KR100950755B1 - Molding apparatus and method of manufactuiring the semiconductor package using the molding apparatus - Google Patents
Molding apparatus and method of manufactuiring the semiconductor package using the molding apparatus Download PDFInfo
- Publication number
- KR100950755B1 KR100950755B1 KR1020080003015A KR20080003015A KR100950755B1 KR 100950755 B1 KR100950755 B1 KR 100950755B1 KR 1020080003015 A KR1020080003015 A KR 1020080003015A KR 20080003015 A KR20080003015 A KR 20080003015A KR 100950755 B1 KR100950755 B1 KR 100950755B1
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- South Korea
- Prior art keywords
- cutter
- unit
- molding
- upper mold
- substrate
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Manufacturing & Machinery (AREA)
Abstract
A molding apparatus and a method of manufacturing a semiconductor package using the same are disclosed. The molding apparatus includes a cutter unit and a cutter unit configured to protrude from a lower mold and an upper mold body facing the lower mold, a lower surface of the upper mold body facing the lower mold, and to form a plurality of molding spaces in a matrix. An upper mold having an up-down unit for down-down.
Description
The present invention relates to a molding apparatus and a method for manufacturing a semiconductor package using the same.
Recently, with the development of semiconductor device manufacturing technology, semiconductor devices capable of storing massive data and processing stored data at higher speeds have been developed.
The semiconductor device developed by the semiconductor device manufacturing technology is attached to a substrate by a die attach process, the semiconductor device attached to the substrate is molded by a molding process, and then the substrate is cut by a sawing process Individualized to produce a semiconductor package.
Specifically, in order to improve the productivity of the semiconductor package, a plurality of semiconductor devices are attached to one substrate in a matrix form, and molding is performed over the entire surface of the substrate on which the plurality of semiconductor devices are disposed, thereby forming a plurality of semiconductor devices on the substrate. A covering molding member is arranged.
Thereafter, the substrate and the molding member are cut by a sawing process to manufacture a semiconductor package.
According to the prior art, a semiconductor package is manufactured by a molding process for forming a molding member covering a plurality of semiconductor elements together and a sawing process for cutting and individualizing the molding member and the substrate.
However, when the semiconductor package is manufactured by a molding process and a sawing process as in the prior art, a problem in which the substrate and / or the molding member are warped frequently is caused by a difference in the thermal expansion coefficients of the molding member and the substrate after the molding process.
In addition, according to the related art, a large amount of epoxy particles, heavy metal copper particles, and substrate dust, which is a flame retardant material, are generated while the molding member and the substrate are sawed, thereby causing environmental pollution.
One object of the present invention is to provide a molding apparatus capable of individualizing a substrate to which a semiconductor chip is attached during the molding process.
Another object of the present invention is to provide a method of manufacturing a semiconductor package for manufacturing a semiconductor package using the molding device.
The molding apparatus according to the present invention includes a lower unit and an upper mold body facing the lower mold, a cutter unit protruding from a lower surface of the upper mold body facing the lower mold to form a plurality of molding spaces in a matrix shape and the And an upper mold having an up-down unit for up-down the cutter unit.
The cutter unit of the molding apparatus has a plate shape disposed perpendicularly to the surface of the lower mold and has a first cutter disposed in a first direction and a plate shape disposed perpendicular to the surface and orthogonal to the first direction. And a second cutter disposed in a second direction and intersecting the first cutter.
The up-down unit of the molding apparatus is a hydraulic cylinder for conveying the cutter unit in the direction toward the lower mold.
The molding apparatus further includes a molding resin providing unit for providing molding resin to each of the molding spaces through the upper mold body.
The method of manufacturing a semiconductor package according to the present invention includes (i) a lower mold and (ii) an upper mold body facing the lower mold, and a lower surface of the upper mold body facing the lower mold, protruding in a matrix shape. Preparing an upper mold having a cutter unit forming two molding spaces and an up-down unit up-down the cutter unit, the substrate having the semiconductor chip disposed at a position corresponding to the molding space, the lower mold and the Arranging between upper molds, pressing the upper surface of the substrate with the cutter unit, molding the semiconductor chip by providing molding resin to the respective molding space through the upper mold, and using the up-down unit Cutting the substrate with a cutter unit to individualize the molded semiconductor chip.
In pressing the upper surface of the substrate with the cutter unit, an end portion of the cutter unit is disposed at a depth of 1% to 80% of the thickness of the substrate from the upper surface of the substrate.
According to the present invention, by separately cutting the semiconductor package from the substrate in a cutting manner, the generation of molding particles, substrate particles, copper particles, and the like can be suppressed, as well as the molding of the semiconductor package is performed separately, when the substrate is individualized in the sawing process. By doing so, it is possible to prevent process defects due to warpage and warpage of the semiconductor package.
Hereinafter, a molding apparatus and a method of manufacturing a semiconductor package using the same according to embodiments of the present invention will be described in detail with reference to the accompanying drawings. However, the present invention is not limited to the following embodiments. Those skilled in the art will be able to implement the present invention in various other forms without departing from the spirit of the present invention.
1 is a cross-sectional view showing a molding apparatus according to an embodiment of the present invention. 2 is a plan view of the cutter unit of FIG. 1.
Referring to FIG. 1, the
The
The
The
Referring to FIG. 2, the
The
The
In the present embodiment, the
The
The
The
The up-down
In this embodiment, the up-
The molding
The molding
The molding
3 to 6 are cross-sectional views illustrating a method of manufacturing a semiconductor package according to an embodiment of the present invention.
Referring to FIG. 3, a
The
After the
Referring to FIG. 4, after the
In this embodiment, each end of the
Meanwhile, in a state where the
Referring to FIG. 5, after the
In this case, the molding resin provided from the molding
Referring to FIG. 6, after the molding resin is filled in the molding space formed by the
Thereafter, the individualized semiconductor package is separated from the
As described above in detail, the semiconductor package is separated from the substrate in a cutting manner, thereby suppressing the generation of molding particles, substrate particles, copper particles, and the like, as well as suppressing the molding of the semiconductor package. By performing it individually, it is possible to prevent the process failure due to the warpage and the warpage of the semiconductor package.
In the detailed description of the present invention described above with reference to the embodiments of the present invention, those skilled in the art or those skilled in the art having ordinary knowledge in the scope of the present invention described in the claims and It will be appreciated that various modifications and variations can be made in the present invention without departing from the scope of the art.
1 is a cross-sectional view showing a molding apparatus according to an embodiment of the present invention.
2 is a plan view of the cutter unit of FIG. 1.
3 to 6 are cross-sectional views illustrating a method of manufacturing a semiconductor package according to an embodiment of the present invention.
Claims (6)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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KR1020080003015A KR100950755B1 (en) | 2008-01-10 | 2008-01-10 | Molding apparatus and method of manufactuiring the semiconductor package using the molding apparatus |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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KR1020080003015A KR100950755B1 (en) | 2008-01-10 | 2008-01-10 | Molding apparatus and method of manufactuiring the semiconductor package using the molding apparatus |
Publications (2)
Publication Number | Publication Date |
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KR20090077200A KR20090077200A (en) | 2009-07-15 |
KR100950755B1 true KR100950755B1 (en) | 2010-04-05 |
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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KR1020080003015A KR100950755B1 (en) | 2008-01-10 | 2008-01-10 | Molding apparatus and method of manufactuiring the semiconductor package using the molding apparatus |
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Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101850979B1 (en) * | 2011-06-03 | 2018-04-20 | 서울반도체 주식회사 | Apparatus and method for forming an encapsulation of light emitting device |
TWI501828B (en) * | 2012-03-13 | 2015-10-01 | Device and method for chip pressing |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH1079463A (en) | 1996-09-02 | 1998-03-24 | Hitachi Ltd | Cutter for manufacturing semiconductor device |
US6344162B1 (en) | 1998-07-10 | 2002-02-05 | Apic Yamada Corporation | Method of manufacturing semiconductor devices and resin molding machine |
US20040161871A1 (en) | 2002-11-27 | 2004-08-19 | Seiko Epson Corporation | Semiconductor device, method of manufacturing the same, circuit substrate and electronic equipment |
KR20060005784A (en) * | 2004-07-14 | 2006-01-18 | 삼성전자주식회사 | Method for singulation of semiconductor package |
-
2008
- 2008-01-10 KR KR1020080003015A patent/KR100950755B1/en not_active IP Right Cessation
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH1079463A (en) | 1996-09-02 | 1998-03-24 | Hitachi Ltd | Cutter for manufacturing semiconductor device |
US6344162B1 (en) | 1998-07-10 | 2002-02-05 | Apic Yamada Corporation | Method of manufacturing semiconductor devices and resin molding machine |
US20040161871A1 (en) | 2002-11-27 | 2004-08-19 | Seiko Epson Corporation | Semiconductor device, method of manufacturing the same, circuit substrate and electronic equipment |
KR20060005784A (en) * | 2004-07-14 | 2006-01-18 | 삼성전자주식회사 | Method for singulation of semiconductor package |
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KR20090077200A (en) | 2009-07-15 |
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