KR100953857B1 - A pcb unified with soft silicon pad for high speed heat dissipation of led and the method thereof - Google Patents

A pcb unified with soft silicon pad for high speed heat dissipation of led and the method thereof Download PDF

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KR100953857B1
KR100953857B1 KR1020090127822A KR20090127822A KR100953857B1 KR 100953857 B1 KR100953857 B1 KR 100953857B1 KR 1020090127822 A KR1020090127822 A KR 1020090127822A KR 20090127822 A KR20090127822 A KR 20090127822A KR 100953857 B1 KR100953857 B1 KR 100953857B1
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pcb
led
film
soft silicon
hole
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Korean (ko)
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장양석
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(주) 그로우
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H01L33/642—Heat extraction or cooling elements characterized by the shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H01L33/641—Heat extraction or cooling elements characterized by the materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/0075—Processes relating to semiconductor body packages relating to heat extraction or cooling elements

Abstract

PURPOSE: A PCB integrated with a soft silicon pad for the high speed heat diffusion of an LED and a method for manufacturing the same are provided to expand the life expectancy of the LED and improve light efficiency by effectively emitting the heat from the LED to the outside of the lighting apparatus. CONSTITUTION: A PCB(123) includes a PCB hole. The PCB hole is formed on the location which the heat emitting surface of an LED is mounted. When an LED is mounted on the center of the PCB hole, a soft silicon(125) contacts to the heat emitting surface of the LED. When a heat sink(101) is mounted on the opposite side of the PCB on which the LED is not mounted, the soft silicon is formed with an uniform thickness in order to be closely adhered to the heat sink of a lighting case.

Description

ＬＥＤ 방열용 고속 열확산 연질실리콘 패드 일체형 ＰＣＢ 및 그 제작 방법{A PCB Unified with Soft Silicon Pad for High Speed Heat Dissipation of LED and the Method Thereof}A PCB Unified with Soft Silicon Pad for High Speed Heat Dissipation of LED and the Method Thereof}

본 발명은 조명용 고휘도 LED 소자가 부착된 PCB에 관한 것으로, 발열을 신속하게 하기 위하여 PCB에 다수 개를 통공된 홀을 내고, PCB 후면 전체에는 연질 실리콘을 도포하고, PCB 전면에는 통공된 홀을 통하여 연질 실리콘이 돌출되게 하여, LED 부착시 돌출된 연질 실리콘에 LED 발열 표면이 밀착되어 LED 소자의 발열 효과를 높인 LED 방열용 고속 열확산 연질실리콘 패드 일체형 PCB 및 그 제작 방법에 관한 것이다.      The present invention relates to a PCB to which a high-brightness LED device for lighting is attached. In order to quickly generate heat, a plurality of holes are provided in the PCB, and soft silicon is coated on the entire PCB rear surface, and through the holes in the PCB front surface. The present invention relates to a high-speed thermal diffusion soft-silicon pad-integrated PCB for LED heat dissipation, in which the soft silicon protrudes, and the LED heating surface adheres to the soft silicon protruding when the LED is attached, thereby increasing the heat generating effect of the LED device.

LED는 전력 절감, 진동 저항성, 고속 반응, 생산성 등에 잇점이 있으므로, LED 광원을 갖는 조명장치가 널리 연구 개발되고 있다. 현재 LED 조명은 고휘도 대전력 LED 소자의 발열과 전도를 위하여 열전도성 구리스를 도포하거나, 열전도성 접착제로 접착하거나, 그래파이트시트를 채택하거나, 운모를 사용하는 방법 등이 널리 이용되고 있다. 이러한 열전도 방식은 단계적으로 LED 발열면에 열전도성 구리스를 도포한 다음, 메탈 PCB나 FR-4 PCB에 LED 소자를 부착 후 알루미늄 방열판에 PCB를 취부한 후 열전도성 구리스나, 그래파이트시트 등을 통하여 LED 조명기구 본체에 장착하는 방식으로 LED 소자에서 방출되는 열을 발산하는 방식을 채택한다. LEDs have advantages in power saving, vibration resistance, high speed response, productivity, and the like, and thus, lighting apparatuses having LED light sources have been widely researched and developed. Currently, LED lighting is widely used to apply heat conductive grease, adhere with a thermal conductive adhesive, adopt graphite sheets, or use mica to generate heat and conduction of high-brightness high-power LED devices. In this thermal conductivity method, the thermal conductive grease is applied to the LED heating surface step by step, the LED element is attached to the metal PCB or the FR-4 PCB, the PCB is mounted on the aluminum heat sink, and then the thermal conductive grease or the graphite sheet is applied to the LED. It adopts a method of dissipating heat emitted from the LED element by mounting on the luminaire body.

이렇게 2~3 단계로 나누어진 방법들은 각각의 접착 부분에서 접착이 제대로 이루어지지 못하여 접촉 저항이 증가하고, 이로 인해 LED의 온도 상승 원인이 되어, LED의 수명이 단축되고, 광 효율의 저하되는 단점이 있다. 특히 고출력 LED 실외조명에 사용되는 LED 소자의 발열을 신속 산열할 수 있는 방법이 가장 시급한 실정이다.These methods divided into two or three steps are not properly adhered at each adhesive portion, the contact resistance increases, which causes the temperature rise of the LED, shortens the life of the LED, and decreases the light efficiency. There is this. In particular, a method for rapidly dissipating heat generated from an LED device used in high-power LED outdoor lighting is urgently needed.

상기와 같은 문제점을 해결하기 위한 본 발명에 의한 LED 방열용 고속 열확산 연질실리콘 패드 일체형 PCB 및 그 제작 방법은 LED 방열용 고속 열확산 연질실리콘 패드 일체형 PCB 제작 방법을 제공하고, 그 방법에 의해 제작된 LED 방열용 고속 열확산 연질실리콘 패드 일체형 PCB를 제공하는 데 그 목적이 있다.High speed thermal diffusion soft silicon pad integrated PCB for LED heat dissipation and its manufacturing method according to the present invention for solving the problems as described above provides a high speed thermal diffusion soft silicon pad integrated PCB manufacturing method for LED heat dissipation, LED produced by the method The purpose is to provide a high speed thermal diffusion soft silicon pad integrated PCB for heat dissipation.

본 발명에 의한 LED 방열용 고속 열확산 연질실리콘 패드 일체형 PCB는 LED 취부 위치에 맞게 LED 취부 위치에 통공되게 PCB 홀이 형성된 PCB와; 상기 PCB에 형성된 PCB 홀에 LED 취부시 LED에 닿을 수 있도록 충진되어 있고, LED가 취부되지 않는 PCB의 반대편 면에는 방열판을 붙일때 방열판과 밀착되도록 고르게 일정 두께로 형성되어 있는 열전도성층;으로 이루어진다.The high-speed thermal diffusion soft silicon pad integrated PCB for LED heat dissipation according to the present invention includes a PCB formed with a PCB hole through the LED mounting position in accordance with the LED mounting position; It is filled in the PCB hole formed in the PCB so as to contact the LED when the LED is mounted, the heat conductive layer is formed to a certain thickness evenly to be in close contact with the heat sink when attaching the heat sink to the other side of the PCB that the LED is not mounted.

본 발명에 의한 LED 방열용 고속 열확산 연질실리콘 패드 일체형 PCB 제작방법은 PCB에 일정 두께의 제 1 필름을 붙이는 단계와; 상기 제 1 필름이 붙은 상기 PCB에 상기 제 1 필름과 상기 PCB가 통공되도록 PCB 홀을 만드는 단계와; 상기 제 1 필름의 위에 일정 두께의 제 2 필름을 붙이는 단계와; 상기 제 1 필름과 상기 제 2 필름이 부착된 상기 PCB의 반대면에 액상 열전도제를 상기 PCB 홀이 충진되도록 도포하여 상기 PCB 상에 일정 두께의 열전도층이 형성되도록 도포하는 단계와; 도포된 상기 액상 열전도제를 일정 시간 건조시켜 연질 열전도제가 되도록 건조하는 건조단계;로 이루어진다.The high-speed thermal diffusion soft silicon pad integrated PCB manufacturing method for LED heat dissipation according to the present invention comprises the steps of: attaching a first film of a predetermined thickness on the PCB; Making a PCB hole to allow the first film and the PCB to pass through the PCB to which the first film is attached; Attaching a second film of a predetermined thickness on the first film; Applying a liquid thermal conductor on the opposite surface of the PCB to which the first film and the second film are attached so that the PCB hole is filled to form a thermal conductive layer having a predetermined thickness on the PCB; Drying the applied liquid thermal conductor for a predetermined time to dry the flexible thermal conductive agent;

본 발명에 의한 LED 방열용 고속 열확산 연질실리콘 패드 일체형 PCB 및 그 제작 방법은 LED가 부착된 PCB의 열을 효율적으로 발산할 수 있어, LED의 수명을 연장할 수 있고, 광효율을 높여 전력 소모를 줄일 수 있는 효과가 있으며 더불어 제조공정 단순화로 인한 원가를 줄일 수 있어 제품의 가격경쟁력을 제고 할 수 있다.The high speed thermal diffusion soft silicon pad integrated PCB for LED heat dissipation according to the present invention and its manufacturing method can efficiently dissipate heat of the PCB to which the LED is attached, which can extend the life of the LED and reduce the power consumption by increasing the light efficiency. In addition, the cost can be reduced by simplifying the manufacturing process, thereby increasing the price competitiveness of the product.

이하 첨부 도면을 참조하여, 본 발명에 의한 LED 방열용 고속 열확산 연질실리콘 패드 일체형 PCB의 실시 예에 대하여 자세히 설명한다. Hereinafter, an embodiment of a high-speed thermal diffusion soft silicon pad integrated PCB for LED heat dissipation according to the present invention will be described in detail with reference to the accompanying drawings.

도 1은 본 발명에 의한 LED 방열용 고속 열확산 연질실리콘 패드 일체형 PCB에 LED가 부착된 LED 등기구이며, 도 2는 LED 방열용 고속 열확산 연질실리콘 패드 일체형 PCB에 LED가 부착된 PCB 기판이며, 도 3은 LED가 아직 부착되지 않은 상태에서 연질 실리콘 침투를 위한 홀이 통공되게 형성되어 있는 PCB 기판이며, 도 4는 은 LED가 아직 부착되지 않은 상태에서 PCB 홀에 연질 실리콘이 침투되어 있고, 침투된 연질 실리콘 위에는 비닐이 피복되어 있는 상태의 PCB 기판이다.1 is a LED luminaire having an LED attached to the high speed thermal diffusion soft silicon pad integrated PCB for LED heat dissipation according to the present invention, Figure 2 is a PCB substrate with an LED attached to the high speed thermal diffusion soft silicon pad integrated PCB for LED heat dissipation, Figure 3 4 is a PCB substrate in which holes for soft silicon penetration are formed in a state in which silver LEDs are not yet attached, and FIG. 4 shows soft silicon infiltrated into PCB holes in a state in which silver LEDs are not yet attached, and are penetrated soft. It is a PCB board with vinyl coated on silicon.

본 발명에 의한 LED 방열용 고속 열확산 연질실리콘 패드 일체형 PCB는 LED 부착 위치에 맞도록 LED 발열 표면의 위치 부위가 통공되게 PCB 홀이 형성된 PCB와; 상기 PCB에 형성된 PCB 홀의 중앙부에 LED 부착시 LED 발열 표면이 닿을 수 있도록 충진되어 있고, LED가 부착되어 있지 않는 PCB의 반대편 면에는 방열판을 붙일 때 조명 케이스의 방열판과 밀착되도록 고르게 일정 두께로 형성되어 있는 열전도성층;으로 이루어진다.The high-speed thermal diffusion soft silicon pad integrated PCB for LED heat dissipation according to the present invention includes a PCB formed with a PCB hole so that the position portion of the LED heating surface is perforated to match the LED attachment position; When the LED is attached to the central part of the PCB hole formed in the PCB, the LED heating surface is filled so that it can be touched, and on the opposite side of the PCB where the LED is not attached, it is formed to have a uniform thickness so as to be in close contact with the heat sink of the lighting case when attaching the heat sink. Consisting of a thermally conductive layer.

본 발명에 의한 LED 방열용 고속 열확산 연질실리콘 패드 일체형 PCB에서 상기 열전도성층의 PCB 홀에 충진된 부위는 LED 발열 표면에 밀착되도록 PCB 홀 외부로 일정 두께 돌출되게 형성되어 있는 것을 특징으로 한다.In the high-speed thermal diffusion soft silicon pad integrated PCB for LED heat dissipation according to the present invention, a portion filled in the PCB hole of the thermal conductive layer is formed to protrude a predetermined thickness outside the PCB hole so as to be in close contact with the LED heating surface.

본 발명에 의한 LED 방열용 고속 열확산 연질실리콘 패드 일체형 PCB의 상기 열전도성층은 연질실리콘층인 것을 특징으로 한다.The thermally conductive layer of the high-speed thermal diffusion soft silicon pad integrated PCB for LED heat dissipation according to the present invention is characterized in that the soft silicon layer.

본 발명에 의한 LED 방열용 고속 열확산 연질실리콘 패드 일체형 PCB 제작방법은 PCB에 일정 두께의 제 1 필름을 붙이는 단계와; 상기 제 1 필름이 붙은 상기 PCB에 상기 제 1 필름과 상기 PCB가 통공되도록 PCB 홀을 만드는 단계와; 상기 제 1 필름의 위에 일정 두께의 제 2 필름을 붙이는 단계와; 상기 제 1 필름과 상기 제 2 필름이 부착된 상기 PCB의 반대면에 액상 열전도제를 상기 PCB 홀이 충진되도록 도포하여 상기 PCB 상에 일정 두께의 열전도층이 형성되도록 도포하는 단계와; 도포된 상기 액상 열전도제를 일정 시간 건조시켜 연질 열전도제가 되도록 건조하는 건조단계;로 이루어진다.The high-speed thermal diffusion soft silicon pad integrated PCB manufacturing method for LED heat dissipation according to the present invention comprises the steps of: attaching a first film of a predetermined thickness on the PCB; Making a PCB hole to allow the first film and the PCB to pass through the PCB to which the first film is attached; Attaching a second film of a predetermined thickness on the first film; Applying a liquid thermal conductor on the opposite surface of the PCB to which the first film and the second film are attached so that the PCB hole is filled to form a thermal conductive layer having a predetermined thickness on the PCB; Drying the applied liquid thermal conductor for a predetermined time to dry the flexible thermal conductive agent;

또한, 본 발명에 의한 LED 방열용 고속 열확산 연질실리콘 패드 일체형 PCB 제작방법에서 상기 액상 열전도제는 연질실리콘인 것을 특징으로 한다.In the high-speed thermal diffusion soft silicon pad integrated PCB manufacturing method for LED heat dissipation according to the present invention, the liquid thermal conductive agent is characterized in that the soft silicon.

또한, 본 발명에 의한 LED 방열용 고속 열확산 연질실리콘 패드 일체형 PCB 제작방법은 PCB에 상기 PCB가 통공되도록 PCB 홀을 만드는 단계와; 상기 PCB에 통공된 PCB 홀에 겹치도록 통공된 일정 두께의 제 1 필름을 붙이는 제 1 필름 부착 단계와; 상기 제 1 필름의 위에 일정 두께의 제 2 필름을 붙이는 제 2 필름 부착 단계와; 상기 제 1 필름과 상기 제 2 필름이 부착된 상기 PCB의 반대면에 액상 열전도제를 상기 PCB 홀이 충진되도록 도포하여 상기 PCB 상에 일정 두께의 열전도층이 형성되도록 도포하는 액상 열전도제 도포 단계와; 도포된 상기 액상 열전도제를 일정 시간 건조시켜 연질 열전도제가 되도록 건조하는 건조단계;로 이루어진다.In addition, the high-speed thermal diffusion soft silicon pad integrated PCB manufacturing method for LED heat dissipation according to the present invention includes the steps of making a PCB hole so that the PCB is through the PCB; A first film attaching step of attaching a first film having a predetermined thickness so as to overlap the PCB hole which is perforated in the PCB; A second film attaching step of attaching a second film having a predetermined thickness on the first film; Applying a liquid thermal conductor on the opposite surface of the PCB to which the first film and the second film are attached so as to fill the PCB hole so that a thermal conductive layer having a predetermined thickness is formed on the PCB; ; Drying the applied liquid thermal conductor for a predetermined time to dry the flexible thermal conductive agent;

본 발명에 의한 LED 방열용 고속 열확산 연질실리콘 패드 일체형 PCB 제작방법에서 상기 액상 열전도제는 연질실리콘인 것을 특징으로 한다.In the high-speed thermal diffusion soft silicon pad integrated PCB manufacturing method for LED heat dissipation according to the present invention, the liquid thermal conductive agent is characterized in that the soft silicon.

도 1을 참조하면, 도 1은 본 발명에 의한 LED 방열용 고속 열확산 연질실리콘 패드 일체형 PCB에 LED가 부착된 LED 등기구의 일 실시예이며, 빛을 발생하는 LED(121)가 PCB(123)위에 부착되고, PCB의 뒤면에는 빠른 열확산을 위하여 연질 실리콘 피복층(125)이 형성되어 있으며, 연질 실리콘 피복층(125)은 등기구 본체의 뒤면에 형성된 방열판(101)과 밀착되어 있어, 신속한 열 소산이 일어나게 한다. 등기구 본체의 중앙에는 LED(121)에 전력을 공급하는 컨버터(107)가 취부되어 있다. 컨버터(107)는 외부에서 빗물과 먼지의 침투를 방지하기 위하여 컨버트룸 커버(103)가 취부되어 있고, 기밀을 유지하도록 제 1 오링(109)을 삽입하여 제 1 체결수단(105)으로 단단하게 체결되어 있다. 또한 전면부에는 LED(121)가 빗물에 젖지 않도록 LED 커버(119)가 씌워지고, 가장자리에는 제 2 오링(117)이 삽입된 후, 제 2 체결 수단으로 체결한다. 등기구 본체의 가장자리는 빗물이 흘러들어 오는 것 을 막기 위하여 'ㄱ'형상으로 물막이(111)가 형성되어 있으며, 물막이(111)의 안쪽에는 빗물이 안쪽으로 흘러 들어가지 않도록 주변보다 깊게 물막이 홈(113)이 형성되어 있다.Referring to FIG. 1, FIG. 1 is an embodiment of an LED luminaire having an LED attached to a high speed thermal diffusion soft silicon pad integrated PCB for heat dissipation according to the present invention, wherein the LED 121 generating light is placed on the PCB 123. On the back of the PCB, a soft silicon coating layer 125 is formed on the back surface of the PCB for rapid thermal diffusion, and the soft silicon coating layer 125 is in close contact with the heat sink 101 formed on the back surface of the luminaire body, thereby causing rapid heat dissipation. . The converter 107 which supplies electric power to the LED 121 is attached to the center of the luminaire main body. The converter 107 is provided with a convert room cover 103 to prevent the ingress of rainwater and dust from the outside, and inserts the first O-ring 109 to maintain the airtightness so as to be firmly connected to the first fastening means 105. It is fastened. In addition, the front cover is covered with an LED cover 119 so that the LED 121 is not wet with rainwater, and the second O-ring 117 is inserted at the edge thereof, and then fastened with the second fastening means. The rim of the luminaire main body is formed with a water barrier 111 in a 'b' shape to prevent rainwater from flowing in, and the water recess groove 113 is deeper than the surroundings so that rain water does not flow inside the water barrier 111. ) Is formed.

도 2를 참조하면, PCB(123)의 전면에는 LED(121)를 붙일 수 있도록 납땜자리(201)가 형성되어 있고, PCB(123)의 가장자리에는 PCB(123)를 고정할 수 있는 PCB 고정 가이드(203)가 형성되어 있으며, PCB 고정 가이드(203)는 PCB 고정 가이드 고정 볼트(204)로 고정된다.Referring to FIG. 2, a soldering seat 201 is formed on the front surface of the PCB 123 to attach the LED 121, and a PCB fixing guide for fixing the PCB 123 to the edge of the PCB 123. 203 is formed, and the PCB fixing guide 203 is fixed by the PCB fixing guide fixing bolt 204.

도 3을 참조하면, 도 3은 PCB(123)에 LED (121)를 부착하기 전의 상태이며, 연질 실리콘을 충진할 PCB 홀(301)이 형성되어 있어, 연질 실리콘이 LED(121)에 닿게 한다.Referring to FIG. 3, FIG. 3 is a state before attaching the LED 121 to the PCB 123, and a PCB hole 301 is formed to fill the soft silicon so that the soft silicon contacts the LED 121. .

도 4를 참조하면, PCB 홀(301)과 일치하도록 홀이 형성된 두께가 0.2t의 제 1 필름(401)을 PCB(123) 위에 붙이고, 다시 홀이 없는 두께가 0.1t의 제 2 필름(403)을 제 1 필름(401) 위에 붙인다. 그리고 나서 연질 실리콘(125)을 PCB(123) 뒤편에 바르고 경화시키면 PCB 홀(301)에 연질 실리콘 충진물(405)이 충진되어 경화된다. 그런 후, 연질 실리콘(125)이 어느 정도 경화가 되면, PCB(123) 뒤편에 제 3 필름(미도시)을 붙여서, 다음에 사용할 때까지 보관한다. 만약 지금 LED(121)를 납땜하고자 하면, 제 1 필름(401)과 제 2 필름(403)을 떼어내고, LED(121)를 납땜한 후, 연질 실리콘(125)이 방열판(도 1 참조, 101)에 닿도록 하여 부착한다. 물론 이때, PCB(123) 위에 제 1 필름(401)을 붙인 상태에서 PCB 홀(301)을 모두 통공되게 뚫을 수도 있고, PCB(123)에 PCB 홀(301)을 만든 후, PCB 홀(301)에 맞게 구 멍이 뚫린 제 1 필름을 붙인 후, 제 2 필름을 붙일 수도 있다.Referring to FIG. 4, the first film 401 having a thickness of 0.2 t is formed on the PCB 123 to match the PCB hole 301, and the second film 403 having a thickness of 0.1 t having no hole is formed again. ) Is pasted onto the first film 401. Then, when the soft silicon 125 is applied to the back of the PCB 123 and cured, the soft silicon filler 405 is filled in the PCB hole 301 and cured. Then, when the soft silicon 125 is cured to some extent, a third film (not shown) is attached to the back of the PCB 123 and stored until the next use. If you want to solder the LED 121 now, after removing the first film 401 and the second film 403, after soldering the LED 121, the soft silicon 125 is a heat sink (see Fig. 1, 101). ) So that it touches Of course, at this time, in the state in which the first film 401 on the PCB 123, all the PCB holes 301 may be perforated, or after making the PCB holes 301 in the PCB 123, the PCB holes 301 The second film may be pasted after attaching the first film having holes in it.

도 5를 참조하면, 도 4의 PCB(123)에서 제 1 필름(401)과 제 2 필름(403)을 떼어내고, LED(121)를 납땜한 후, 연질 실리콘(125)이 방열판(도 1 참조, 101)에 닿도록 부착한다. 이때 제 1 필름(401)과 제 2 필름(403)을 떼어내면, 제 1 필름(401) 두께 0.2 t 만큼 외부로 돌출되어 LED(121)의 하부에 밀착되어 열전달이 용이하게 된다. 이렇게 함으로서, 기존 방식에서 LED(121)에서 발생한 열이 메탈PCB(미도시), FR PCB(미도시), 알미늄 방열판(미도시)을 경유하여 전달되던 것이 LED (121)에서 발생한 열이 연질 실리콘(125) 패드를 통하여 직접 등기구 외부로 전달되므로, 그만큼 열 저항이 적어 방열 효과가 우수하다. 여기서 PCB(123)는 FR-PCB(미도시), 메탈 PCB (미도시) 및 알미늄 방열판(미도시)을 포함한다.Referring to FIG. 5, after removing the first film 401 and the second film 403 from the PCB 123 of FIG. 4 and soldering the LED 121, the soft silicon 125 may be a heat sink (FIG. 1). Reference, 101). At this time, when the first film 401 and the second film 403 are removed, the first film 401 protrudes to the outside by 0.2 t of thickness and is in close contact with the lower portion of the LED 121 to facilitate heat transfer. By doing so, the heat generated in the LED 121 is transferred to the heat generated in the LED 121 through the metal PCB (not shown), the FR PCB (not shown), and the aluminum heat sink (not shown). (125) Since it is transmitted directly to the outside of the luminaire through the pad, the heat resistance is less so that the heat dissipation effect is excellent. Here, the PCB 123 includes a FR-PCB (not shown), a metal PCB (not shown), and an aluminum heat sink (not shown).

도 1은 본 발명에 의한 LED 방열용 고속 열확산 연질실리콘 패드 일체형 PCB에 LED가 부착된 LED 등기구의 단면도이며, 1 is a cross-sectional view of the LED luminaire with the LED attached to the high-speed thermal diffusion soft silicon pad integrated PCB for LED heat dissipation according to the present invention,

도 2는 LED 방열용 고속 열확산 연질실리콘 패드 일체형 PCB에 LED가 부착된 PCB 기판 사시도이며, 2 is a perspective view of a PCB substrate with an LED attached to the high-speed thermal diffusion soft silicon pad integrated PCB for LED heat dissipation,

도 3은 LED가 아직 부착되지 않은 상태에서 연질 실리콘 침투를 위한 홀이 통공되게 형성되어 있는 PCB 기판 사시도이며, 3 is a perspective view of a PCB substrate in which a hole for soft silicon penetration is formed in a state in which the LED is not yet attached;

도 4는 은 LED가 아직 부착되지 않은 상태에서 PCB 홀에 연질 실리콘이 침투되어 있고, 침투된 연질 실리콘 위에는 비닐이 피복되어 있는 상태의 PCB 기판의 단면도이며,4 is a cross-sectional view of a PCB substrate in which soft silicon is infiltrated into the PCB hole while the silver LED is not yet attached, and a vinyl is coated on the infiltrated soft silicon.

도 5는 LED 방열용 고속 열확산 연질실리콘 패드 일체형 PCB에 LED가 부착된 PCB 기판의 단면도이다.      5 is a cross-sectional view of a PCB substrate with an LED attached to the high-speed thermal diffusion soft silicon pad integrated PCB for LED heat dissipation.

<도면의 부호에 대한 상세한 설명> <Detailed Description of Symbols in Drawings>

101 : 방열판, 103 : 컨버터룸 덮개,101: heat sink, 103: converter room cover,

105 : 제 1 체결 나사, 107 : 컨버터,105: first fastening screw, 107: converter,

109 : 제 1 오링, 111 : 물막이,109: first O-ring, 111: water barrier,

113 : 물막이 홈, 115 : 제 2 체결 수단,113: water groove, 115: second fastening means,

117 : 제 2 오링, 119 : LED 덮개,117: second O-ring, 119: LED cover,

121 : LED, 123 : PCB,121: LED, 123: PCB,

125 : 연질 실리콘, 201 : LED 납땜자리,125: soft silicon, 201: LED soldering spot,

203 : PCB 고정 가이드, 204 : PCB 고정 가이드 고정 볼트,203: PCB fixing guide, 204: PCB fixing guide fixing bolt,

301 : PCB 홀,301: PCB hole,

401 : 제 1 필름, 403 : 제 2 필름,401: first film, 403: second film,

405 : 연질 실리콘 충진물405 soft silicone fill

Claims (7)

LED 부착용 PCB에 있어서, LED 부착 위치에 맞게 LED 발열 표면의 위치 부위가 통공되게 PCB 홀이 형성된 PCB와;A PCB for attaching an LED, comprising: a PCB having a PCB hole formed so that a location of an LED heating surface is perforated according to an LED attachment position; 상기 PCB에 형성된 PCB 홀의 중앙부에 LED 부착시 LED 발열 표면이 닿을 수 있도록 충진되어 있고, LED가 부착되어 있지 않는 PCB의 반대편 면에는 방열판을 붙일 때 조명 케이스의 방열판과 밀착되도록 고르게 일정 두께로 형성되어 있는 열전도성층;이 형성되어 이루어진 것을 특징으로 하는 LED 방열용 고속 열확산 연질실리콘 패드 일체형 PCB.When the LED is attached to the central part of the PCB hole formed in the PCB, the LED heating surface is filled so that the LED heating surface can be reached. Fast thermal diffusion soft silicon pad integrated PCB for LED heat radiation, characterized in that formed; 제 1 항에 있어서, 상기 열전도성층의 PCB 홀에 충진된 부위는 LED 발열 표면에 밀착되도록 PCB 홀 외부로 일정 두께 돌출되게 형성되어 있는 것을 특징으로 하는 LED 방열용 고속 열확산 연질실리콘 패드 일체형 PCB.The high speed thermal diffusion soft silicon pad integrated PCB for heat dissipation according to claim 1, wherein the portion filled in the PCB hole of the thermal conductive layer is formed to protrude a predetermined thickness to the outside of the PCB hole so as to be in close contact with the LED heating surface. 제 1 항에 있어서, 상기 열전도성층은 연질실리콘층인 것을 특징으로 하는 LED 방열용 고속 열확산 연질실리콘 패드 일체형 PCB.2. The high speed thermal diffusion soft silicon pad integrated PCB for heat dissipation of claim 1, wherein the thermal conductive layer is a soft silicon layer. LED 부착용 PCB 제작 방법에 있어서,In the PCB manufacturing method for LED attachment, PCB에 일정 두께의 제 1 필름을 붙이는 단계와;Attaching a first film of a predetermined thickness to the PCB; 상기 제 1 필름이 붙은 상기 PCB에 상기 제 1 필름과 상기 PCB가 통공되도록 PCB 홀을 만드는 단계와;Making a PCB hole to allow the first film and the PCB to pass through the PCB to which the first film is attached; 상기 제 1 필름의 위에 일정 두께의 제 2 필름을 붙이는 단계와;Attaching a second film of a predetermined thickness on the first film; 상기 제 1 필름과 상기 제 2 필름이 부착된 상기 PCB의 반대면에 On the opposite side of the PCB to which the first film and the second film are attached 액상 열전도제를 상기 PCB 홀이 충진되도록 도포하여 상기 PCB 상에 일정 두께의 열전도층이 형성되도록 도포하는 단계와;Applying a liquid thermal conductor to fill the PCB hole to form a thermal conductive layer having a predetermined thickness on the PCB; 도포된 상기 액상 열전도제를 일정 시간 건조시켜 연질 열전도제가 되도록 건조하는 건조단계;로 이루어진 것을 특징으로 하는 LED 방열용 고속 열확산 연질실리콘 패드 일체형 PCB 제작방법.Method of manufacturing a high-speed thermal diffusion soft silicon pad integrated PCB for LED heat dissipation, characterized in that consisting of; drying step of drying the applied liquid thermal conductor for a predetermined time to become a soft thermal conductor. 제 4 항에 있어서, 상기 액상 열전도제는 연질실리콘인 것을 특징으로 하는 LED 방열용 고속 열확산 연질실리콘 패드 일체형 PCB 제작방법.5. The method of claim 4, wherein the liquid thermal conductive agent is soft silicon. 6. LED 부착용 PCB 제작 방법에 있어서,In the PCB manufacturing method for LED attachment, PCB에 상기 PCB가 통공되도록 PCB 홀을 만드는 단계와;Making a PCB hole to allow the PCB to pass through the PCB; 상기 PCB에 통공된 PCB 홀에 겹치도록 통공된 일정 두께의 제 1 필름을 붙이 는 제 1 필름 부착 단계와;A first film attaching step of attaching a first film having a predetermined thickness to overlap the PCB hole through which the PCB is holed; 상기 제 1 필름의 위에 일정 두께의 제 2 필름을 붙이는 제 2 필름 부착 단계와;A second film attaching step of attaching a second film having a predetermined thickness on the first film; 상기 제 1 필름과 상기 제 2 필름이 부착된 상기 PCB의 반대면에 On the opposite side of the PCB to which the first film and the second film are attached 액상 열전도제를 상기 PCB 홀이 충진되도록 도포하여 상기 PCB 상에 일정 두께의 열전도층이 형성되도록 도포하는 액상 열전도제 도포 단계와;Applying a liquid thermal conductor so that the PCB hole is filled, and applying a liquid thermal conductor to form a thermal conductive layer having a predetermined thickness on the PCB; 도포된 상기 액상 열전도제를 일정 시간 건조시켜 연질 열전도제가 되도록 건조하는 건조단계;로 이루어진 것을 특징으로 하는 LED 방열용 고속 열확산 연질실리콘 패드 일체형 PCB 제작방법.Method of manufacturing a high-speed thermal diffusion soft silicon pad integrated PCB for LED heat dissipation, characterized in that consisting of; drying step of drying the applied liquid thermal conductor for a predetermined time to become a soft thermal conductor. 제 6 항에 있어서, 상기 액상 열전도제는 연질실리콘인 것을 특징으로 하는 LED 방열용 고속 열확산 연질실리콘 패드 일체형 PCB 제작방법.7. The method of claim 6, wherein the liquid thermal conductive agent is soft silicon.
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KR100990331B1 (en) 2010-06-21 2010-10-29 장양석 Heat dissipation structure of high power led using fr4 pcb
KR101184508B1 (en) * 2011-02-08 2012-09-19 삼성전기주식회사 Printed circuit board
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KR102654494B1 (en) * 2018-09-03 2024-04-04 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 Semiconductor device package

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