KR100950755B1

KR100950755B1 - Molding apparatus and method of manufactuiring the semiconductor package using the molding apparatus

Info

Publication number: KR100950755B1
Application number: KR1020080003015A
Authority: KR
Inventors: 이웅선
Original assignee: 주식회사 하이닉스반도체
Priority date: 2008-01-10
Filing date: 2008-01-10
Publication date: 2010-04-05
Also published as: KR20090077200A

Abstract

A molding apparatus and a method of manufacturing a semiconductor package using the same are disclosed. The molding apparatus includes a cutter unit and a cutter unit configured to protrude from a lower mold and an upper mold body facing the lower mold, a lower surface of the upper mold body facing the lower mold, and to form a plurality of molding spaces in a matrix. An upper mold having an up-down unit for down-down.

Description

MOLDING APPARATUS AND METHOD OF MANUFACTUIRING THE SEMICONDUCTOR PACKAGE USING THE MOLDING APPARATUS}

The present invention relates to a molding apparatus and a method for manufacturing a semiconductor package using the same.

Recently, with the development of semiconductor device manufacturing technology, semiconductor devices capable of storing massive data and processing stored data at higher speeds have been developed.

The semiconductor device developed by the semiconductor device manufacturing technology is attached to a substrate by a die attach process, the semiconductor device attached to the substrate is molded by a molding process, and then the substrate is cut by a sawing process Individualized to produce a semiconductor package.

Specifically, in order to improve the productivity of the semiconductor package, a plurality of semiconductor devices are attached to one substrate in a matrix form, and molding is performed over the entire surface of the substrate on which the plurality of semiconductor devices are disposed, thereby forming a plurality of semiconductor devices on the substrate. A covering molding member is arranged.

Thereafter, the substrate and the molding member are cut by a sawing process to manufacture a semiconductor package.

According to the prior art, a semiconductor package is manufactured by a molding process for forming a molding member covering a plurality of semiconductor elements together and a sawing process for cutting and individualizing the molding member and the substrate.

However, when the semiconductor package is manufactured by a molding process and a sawing process as in the prior art, a problem in which the substrate and / or the molding member are warped frequently is caused by a difference in the thermal expansion coefficients of the molding member and the substrate after the molding process.

In addition, according to the related art, a large amount of epoxy particles, heavy metal copper particles, and substrate dust, which is a flame retardant material, are generated while the molding member and the substrate are sawed, thereby causing environmental pollution.

One object of the present invention is to provide a molding apparatus capable of individualizing a substrate to which a semiconductor chip is attached during the molding process.

Another object of the present invention is to provide a method of manufacturing a semiconductor package for manufacturing a semiconductor package using the molding device.

The molding apparatus according to the present invention includes a lower unit and an upper mold body facing the lower mold, a cutter unit protruding from a lower surface of the upper mold body facing the lower mold to form a plurality of molding spaces in a matrix shape and the And an upper mold having an up-down unit for up-down the cutter unit.

The cutter unit of the molding apparatus has a plate shape disposed perpendicularly to the surface of the lower mold and has a first cutter disposed in a first direction and a plate shape disposed perpendicular to the surface and orthogonal to the first direction. And a second cutter disposed in a second direction and intersecting the first cutter.

The up-down unit of the molding apparatus is a hydraulic cylinder for conveying the cutter unit in the direction toward the lower mold.

The molding apparatus further includes a molding resin providing unit for providing molding resin to each of the molding spaces through the upper mold body.

The method of manufacturing a semiconductor package according to the present invention includes (i) a lower mold and (ii) an upper mold body facing the lower mold, and a lower surface of the upper mold body facing the lower mold, protruding in a matrix shape. Preparing an upper mold having a cutter unit forming two molding spaces and an up-down unit up-down the cutter unit, the substrate having the semiconductor chip disposed at a position corresponding to the molding space, the lower mold and the Arranging between upper molds, pressing the upper surface of the substrate with the cutter unit, molding the semiconductor chip by providing molding resin to the respective molding space through the upper mold, and using the up-down unit Cutting the substrate with a cutter unit to individualize the molded semiconductor chip.

In pressing the upper surface of the substrate with the cutter unit, an end portion of the cutter unit is disposed at a depth of 1% to 80% of the thickness of the substrate from the upper surface of the substrate.

According to the present invention, by separately cutting the semiconductor package from the substrate in a cutting manner, the generation of molding particles, substrate particles, copper particles, and the like can be suppressed, as well as the molding of the semiconductor package is performed separately, when the substrate is individualized in the sawing process. By doing so, it is possible to prevent process defects due to warpage and warpage of the semiconductor package.

Hereinafter, a molding apparatus and a method of manufacturing a semiconductor package using the same according to embodiments of the present invention will be described in detail with reference to the accompanying drawings. However, the present invention is not limited to the following embodiments. Those skilled in the art will be able to implement the present invention in various other forms without departing from the spirit of the present invention.

1 is a cross-sectional view showing a molding apparatus according to an embodiment of the present invention. 2 is a plan view of the cutter unit of FIG. 1.

Referring to FIG. 1, the molding apparatus 300 according to the present exemplary embodiment may mold a plurality of semiconductor chips mounted on a substrate with an epoxy resin. The molding apparatus 300 includes a lower mold 100 and an upper mold 200.

The lower mold 100 has a plate shape. The lower mold 100 supports a substrate on which semiconductor chips are mounted.

The upper mold 200 is disposed above the lower mold 100. The lower mold 100 and the upper mold 200 face each other.

The upper mold 200 includes an upper mold body 210, a cutter unit 220 and an up-down unit 230. In addition, the upper mold 200 may further include a molding resin providing unit 240.

Referring to FIG. 2, the cutter unit 220 includes a first cutter 222 and a second cutter 224.

The first cutter 222 has a cuboid plate shape, and as shown in FIG. 1, the first cutter 222 is disposed substantially perpendicular to the surface of the lower mold 100. For example, the first cutter 222 is disposed in parallel with the first direction FD, and the plurality of first cutters 222 are disposed in parallel with each other along the second direction.

The second cutter 224 has substantially the same shape as the first cutter 222, and the second cutter 224 is disposed substantially perpendicular to the surface of the lower mold 100. For example, the second cutter 224 is disposed in parallel with the second direction SD, and the plurality of second cutters 224 are disposed in parallel with each other in the first direction.

In the present embodiment, the first cutter 222 intersects substantially perpendicularly to the second cutter 224, whereby when viewed in plan, the first cutter 222 and the second cutter 224 are grid-shaped. Is placed. In this embodiment, the first cutter 222 and the second cutter 224 intersected with each other form a molding space in which the molding resin is filled.

The upper mold body 210 has a rectangular parallelepiped shape suitable for accommodating the cutter unit 220. The upper mold body 210 may include a transfer unit (not shown) for transferring the upper mold body 210 toward the lower mold 100.

The upper mold body 210 is formed in the cutter accommodating groove 212 to accommodate the cutter unit 220. The cutter receiving groove 212 is formed from the lower surface 211 of the upper mold body 210 facing the lower mold 100. The cutter accommodating groove 212 has a grid shape for accommodating the cutter unit 220 when viewed in a plan view.

The cutter unit 220 accommodated in the cutter accommodation groove 212 may protrude, for example, a predetermined length from the lower surface 211 of the upper mold body 210. The protruding length of the cutter unit 220 protruding from the lower surface 211 of the upper mold body 210 may be precisely adjusted by the up-down unit 230 which will be described later.

The up-down unit 230 may be mechanically connected to the first cutter 222 and / or the second cutter 224 of the cutter unit 220. The up-down unit 230 transfers the cutter unit 220 from the upper mold body 210 toward the surface of the lower mold 100. In addition, the up-down unit 230 transfers the cutter unit 220 from the lower mold 100 toward the upper mold body 210.

In this embodiment, the up-down unit 230 may be, for example, a hydraulic cylinder electrically connected with the cutter unit 220.

The molding resin providing unit 240 includes a molding resin providing unit 242 and a molding resin providing pipe 244.

The molding resin providing unit 242 provides a molten epoxy resin and the like, and the molding resin providing pipe 244 provides the molten epoxy resin as a molding space between the upper mold 200 and the lower mold 100. The molding resin providing pipe 244 is formed through the upper mold body 210.

The molding resin providing pipe 244 provides a molten epoxy resin in each molding space formed by the first cutter 222 and the second cutter 224 of the cutter unit 220.

3 to 6 are cross-sectional views illustrating a method of manufacturing a semiconductor package according to an embodiment of the present invention.

Referring to FIG. 3, a lower mold 100 and an upper mold 200 spaced apart from the lower mold 100 are prepared to manufacture a semiconductor package. The upper mold 200 shown in FIG. 3 has substantially the same configuration as the upper mold 200 shown in FIGS. 1 and 2, and thus redundant descriptions of the same parts will be omitted, and the same components. The same reference numerals and the same names will be used for the reference numerals.

The upper mold 200 protrudes from the upper mold body 210 facing the lower mold 100 and the lower surface 211 of the upper mold body 210 facing the lower mold 100 to form a plurality of moldings in a matrix shape. It has a cutter unit 220 forming spaces and an up-down unit 230 up-down the cutter unit 220.

After the lower mold 100 and the upper mold 200 spaced apart from the lower mold 100 are prepared, on the lower mold 100, a plurality of semiconductor chips 5 are arranged in a matrix form when viewed in plan view. In the present embodiment, the molding space formed by the first and second cutters 222 and 224 of the upper mold 200 corresponds to each semiconductor chip 5 formed on the substrate 10.

Referring to FIG. 4, after the substrate 10 on which the plurality of semiconductor chips 5 are mounted is loaded on the lower mold 100, the upper mold 200 is transferred toward the lower mold 100, thereby The first cutter 222 and the second cutter 224 of the cutter unit 220 protruding from the lower surface 211 of the upper mold body 210 of the upper mold 200 are in contact with the surface of the substrate 10. .

In this embodiment, each end of the first cutter 222 and the second cutter 224 of the cutter unit 220 cuts the substrate 10 to a depth of 1% to 80% of the total thickness of the substrate 10. In order to do so, the upper mold 200 may be transferred toward the lower mold 100.

Meanwhile, in a state where the upper mold 200 is fixed to the upper portion of the lower mold 100, the ends of the first cutter 222 and the second cutter 224 of the cutter unit 220 are formed on the entire substrate 10. The up-down unit 230 fixed to the cutter unit 220 may be transferred toward the lower mold 100 to cut the substrate 10 to a depth of 1% to 80% of the thickness.

Referring to FIG. 5, after the first cutter 222 and the second cutter 224 of the cutter unit 220 partially cut the substrate 10, the molten epoxy manufactured from the molding resin providing unit 240 may be used. The resin passes through the upper mold body 210 and is provided to the molding space corresponding to each semiconductor chip 5, whereby each semiconductor chip 5 is molded.

In this case, the molding resin provided from the molding resin providing unit 240 individually separates the semiconductor chip 5 disposed in each molding space divided by the first cutter 222 and the second cutter 224 of the cutter unit 220. Mold with.

Referring to FIG. 6, after the molding resin is filled in the molding space formed by the first cutter 222 and the second cutter 224 of the cutter unit 220, the up-down unit 230 is the cutter unit 220. Transfer the first cutter 222 and the second cutter 224 toward the lower mold 100 to completely cut the partially cut substrate 10 so that each semiconductor chip is separated from the substrate 10 so as to obtain a semiconductor package. Manufacture.

Thereafter, the individualized semiconductor package is separated from the upper mold 200 by a lift unit or the like.

As described above in detail, the semiconductor package is separated from the substrate in a cutting manner, thereby suppressing the generation of molding particles, substrate particles, copper particles, and the like, as well as suppressing the molding of the semiconductor package. By performing it individually, it is possible to prevent the process failure due to the warpage and the warpage of the semiconductor package.

In the detailed description of the present invention described above with reference to the embodiments of the present invention, those skilled in the art or those skilled in the art having ordinary knowledge in the scope of the present invention described in the claims and It will be appreciated that various modifications and variations can be made in the present invention without departing from the scope of the art.

1 is a cross-sectional view showing a molding apparatus according to an embodiment of the present invention.

2 is a plan view of the cutter unit of FIG. 1.

Claims

Lower mold; And

An upper mold body facing the lower mold, a cutter unit projecting from a lower surface of the upper mold body facing the lower mold to form a plurality of molding spaces in a matrix shape, and an up-down to down-cut the cutter unit Molding apparatus comprising an upper mold having a unit.

The method of claim 1,

The cutter unit may include a first cutter having a plate shape disposed perpendicular to the surface of the lower mold and arranged in a first direction; And

And a second cutter having a plate shape perpendicular to the surface and disposed in a second direction orthogonal to the first direction and intersecting the first cutter.

The method of claim 1,

And the up-down unit is a hydraulic cylinder for transferring the cutter unit in a direction toward the lower mold.

The method of claim 1,

And a molding resin providing unit for providing molding resin to each of the molding spaces through the upper mold body.

(i) a lower mold and (ii) an upper mold body facing the lower mold, a cutter unit projecting from a lower surface of the upper mold body facing the lower mold to form a plurality of molding spaces in a matrix shape and the cutter Preparing an upper mold having an up-down unit to up-down the unit;

Disposing a substrate on which a semiconductor chip is disposed at a position corresponding to the molding space between the lower mold and the upper mold;

Pressing an upper surface of the substrate with the cutter unit;

Molding the semiconductor chip by providing a molding resin to each of the molding spaces through the upper mold; And

Cutting the substrate with a cutter unit using the up-down unit to individualize the molded semiconductor chip.

The method of claim 5,

In the pressing of the upper surface of the substrate with the cutter unit, the end of the cutter unit is disposed in the depth of 1% to 80% of the thickness of the substrate from the upper surface of the substrate.