls the application module. It is configured to include; a memory unit including a.

According to the present invention, by stacking the memory used in the communication modem in the application processor, there is an effect that can effectively reduce the space occupied in the wireless communication terminal and lower the manufacturing cost.

1 is a diagram illustrating the structure of a communication modem and an application processor included in a conventional wireless communication terminal.
2 is a diagram illustrating a structure of a communication modem, an application processor unit, and a memory unit included in a wireless communication terminal according to an embodiment of the present invention.

DETAILED DESCRIPTION Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings so that those skilled in the art may easily implement the present invention. As those skilled in the art would realize, the described embodiments may be modified in various different ways, all without departing from the spirit or scope of the present invention. In the drawings, parts irrelevant to the description are omitted in order to clearly describe the present invention, and like reference numerals designate like parts throughout the specification.

2 is a diagram illustrating a structure of a communication modem, an application processor unit, and a memory unit included in a wireless communication terminal according to an embodiment of the present invention.

Referring to FIG. 2, the wireless communication terminal includes a communication modem 210, an application processor unit 240, and a memory unit 250.

The communication modem 210 controls a communication module 130 such as a radio frequency (RF) module, a global positioning system (GPS) module, and processes data transmitted and received through the communication module 130. Here, PMIC (PMIC) is an IC that manages power provided by a wireless communication terminal.

In addition, the communication modem 210 may be any one of a BUS interface method, an SPI (SPI: Serial Peripheral Interface, SPI) method, or a UART (UART: Universal Asynchronous Receiver Transmitter, hereinafter called `` UART '') method. The data is transmitted to the application processor unit 240 (A).

The application processor 240 is electrically connected to the communication modem 210 and controls an application module 260 including a camera module, a connectivity module, an LCD module, and the like. And a communication modem 210 temporarily stores a communication modem 243 for temporarily storing data generated in the process of processing data transmitted and received through the communication module 130 while controlling the communication module 130. . Here, the application processor 241 included in the application processor unit 240 and the temporary storage module 243 for the communication modem are preferably configured in a stack structure of a MCP (Mutli-Chip Package) method, and in some cases, The stack may be configured in a stack-on-package (POP) stack structure. Here, each module included in the application module 260 is well known to those skilled in the art, detailed description thereof will be omitted in the embodiment of the present invention.

The application processor 241 of the application processor unit 240 transmits data to the communication modem 210 using any one of an external host interface (EHI) method, an SPI method, or a UART method. (A).

The communication modem temporary storage module 243 is provided with input / output pins for connection with the communication modem 210, and the communication modem 210 is connected to the communication modem temporary storage module 243 through a memory controller of a DRAM interface method. One-to-one communication is possible (B), the data generated from the communication modem 210 can be received and temporarily stored.

The memory unit 250 is electrically connected to the application processor unit 240, the system code storage module 251 and the application processor 241 which store the system code of the communication modem 210 and the system code of the application processor 241. Includes a temporary storage module 253 for an application for temporarily storing data generated while controlling the application module 260. Here, each system code is a code including instructions necessary to operate the communication modem 210 or the application processor 241. In addition, the system code storage module 251 and the temporary storage module 253 for the application included in the memory unit 250 is preferably configured to be combined in a stack structure of the MCP method, in some cases is coupled to the POP method It is also possible to be configured.

The memory unit 250 transmits the system code of the communication modem 210 stored in the system code storage module 251 to the communication modem 210 through the application processor 241 when the system of the wireless communication terminal is booted. The system code of 241 is transmitted to the application processor 241.

Therefore, by combining the communication modem temporary storage module 243 for storing temporary data of the communication modem 210 in the application processor 241 in an MCP stack structure, the space occupied in the wireless communication terminal can be efficiently It can reduce the manufacturing cost.

Although the present invention has been described in more detail with reference to the examples, the present invention is not necessarily limited to these embodiments, and various modifications can be made without departing from the spirit of the present invention. Therefore, the embodiments disclosed in the present invention are not intended to limit the technical idea of the present invention but to describe the present invention, and the scope of the technical idea of the present invention is not limited by these embodiments. The scope of protection of the present invention should be construed according to the following claims, and all technical ideas falling within the scope of the same shall be construed as falling within the scope of the present invention.

110: communication modem 120: communication modem memory
121: system code storage module for communication modem
123: temporary storage module for communication modem 130: communication module
140: application processor
150: memory for the application processor
151: System code storage module for the application processor
153: Temporary storage module for the application processor
160: application module
210: communication modem 230: communication module
240: application processor unit 241: application processor
243: temporary storage module for communication modem 250: memory
251 system code storage module
253: Temporary storage module for application processor
260 application module

Claims (6)

A communication modem 210 for controlling the wireless communication module 230;
The communication modem temporary storage module 243 and one or more applications electrically connected to the communication modem and configured to temporarily receive data generated in the operation of the communication modem through a dedicated input / output interface directly connected to the communication modem. An application processor 240 configured to combine an application processor 241 for controlling a module in a Mutli-Chip Package (MCP) stack structure; And
The system code storage module 251 is electrically connected to the application processor and stores the system code for the communication modem and the system code for the application processor, and temporarily stores the data generated from the operation of the application processor. A memory unit 250 including a temporary storage module 253 for application;
Wireless communication terminal of a stack memory structure comprising a.
delete The method according to claim 1,
The communication modem 210,
And a communication modem system code stored in the system code storage module of the memory unit when the system is booted through the application processor unit.
The method according to claim 3,
The communication modem 210,
A wireless communication terminal having a stack memory structure, which is connected to the temporary storage module for the communication modem in a one-to-one manner by using a memory controller to transmit and receive the temporary data.
The method according to claim 4,
The communication modem 210,
Data is transmitted to the application processor by any one of a BUS interface method, SPI (SPI: Serial Interface), or UART (UART: Universal Asynchronous Receiver Transmitter). And receiving data from the application processor unit in any one of an EHI (EHI: External Host Interface, EPI), SPI, and UART schemes.
The method according to claim 5,
The temporary storage module 243 for the communication modem,
A wireless communication terminal having a stack memory structure, characterized in that for transmitting and receiving the temporary data with the communication modem in a DRAM interface method.
KR1020100024864A 2010-03-19 2010-03-19 Mobile communication terminal having for stack memory structure KR100991489B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020100024864A KR100991489B1 (en) 2010-03-19 2010-03-19 Mobile communication terminal having for stack memory structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020100024864A KR100991489B1 (en) 2010-03-19 2010-03-19 Mobile communication terminal having for stack memory structure

Publications (1)

Publication Number Publication Date
KR100991489B1 true KR100991489B1 (en) 2010-11-04

Family

ID=43409256

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020100024864A KR100991489B1 (en) 2010-03-19 2010-03-19 Mobile communication terminal having for stack memory structure

Country Status (1)

Country Link
KR (1) KR100991489B1 (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100618834B1 (en) * 2003-09-20 2006-08-31 삼성전자주식회사 Communication device and method having a common platform

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100618834B1 (en) * 2003-09-20 2006-08-31 삼성전자주식회사 Communication device and method having a common platform

Similar Documents

Publication Publication Date Title
JP6470835B2 (en) Electronic system, power amplifier system, packaged module, and portable device
ES2559813T3 (en) Wireless Internet access device, SD control chip and method for data communication
CN105390798B (en) Electronic device using antenna
KR102208207B1 (en) Antenna for Mobile Device using Case
EP2713317A1 (en) Secure digital card capable of transmitting data through wireless networks
US9660737B2 (en) Method of supporting multi-frequency bands and electronic device supporting the same
CN112335126A (en) Circuit board including insulating layer having plurality of dielectrics different in dielectric loss and electronic device including the same
CN105281690A (en) Diversity AMP module and apparatus comprising the same
WO2013104292A1 (en) Terminal power supply circuit and multi-mode data card
KR100991489B1 (en) Mobile communication terminal having for stack memory structure
CN101710834B (en) Wireless data terminal equipment
CN110545238A (en) Gateway equipment and communication system
US20100153591A1 (en) Interface unit and electronic system including the same
KR20150145048A (en) Method for providing communication service and electronic device thereof
US11211965B2 (en) Electronic device and method for providing communication service
CN204090360U (en) A kind of functional shell assembly and terminal
CN203086471U (en) Network NFC (Near Field Communication) equipment
CN201984582U (en) Embedded near field communication mobile payment module
CN103812520B (en) Preposition device
WO2020112255A1 (en) Concept for a buffered flipped voltage follower and for a low dropout voltage regulator
WO2020002555A1 (en) Power management in a system on chip
CN214256628U (en) LTE CAT1 module
WO2019190512A1 (en) Concept of capacitor scaling
US11343875B2 (en) Mobile terminal and wireless communication module
CN107682032B (en) Voltage regulator circuit, RF front-end module and terminal

Legal Events

Date Code Title Description
A201 Request for examination
A302 Request for accelerated examination
E902 Notification of reason for refusal
E701 Decision to grant or registration of patent right
GRNT Written decision to grant
FPAY Annual fee payment

Payment date: 20130905

Year of fee payment: 4

FPAY Annual fee payment

Payment date: 20140904

Year of fee payment: 5

FPAY Annual fee payment

Payment date: 20150903

Year of fee payment: 6

FPAY Annual fee payment

Payment date: 20160922

Year of fee payment: 7

FPAY Annual fee payment

Payment date: 20170926

Year of fee payment: 8

FPAY Annual fee payment

Payment date: 20180911

Year of fee payment: 9