KR100960681B1 - Preparation method of polypropylene shaped body with plating layer and the shaped body - Google Patents
Preparation method of polypropylene shaped body with plating layer and the shaped bodyInfo
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- KR100960681B1 KR100960681B1 KR1020090084646A KR20090084646A KR100960681B1 KR 100960681 B1 KR100960681 B1 KR 100960681B1 KR 1020090084646 A KR1020090084646 A KR 1020090084646A KR 20090084646 A KR20090084646 A KR 20090084646A KR 100960681 B1 KR100960681 B1 KR 100960681B1
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- plating layer
- polypropylene
- polypropylene molded
- molded body
- copper
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1646—Characteristics of the product obtained
- C23C18/165—Multilayered product
- C23C18/1651—Two or more layers only obtained by electroless plating
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
- C23C18/2013—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by mechanical pretreatment, e.g. grinding, sanding
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/22—Roughening, e.g. by etching
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/28—Sensitising or activating
- C23C18/30—Activating or accelerating or sensitising with palladium or other noble metal
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/38—Coating with copper
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- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
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- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemically Coating (AREA)
Abstract
Description
본 발명은 폴리프로필렌 성형체의 제조방법에 관한 것으로, 보다 상세하게는 반도체 제조공정에 사용되어지는 포토레지스트액 내지 각종 용액이 충돌하여도 반도체 제조공정에 사용되고 있는 보울 내부표면에 부착됨이 없이 원활하게 배출될 수 있는 도금층이 형성된 폴리프로필렌 성형체의 제조방법 및 동 방법에 의해 얻어질 수 있는 성형체에 관한 것이다.The present invention relates to a method for producing a polypropylene molded body, and more particularly, even if the photoresist liquid or various solutions used in the semiconductor manufacturing process collide with each other, it does not adhere to the inner surface of the bowl used in the semiconductor manufacturing process. The present invention relates to a method for producing a polypropylene molded article having a plated layer which can be discharged, and a molded article obtainable by the same method.
폴리프로필렌은 폴리에틸렌 등과 함께 범용 플라스틱 등으로 불리우는 폴리머이고, 비교적 저렴하고 또한 경량이고, 게다가 고융점에서의 성형가공이 용이하기 때문에 반도체 제조용 설비, 자동차 부품, 가정전화제품, 식품포장필림, 완구, 잡화 등에 폭 넓게 사용되고 있다.Polypropylene is a polymer called general-purpose plastic, etc. together with polyethylene, and is relatively inexpensive and lightweight, and it is easy to mold at a high melting point, and thus, semiconductor manufacturing equipment, automobile parts, household telephone products, food packaging films, toys, and sundries. It is widely used on the back.
반도체 사진공정에서 웨이퍼 상에 포토레지스트를 도포하는 스핀코터는 도 1에 도시된 바와 같이 진공척(1) 위에 웨이퍼(2)를 적재하고 상기 웨이퍼(2)의 중심 부에 일정량의 포토레지스트를 분사하면서 상기 웨이퍼(2)를 고속으로 회전시켜 웨이퍼(2) 상에 포토레지스트를 균일하게 도포하게 된다. 고속으로 회전하는 웨이퍼(2)의 중심부 상에 분사된 포토레지스트는 원심력에 의해 웨이퍼(2)의 가장자리로 퍼져 나가면서 웨이퍼(2) 전면에 도포되고 여분의 포토레지스트는 웨이퍼(2)를 벗어나 진공척(1)을 둘러싸고 있는 보울(3)의 내벽에 충돌하게 된다. 이와 같은 과정에 의해 보울(3)의 내벽에 충돌된 포토레지스트는 그 상부 보울의 하부에 형성설치된 하부 보울의 드레인홀을 통하여 배출되게 되는 것이다.In the semiconductor photolithography process, a spin coater for applying photoresist onto a wafer loads a
그러나, 종래 반도체 사진공정에 적용되고 있는 보울(3)은 폴리프로필렌으로 제조되어 포토레지스트 코팅시 레지스트 입자 및 변형된 폴리머 등이 보울(3)의 표면에 부착되어 코팅공정 중에 원활하게 배기되기 어렵고, 이로 인하여, 포토레지스트의 증기나 시너(thinner)에 의해 공정 부품들의 주기적인 보수 및 웨이퍼의 코팅 불량이 유발된다.However, the
본 발명은 상기한 바와 같이 종래기술이 가지는 문제를 해결하기 위해 제안된 것으로, The present invention has been proposed to solve the problems of the prior art as described above,
그 목적은 반도체 제조공정에 사용되어지는 포토레지스트액 내지 각종 용액이 충돌하여도 보울 내부표면에 부착됨이 없이 원활하게 배출될 수 있는 도금층이 형성된 폴리프로필렌 성형체의 제조방법 및 이에 의해 얻을 수 있는 성형체를 제공함에 있다.Its purpose is to produce a polypropylene molded article having a plating layer which can be smoothly discharged without being attached to the inner surface of the bowl even when the photoresist liquid or various solutions used in the semiconductor manufacturing process collide with the molded article obtainable thereby. In providing.
상기한 바와 같은 본 발명의 기술적 과제는 다음과 같은 수단에 의해 달성되어진다.The technical problem of the present invention as described above is achieved by the following means.
(1) (a) 폴리프로필렌 성형체를 표면처리하는 단계; 및 (1) (a) surface treating a polypropylene molded body; And
(b) 상기 표면처리된 폴리프로필렌 성형체의 표면에 도금층을 형성하는 단계를 포함하는 도금층이 형성된 폴리프로필렌 성형체의 제조방법.(b) a method for producing a polypropylene molded article having a plating layer comprising forming a plating layer on the surface of the surface-treated polypropylene molded article.
(2) 제1항에 있어서,(2) The method of claim 1,
폴리프로필렌 성형체의 표면처리단계는,Surface treatment of the polypropylene molded body,
(a1) 폴리프로필렌 성형체의 표면을 연마하는 단계; (a1) polishing the surface of the polypropylene molded body;
(a2) 연마된 폴리프로필렌 성형체 표면의 오염물을 제거하고 에칭처리하는 단계; 및 (a2) removing and etching contaminants on the polished polypropylene molded surface; And
(a3) 에칭처리된 폴리프로필렌 성형체 표면의 평탄도를 조절하는 단계를 포함하는 도금층이 형성된 폴리프로필렌 성형체의 제조방법.(A3) A method for producing a polypropylene molded article with a plating layer comprising the step of adjusting the flatness of the surface of the etched polypropylene molded article.
(3) 제1항에 있어서,(3) The method of paragraph 1,
폴리프로필렌 성형체 표면을 금속화하는 단계를 더 포함하는 도금층이 형성된 폴리프로필렌 성형체의 제조방법.A method for producing a polypropylene molded body having a plating layer further comprising metallizing the polypropylene molded body surface.
(4) 제3항에 있어서,(4) The method of
상기 금속화 단계는 팔라듐을 흡착하는 것에 의해 이루어지는 것을 특징으로 하는 도금층이 형성된 폴리프로필렌 성형체의 제조방법.The metallization step is a method for producing a polypropylene molded article formed with a plating layer, characterized in that by adsorbing palladium.
(5) 제1항에 있어서,(5) The method of paragraph 1,
상기 도금층은 무전해 도금공정에 의해 형성되어지는 것을 특징으로 하는 도금층이 형성된 폴리프로필렌 성형체의 제조방법.The plating layer is a method for producing a polypropylene molded article with a plating layer, characterized in that formed by an electroless plating process.
(6) 제1항에 있어서,(6) the method of paragraph 1,
상기 도금층의 형성단계는 Forming the plating layer is
(b1) 상기 폴리프로필렌 성형체 표면에 제1금속으로 이루어지는 도금층을 형성하는 단계; (b1) forming a plating layer made of a first metal on a surface of the polypropylene molded body;
(b2) 상기 제1금속 도금층위에 제2금속으로 이루어지는 적어도 1층 이상의 도금층을 형성하는 단계; (b2) forming at least one plating layer made of a second metal on the first metal plating layer;
(b3) 상기 제2금속 도금층 위에 상기 제1금속으로 이루어지는 적어도 1층 이상의 도금층을 형성하는 단계; 및 (b3) forming at least one or more plating layers comprising the first metal on the second metal plating layer; And
(b4) 도금층이 형성된 폴리프로필렌을 건조하는 단계를 포함하는 도금층이 형성된 폴리프로필렌 성형체의 제조방법.(b4) A method for producing a polypropylene molded article having a plating layer including a step of drying the polypropylene having a plating layer formed thereon.
(7) 제6항에 있어서,(7) the method of paragraph 6,
제1금속은 니켈, 구리의 군에서 선택되는 적어도 1종인 것을 특징으로 하는 도금층이 형성된 폴리프로필렌 성형체의 제조방법.The first metal is at least one selected from the group consisting of nickel and copper.
(8) 제6항에 있어서,(8) the method of item 6,
제2금속은 구리, 니켈, 아연, 크롬의 군에서 선택되는 적어도 1종인 것을 특징으로 하는 도금층이 형성된 폴리프로필렌 성형체의 제조방법.The second metal is at least one member selected from the group consisting of copper, nickel, zinc and chromium.
(9) 제1항에 있어서,(9) The method according to 1,
최외각 도금층은 폴리테트라플루오로에틸렌(PTFE), 퍼플로오로알콕시(PFA), 플루오로에틸렌프로필렌(FEP), 및 폴리비닐리덴플루오라이드(PVDF)의 군에서 선택되는 적어도 1종의 불소수지를 포함하는 것을 특징으로 하는 도금층이 형성된 폴리프로필렌 성형체의 제조방법.The outermost plating layer is at least one fluorine resin selected from the group of polytetrafluoroethylene (PTFE), perfluoroalkoxy (PFA), fluoroethylene propylene (FEP), and polyvinylidene fluoride (PVDF). Method for producing a polypropylene molded article formed with a plating layer comprising a.
(10) 제1항에 의해 얻어질 수 있는 도금층이 형성된 폴리프로필렌 성형체.(10) A polypropylene molded article formed with a plating layer obtainable according to (1).
(11) 제10항에 있어서,(11) The method according to 10,
성형체는 반도체 제조공정에 사용되는 보울인 것을 특징으로 하는 도금층이 형성된 폴리프로필렌 성형체. The molded article is a polypropylene molded article having a plating layer, characterized in that the bowl is used in a semiconductor manufacturing process.
본 발명에 의하면, 반도체 제조공정에 사용되어지는 포토레지스트액 내지 각종 용액이 충돌하여도 표면에 부착됨이 없이 원활하게 배출될 수 있는 도금층이 형성된 폴리프로필렌 성형체를 제공한다.According to the present invention, there is provided a polypropylene molded body having a plating layer which can be smoothly discharged without being adhered to the surface even when the photoresist liquid or various solutions used in the semiconductor manufacturing process collide with each other.
이하, 본 발명의 내용을 보다 상세하게 설명하기로 한다.Hereinafter, the content of the present invention will be described in more detail.
본 발명은 폴리프로필렌 성형체의 표면을 기계적 또는 화학적으로 연마하는 단계;
연마된 폴리프로필렌 성형체 표면의 오염물을 제거하고 에칭처리하는 단계;
에칭처리된 폴리프로필렌 성형체 표면의 평탄도를 조절하는 단계;
폴리프로필렌 성형체 표면을 팔라듐을 흡착하여 금속화하는 단계;
상기 폴리프로필렌 성형체 표면에 무전해 니켈하지도금층을 형성하는 단계;
상기 니켈하지도금층 위에 제1구리도금층을 형성하는 단계;
상기 제1구리도금층 위에 제2구리도금층을 형성하는 단계;
상기 제2구리도금층 위에 무전해 제1니켈도금층을 형성하는 단계; 및
상기 무전해 제1니켈도금층 위에 폴리테트라플루오로에틸렌을 함유하는 무전해 제2니켈도금층을 형성하는 단계;
를 포함하는 도금층이 형성된 폴리프로필렌 성형체의 제조방법을 포함한다.The present invention comprises the steps of mechanically or chemically polishing the surface of a polypropylene molded body;
Removing and etching contaminants on the polished polypropylene molded surface;
Adjusting the flatness of the etched polypropylene molded body surface;
Adsorbing palladium on the polypropylene molded surface to metallize it;
Forming an electroless nickel base plated layer on a surface of the polypropylene molded body;
Forming a first copper plating layer on the nickel base plating layer;
Forming a second copper plating layer on the first copper plating layer;
Forming an electroless first nickel plating layer on the second copper plating layer; And
Forming an electroless second nickel plated layer containing polytetrafluoroethylene on the electroless first nickel plated layer;
It includes a method for producing a polypropylene molded body formed with a plating layer comprising a.
삭제delete
본 발명에서 폴리프로필렌 성형체는 폴리프로필렌이 단독으로 함유된 성형체는 물론, 이를 주재료로 하며, 여기에 소정의 유기화합물(고분자를 포함) 및 무기화합물(고분자를 포함)이 첨가된 혼합조성으로 이루어지는 성형체도 포함된다.In the present invention, the polypropylene molded body is not only a molded product containing polypropylene alone, but also a main material thereof, and a molded product comprising a mixed composition in which predetermined organic compounds (including polymers) and inorganic compounds (including polymers) are added thereto. Also included.
상기 본 발명에 따른 폴리프로필렌 성형체의 표면처리 단계 (a)는 폴리프로필렌 성형체에 도금층을 형성하기 위한 전처리 단계이다. 상기 표면처리 단계는 바람직하게는 폴리프로필렌 성형체의 표면을 연마하는 단계 (a1); 연마된 폴리프로필렌 성형체 표면의 오염물을 제거하고 에칭처리하는 단계 (a2); 및 에칭처리된 폴리프로필렌 성형체 표면의 평탄도를 조절하는 단계 (a3)를 포함한다.The surface treatment step (a) of the polypropylene molded body according to the present invention is a pretreatment step for forming a plating layer on the polypropylene molded body. The surface treatment step is preferably a step (a1) of polishing the surface of the polypropylene molded body; (A2) removing and etching contaminants on the polished polypropylene molded surface; And (a3) adjusting the flatness of the etched polypropylene molded body surface.
상기 단계 (a1)은 폴리프로필렌 성형체의 표면을 샌딩머신(Sanding Machine) 또는 플라즈마 등을 이용하여 기계적, 화학적으로 연마하는 공정으로, 이에 의해 성형체의 표면은 금속 촉매와의 최적의 흡착력을 유지하기 위한 표면을 얻을 수 있게 된다. 이 때, 연마되는 표면이 5um이상 되지 않도록 한다.The step (a1) is a process of mechanically and chemically polishing the surface of the polypropylene molded body by using a sanding machine or a plasma, whereby the surface of the molded body is used to maintain an optimum adsorption force with a metal catalyst. You get a surface. At this time, the surface to be polished should not be more than 5um.
상기 단계 (a2)는 폴리프로필렌 성형체 표면의 오염물을 제거하고 에칭처리하는 단계로서, 상기 성형체 표면의 오염물의 제거공정은 침적 탈지제(예를 들어, 제품명 PROCLEAN 151)를 이용하는 탈지과정에 의해 수행될 수 있다. 이때 침적 탈지제는 40 내지 60 g/L의 용액을 침적온도 40 내지 50 ℃, 침적시간 10 내지 20분으로 하는 것이 바람직하다. 만일 상기 조건을 벗어나는 경우 침적과정에서 성형체 표면에 존재하는 오염물이 충분히 제거되지 않을 수 있다.The step (a2) is a step of removing contaminants on the surface of the polypropylene molded body and etching, and the step of removing contaminants on the surface of the molded body may be performed by degreasing using a deposition degreasing agent (for example, a product name PROCLEAN 151). have. At this time, it is preferable that the deposition degreasing agent is a solution of 40 to 60 g / L to a deposition temperature of 40 to 50 ℃, deposition time 10 to 20 minutes. If the above conditions are exceeded, contaminants present on the surface of the molded body may not be sufficiently removed during the deposition process.
에칭처리과정은 도금층의 원활한 형성을 위하여 성형체 표면을 요철화하기 위한 공정으로, 에칭액(예를 들어, 200-400 g/L 크롬산과 100-200 ml/L 황산으로 이루어진 에칭액)을 상기 성형체 표면에 온도 50 내지 70 ℃, 시간 30 내지 60분 간 처리하는 것에 의해 수행될 수 있다.The etching process is a process for roughening the surface of the molded body for the smooth formation of the plating layer. An etching solution (for example, an etching solution composed of 200-400 g / L chromic acid and 100-200 ml / L sulfuric acid) is applied to the surface of the molded body. By treatment at a temperature of 50-70 ° C., time 30-60 minutes.
마지막으로 상기 단계 (a3)는 에칭처리된 폴리프로필렌 성형체 표면에 계면 활성제를 처리하여 평탄도를 조절하는 과정이다. 이 과정에 사용될 수 있는 계면활성제의 예로는 양 이온계 또는 음 이온계 계면 활성제 중 단독 또는 2종 이상 혼합하여 사용할 수 있으며 5 내지 20% 농도로 준비하여 사용하는 것으로 충분하다. 계면활성제의 처리온도는 20 내지 40 ℃, 처리시간은 10 내지 20 분간 처리하는 것이 바람직하다. 만일 상기 처리조건을 만족하지 않을 경우에는 표면의 평탄화가 원활하지 않아 표면이 균일하지 않게 되는 문제가 있다. Finally, step (a3) is a process of adjusting the flatness by treating the surface of the etched polypropylene molded body with a surfactant. Examples of the surfactant that can be used in this process may be used alone or in combination of two or more of the positive or negative ion-based surfactant, it is sufficient to prepare and use at a concentration of 5 to 20%. The treatment temperature of the surfactant is preferably 20 to 40 ° C., and the treatment time is 10 to 20 minutes. If the treatment conditions are not satisfied, there is a problem that the surface is not smoothed and the surface is not uniform.
상기 표면처리공정이 완료된 후 비금속인 폴리프로필렌 성형체 표면을 금속화하는 것이 바람직하다. 금속화 공정은 후속공정인 도금층의 형성공정을 원활하게 수행하기 위한 것으로 이는 성형체 표면에 팔라듐과 같은 금속을 흡착시키는 과정에 의해 이루어진다. 팔라듐의 흡착은 예를 들어, 0.2 내지 2g/L 팔라듐과 100 내지 200ml/L 염산으로 이루어진 조성액을 온도 20 내지 30 ℃, 10 내지 20 분간 상기 표면처리된 성형체의 표면에 흡착시키는 과정에 의해 이루어질 수 있다. 이때 팔라듐과 같은 금속성분의 흡착과정에 존재하게 되는 불순물(예를 들어, 주석)은 5 내지 10 %의 ACC와 같은 용액을 처리하여 주는 것에 의해 제거될 수 있다. 이때 처리조건으로는 20 내지 30 ℃, 10 내지 20 분 정도가 바람직하다It is preferable to metallize the surface of the polypropylene molded body which is a nonmetal after the said surface treatment process is completed. The metallization process is to smoothly perform the subsequent process of forming the plating layer, which is performed by adsorbing a metal such as palladium on the surface of the molded body. Adsorption of palladium may be achieved by, for example, adsorbing a composition liquid consisting of 0.2 to 2 g / L palladium and 100 to 200 ml / L hydrochloric acid on the surface of the surface-treated molded body at a temperature of 20 to 30 ° C. for 10 to 20 minutes. have. At this time, impurities (eg, tin) present in the adsorption process of metal components such as palladium may be removed by treating a solution such as 5 to 10% of ACC. At this time, 20 to 30 degreeC and 10 to 20 minutes are preferable as processing conditions.
상기 금속화 공정(또는 촉매활성화 공정)을 완료한 후에 상기 폴리프로필렌 성형체의 표면에 도금층을 형성한다. 바람직하게는 상기 도금층은 적어도 1층 이상의 도금층을 포함하며, 무전해 도금공정이 이용될 수 있다. After completing the metallization process (or catalyst activation process), a plating layer is formed on the surface of the polypropylene molded body. Preferably, the plating layer includes at least one or more plating layers, and an electroless plating process may be used.
상기 도금층의 형성단계는 상기 폴리프로필렌 성형체 표면에 제1금속으로 이루어지는 도금층을 형성하는 단계 (b1); 상기 제1금속 도금층위에 제2금속으로 이 루어지는 적어도 1층 이상의 도금층을 형성하는 단계 (b2); 상기 제2금속 도금층 위에 상기 제1금속으로 이루어지는 적어도 1층 이상의 도금층을 형성하는 단계 (b3); 및 도금층이 형성된 폴리프로필렌을 건조하는 단계 (b4)에 의해 수행되어질 수 있다. The forming of the plating layer may include forming a plating layer of a first metal on a surface of the polypropylene molded body (b1); (B2) forming at least one or more plating layers comprising a second metal on the first metal plating layer; (B3) forming at least one or more plating layers comprising the first metal on the second metal plating layer; And (b4) drying the polypropylene on which the plating layer is formed.
상기 단계 (b1)에서 제1금속의 예로는 니켈, 구리의 군에서 선택되는 적어도 1종이며, 바람직하게는 니켈이 사용된다. 상기 제1금속 도금층은 60ml/L EN-A 과 150ml/L EN-B 로 이루어진 도금액을 80 내지 90 ℃하에 30분 내지 60분 무전해 도금시켜 형성할 수 있다. 이러한 제1금속 도금층은 하지금속층으로서 기능하게 된다. Examples of the first metal in the step (b1) is at least one selected from the group of nickel and copper, preferably nickel is used. The first metal plating layer may be formed by electroless plating a plating solution consisting of 60 ml / L EN-A and 150 ml / L EN-B at 80 to 90 ° C. for 30 to 60 minutes. This first metal plating layer functions as a base metal layer.
상기 단계 (b1)에 의한 제1금속 도금층의 상부에 제2금속 도금층이 형성된다. 제2금속의 예로는 구리, 니켈, 아연, 크롬의 군에서 선택되는 적어도 1종이며, 바람직하게는 구리가 사용된다. 상기 제2금속 도금층은 20 내지 40 g/L 시안화구리와 32 내지 54 g/L 시안화나트륨으로 이루어지는 도금액을 전류밀도 4 내지 6 A/d㎡ 로 45 내지 60 ℃하에 1분 내지 10분 정도 반응시켜 도금층을 형성할 수 있다. 상기 제2금속 도금층의 상부에 추가적으로 제2금속 도금층이 더 형성될 수 있다. 예를 들어 상기 제2금속 도금층의 상부에 바람직하게는 200 내지 300 g/L 황산구리와 40 내지 60 g/L 황산으로 이루어지는 도금액을 전류밀도 1 내지 10 A/d㎡로 20 내지 30 ℃하에 30분 내지 60분 정도 반응시켜 도금층을 형성할 수 있다.The second metal plating layer is formed on the first metal plating layer by the step (b1). Examples of the second metal are at least one selected from the group of copper, nickel, zinc and chromium, and preferably copper is used. The second metal plating layer is made by reacting a plating liquid consisting of 20 to 40 g / L copper cyanide and 32 to 54 g / L sodium cyanide at a current density of 4 to 6 A /
상기 제2금속 도금층이 형성된 후 그 위에 상기 제1금속 도금층을 적어도 1층 이상 추가적으로 형성한다. 이는 최종적으로 얻게 되는 성형체의 표면조도를 조절하기 위한 공정이다. 이 공정은 바람직하게는 무전해 금속도금 공정을 이용하여 적어도 2층 이상 형성하는 것이 좋다. 예를 들어 1층은 60 ml/L EN-A(WINSTAR, 홍콩)과 150 ml/L EN-B(WINSTAR,홍콩) 로 이루어진 도금액을 80 내지 90 ℃하에 20분 내지 60분 무전해 도금시켜 형성하고, 그 위에 2층으로 200 ml/L ELNIC(MacderMid, 미국)로 이루어진 도금액을 80 내지 90 ℃하에 20분 내지 60분 무전해 도금시켜 형성할 수 있다. 바람직하게는 상기 최외각 도금층을 형성할 때 본 발명에서 원하는 기능성을 효과적으로 발휘하기 위하여 도금액의 조성에 불소수지, 예를 들어 폴리테트라플루오로에틸렌(PTFE), 퍼플로오로알콕시(PFA), 플루오로에틸렌프로필렌(FEP), 폴리비닐리덴플루오라이드(PVDF) 등이 첨가된다. 특히 바람직하게는 폴리테트라플루오로에틸렌(PTFE)이 사용된다. 이들 불소수지의 첨가량은 조성액의 중량대비 30 내지 50 %가 바람직하다. After the second metal plating layer is formed, the first metal plating layer is further formed on at least one layer thereon. This is a process for adjusting the surface roughness of the molded article finally obtained. This step is preferably formed at least two or more layers using an electroless metal plating process. For example, one layer is formed by electroless plating a plating solution consisting of 60 ml / L EN-A (WINSTAR, Hong Kong) and 150 ml / L EN-B (WINSTAR, Hong Kong) at 80 to 90 ° C. for 20 to 60 minutes. In addition, a plating solution consisting of 200 ml / L ELNIC (MacderMid, USA) can be formed on the two layers by electroless plating for 20 to 60 minutes at 80 to 90 ° C. Preferably, in order to effectively exhibit the desired functionality in the present invention when forming the outermost plating layer, a fluororesin such as polytetrafluoroethylene (PTFE), perfluoroalkoxy (PFA), fluoro Ethylene propylene (FEP), polyvinylidene fluoride (PVDF), etc. are added. Especially preferably polytetrafluoroethylene (PTFE) is used. The addition amount of these fluororesins is preferably 30 to 50% by weight of the composition liquid.
도금이 완료된 성형체는 단계 (b4)에 의해 80 내지 90℃ 하에 30 내지 60분간 열풍에 의해 건조되어 최종 제품화한다.After completion of plating, the molded product is dried by hot air for 30 to 60 minutes at 80 to 90 ° C. by step (b4) to form a final product.
상기 과정에 의해 얻어진 도금층이 형성된 폴리프로필렌 성형체는 표면조도 특성이 우수하고, 특히 포토레지스트액이 부착됨이 없이 하방으로 흘러 거의 완전하게 배출이 가능하다.The polypropylene molded body formed with the plating layer obtained by the above process has excellent surface roughness characteristics, and in particular, it can be discharged almost completely without flowing to the photoresist liquid.
따라서, 본 발명에 따라 얻어지는 성형체는 특히 바람직하게는 반도체 제조공정에 사용되는 보울로서 사용될 수 있다.Thus, the shaped bodies obtained according to the invention can be used particularly preferably as bowls used in semiconductor manufacturing processes.
이하, 본 발명을 하기의 실시예에 의해 상세히 설명한다. 단, 하기 실시예는 본 발명의 이해를 돕기 위해 예시하는 것일 뿐, 본 발명의 권리범위가 하기 실시예에 의해 한정되는 것은 아니다.Hereinafter, the present invention will be described in detail by the following examples. However, the following examples are only illustrated to aid the understanding of the present invention, and the scope of the present invention is not limited to the following examples.
<실시예 1>≪ Example 1 >
기계연마 처리한 폴리프로필렌 재질의 보울을 50 g/L의 PROCLEAN 151에 40 ℃에서 10분간 침적하여 표면에 묻은 오염물을 제거하였다. 그런 다음 300 g/L 크롬산과 200 ml/L 황산으로 조성된 에천트를 이용하여 60 ℃하에 50분간 에칭처리하였다. 에칭처리된 보울을 10 % 계면활성제로 25 ℃하에 15분간 표면조정과정을 거쳤다. 이후 촉매화를 위해 1.0 g/L 팔라듐과 100 ml/L 염산으로 조성된 용액으로 25 ℃하에 10분 처리하여 팔라듐을 표면에 흡착시켰다. 10 % ACC를 25 ℃하에 10분 처리하여 성형체 표면에 존재하는 주석 등의 불순물을 제거하였다.A mechanically ground polypropylene bowl was immersed in 50 g / L of PROCLEAN 151 for 10 minutes at 40 ° C. to remove contaminants on the surface. Then, an etchant composed of 300 g / L chromic acid and 200 ml / L sulfuric acid was used for etching at 60 DEG C for 50 minutes. The etched bowl was surface adjusted at 25 ° C. for 15 minutes with 10% surfactant. Thereafter, palladium was adsorbed on the surface by 10 minutes treatment at 25 ° C. with a solution composed of 1.0 g / L palladium and 100 ml / L hydrochloric acid for catalysis. The 10% ACC was treated at 25 ° C. for 10 minutes to remove impurities such as tin present on the surface of the molded body.
상기과정을 통해 표면처리된 보울의 외부 및 내부 표면에 60 ml/L EN-A와 150 ml/L EN-B로 조성된 도금액을 처리하여 80 ℃하에 30분간 무전해 도금공정을 수행하여 니켈하지도금층을 형성하였다. 그런 다음 30 g/L 시안화구리와 40 g/L의 시안화나트륨으로 조성된 구리도금액을 처리하여 50 ℃하에 5분간 전류밀도 5 A/d㎡의 조건하에 구리도금 공정을 수행하여 제1구리도금층을 형성하였다. 이후 250 g/L 황산구리와 50 g/L 황산으로 조성된 구리도금액을 처리하여 25 ℃하에 30분간 전류밀도 10 A/d㎡의 조건하에 구리도금 공정을 추가적으로 수행하여 제2구리도금층을 형성하였다.Through the above process, the plating solution composed of 60 ml / L EN-A and 150 ml / L EN-B was treated on the outer and inner surfaces of the bowl, which was surface treated, and then subjected to an electroless plating process at 80 ° C. for 30 minutes. A plating layer was formed. Then, a copper plating solution composed of 30 g / L copper cyanide and 40 g / L sodium cyanide was treated, and a copper plating process was performed under a condition of a current density of 5 A /
상기 구리도금층의 상부에 다시 60 ml/L EN-A와 150 ml/L EN-B로 조성된 도금액을 처리하여 80 ℃하에 30분간 무전해 도금공정을 수행하여 무전해 제1니켈도금층을 형성하였다. 상기 제1니켈도금층의 상부에 보울의 기능성을 부여하기 위하여 200 ml/L ELNIC와 30 중량%의 PTFE로 이루어진 니켈도금액을 처리하여 80 ℃하에 30분간 무전해 도금공정을 수행하여 무전해 제2니켈도금층을 형성하였다. 상기 최외각 니켈도금층이 형성된 보울을 80 ℃하에 30분간 건조하여 도금층이 형성된 보울을 제조하였다.The plating solution composed of 60 ml / L EN-A and 150 ml / L EN-B was again treated on the upper portion of the copper plating layer to perform an electroless plating process at 80 ° C. for 30 minutes to form an electroless first nickel plating layer. . In order to impart the functionality of the bowl to the upper portion of the first nickel plated layer, a nickel plating solution composed of 200 ml / L ELNIC and 30 wt% PTFE was treated, followed by an electroless plating process at 80 ° C. for 30 minutes, to thereby conduct electroless plating. A nickel plated layer was formed. The bowl on which the outermost nickel plated layer was formed was dried at 80 ° C. for 30 minutes to prepare a bowl having a plated layer.
<실시예 2><Example 2>
PTFE 대신 PFA를 동량 첨가한 것을 제외하고는 실시예 1에서와 동일한 공정에 의해 도금층이 형성된 보울을 제조하였다.A bowl with a plated layer was prepared in the same manner as in Example 1 except that the same amount of PFA was added instead of PTFE.
<실험예>Experimental Example
종래 폴리프로필렌으로만 구성된 보울을 비교예로 하여 포토레지스트액을 보울의 표면에 흐르게 하여 부착정도를 육안검사를 통해 확인한 결과는 도 1에 제시된 바와 같다. 결과적으로 본 발명에 따른 도금층이 형성된 보울은 포토레지스트 성분이 부착됨이 없이 원활하게 흘러 하방으로 배출되어짐을 확인할 수 있다. The result of confirming the adhesion degree by visual inspection by flowing the photoresist liquid on the surface of the bowl using a conventional bowl made of only polypropylene as a comparative example is shown in FIG. As a result, it can be seen that the bowl in which the plating layer is formed according to the present invention flows smoothly without being attached to the photoresist component and is discharged downward.
상기와 같이, 본 발명의 바람직한 실시 예를 참조하여 설명하였지만 해당 기술 분야의 숙련된 당업자라면 하기의 특허청구범위에 기재된 본 발명의 사상 및 영역으로부터 벗어나지 않는 범위 내에서 본 발명을 다양하게 수정 및 변경시킬 수 있음을 이해할 수 있을 것이다.As described above, it has been described with reference to a preferred embodiment of the present invention, but those skilled in the art various modifications and changes of the present invention without departing from the spirit and scope of the invention described in the claims below I can understand that you can.
도 1은 반도체 제조공정에 사용되어지는 종래 포토레지스트의 스핀코팅과정을 보여주는 모식도이다.1 is a schematic diagram showing a spin coating process of a conventional photoresist used in a semiconductor manufacturing process.
도 2는 본 발명에 따른 도금층이 형성된 보울에 대하여 포토레지스트액의 부착정도를 측정한 실험결과 사진을 보여준다(a: 비교예, b: 실시예). Figure 2 shows a photograph of the experimental results of measuring the adhesion of the photoresist liquid to the bowl formed with a plating layer according to the present invention (a: Comparative Example, b: Example).
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| Publication number | Priority date | Publication date | Assignee | Title |
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| KR101232718B1 (en) | 2012-05-25 | 2013-02-13 | (주) 딜라이트오브서피스앤컬러 | Method for preparing molded product using plated resin |
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| KR940006497B1 (en) * | 1991-10-19 | 1994-07-21 | 호진산업 주식회사 | Electroless plating method for shielding electromagnetic waves of abs resin articles |
| JPH11310880A (en) * | 1998-04-30 | 1999-11-09 | Idemitsu Petrochem Co Ltd | Metal-plated resin molding |
| KR100293532B1 (en) | 1998-06-22 | 2001-07-12 | 윤덕용 | Metal plating method of plastic polymer surface |
| KR100553719B1 (en) * | 2005-08-03 | 2006-02-24 | 신신화학공업 주식회사 | Gilding method of pvc shooting out goods |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR940006497B1 (en) * | 1991-10-19 | 1994-07-21 | 호진산업 주식회사 | Electroless plating method for shielding electromagnetic waves of abs resin articles |
| JPH11310880A (en) * | 1998-04-30 | 1999-11-09 | Idemitsu Petrochem Co Ltd | Metal-plated resin molding |
| KR100293532B1 (en) | 1998-06-22 | 2001-07-12 | 윤덕용 | Metal plating method of plastic polymer surface |
| KR100553719B1 (en) * | 2005-08-03 | 2006-02-24 | 신신화학공업 주식회사 | Gilding method of pvc shooting out goods |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101232718B1 (en) | 2012-05-25 | 2013-02-13 | (주) 딜라이트오브서피스앤컬러 | Method for preparing molded product using plated resin |
| WO2013176465A1 (en) * | 2012-05-25 | 2013-11-28 | (주)딜라이트오브서피스앤컬러 | Method for manufacturing molded product using plated raw material resin |
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