KR100941412B1 - A light emitting diode array package with heat radiation - Google Patents
A light emitting diode array package with heat radiation Download PDFInfo
- Publication number
- KR100941412B1 KR100941412B1 KR20090046155A KR20090046155A KR100941412B1 KR 100941412 B1 KR100941412 B1 KR 100941412B1 KR 20090046155 A KR20090046155 A KR 20090046155A KR 20090046155 A KR20090046155 A KR 20090046155A KR 100941412 B1 KR100941412 B1 KR 100941412B1
- Authority
- KR
- South Korea
- Prior art keywords
- light emitting
- emitting diode
- conductive pattern
- heat dissipation
- array package
- Prior art date
Links
- 230000005855 radiation Effects 0.000 title claims abstract description 14
- 239000000758 substrate Substances 0.000 claims abstract description 20
- 230000017525 heat dissipation Effects 0.000 claims description 34
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 11
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 11
- 229910052737 gold Inorganic materials 0.000 claims description 11
- 239000010931 gold Substances 0.000 claims description 11
- 229910052709 silver Inorganic materials 0.000 claims description 11
- 239000004332 silver Substances 0.000 claims description 11
- 238000000034 method Methods 0.000 claims description 8
- 239000000853 adhesive Substances 0.000 claims description 7
- 230000001070 adhesive effect Effects 0.000 claims description 7
- 239000000919 ceramic Substances 0.000 claims description 4
- 239000004593 Epoxy Substances 0.000 claims description 3
- 229910044991 metal oxide Inorganic materials 0.000 claims description 3
- 150000004706 metal oxides Chemical class 0.000 claims description 3
- 229920000642 polymer Polymers 0.000 claims description 3
- 229910000679 solder Inorganic materials 0.000 claims description 3
- 238000007747 plating Methods 0.000 claims description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000003491 array Methods 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 230000000593 degrading effect Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- PQTCMBYFWMFIGM-UHFFFAOYSA-N gold silver Chemical compound [Ag].[Au] PQTCMBYFWMFIGM-UHFFFAOYSA-N 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N9/00—Details of colour television systems
- H04N9/12—Picture reproducers
- H04N9/31—Projection devices for colour picture display, e.g. using electronic spatial light modulators [ESLM]
- H04N9/3141—Constructional details thereof
- H04N9/315—Modulator illumination systems
- H04N9/3164—Modulator illumination systems using multiple light sources
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49171—Fan-out arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10106—Light emitting diode [LED]
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
- Printers Or Recording Devices Using Electromagnetic And Radiation Means (AREA)
Abstract
Description
The present invention relates to a light emitting diode package, and more particularly to a light emitting diode array package having a heat radiation function.
A light emitting diode (LED) is a type of semiconductor that converts an electrical signal into infrared or visible light using the characteristics of a compound semiconductor. Light emitting diodes have been widely used for purposes such as simple light emitting display or numeric display to this day because of low brightness, low voltage, long life, low cost and small size. In recent years, in addition to the use of light emitting diodes in existing simple light emitting displays, there is a growing interest in using them in lighting fields such as infrared emitters, infrared emitters, and infrared illuminators. In particular, when an infrared light emitting diode is used for illumination, not only the quality of light emission but also the light output of several tens of watts is required. In order to obtain such a high power light source, a plurality of light emitting diodes are used. In this case, the light emitting diodes need to be connected in series and in parallel according to the voltage used and the amount of light required. To this end, one block may be made of chips configured in parallel, and the blocks may be connected in parallel to form an array of light emitting diodes, and chip blocks formed by connecting at least one light emitting diode in parallel are generally surface mounted. When a copper pattern is connected to a printed circuit board (PCB) like a surface mounted device (SMD), a copper pattern on the PCB is lifted by heat generated from chip blocks. This is because the heat generated from the light emitting diodes is so large that the temperature of the junction of the light emitting diode chip block, which is formed by connecting at least one light emitting diode in parallel, may increase to 150 degrees Celsius.
Failure to effectively dissipate heat generated from the light emitting diodes causes thermal fatigue to accumulate in the light emitting diodes, thereby degrading long-term driving and performance reliability, and in severe cases, the light emitting diodes in the chip block may be damaged. 1 is a view schematically showing an example of a general light emitting diode array package. As shown in FIG. 1, in particular, in the case of the light emitting
In order to solve the above problems, an object of the present invention is to provide a conductive pattern for effectively configuring a light emitting diode array. In addition, another object of the present invention is to provide a light emitting diode array package having heat dissipation and excellent heat resistance.
A light emitting diode array package having a heat dissipation function according to a feature of the present invention for achieving the above object,
(1) at least one light emitting diode that emits light;
(2) a conductive pattern to which the at least one light emitting diodes are connected;
(3) a heat dissipation substrate for dissipating heat generated by the at least one light emitting diodes;
(4) a stem in which the at least one light emitting diode, the conductive pattern and the heat dissipation substrate are accommodated;
(5) It is characterized by the structure including the adhesive member which adheres the said heat radiation board | substrate and the said stem.
Preferably, the at least one LED may further include a lead pin for supplying power from the outside.
More preferably, in order to supply power to the at least one light emitting diodes, the power supply unit may be further connected to the lead pins.
Preferably, at least one light emitting diodes are connected in parallel in one conductive pattern to obtain a required amount of light, and the conductive patterns in which the at least one light emitting diodes are connected in parallel are connected in parallel and parallel to each other according to a voltage used. Arrays can be configured.
Preferably, the conductive pattern,
A parallel connection in which at least one light emitting diode is disposed, and
At least one light emitting diode disposed in a parallel connection part of another conductive pattern may be configured as a serial connection part connected through wire bonding.
More preferably, the wire may be formed of gold or silver.
More preferably, the series connecting portion of the conductive pattern may be configured to surround the parallel connecting portion of another adjacent conductive pattern.
More preferably, the at least one light emitting diode may be disposed at the outermost part of the parallel connection portion.
Preferably, the conductive pattern is formed of gold, the heat dissipation substrate is made of any one of polymer, ceramic, and metal oxide, and the adhesive member corresponds to any one of silver-epoxy, silver paste and solder, and the stem It may be plated with silver gold or silver.
According to the LED array package having a heat dissipation function of the present invention, by providing a conductive pattern that can easily configure the LED array according to the voltage used and the amount of light required, it is possible to effectively arrange the LEDs in a small area There is.
In addition, by providing a heat dissipation substrate having excellent heat resistance and thermal conductivity at the bottom of the parallel-parallel circuit composed of light emitting diodes, heat generated from the light emitting diodes can be effectively discharged to the outside, thereby constructing a light emitting diode array package having heat resistance. It can work.
Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.
2 is a schematic cross-sectional view of a light emitting diode array package having a heat dissipation function according to an embodiment of the present invention. As shown in FIG. 2, the light emitting diode array package 200 having a heat dissipation function according to an embodiment of the present invention includes at least one
Gold or silver may be used as the material of the
The
The
The
The
3 is a schematic perspective view of a light emitting diode array package having a heat dissipation function according to an embodiment of the present invention. As shown in FIG. 3, the LED array package with heat dissipation according to an embodiment of the present invention includes
4 is a top view of a light emitting diode array package having a heat dissipation function according to an exemplary embodiment of the present invention. As shown in FIG. 4, the
The
The
It can be seen that the
The present invention described above may be variously modified or applied by those skilled in the art, and the scope of the technical idea according to the present invention should be defined by the following claims.
1 is a view schematically showing an example of a typical light emitting diode array package.
Figure 2 is a schematic cross-sectional view of a light emitting diode array package having a heat radiation function according to an embodiment of the present invention.
Figure 3 is a schematic perspective view of a light emitting diode array package having a heat radiation function according to an embodiment of the present invention.
Figure 4 is a top view of the light emitting diode array package having a heat radiation function according to an embodiment of the present invention.
<Explanation of symbols for main parts of the drawings>
110, 260: stem
120: light emitting diode chip block
200: LED array with heat dissipation
210, 470: light emitting diodes
220, 440: wire
230, 320: conductive pattern
240, 310, 410: heat sink
250: adhesive member
330a, 330b: lead pins
340a, 340b, 420a, 420b: lead pin head
430: power supply
450: parallel connection
460: serial connection
Claims (9)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR20090046155A KR100941412B1 (en) | 2009-05-26 | 2009-05-26 | A light emitting diode array package with heat radiation |
PCT/KR2010/003325 WO2010137868A2 (en) | 2009-05-26 | 2010-05-26 | Light-emitting diode array package having a heat-dissipating function |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR20090046155A KR100941412B1 (en) | 2009-05-26 | 2009-05-26 | A light emitting diode array package with heat radiation |
Publications (1)
Publication Number | Publication Date |
---|---|
KR100941412B1 true KR100941412B1 (en) | 2010-02-10 |
Family
ID=42083214
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR20090046155A KR100941412B1 (en) | 2009-05-26 | 2009-05-26 | A light emitting diode array package with heat radiation |
Country Status (2)
Country | Link |
---|---|
KR (1) | KR100941412B1 (en) |
WO (1) | WO2010137868A2 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8492777B2 (en) | 2010-04-09 | 2013-07-23 | Everlight Electronics Co., Ltd. | Light emitting diode package, lighting device and light emitting diode package substrate |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0823145A (en) * | 1994-07-06 | 1996-01-23 | Mitsubishi Materials Corp | Substrate for hybrid ic |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20060020089A (en) * | 2004-08-31 | 2006-03-06 | 서울옵토디바이스주식회사 | Luminous element having arrayed cells |
KR100755615B1 (en) * | 2006-04-14 | 2007-09-06 | 삼성전기주식회사 | Backlight for liquid crystal display comprising light emitting diode |
JP2009111099A (en) * | 2007-10-29 | 2009-05-21 | Mitsubishi Chemicals Corp | Integrated light-emitting source and manufacturing method therefor |
-
2009
- 2009-05-26 KR KR20090046155A patent/KR100941412B1/en not_active IP Right Cessation
-
2010
- 2010-05-26 WO PCT/KR2010/003325 patent/WO2010137868A2/en active Application Filing
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0823145A (en) * | 1994-07-06 | 1996-01-23 | Mitsubishi Materials Corp | Substrate for hybrid ic |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8492777B2 (en) | 2010-04-09 | 2013-07-23 | Everlight Electronics Co., Ltd. | Light emitting diode package, lighting device and light emitting diode package substrate |
Also Published As
Publication number | Publication date |
---|---|
WO2010137868A3 (en) | 2011-02-17 |
WO2010137868A2 (en) | 2010-12-02 |
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