KR100941412B1 - A light emitting diode array package with heat radiation - Google Patents

A light emitting diode array package with heat radiation Download PDF

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Publication number
KR100941412B1
KR100941412B1 KR20090046155A KR20090046155A KR100941412B1 KR 100941412 B1 KR100941412 B1 KR 100941412B1 KR 20090046155 A KR20090046155 A KR 20090046155A KR 20090046155 A KR20090046155 A KR 20090046155A KR 100941412 B1 KR100941412 B1 KR 100941412B1
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KR
South Korea
Prior art keywords
light emitting
emitting diode
conductive pattern
heat dissipation
array package
Prior art date
Application number
KR20090046155A
Other languages
Korean (ko)
Inventor
이성수
Original Assignee
(주)파라곤테크
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Application filed by (주)파라곤테크 filed Critical (주)파라곤테크
Priority to KR20090046155A priority Critical patent/KR100941412B1/en
Application granted granted Critical
Publication of KR100941412B1 publication Critical patent/KR100941412B1/en
Priority to PCT/KR2010/003325 priority patent/WO2010137868A2/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N9/00—Details of colour television systems
    • H04N9/12—Picture reproducers
    • H04N9/31—Projection devices for colour picture display, e.g. using electronic spatial light modulators [ESLM]
    • H04N9/3141—Constructional details thereof
    • H04N9/315—Modulator illumination systems
    • H04N9/3164—Modulator illumination systems using multiple light sources
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)
  • Printers Or Recording Devices Using Electromagnetic And Radiation Means (AREA)

Abstract

PURPOSE: A light emitting diode array package with heat radiation is provided to emit the heat generated from the light emitting diode to the outside by including a heat radiating substrate with a heat resistance and heat conduction. CONSTITUTION: In a light emitting diode array package with heat radiation, at least one light emitting diode(470) emits the light. A conductive pattern locates at the lower part of at least light emitting diode and it is connected to the at least one light emitting diodes. A radiation substrate(410) is located at the lower part of the conductive pattern and radiates the heat generate from at least one light emitting diodes. A stem is located at the lower part of the radiation substrate and it receives at least one light emitting diode, a conductive pattern, and radiation substrate. The conductive pattern comprises a parallel connection part(450) and a series connection part(460).

Description

LED Array Package with Heat Dissipation {A LIGHT EMITTING DIODE ARRAY PACKAGE WITH HEAT RADIATION}

The present invention relates to a light emitting diode package, and more particularly to a light emitting diode array package having a heat radiation function.

A light emitting diode (LED) is a type of semiconductor that converts an electrical signal into infrared or visible light using the characteristics of a compound semiconductor. Light emitting diodes have been widely used for purposes such as simple light emitting display or numeric display to this day because of low brightness, low voltage, long life, low cost and small size. In recent years, in addition to the use of light emitting diodes in existing simple light emitting displays, there is a growing interest in using them in lighting fields such as infrared emitters, infrared emitters, and infrared illuminators. In particular, when an infrared light emitting diode is used for illumination, not only the quality of light emission but also the light output of several tens of watts is required. In order to obtain such a high power light source, a plurality of light emitting diodes are used. In this case, the light emitting diodes need to be connected in series and in parallel according to the voltage used and the amount of light required. To this end, one block may be made of chips configured in parallel, and the blocks may be connected in parallel to form an array of light emitting diodes, and chip blocks formed by connecting at least one light emitting diode in parallel are generally surface mounted. When a copper pattern is connected to a printed circuit board (PCB) like a surface mounted device (SMD), a copper pattern on the PCB is lifted by heat generated from chip blocks. This is because the heat generated from the light emitting diodes is so large that the temperature of the junction of the light emitting diode chip block, which is formed by connecting at least one light emitting diode in parallel, may increase to 150 degrees Celsius.

Failure to effectively dissipate heat generated from the light emitting diodes causes thermal fatigue to accumulate in the light emitting diodes, thereby degrading long-term driving and performance reliability, and in severe cases, the light emitting diodes in the chip block may be damaged. 1 is a view schematically showing an example of a general light emitting diode array package. As shown in FIG. 1, in particular, in the case of the light emitting diode chip blocks 120 disposed at the center, heat dissipation means are required to solve this problem because heat dissipation is more difficult than that of the chip blocks 120 present in the periphery. . To this end, a method of radiating heat to the outside by attaching a heat sink made of aluminum or copper to the back of the stem 110 on which the light emitting diode package is mounted is generally used, but heat dissipation through such a method is limited. Therefore, the conductive patterns and heat generated from the light emitting diodes can be effectively arranged to effectively arrange the light emitting diodes in a small area and connect the light emitting diodes with a minimum of wires to form a parallel circuit. There is a need for heat dissipation means that can be released to the outside.

In order to solve the above problems, an object of the present invention is to provide a conductive pattern for effectively configuring a light emitting diode array. In addition, another object of the present invention is to provide a light emitting diode array package having heat dissipation and excellent heat resistance.

A light emitting diode array package having a heat dissipation function according to a feature of the present invention for achieving the above object,

(1) at least one light emitting diode that emits light;

(2) a conductive pattern to which the at least one light emitting diodes are connected;

(3) a heat dissipation substrate for dissipating heat generated by the at least one light emitting diodes;

(4) a stem in which the at least one light emitting diode, the conductive pattern and the heat dissipation substrate are accommodated;

(5) It is characterized by the structure including the adhesive member which adheres the said heat radiation board | substrate and the said stem.

Preferably, the at least one LED may further include a lead pin for supplying power from the outside.

More preferably, in order to supply power to the at least one light emitting diodes, the power supply unit may be further connected to the lead pins.

Preferably, at least one light emitting diodes are connected in parallel in one conductive pattern to obtain a required amount of light, and the conductive patterns in which the at least one light emitting diodes are connected in parallel are connected in parallel and parallel to each other according to a voltage used. Arrays can be configured.

Preferably, the conductive pattern,

A parallel connection in which at least one light emitting diode is disposed, and

At least one light emitting diode disposed in a parallel connection part of another conductive pattern may be configured as a serial connection part connected through wire bonding.

More preferably, the wire may be formed of gold or silver.

More preferably, the series connecting portion of the conductive pattern may be configured to surround the parallel connecting portion of another adjacent conductive pattern.

More preferably, the at least one light emitting diode may be disposed at the outermost part of the parallel connection portion.

Preferably, the conductive pattern is formed of gold, the heat dissipation substrate is made of any one of polymer, ceramic, and metal oxide, and the adhesive member corresponds to any one of silver-epoxy, silver paste and solder, and the stem It may be plated with silver gold or silver.

According to the LED array package having a heat dissipation function of the present invention, by providing a conductive pattern that can easily configure the LED array according to the voltage used and the amount of light required, it is possible to effectively arrange the LEDs in a small area There is.

In addition, by providing a heat dissipation substrate having excellent heat resistance and thermal conductivity at the bottom of the parallel-parallel circuit composed of light emitting diodes, heat generated from the light emitting diodes can be effectively discharged to the outside, thereby constructing a light emitting diode array package having heat resistance. It can work.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

2 is a schematic cross-sectional view of a light emitting diode array package having a heat dissipation function according to an embodiment of the present invention. As shown in FIG. 2, the light emitting diode array package 200 having a heat dissipation function according to an embodiment of the present invention includes at least one light emitting diode 210 that emits light and a conductive pattern in which the light emitting diodes are disposed. 230, a wire 220 connecting the conductive pattern and the light emitting diodes, a heat dissipation substrate 240 for dissipating heat generated from the light emitting diodes, the light emitting diode 210 and the conductive pattern 230, and the heat dissipation substrate 240. ) Is a stem 260 is accommodated, and the adhesive member 250 for adhering the heat radiation board 240 and the stem 260.

Gold or silver may be used as the material of the wire 220 and is preferably formed of gold.

The conductive pattern 230 corresponds to a conductive line connecting the light emitting diodes 210 in series or in parallel, and gold is preferably used as a material of the conductive pattern, because the conductive pattern 230 is connected to the wire 220 and the conductive pattern connected to the conductive pattern. The back of the light emitting diode 210 in contact, that is, the cathode is also generally made of gold, which is advantageous for mutual bonding, and also has excellent thermal conductivity to transfer heat generated from the light emitting diodes 210 to the heat dissipation substrate 240. Because it is easy to do. The conductive pattern formed of gold may be manufactured by, for example, vacuum deposition using a mask by photoetching or chemical plating using a mask. The configuration of the light emitting diode array and the light emitting diode arrangement using the conductive pattern will be described in more detail with reference to FIG. 4.

The heat dissipation substrate 240 is formed at a lower side of the parallel circuit composed of the conductive pattern 230 and the light emitting diodes 210 and emits heat generated from the light emitting diodes 210 to the outside. The heat dissipation substrate 240 may be manufactured using any one material of a polymer, a ceramic, and a metal oxide, and is preferably made of a ceramic having good heat resistance and good thermal conductivity.

The stem 260 is a portion in which the light emitting diode 210, the conductive pattern 230, and the heat dissipation substrate 240 are accommodated, and corresponds to a portion that finally emits heat. The stem 260 may also be plated with gold or silver because the thermal conductivity must be high, and a heat sink (not shown) may be further adhered to the bottom of the stem to release heat to the outside.

The adhesive member 250 is for bonding the radiating substrate 240 and the stem 260, and may be formed of any one of silver-epoxy, silver paste, and solder, and the silver paste has excellent thermal conductivity and adhesion. Since the process and the like are convenient and effective, they are preferably formed as a silver paste.

3 is a schematic perspective view of a light emitting diode array package having a heat dissipation function according to an embodiment of the present invention. As shown in FIG. 3, the LED array package with heat dissipation according to an embodiment of the present invention includes lead pins 330a and 330b and lead pins 330a and 330b for applying power to the light emitting diodes. In order to connect the to the conductive pattern 320, the lead fin heads 340a and 340b formed outside the heat dissipation substrate 310 may be further provided. In FIG. 3, a pair of lead pins 330a and 330b and lead pin heads 340a and 340b are illustrated, but a pair of lead pins and lead pin heads may be used. In addition, although not shown in FIG. 3, a lens may be further provided to seal the light emitting diode and to focus light generated by the light emitting diode.

4 is a top view of a light emitting diode array package having a heat dissipation function according to an exemplary embodiment of the present invention. As shown in FIG. 4, the power supply unit 430 of the conductive pattern in the light emitting diode array package having the heat dissipation function is directly connected to the lead pin head 420a and the wire 440 to supply power from the outside. It corresponds to a pattern for supplying power to the light emitting diodes.

The parallel connection portion 450 of the conductive pattern is an area in which at least one light emitting diode to be configured in parallel is actually disposed, and may bond the cathode and the parallel connection portion of the light emitting diodes to be connected in parallel to obtain a necessary light amount. In addition, the lead pin head 420b for supplying power from the outside may be directly connected to a wire to supply power to the light emitting diodes.

The series connecting portion 460 of the conductive pattern may be configured to enclose the parallel connecting portions of other adjacent conductive patterns. The LED chip blocks may be connected in series by connecting the anode of the LED and the serial connector 460 in the parallel connection 450 of another adjacent conductive pattern through a wire. In general, 5V, 12V, and 24V voltages can be applied to the LED array package. For effective current control, two series circuits at 5V, five series circuits at 12V, and 9 to 12 series circuits at 24V. It is preferable that it consists of.

It can be seen that the light emitting diodes 470 are disposed at the outermost portion of the parallel connection portion 450 of the conductive pattern, so that the light emitting diodes 470 may be configured as a series circuit using a minimum of wires. If the length of the wire becomes longer, there is a risk of disconnection and short circuit due to the influence of gravity or the filling of the epoxy resin to finish the filling, so that at least one or more light emitting diodes constituting the parallel circuit is arranged in the above manner, It is possible to prevent the degradation of the reliability of the LED array package, which may occur due to wire breakage.

The present invention described above may be variously modified or applied by those skilled in the art, and the scope of the technical idea according to the present invention should be defined by the following claims.

1 is a view schematically showing an example of a typical light emitting diode array package.

Figure 2 is a schematic cross-sectional view of a light emitting diode array package having a heat radiation function according to an embodiment of the present invention.

Figure 3 is a schematic perspective view of a light emitting diode array package having a heat radiation function according to an embodiment of the present invention.

Figure 4 is a top view of the light emitting diode array package having a heat radiation function according to an embodiment of the present invention.

<Explanation of symbols for main parts of the drawings>

110, 260: stem

120: light emitting diode chip block

200: LED array with heat dissipation

210, 470: light emitting diodes

220, 440: wire

230, 320: conductive pattern

240, 310, 410: heat sink

250: adhesive member

330a, 330b: lead pins

340a, 340b, 420a, 420b: lead pin head

430: power supply

450: parallel connection

460: serial connection

Claims (9)

A light emitting diode array package with heat dissipation, (1) at least one light emitting diode that emits light; (2) a conductive pattern positioned under the at least one light emitting diode and connected with the at least one light emitting diode; (3) a heat dissipation substrate positioned below the conductive pattern and connected to the conductive pattern to dissipate heat generated by the at least one light emitting diodes; (4) a stem positioned below the heat dissipation substrate and receiving the at least one light emitting diode, the conductive pattern, and the heat dissipation substrate; (5) including an adhesive member for adhering the heat radiation board and the stem, The conductive pattern is, A parallel connection in which at least one light emitting diode is disposed, and At least one light emitting diode disposed in a parallel connection portion of the other conductive pattern is composed of a serial connection connected via wire bonding, The at least one light emitting diode is disposed at the outermost portion of the parallel connection portion, the light emitting diode array package having a heat dissipation function, characterized in that the series connection portion of the conductive pattern is configured to surround the parallel connection portion of another adjacent conductive pattern . The method of claim 1, The LED array package having a heat dissipation function further comprises a lead pin for supplying power to the at least one LED. The method of claim 2, And a power supply unit directly connected to the lead pins to supply power to the at least one light emitting diodes. The method of claim 1, In order to obtain the required amount of light, at least two light emitting diodes are connected in parallel in one conductive pattern, and the conductive patterns in which the at least two light emitting diodes are connected in parallel are connected in parallel according to the voltage used, thereby forming a light emitting diode array. Light emitting diode array package having a heat dissipation function, characterized in that the configuration. delete The method of claim 1, wherein the wire, A light emitting diode array package with heat dissipation, characterized in that formed of gold or silver. delete delete The method of claim 1, The conductive pattern is formed of gold, The heat sink is made of any one of a polymer, ceramic, metal oxide, The adhesive member corresponds to any one of silver-epoxy, silver paste and solder, The stem is a light emitting diode array package, characterized in that the plating with gold or silver.
KR20090046155A 2009-05-26 2009-05-26 A light emitting diode array package with heat radiation KR100941412B1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
KR20090046155A KR100941412B1 (en) 2009-05-26 2009-05-26 A light emitting diode array package with heat radiation
PCT/KR2010/003325 WO2010137868A2 (en) 2009-05-26 2010-05-26 Light-emitting diode array package having a heat-dissipating function

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR20090046155A KR100941412B1 (en) 2009-05-26 2009-05-26 A light emitting diode array package with heat radiation

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WO (1) WO2010137868A2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8492777B2 (en) 2010-04-09 2013-07-23 Everlight Electronics Co., Ltd. Light emitting diode package, lighting device and light emitting diode package substrate

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0823145A (en) * 1994-07-06 1996-01-23 Mitsubishi Materials Corp Substrate for hybrid ic

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20060020089A (en) * 2004-08-31 2006-03-06 서울옵토디바이스주식회사 Luminous element having arrayed cells
KR100755615B1 (en) * 2006-04-14 2007-09-06 삼성전기주식회사 Backlight for liquid crystal display comprising light emitting diode
JP2009111099A (en) * 2007-10-29 2009-05-21 Mitsubishi Chemicals Corp Integrated light-emitting source and manufacturing method therefor

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0823145A (en) * 1994-07-06 1996-01-23 Mitsubishi Materials Corp Substrate for hybrid ic

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8492777B2 (en) 2010-04-09 2013-07-23 Everlight Electronics Co., Ltd. Light emitting diode package, lighting device and light emitting diode package substrate

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WO2010137868A3 (en) 2011-02-17
WO2010137868A2 (en) 2010-12-02

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