KR100939596B1 - 단일 웨이퍼 건조기 및 건조 방법 - Google Patents
단일 웨이퍼 건조기 및 건조 방법 Download PDFInfo
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Abstract
Description
Claims (21)
- 프로세싱부를 포함하는 웨이퍼 처리 모듈로서,상기 프로세싱부가:상기 프로세싱부 안으로 웨이퍼가 하강할 수 있도록 상기 웨이퍼를 통과시키는 로드 포트;언로드 포트로서, 상기 언로드 포트에서 상기 프로세싱부의 외부로 상기 웨이퍼가 상승될 수 있도록 상기 로드 포트로부터 수평으로 변위되는 언로드 포트; 및상기 웨이퍼가 상기 로드 포트와 일렬로 배열되는 제 1 배향으로부터 상기 웨이퍼가 상기 언로드 포트와 일렬로 배열되는 제 2 배향으로 입력 웨이퍼를 회전시키기 위한 회전식 웨이퍼 지지부를 구비하는,웨이퍼 처리 모듈.
- 제 1 항에 있어서,상기 회전식 웨이퍼 지지부는 상기 제 1 배향이 수직이며 상기 제 2 배향이 상기 제 1 배향으로부터 경사지도록 설치되어 있는,웨이퍼 처리 모듈.
- 제 1 항에 있어서,상기 회전식 웨이퍼 지지부는 상기 제 1 배향이 상기 언로드 포트로부터 떨 어져서 제 1 방향으로 기울어지고 상기 제 2 배향이 상기 언로드 포트를 향해 제 2 방향으로 기울어지도록 설치되어 있는,웨이퍼 처리 모듈.
- 제 2 항에 있어서,상기 프로세싱부는 상기 언로드 포트와 인접한 경사진 후방벽을 더 포함하는,웨이퍼 처리 모듈.
- 제 3 항에 있어서,상기 프로세싱부는 상기 로드 포트와 인접한 경사진 전방벽과, 상기 언로드 포트와 인접한 경사진 후방벽을 더 포함하는,웨이퍼 처리 모듈.
- 프로세싱부를 포함하는 웨이퍼 처리 모듈로서,상기 프로세싱부가:상기 프로세싱부 안으로 웨이퍼가 하강할 수 있도록 상기 웨이퍼를 통과시키는 로드 포트;언로드 포트로서, 상기 언로드 포트에서 상기 프로세싱부의 외부로 상기 웨이퍼가 상승될 수 있도록 상기 로드 포트로부터 수평으로 변위되는 언로드 포트;상기 프로세싱부의 외부를 따라 위치하는 외부 오버플로우 위어; 및상기 프로세싱부의 상부 영역을 제 1 섹션 및 제 2 섹션으로 구분하도록, 그리고 상기 제 1 섹션과 상기 제 2 섹션 사이에서 표면 유체가 이동하는 것을 방지하도록 상기 로드 포트와 상기 언로드 포트 사이에 위치하는 분리벽을 구비하는,웨이퍼 처리 모듈.
- 제 6 항에 있어서,상기 분리벽은 상기 제 1 섹션 및 상기 제 2 섹션 중 하나 이상으로부터 범람하는 유체를 수용하도록 구성되는 내부 오버플로우 위어를 포함하는,웨이퍼 처리 모듈.
- 삭제
- 프로세싱부를 포함하는 웨이퍼 처리 모듈로서,상기 프로세싱부가:상기 프로세싱부 안으로 웨이퍼가 하강할 수 있도록 상기 웨이퍼를 통과시키는 로드 포트; 및프로세싱 동안 상기 프로세싱부 내에 포함된 유체 내에 침지되며, 상기 웨이퍼가 상기 로드 포트를 통해 하강할 때 웨이퍼의 수중면에 유체를 분무하도록 위치하는 분무 기구를 구비하는,웨이퍼 처리 모듈.
- 제 9 항에 있어서,프로세싱 동안 상기 프로세싱부 내에 포함된 유체 수위 위에 있게 되며, 상기 웨이퍼가 상기 로드 포트를 통해 하강할 때 상기 웨이퍼의 수면 위에 유체를 분무하도록 위치되는 분무 기구를 더 포함하는,웨이퍼 처리 모듈.
- 제 9 항에 있어서,상기 웨이퍼가 언로드 포트에서 상기 프로세싱부의 외부로 상승되도록 상기 로드 포트로부터 수평으로 변위되는 언로드 포트; 및상기 프로세싱부의 상부 영역을 상기 로드 포트와 인접한 제 1 섹션과 상기 언로드 포트와 인접한 제 2 섹션으로 구분하도록, 그리고 상기 제 1 섹션으로부터 상기 제 2 섹션으로 표면 유체가 이동하는 것을 방지하도록 상기 로드 포트와 상기 언로드 포트 사이에 위치하는 분리벽을 더 포함하는,웨이퍼 처리 모듈.
- 제 11 항에 있어서,상기 제 2 섹션은 상기 웨이퍼가 상기 언로드 포트에서 상기 프로세싱부의 외부로 상승될 때 상기 웨이퍼 상에 건조 가스를 분무하도록 구성되는 분무 기구를 포함하는,웨이퍼 처리 모듈.
- 프로세싱부 및 출력부를 포함하는 모듈로서,상기 프로세싱부가:상기 프로세싱부 안으로 웨이퍼가 하강할 수 있도록 상기 웨이퍼를 통과시키는 로드 포트; 및언로드 포트로서, 상기 언로드 포트에서 상기 프로세싱부의 외부로 상기 웨이퍼가 상승될 수 있도록 상기 로드 포트로부터 수평으로 변위되는 언로드 포트를 구비하며, 그리고상기 출력부가:상기 언로드 포트를 통해 상승되는 웨이퍼를 수용하는 제 1 웨이퍼 수용부; 및상기 제 1 웨이퍼 수용부에 연결되고, 상기 언로드 포트로부터 상승되는 웨이퍼와 접촉하며, 상기 웨이퍼와 함께 수동적으로 상승하는 캐쳐를 구비하는,프로세싱부 및 출력부를 포함하는 모듈.
- 제 13 항에 있어서,상기 캐쳐는 상기 웨이퍼의 상부 영역을 고정시키도록 구성되는,프로세싱부 및 출력부를 포함하는 모듈.
- 제 14 항에 있어서,상기 제1 웨이퍼 수용부에 연결되어 있고 웨이퍼 통과 위치와 웨이퍼 고정 위치 사이에서 선택적으로 이동하도록 구성되는 핑거를 더 포함하며, 상기 웨이퍼 고정 위치는 상기 핑거가 상기 웨이퍼 고정 위치 내에 있는 경우 상기 웨이퍼가 상기 캐쳐와 상기 핑거 사이에 고정되도록 웨이퍼의 하부 영역과 접촉하며 상기 하부 영역을 고정시키도록 구성되는,프로세싱부 및 출력부를 포함하는 모듈.
- 프로세싱부 및 출력부를 포함하는 웨이퍼 세척 및 건조 모듈로서,상기 프로세싱부가:상기 프로세싱부 안으로 웨이퍼가 하강할 수 있도록 상기 웨이퍼를 통과시키는 로드 포트; 및언로드 포트로서, 상기 언로드 포트에서 상기 프로세싱부의 외부로 상기 웨이퍼가 상승될 수 있도록 상기 로드 포트로부터 수평으로 변위되는 언로드 포트를 구비하며, 그리고상기 출력부가:상기 언로드 포트를 통해 상승되는 웨이퍼를 수용하는 제 1 웨이퍼 수용부; 및상기 제 1 웨이퍼 수용부를 둘러싸는 외장을 구비하고,상기 외장이:상기 프로세싱부로부터 상기 언로드 포트를 통해 상기 제1 웨이퍼 수용부로 웨이퍼가 상승될 수 있게 하는 제 1 개구;웨이퍼 핸들러가 상기 제 1 웨이퍼 수용부로부터 웨이퍼를 인출할 수 있게 하는 제 2 개구; 및상기 외장 내부에 공기의 층류 유동이 생성될 수 있게 하는 다수의 추가의 개구를 구비하는,웨이퍼 세척 및 건조 모듈.
- 프로세싱부 및 출력부를 포함하는 모듈로서,상기 프로세싱부가:상기 프로세싱부 안으로 웨이퍼가 하강할 수 있도록 상기 웨이퍼를 통과시키는 로드 포트; 및언로드 포트로서, 상기 언로드 포트에서 상기 프로세싱부의 외부로 상기 웨이퍼가 상승될 수 있도록 상기 로드 포트로부터 수평으로 변위되는 언로드 포트를 구비하며, 그리고상기 출력부가:상기 언로드 포트를 통해 상승되는 웨이퍼를 수용하는 제 1 웨이퍼 수용부; 및상기 언로드 포트를 통해 상승되는 웨이퍼를 수용하는 제 2 웨이퍼 수용부를 구비하고,상기 제 1 및 제 2 웨이퍼 수용부는, 상기 제 1 웨이퍼 수용부가 상기 언로드 포트를 통해 상승되는 웨이퍼를 수용하도록 위치하는 제 1 위치와 상기 제 2 웨이퍼 수용부가 상기 언로드 포트를 통해 상승하는 웨이퍼를 수용하도록 위치하는 제 2 위치 사이에서 병진이동하도록 구성되는,프로세싱부 및 출력부를 포함하는 모듈.
- 제 17 항에 있어서,상기 제 1 및 제 2 웨이퍼 수용부가 연결되는 플랫폼을 더 포함하며,상기 플랫폼은 상기 제 1 위치와 상기 제 2 위치 사이에서 상기 제 1 및 제 2 웨이퍼 수용부를 이동시키도록 수평으로 병진이동하도록 구성되는,프로세싱부 및 출력부를 포함하는 모듈.
- 제 17 항에 있어서,상기 제 1 및 제 2 웨이퍼 수용부를 둘러싸는 외장을 더 포함하며,상기 외장이,상기 프로세싱부로부터 상기 언로드 포트를 통해 상기 제 1 및 제 2 웨이퍼 수용부 중 어느 하나로 웨이퍼가 상승되도록 구성되는 제 1 개구;웨이퍼 핸들러가 상기 제 1 및 제 2 웨이퍼 수용부 중 어느 하나로부터 웨이퍼를 인출할 수 있게 하는 제 2 개구; 및상기 외장의 내부에 공기의 층류 유동이 생성될 수 있게 하는 다수의 추가의 개구를 구비하는,프로세싱부 및 출력부를 포함하는 모듈.
- 제 1 항에 있어서,상기 프로세싱부는:상기 로드 포트와 인접하게 위치하고, 상기 웨이퍼의 전방면 및 후방면을 따라 유체가 아래로 유동하게 하여 상기 전방면 및 상기 후방면을 습윤 상태로 유지시키도록 상기 웨이퍼의 상기 전방면 및 상기 후방면 모두에 유체를 공급하도록 구성되는 한 쌍의 제 1 분무 기구;상기 언로드 포트와 인접하게 위치하고, 상기 웨이퍼의 상기 전방면 및 상기 후방면 모두에 유체 메니스커스를 형성시키도록 상기 웨이퍼의 상기 전방면 및 상기 후방면 모두에 유체를 공급하도록 구성되는 한 쌍의 제 2 분무 기구; 및상기 한 쌍의 제 2 분무 기구 위에 위치하고, 상기 웨이퍼의 상기 전방면 및 상기 후방면에 형성된 상기 유체 메니스커스에 건조 증기를 공급하도록 구성되는 한 쌍의 제 3 분무 기구를 포함하는,웨이퍼 처리 모듈.
- 제 12 항에 있어서,상기 건조 가스를 분무하는 상기 분무 기구에 연결되어 있으며, 상기 건조 가스에 노출되는 상기 프로세싱부 내에 포함된 상기 유체의 부피를 제한하도록 구성되는 유동 편향기를 더 포함하는,웨이퍼 처리 모듈.
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US20030121170A1 (en) | 2003-07-03 |
CN101499413A (zh) | 2009-08-05 |
US20100006124A1 (en) | 2010-01-14 |
CN101414547A (zh) | 2009-04-22 |
TW200301504A (en) | 2003-07-01 |
JP4296090B2 (ja) | 2009-07-15 |
CN101086955A (zh) | 2007-12-12 |
JP2005534162A (ja) | 2005-11-10 |
CN101414548A (zh) | 2009-04-22 |
CN101414547B (zh) | 2012-02-08 |
CN101414548B (zh) | 2011-10-19 |
WO2003041131A3 (en) | 2004-04-01 |
KR20050042224A (ko) | 2005-05-06 |
CN101086955B (zh) | 2013-03-27 |
US20070295371A1 (en) | 2007-12-27 |
WO2003041131A2 (en) | 2003-05-15 |
US20090241996A1 (en) | 2009-10-01 |
CN1650396A (zh) | 2005-08-03 |
KR20080095310A (ko) | 2008-10-28 |
US7980255B2 (en) | 2011-07-19 |
TWI285911B (en) | 2007-08-21 |
CN100477071C (zh) | 2009-04-08 |
US20050241684A1 (en) | 2005-11-03 |
US6955516B2 (en) | 2005-10-18 |
US20060174921A1 (en) | 2006-08-10 |
EP1446827A2 (en) | 2004-08-18 |
CN101499413B (zh) | 2011-05-04 |
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