KR100933593B1 - Wafer Support Structure of Wet Cleaner - Google Patents

Wafer Support Structure of Wet Cleaner Download PDF

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KR100933593B1
KR100933593B1 KR1020070131685A KR20070131685A KR100933593B1 KR 100933593 B1 KR100933593 B1 KR 100933593B1 KR 1020070131685 A KR1020070131685 A KR 1020070131685A KR 20070131685 A KR20070131685 A KR 20070131685A KR 100933593 B1 KR100933593 B1 KR 100933593B1
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wafer
support structure
wet cleaning
wafers
guide
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KR1020070131685A
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KR20090064115A (en
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김용재
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주식회사 동부하이텍
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67057—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68771—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by supporting more than one semiconductor substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

본 발명은 습식세정장치의 웨이퍼가이드에 배치방식으로 웨이퍼를 로딩하는 과정에서 웨이퍼의 파손을 방지할 수 있도록 한 습식세정장치의 웨이퍼 지지구조에 관한 것이다.The present invention relates to a wafer support structure of a wet cleaning apparatus, which can prevent breakage of the wafer in the process of loading the wafer in a batch manner into the wafer guide of the wet cleaning apparatus.

이를 실현하기 위한 본 발명은 내부에 세정액이 수용되는 배스와, 상비 배스 내부에 투입되는 복수의 웨이퍼를 지지고정할 수 있도록 슬롯을 구비하는 웨이퍼가이드와, 상기 웨이퍼가이드에 웨이퍼를 로딩/언로딩하는 웨이퍼척을 구비하는 웨이퍼이송수단을 포함하는 습식세정장치의 웨이퍼 지지구조에 있어서, 상기 슬롯은 수직상태로 로딩되는 복수의 웨이퍼를 지지고정할 수 있도록 수평방향으로 소정간격 이격되게 복수개 형성되되 상기 웨이퍼와의 접촉면적을 최소로 할 수 있도록 3점 지지방식으로 형성되고, 상기 슬롯 내부에는 웨이퍼와 접촉 시 발생하는 충격을 흡수할 수 있도록 완충부재가 구비되는 것을 특징으로 한다.The present invention for realizing this is a wafer guide having a bath to accommodate the cleaning solution therein, a wafer guide having a slot for fixing a plurality of wafers to be placed in the standing bath, and loading / unloading the wafer in the wafer guide In the wafer support structure of a wet cleaning apparatus including a wafer transfer means having a wafer chuck, a plurality of slots are formed at a predetermined interval in a horizontal direction so as to support and support a plurality of wafers loaded in a vertical state. It is formed in a three-point support method so as to minimize the contact area with the, characterized in that the buffer member is provided in the slot to absorb the shock generated when the contact with the wafer.

습식세정장치, 웨이퍼가이드, 석영, 슬롯, 테플론 Wet Cleaner, Wafer Guide, Quartz, Slotted, Teflon

Description

습식세정장치의 웨이퍼 지지구조{Wafer support structure for wet cleaning apparatus}Wafer support structure for wet cleaning apparatus

본 발명은 습식세정장치의 웨이퍼 지지구조에 관한 것으로, 보다 상세하게는 습식세정장치의 웨이퍼가이드에 웨이퍼를 로딩하는 과정에서 웨이퍼의 파손을 방지할 수 있도록 한 습식세정장치의 웨이퍼 지지구조에 관한 것이다.The present invention relates to a wafer support structure of a wet cleaning device, and more particularly, to a wafer support structure of a wet cleaning device to prevent breakage of a wafer during loading of a wafer into the wafer guide of the wet cleaning device. .

일반적으로, 반도체는 사진공정, 식각공정, 박막증착공정, 이온주입공정, 금속배선공정 등의 일련의 단위 공정들을 반복 수행함에 의해서 제조된다.In general, a semiconductor is manufactured by repeatedly performing a series of unit processes such as a photo process, an etching process, a thin film deposition process, an ion implantation process, and a metal wiring process.

반도체는 형성하고자 하는 패턴이 미세하므로 공정수행 중 발생하게 되는 불순물이나 각종 오염물 등으로 인하여 제품 수율(Yield)에 미치게 되는 영향력이 크다. 이러한 각종 불순물들은 공정수행 중에 발생하기도 하지만 웨이퍼의 이송 중에도 발생하게 되므로 전 공정에 걸쳐 웨이퍼를 청결하게 유지시키는 것이 대단히 중요하며, 이를 위해 구비되는 것이 웨이퍼 세정이다. Since semiconductors have a fine pattern to be formed, they have a great influence on the yield of products due to impurities or various contaminants generated during the process. Although these various impurities are generated during the process execution, but also occur during the transfer of the wafer, it is very important to keep the wafer clean throughout the entire process, and the wafer cleaning is provided for this purpose.

웨이퍼 세정은 각 단위 공정에 따라서 다양하게 수행되고 있고, 그에 필요한 설비 또한 다양하게 구비된다. Wafer cleaning is variously performed according to each unit process, and various equipments are also provided.

이중 습식세정은 로딩된 복수의 웨이퍼를 배치(Batch)방식으로 하여 소정의 케미컬 또는 순수(D.I water) 등의 세정액이 담긴 배스(Bath)에 담겨져 세정이 이루어지게 된다.The double wet cleaning is performed by placing a plurality of loaded wafers in a batch manner so as to be cleaned by being placed in a bath containing a cleaning liquid such as a predetermined chemical or D.I water.

도 1은 종래 습식세정장치의 웨이퍼 지지구조를 보여주는 구성도이다.1 is a block diagram showing a wafer support structure of a conventional wet cleaning apparatus.

도 1을 참조하면, 종래의 습식세정장치(10)는, 내부에 세정액이 수용되는 배스(11)와, 상기 배스(11) 내부에 복수의 웨이퍼(W)를 투입하여 세정공정을 수행할 수 있도록 상기 웨이퍼(W)를 지지고정하는 웨이퍼가이드(20)와, 상기 웨이퍼가이드(20)에 복수의 웨이퍼(W)를 배치방식으로 로딩/언로딩하는 웨이퍼척(31)을 구비한 웨이퍼이송수단(30)을 포함하여 구성된다.Referring to FIG. 1, the conventional wet cleaning apparatus 10 may perform a cleaning process by injecting a bath 11 into which a cleaning liquid is contained and a plurality of wafers W into the bath 11. A wafer transfer means having a wafer guide 20 for holding and holding the wafer W and a wafer chuck 31 for loading / unloading a plurality of wafers W in the wafer guide 20 in a batch manner ( 30).

상기 웨이퍼가이드(20)에는 로딩되는 웨이퍼(W)를 고정할 수 있도록 Y형상의 슬롯(21)이 소정간격 이격되게 복수개 형성된다. 이 경우 상기 웨이퍼가이드(200)는 고온상태의 케미컬에서도 내성이 강한 석영(Quartz)재질로 형성된다.A plurality of Y-shaped slots 21 are formed in the wafer guide 20 so as to fix the loaded wafers W at predetermined intervals. In this case, the wafer guide 200 is formed of a quartz material having strong resistance even in a high temperature chemical.

그러나 상기 석영재질의 웨이퍼가이드(20)는 높은 강도를 가지고 있어, 상기 웨이퍼이송수단(30)에 의해 웨이퍼(W)가 슬롯(21)에 접촉 시 발생하게 되는 충격에 의해 파손될 수 있는 문제점이 있었다.However, since the quartz wafer wafer 20 has a high strength, the wafer guide 20 may be damaged by the impact generated when the wafer W contacts the slot 21 by the wafer transfer means 30. .

본 발명은 상술한 문제점을 해결하고자 안출된 것으로, 습식세정장치의 웨이퍼가이드에 배치방식으로 웨이퍼를 로딩하는 과정에서 웨이퍼의 파손을 방지할 수 있도록 한 습식세정장치의 웨이퍼 지지구조를 제공하는데 그 목적이 있다.An object of the present invention is to provide a wafer support structure of a wet cleaning apparatus, which can prevent breakage of a wafer during a process of loading a wafer in a batch manner into a wafer guide of a wet cleaning apparatus. There is this.

상술한 바와 같은 목적을 구현하기 위한 본 발명의 습식세정장치의 웨이퍼 지지구조는, 내부에 세정액이 수용되는 배스와, 상비 배스 내부에 투입되는 복수의 웨이퍼를 지지고정할 수 있도록 슬롯을 구비하는 웨이퍼가이드와, 상기 웨이퍼가이드에 웨이퍼를 로딩/언로딩하는 웨이퍼척을 구비하는 웨이퍼이송수단을 포함하는 습식세정장치의 웨이퍼 지지구조에 있어서, 상기 슬롯은 수직상태로 로딩되는 복수의 웨이퍼를 지지고정할 수 있도록 수평방향으로 소정간격 이격되게 복수개 형성되되 상기 웨이퍼와의 접촉면적을 최소로 할 수 있도록 3점 지지방식으로 형성되고, 상기 슬롯 내부에는 웨이퍼와 접촉 시 발생하는 충격을 흡수할 수 있도록 완충부재가 구비되는 것을 특징으로 한다.The wafer support structure of the wet cleaning apparatus of the present invention for realizing the above object includes a wafer having a bath in which a cleaning liquid is housed therein and a slot for supporting and fixing a plurality of wafers introduced into the standing bath. A wafer support structure of a wet cleaning apparatus comprising a guide and a wafer transfer means having a wafer chuck for loading / unloading a wafer into the wafer guide, wherein the slot is configured to support and hold a plurality of wafers loaded vertically. It is formed in a plurality of spaced apart a predetermined interval in the horizontal direction so as to be formed in a three-point support method to minimize the contact area with the wafer, the buffer member to absorb the shock generated when the contact with the wafer inside the slot Characterized in that is provided.

이 경우 상기 완충부재는, 상기 웨이퍼가이드의 일측면에 형성되되 상기 슬롯 하부의 수평방향으로 형성된 복수의 삽입공에 각각 삽입결합되고, 상기 완충부재의 교체가 용이하도록 상기 삽입공에는 마감볼트가 체결되는 것을 특징으로 한다.In this case, the shock absorbing member is formed on one side of the wafer guide, each of which is coupled to a plurality of insertion holes formed in the horizontal direction of the lower portion of the slot, the closing bolt is fastened to the insertion hole to facilitate replacement of the shock absorbing member It is characterized by.

또한, 상기 완충부재는 원형의 긴 막대형상으로 형성되는 것을 특징으로 한 다.In addition, the buffer member is characterized in that it is formed in a circular long rod shape.

또한, 상기 완충부재는 테플론(Teflon)인 것을 특징으로 한다.In addition, the buffer member is characterized in that the Teflon (Teflon).

본 발명에 따른 습식세정장치의 웨이퍼 지지구조는, 웨이퍼가이드의 슬롯과 로딩되는 웨이퍼의 접촉면적을 최소로 할 수 있고, 상기 슬롯과 웨이퍼의 접촉 시 발생하는 충격을 흡수해줌으로써 웨이퍼의 파손을 방지할 수 있는 장점이 있다.The wafer support structure of the wet cleaning apparatus according to the present invention can minimize the contact area between the slot of the wafer guide and the loaded wafer, and prevent damage to the wafer by absorbing the impact generated when the slot and the wafer contact. There is an advantage to this.

이하 첨부한 도면을 참조하여 본 발명의 바람직한 실시예에 대한 구성 및 작용을 상세히 설명하면 다음과 같다.Hereinafter, the configuration and operation of the preferred embodiment of the present invention will be described in detail with reference to the accompanying drawings.

도 2는 본 발명에 따른 습식세정장치의 웨이퍼 지지구조를 보여주는 구성도이고, 도 3은 도 2의 A-A선 단면도이며, 도 4는 도 2의 'B' 부분 단면상세도이다.2 is a schematic view showing a wafer support structure of the wet cleaning apparatus according to the present invention, FIG. 3 is a cross-sectional view taken along the line A-A of FIG. 2, and FIG.

도 2 및 도 3을 참조하면, 본 발명은 내부에 세정액이 수용되는 배스(110)와, 상비 배스(110) 내부에 투입되는 복수의 웨이퍼(W)를 지지고정할 수 있도록 복수의 슬롯(210)을 구비하는 웨이퍼가이드(200)와, 상기 웨이퍼가이드(200)에 웨이퍼(W)를 로딩/언로딩하는 웨이퍼척(310)을 구비하는 웨이퍼이송수단(300)의 구성은 종래의 기술과 동일하므로 설명의 중복을 피하기 위하여 상세한 설명은 생략하고, 새로이 부가되는 구성 부재들의 동작을 중심으로 하여 상세히 설명한다.2 and 3, the present invention provides a plurality of slots 210 to support and fix a bath 110 in which a cleaning liquid is contained therein, and a plurality of wafers W inserted into the standing bath 110. The configuration of the wafer transfer means 300 having a wafer guide (200) having a) and a wafer chuck (310) for loading / unloading the wafer (W) in the wafer guide (200) are the same as in the prior art. Therefore, detailed description will be omitted in order to avoid duplication of description, and will be described in detail with reference to the operation of newly added constituent members.

상기 웨이퍼이송수단(300)에 의해 복수의 웨이퍼(W)가 슬롯(210)에 로딩되는 과정에서, 상기 웨이퍼(W)와 슬롯(210)의 접촉 시 발생하는 충격에 의해 웨이퍼(W)가 파손되는 것을 방지해줄 수 있는 구조가 마련되어야 한다.In the process of loading the plurality of wafers W into the slot 210 by the wafer transfer means 300, the wafer W is broken by an impact generated when the wafer W contacts the slot 210. A structure should be provided to prevent this.

이를 구현하기 위한 본 발명은 웨이퍼(W)가 수직상태로 로딩될 수 있도록 웨이퍼가이드(200)의 상면에 수평방향으로 소정간격 이격되게 복수의 슬롯(210)이 형성되되, 상기 슬롯(210)은 웨이퍼(W)와의 접촉면적을 최소로 하여 접촉 시 발생하게 되는 충격을 줄여줄 수 있도록 3점 지지방식으로 형성된다.According to the present invention for implementing this, a plurality of slots 210 are formed on the upper surface of the wafer guide 200 so as to be spaced apart at a predetermined interval in a horizontal direction so that the wafer W can be loaded in a vertical state. The contact area with the wafer W is minimized so as to reduce the impact generated during contact.

즉, 상기 슬롯(210)을 로딩되는 웨이퍼(W)의 좌, 우측과 하부중심 이렇게 세 부분만을 지지하도록 형성시킴으로써, 상기 웨이퍼(W)와의 접촉면적을 최소화함과 동시에 상기 웨이퍼(W)를 견고하게 고정할 수 있게 된다.That is, the slot 210 is formed to support only three portions such as the left, right, and bottom centers of the wafer W to be loaded, thereby minimizing the contact area with the wafer W and firmly fixing the wafer W. Can be fixed.

또한, 상기 슬롯(210)의 내부에는 로딩되는 웨이퍼(W)와의 접촉시 발생하는 충격을 흡수하여 웨이퍼(W)의 파손을 방지할 수 있도록 완충부재(250)가 구비된다.In addition, a buffer member 250 is provided in the slot 210 to absorb a shock generated when the wafer 210 contacts the loaded wafer W, thereby preventing the wafer W from being damaged.

일례로, 상기 웨이퍼가이드(200)의 일측면에는 3점 지지방식으로 형성된 슬롯(210)의 하부 수평방향으로 삽입공(230)이 각각 형성되고, 상기 삽입공(230)에는 원형의 긴 막대형상으로 형성된 완충부재(250)가 각각 삽입결합된다.For example, insertion holes 230 are formed in one side surface of the wafer guide 200 in the horizontal direction below the slot 210 formed in a three-point support method, and the insertion hole 230 has a circular long rod shape. The shock absorbing members 250 are inserted into the coupling.

이 경우 도 4에 도시된 바와 같이, 상기 삽입공(230)에 복수의 완충부재(250)가 삽입된 완충부재(250)는 슬롯(210)의 내부 바닥면에 위치하게 되어 삽입되는 웨이퍼(W)의 충격을 흡수할 수 있게 된다.In this case, as shown in Figure 4, the buffer member 250 is a plurality of buffer member 250 is inserted into the insertion hole 230 is located on the inner bottom surface of the slot 210 is inserted into the wafer (W) The shock of) can be absorbed.

또한, 상기 완충부재(250)가 삽입공(230)에 삽입결합된 후, 상기 삽입공(230)의 입구에는 완충부재(250)의 이탈방지 또는 교체가 용이할 수 있도록 마감볼트(270)가 체결된다.In addition, after the shock absorbing member 250 is inserted into the insertion hole 230, a closing bolt 270 is provided at the inlet of the insertion hole 230 to facilitate the prevention or replacement of the shock absorbing member 250. Is fastened.

따라서, 상기 완충부재(250)의 장기사용으로 인해 마모가 되어 교체가 필요한 경우, 상기 체결된 마감볼트(270)를 풀어낸 다음 완충부재(250)를 빼내고 새로 운 완충부재(250)로 용이하게 교체할 수 있게 된다.Therefore, when replacement is necessary due to wear due to the long-term use of the shock absorbing member 250, the fastened closing bolt 270 is released and then the shock absorbing member 250 is removed and the new shock absorbing member 250 is easily removed. It can be replaced.

한편, 상기 완충부재(250)는 테플론(Teflon)으로 형성되는 것이 바람직하다. 상기 테클론은 플라스틱 계통의 합성수지로, 산과 고온에 강한 장점을 가지고 있다.On the other hand, the buffer member 250 is preferably formed of Teflon (Teflon). The Teklon is a plastic-based synthetic resin, has a strong advantage against acids and high temperatures.

이와 같은 구성의 본 발명에 따른 습식세정장치의 웨이퍼 지지구조의 작용을 다시 도 3 및 도 4를 참조하여 설명하면 다음과 같다.The operation of the wafer support structure of the wet cleaning apparatus according to the present invention having such a configuration will be described with reference to FIGS. 3 and 4 as follows.

먼저, 웨이퍼이송수단(300)에 의해 복수의 웨이퍼(W)가 배치방식으로 웨이퍼가이드(200)의 슬롯(210)에 로딩되는 과정에서, 상기 3점 지지방식으로 형성된 슬롯(210)에 로딩되는 웨이퍼(W)는 접촉면적이 작아 발생하는 충격이 최소화된다. First, in the process of loading the plurality of wafers W into the slots 210 of the wafer guide 200 in a batch manner by the wafer transfer means 300, the wafers 210 are loaded into the slots 210 formed by the three-point support method. The wafer W has a small contact area, thereby minimizing impact.

아울러, 상기 슬롯(210)의 내부 바닥면에는 충격을 흡수하는 완충부재(250)가 구비되어 있어, 상기 웨이퍼(W)가 슬롯(210)에 접촉 시 발생하게 되는 충격을 흡수해주게 됨으로써 웨이퍼(W)의 파손을 방지할 수 있게 된다.In addition, the inner bottom surface of the slot 210 is provided with a shock absorbing member 250 to absorb the shock, the wafer (W) is to absorb the shock generated when the contact with the slot 210, the wafer (W) ) Can be prevented from being damaged.

이상에서는 본 발명을 특정의 바람직한 실시 예를 들어 도시하고 설명하였으나, 본 발명은 상기한 실시 예에 한정되지 않으며 본 발명의 기술사상을 벗어나지 않는 범위 내에서 당해 발명이 속하는 기술 분야에서 통상의 지식을 가진 자에 의해 다양한 변경과 수정이 가능함은 물론이다.Although the present invention has been shown and described with reference to certain preferred embodiments, the present invention is not limited to the above-described embodiments, and the general knowledge in the technical field to which the present invention pertains falls within the scope of the technical spirit of the present invention. Of course, various changes and modifications are possible.

도 1은 종래 습식세정장치의 웨이퍼 지지구조를 보여주는 구성도,1 is a block diagram showing a wafer support structure of a conventional wet cleaning device;

도 2는 본 발명에 따른 습식세정장치의 웨이퍼 지지구조를 보여주는 구성도,2 is a block diagram showing a wafer support structure of the wet cleaning apparatus according to the present invention;

도 3은 도 2의 A-A선 단면도,3 is a cross-sectional view taken along the line A-A of FIG.

도 4는 도 2의 'B' 부분 단면상세도이다.4 is a partial cross-sectional detail view of the portion 'B' of FIG. 2.

<도면의 주요부분에 대한 부호의 설명><Description of the symbols for the main parts of the drawings>

100 : 습식세정장치 110 : 베스(Bath)100: wet cleaning device 110: bath (Bath)

200 : 웨이퍼가이드 210 : 슬롯200: wafer guide 210: slot

230 : 삽입공 250 : 완충부재230: insertion hole 250: buffer member

270 : 마감볼트 300 : 웨이퍼이송수단270: finishing bolt 300: wafer transfer means

310 : 웨이퍼척310: wafer chuck

Claims (4)

내부에 세정액이 수용되는 배스와, 상비 배스 내부에 투입되는 복수의 웨이퍼를 지지고정할 수 있도록 슬롯을 구비하는 웨이퍼가이드와, 상기 웨이퍼가이드에 웨이퍼를 로딩/언로딩하는 웨이퍼척을 구비하는 웨이퍼이송수단을 포함하는 습식세정장치의 웨이퍼 지지구조에 있어서,A wafer transfer having a bath containing a cleaning liquid therein, a wafer guide having a slot for holding and fixing a plurality of wafers inserted into the standing bath, and a wafer chuck for loading / unloading wafers into the wafer guide. In the wafer support structure of a wet cleaning device comprising a means, 상기 슬롯은 수직상태로 로딩되는 복수의 웨이퍼를 지지고정할 수 있도록 수평방향으로 소정간격 이격되게 복수개 형성되되 상기 웨이퍼와의 접촉면적을 최소로 할 수 있도록 3점 지지방식으로 형성되고, 상기 슬롯 내부에는 웨이퍼와 접촉시 발생하는 충격을 흡수할 수 있도록 상기 슬롯의 하부 수평방향으로 각각 형성되는 삽입공에 테플론(Teflon) 재질의 완충부재가 삽입결합된 것을 특징으로 하는 습식세정장치의 웨이퍼 지지구조.The slots are formed in a plurality of slots so as to support a plurality of wafers loaded in a vertical state at predetermined intervals in a horizontal direction, and are formed in a three-point support method to minimize the contact area with the wafers. And a buffer member of Teflon material is inserted and inserted into insertion holes respectively formed in the lower horizontal direction of the slot to absorb shock generated when the wafer contacts the wafer. 제 1항에 있어서,The method of claim 1, 상기 삽입공의 입구에는 상기 삽입결합된 완충부재의 교체가 용이하도록 마감볼트가 체결되는 것을 특징으로 하는 습식세정장치의 웨이퍼 지지구조.The inlet of the insertion hole is a wafer support structure of the wet cleaning device, characterized in that the closing bolt is fastened to facilitate replacement of the inserted shock absorbing member. 제 1항 또는 제 2항에 있어서,The method according to claim 1 or 2, 상기 완충부재는 원형의 긴 막대형상으로 형성되는 것을 특징으로 하는 습식세정장치의 웨이퍼 지지구조.The buffer member is a wafer support structure of the wet cleaning device, characterized in that formed in the shape of a long circular rod. 삭제delete
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