KR100904683B1 - Cooler module - Google Patents
Cooler module Download PDFInfo
- Publication number
- KR100904683B1 KR100904683B1 KR1020080072874A KR20080072874A KR100904683B1 KR 100904683 B1 KR100904683 B1 KR 100904683B1 KR 1020080072874 A KR1020080072874 A KR 1020080072874A KR 20080072874 A KR20080072874 A KR 20080072874A KR 100904683 B1 KR100904683 B1 KR 100904683B1
- Authority
- KR
- South Korea
- Prior art keywords
- heat
- base block
- heat sink
- cooler module
- bottom opening
- Prior art date
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3677—Wire-like or pin-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3736—Metallic materials
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- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
Description
The present invention relates to a cooler module for cooling an electronic chip. More specifically, the horizontal cooler module, the cooler module has a flat wall portion of the heat pipe that is exposed to the outside of the base block to be in direct contact with the heat source for rapid heat dissipation of the heat energy from the heat source to fit It is composed of joined members.
Heat pipes are widely used in cooler modules for cooling semiconductor chips and the like. In addition to the heat pipes, conventional cooler modules include a heat sink and a base block formed of a plurality of heat sink fins. The heat dissipation fin is made by extrusion molding of aluminum or copper. The heat tubes are sealed metal tubes filled with a working fluid. The base block is a block of aluminum or copper. Since the heat tubes and the base block of this type of cooler module are made of different materials, nickel plating technology is required to connect the heat tubes and the base block by tin-lead alloy soldering or thermal bonding. The manufacturing and assembly process of such cooler module is complicated, resulting in low production rate and high manufacturing cost. Soldering between the base block and the heat pipes reduces the heat transfer efficiency of the cooler module relatively. In addition, environmental pollution can occur during the soldering of the heat pipes to the base block.
In use, the base block (aluminum base block or copper base block) absorbs the heat energy from the electronic chip, transfers the absorbed heat energy to the heat pipe, and then transfers it to the heat sink for additional heat dissipation. It is placed in contact with the face. Since heat energy is indirectly transferred to the heat pipe and heat sink, the heat dissipation efficiency of this type of cooler module is low.
In order to solve the above problems, the heat sink, heat pipe, and base block are combined by fitting, not by soldering or thermal bonding, to simplify the assembly process and reduce environmental pollution. Direct contact with the heat source is to enhance the heat transfer efficiency and heat dissipation effect.
According to one aspect of the invention, the horizontal cooler module includes a plurality of heat sink fins, a plurality of heat pipes, and the base block. The constituent members of the cooler module have a perfect structure. Each of the heat tubes has a flat wall portion exposed to the outside of the base block for direct contact with the electronic chip to transfer heat energy directly from the electronic chip to the heat sink for rapid heat dissipation.
According to another aspect of the present invention, the coupling of the constituent members of the cooler module is increased by thermal expansion, thereby providing excellent thermal conductivity and excellent heat dissipation. Since the horizontal cooler module does not require tin-lead alloy soldering or nickel plating, the manufacturing method of the present invention does not cause any environmental pollution due to tin-lead alloy soldering or nickel plating. Therefore, the manufacturing method of the present invention is well suited to environmental protection as compared to the manufacturing method of the conventional cooler module.
According to yet another aspect of the present invention, the base block includes a plurality of bottom opening grooves each receiving the heat pipe, and a plurality of clamping ribs protruding from the bottom wall and extending along both walls of the bottom opening grooves. rib). After the heat pipes are inserted into the bottom open grooves of the base block, the clam flanges may be fixed in such a way that the heat pipes are held in engagement with the bottom open grooves, and may be laterally pressed to tighten the heat pipes.
The present invention is a flat wall portion formed in the heat pipe can directly and heat transfer heat energy to the heat sink can be quickly and effectively, the heat expansion is more efficient because the coupling force of the component is possible, the efficient heat transfer, by fitting the coupling of the component It is effective in simplifying the assembly process, lowering production costs, and reducing environmental pollution since there is no process such as soldering.
1 to 5, the horizontal cooler module of the present invention is shown to include a plurality of
The
Both side ends of the
The
The
The
Since the members of the cooler module of the present invention are firmly fitted to each other, they are firmly fixed without vibration between the members, and the production cost is reduced because the manufacture of the cooler module is easy and fast. Since the
The
The specimen of the horizontal cooler module is constructed in accordance with the features shown in Figs. 1-7, and the cooler module works smoothly to provide all the features described above.
Although described in detail for the purpose of specific implementation in the specific content for the practice of the invention, various modifications and improvements can be made without departing from the spirit and equivalents of the present invention. Therefore, the scope of the present invention should not be limitedly interpreted only by the claims.
1 is a plan perspective view of a horizontal structure cooler module according to the present invention.
Figure 2 is an exploded view of the heat pipe and the base block of the horizontal structure cooler module according to the present invention.
3 is a perspective view of a base block according to the present invention;
4 is an enlarged partial view of a base block according to the present invention;
5 is an exploded view of a horizontal structure cooler module according to the present invention.
Figure 6 is a bottom perspective view of a horizontal structure cooler module according to the present invention.
7 is a front view of a horizontal structure cooler module according to the present invention.
8 is a rear view of the horizontal structure cooler module according to the present invention.
[Description of Symbols for Main Parts of Drawing]
1: heat radiation fin 2: heat pipe
3: base block 10: heat sink
11: through groove 12: notch
21: first extension branch 22: second extension branch
23: flat wall portion 31: the upper wall
32: floor opening groove 33: clamping rib (clamping rib)
34: guide portion 321: heat pipe fixing jaw
331: cutting surface
Claims (6)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020080072874A KR100904683B1 (en) | 2008-07-25 | 2008-07-25 | Cooler module |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020080072874A KR100904683B1 (en) | 2008-07-25 | 2008-07-25 | Cooler module |
Publications (1)
Publication Number | Publication Date |
---|---|
KR100904683B1 true KR100904683B1 (en) | 2009-06-25 |
Family
ID=40983175
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020080072874A KR100904683B1 (en) | 2008-07-25 | 2008-07-25 | Cooler module |
Country Status (1)
Country | Link |
---|---|
KR (1) | KR100904683B1 (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104869794A (en) * | 2015-06-22 | 2015-08-26 | 东莞市澍华五金制品有限公司 | Integrated heat-pipe heat dissipating device |
CN114287871A (en) * | 2022-03-09 | 2022-04-08 | 杭州康基医疗器械有限公司 | Medical endoscope fluorescence cold light source camera system with high-efficient heat radiation structure |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20060011329A1 (en) * | 2004-07-16 | 2006-01-19 | Jack Wang | Heat pipe heat sink with holeless fin module |
-
2008
- 2008-07-25 KR KR1020080072874A patent/KR100904683B1/en not_active IP Right Cessation
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20060011329A1 (en) * | 2004-07-16 | 2006-01-19 | Jack Wang | Heat pipe heat sink with holeless fin module |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104869794A (en) * | 2015-06-22 | 2015-08-26 | 东莞市澍华五金制品有限公司 | Integrated heat-pipe heat dissipating device |
CN114287871A (en) * | 2022-03-09 | 2022-04-08 | 杭州康基医疗器械有限公司 | Medical endoscope fluorescence cold light source camera system with high-efficient heat radiation structure |
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E902 | Notification of reason for refusal | ||
AMND | Amendment | ||
E601 | Decision to refuse application | ||
J201 | Request for trial against refusal decision | ||
AMND | Amendment | ||
B701 | Decision to grant | ||
GRNT | Written decision to grant | ||
FPAY | Annual fee payment |
Payment date: 20130619 Year of fee payment: 5 |
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FPAY | Annual fee payment |
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FPAY | Annual fee payment |
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