KR100938376B1 - 실리콘 중간체를 포함하는 플립 칩 본딩용 비도전성접착제 조성물 - Google Patents
실리콘 중간체를 포함하는 플립 칩 본딩용 비도전성접착제 조성물 Download PDFInfo
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- KR100938376B1 KR100938376B1 KR1020020082729A KR20020082729A KR100938376B1 KR 100938376 B1 KR100938376 B1 KR 100938376B1 KR 1020020082729 A KR1020020082729 A KR 1020020082729A KR 20020082729 A KR20020082729 A KR 20020082729A KR 100938376 B1 KR100938376 B1 KR 100938376B1
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- resin
- weight
- adhesive composition
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J201/00—Adhesives based on unspecified macromolecular compounds
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
Description
수지 전처리 여부 | 실리콘 중간체 함량 (중량부) | 접속저항(Ω) | |||||
초기 | 고온고습 시험 후 | 차이(△) | 열충격 시험 후 | 차이(△) | |||
실시예 1 | O | 5 | 2.8 | 3.0 | 0.2 | 3.3 | 0.5 |
실시예 2 | O | 20 | 2.8 | 3.1 | 0.3 | 3.3 | 0.5 |
비교예 1 | X | 5 | 2.9 | 3.5 | 0.6 | 4.7 | 1.8 |
비교예 2 | O | X | 2.8 | 4.1 | 1.3 | 3.6 | 0.8 |
Claims (5)
- 제1항에 있어서, 상기 절연성 접착제 수지 100중량부에 대하여 상기 비도전성 필러의 함량은 1 내지 80 중량부이며, 상기 실리콘 중간체의 함량은 1 내지 20 중량부인 비도전성 접착제 조성물.
- 삭제
- 제1항에 있어서, 상기 전처리 공정은 진공 조건 및 100 내지 150℃에서, 30분 내지 2시간 동안 절연성 접착제 수지를 가열하여 수행되는 것인 비도전성 접착제 조성물.
- 제1항에 있어서, 상기 절연성 접착제 수지는 에폭시 수지, 변성 에폭시 수지, 스티렌 수지, 스티렌-부타디엔 수지, 우레탄 수지, 페놀 수지, 아미드계 수지, 아크릴레이트계 수지, 폴리이미드 수지, 폴리에테르이미드 수지, 에틸렌-비닐 수지, 아크릴로니트릴부타디엔 고무, 실리콘 수지, 아크릴계 수지 및 이들의 혼합물로 이루어진 군으로부터 선택되는 것인 비도전성 접착제 조성물.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020020082729A KR100938376B1 (ko) | 2002-12-23 | 2002-12-23 | 실리콘 중간체를 포함하는 플립 칩 본딩용 비도전성접착제 조성물 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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KR1020020082729A KR100938376B1 (ko) | 2002-12-23 | 2002-12-23 | 실리콘 중간체를 포함하는 플립 칩 본딩용 비도전성접착제 조성물 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20040056174A KR20040056174A (ko) | 2004-06-30 |
KR100938376B1 true KR100938376B1 (ko) | 2010-01-22 |
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Application Number | Title | Priority Date | Filing Date |
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KR1020020082729A KR100938376B1 (ko) | 2002-12-23 | 2002-12-23 | 실리콘 중간체를 포함하는 플립 칩 본딩용 비도전성접착제 조성물 |
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KR (1) | KR100938376B1 (ko) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI321975B (en) * | 2003-06-27 | 2010-03-11 | Ajinomoto Kk | Resin composition and adhesive film for multi-layered printed wiring board |
KR100601762B1 (ko) * | 2004-11-09 | 2006-07-19 | 삼성전자주식회사 | 비전도성 접착제를 사용하는 플립 칩 본딩 제조 방법 |
KR102471765B1 (ko) * | 2020-11-06 | 2022-11-28 | 제일 이엔에스 주식회사 | 고온·고압용 가스켓 절연 단열재 및 이의 제조 방법 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4905104A (en) | 1986-07-22 | 1990-02-27 | Hitachi, Ltd. | Rotary head type digital signal recording and/or reproducing apparatus for recording and/or reproducing with a variable speed |
US5756221A (en) | 1996-01-22 | 1998-05-26 | Kansai Paint Co., Ltd. | Coating method |
US5904791A (en) * | 1995-09-25 | 1999-05-18 | Dow Corning Corporation | Use of preceramic polymers as electronic adhesives |
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2002
- 2002-12-23 KR KR1020020082729A patent/KR100938376B1/ko active IP Right Grant
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4905104A (en) | 1986-07-22 | 1990-02-27 | Hitachi, Ltd. | Rotary head type digital signal recording and/or reproducing apparatus for recording and/or reproducing with a variable speed |
US5904791A (en) * | 1995-09-25 | 1999-05-18 | Dow Corning Corporation | Use of preceramic polymers as electronic adhesives |
US5756221A (en) | 1996-01-22 | 1998-05-26 | Kansai Paint Co., Ltd. | Coating method |
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KR20040056174A (ko) | 2004-06-30 |
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