KR100881061B1 - Method for electroplating with magnesium alloy a plate - Google Patents

Method for electroplating with magnesium alloy a plate Download PDF

Info

Publication number
KR100881061B1
KR100881061B1 KR1020070059807A KR20070059807A KR100881061B1 KR 100881061 B1 KR100881061 B1 KR 100881061B1 KR 1020070059807 A KR1020070059807 A KR 1020070059807A KR 20070059807 A KR20070059807 A KR 20070059807A KR 100881061 B1 KR100881061 B1 KR 100881061B1
Authority
KR
South Korea
Prior art keywords
magnesium alloy
acid
minutes
solution
alloy sheet
Prior art date
Application number
KR1020070059807A
Other languages
Korean (ko)
Other versions
KR20080111628A (en
Inventor
한용순
Original Assignee
한용순
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 한용순 filed Critical 한용순
Priority to KR1020070059807A priority Critical patent/KR100881061B1/en
Publication of KR20080111628A publication Critical patent/KR20080111628A/en
Application granted granted Critical
Publication of KR100881061B1 publication Critical patent/KR100881061B1/en

Links

Images

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10—Electroplating with more than one layer of the same or of different metals
    • C25D5/12—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
    • C25D5/14—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium two or more layers being of nickel or chromium, e.g. duplex or triplex layers
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/54—Contact plating, i.e. electroless electrochemical plating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • C23C28/02—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material
    • C23C28/023—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material only coatings of metal elements only
    • C23C28/025—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material only coatings of metal elements only with at least one zinc-based layer
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/04—Electroplating: Baths therefor from solutions of chromium
    • C25D3/06—Electroplating: Baths therefor from solutions of chromium from solutions of trivalent chromium
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/12—Electroplating: Baths therefor from solutions of nickel or cobalt
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • C25D3/40—Electroplating: Baths therefor from solutions of copper from cyanide baths, e.g. with Cu+
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/34—Pretreatment of metallic surfaces to be electroplated
    • C25D5/42—Pretreatment of metallic surfaces to be electroplated of light metals
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/627—Electroplating characterised by the visual appearance of the layers, e.g. colour, brightness or mat appearance
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
    • C25F1/00—Electrolytic cleaning, degreasing, pickling or descaling
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electrochemistry (AREA)
  • Mechanical Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Electroplating Methods And Accessories (AREA)

Abstract

본본 발명은 알루미늄과 망간, 아연, 철 및 구리 등이 함유되어 내구성이 강화된 마그네슘합금판재에 청화동, 유산동, 니켈, 3가크롬을 도금하는 도금방법에 관한 것으로서, 안경테와 휴대폰 및 노트북 케이스로 제작 사용함으로써 발생하는 전자파를 차단하고, 염분이 포함된 사람의 땀에 의해 마그네슘합금이 부식되지 않고, 휴대폰 및 노트북에서 발생하는 열에 의해 마그네슘합금이 발화되지 않음과 동시에 외관이 미려한 특징이 있다.The present invention relates to a plating method for plating blue, copper, lactic acid copper, nickel, trivalent chromium on a magnesium alloy sheet containing aluminum, manganese, zinc, iron, copper, etc., and having enhanced durability. It is characterized by blocking electromagnetic waves generated by using and manufacturing, magnesium alloy is not corroded by human sweat containing salt, magnesium alloy is not ignited by heat generated from mobile phones and laptops, and the appearance is beautiful.

본 발명의 대략적인 공정을 살펴보면, 세척액 속에 5 내지 7분간 침지하여 마그네슘합금판재 표면을 세척하는 제1공정과; 제1공정을 거친 마그네슘합금판재를 탄산염, 수산화나트륨, 인산염, 계면활성제, 가성소다, 청화소다로 혼합된 전해탈지액 속에 90 내지 150초간 침지하여 4.5 내지 5V로 전해탈지시켜 마그네슘합금판재 표면의 이물질을 제거하는 제2공정과; 제2공정을 거친 마그네슘합금판재를 황산, 질산, 불산, 인히비터, 산성탈지제, 슬파민산 산성불화암모늄로 혼합된 산성액 속에 5 내지 8초간 침지하여 산화시키는 제3공정과; 상기 제3공정을 거친 마그네슘합금 판재를 수산화나트륨용액에 구루코산나트륨 첨가된 70 내지 80℃의 엣칭액 속에 4 내지 6분간 침지하여 부착생성물질을 제거시키는 제4공정과; 제4공정을 거친 마그네슘합금판재를 70 내지 80℃의 무기산염, 무기아연염, 키래이트제, 불소화합물, 불화 칼륨으로 구성된 아연치환액 속에 2 내지 4분간 침지하여 아연치환시키는 제5공정과; 제5공정을 거친 마그네슘합금판재를 55 내지 60℃의 청화동, 유리청화소다, 탄산소다로 혼합된 청화동전해탈도금액 속에 침지하여 1.5 내지 3.5V로 20 내지 25분간 전해도금시키는 제6공정과; 제6공정을 거친 마그네슘합금판재를 25 내지 30℃의 유산동과 황산으로 혼합된 유산동 전해도금액 속에 침지하여 2 내지 4V로 10 내지 20분간 전해도금시키는 제7공정과; 제7공정을 거친 마그네슘합금판재를 55 내지 60℃의 유산니켈, 염화니켈, 붕산으로 혼합된 니켈 전해도금액 속에 침지하여 2.5 내지 4.5V로 12 내지 15분간 전해도금시키는 제8공정과; 제8공정을 거친 마그네슘합금판재를 55 내지 60℃의 envirochrome salt, envirochrome part 1, envirochrome initial, envirochrome wetter로 구성된 3가크롬전해도금액 속에 6 내지 10V로 10 내지 13분간 전해도금시키는 제9공정으로 그 대략적인 공정이 이루어진다.Looking at the general process of the present invention, the first step of washing the surface of the magnesium alloy plate material by immersing in the washing solution for 5 to 7 minutes; Magnesium alloy sheet material after the first step is immersed in the electrolytic degreasing solution mixed with carbonate, sodium hydroxide, phosphate, surfactant, caustic soda and blue soda for 90 to 150 seconds, and electrolytically degreased at 4.5 to 5V to remove foreign substances on the surface of the magnesium alloy sheet. A second step of removing; A third step of oxidizing the magnesium alloy plate material subjected to the second step by immersing for 5 to 8 seconds in an acid solution mixed with sulfuric acid, nitric acid, hydrofluoric acid, inhibitor, acidic degreaser, and ammonium sulfamic acid ammonium fluoride; A fourth step of immersing the magnesium alloy sheet material subjected to the third step in an etching solution at 70 to 80 ° C. in which sodium gurucoate is added to sodium hydroxide solution for 4 to 6 minutes to remove adhesion products; A fifth step of immersing the zinc alloy sheet material having undergone the fourth step in a zinc replacement solution composed of an inorganic acid salt, an inorganic zinc salt, a chelating agent, a fluorine compound, and potassium fluoride at 70 to 80 ° C. for 2 to 4 minutes to replace the zinc; A sixth step of immersing the magnesium alloy sheet having undergone the fifth step in a clarified copper electrolytic desalting solution mixed with 55 to 60 ° C of blue, blue and blue carbonic acid, and sodium carbonate and electroplating for 20 to 25 minutes at 1.5 to 3.5V; ; A seventh step of immersing the magnesium alloy plate material subjected to the sixth step in an electrolytic plating solution mixed with copper lactate and sulfuric acid at 25 to 30 ° C. for 10 to 20 minutes at 2 to 4 V; An eighth step of immersing the magnesium alloy sheet material subjected to the seventh step in a nickel electrolytic plating solution mixed with nickel lactate, nickel chloride, and boric acid at 55 to 60 ° C. for 12 to 15 minutes at 2.5 to 4.5 V; The ninth step of electroplating the magnesium alloy plate material, which has undergone the eighth step, in a trivalent chromium electrolytic solution consisting of envirochrome salt, envirochrome part 1, envirochrome initial, and envirochrome wetter at 55 to 60 ° C. at 6 to 10 V for 10 to 13 minutes. The approximate process is done.

상기와 같이 구성된 마그네슘합금판재의 도금방법으로 형성된 마그네슘합금판재는 청화동도금층 및 유산동도금층에 의해 휴대폰 및 노트북에서 발생하는 전자파를 용이하게 차단하여 사용자의 건강을 유지할 수 있는 효과가 있으며, 니켈도금층에 의해 사용자의 피부와 접촉하여 사용되는 안경 및 휴대폰 등에 염분을 포함한 사람의 땀으로 부식되지 않는 효과가 있고, 3가크롬도금층에 의해 휴대폰 및 노트북 등에서 발생하는 열에 의해 발화 및 폭발하지 않는 효과가 있음과 동시에 녹이 슬지않으며 광택에 의한 아름다운 제품의 표면을 유지할 수 있는 효과가 있다.Magnesium alloy plate formed by the plating method of the magnesium alloy plate material configured as described above has the effect of easily blocking the electromagnetic waves generated in the mobile phone and notebook by the cyanide copper plating layer and lactic acid copper plating layer to maintain the health of the user, the nickel plating layer It has the effect of not being corroded by human sweat including salinity such as glasses and mobile phones used in contact with the user's skin, and by the trivalent chromium plating layer, it does not ignite and explode by heat generated from mobile phones and laptops. At the same time, it does not rust and has the effect of maintaining the surface of beautiful products due to gloss.

마그네슘합금, 마그네슘판재, 도금, 3가크롬, 전해도금 Magnesium alloy, magnesium plate, plating, trivalent chromium, electroplating

Description

마그네슘합금판재의 도금방법 {METHOD FOR ELECTROPLATING WITH MAGNESIUM ALLOY A PLATE}Plating method of magnesium alloy sheet {METHOD FOR ELECTROPLATING WITH MAGNESIUM ALLOY A PLATE}

도 1은 마그네슘 합금의 도금 층을 도시한 단면도.1 is a cross-sectional view showing a plating layer of magnesium alloy.

[도면의 주요부호에 대한 설명][Description of Major Symbols in Drawing]

10 : 마그네슘합금판재 20 : 청화동도금층10: magnesium alloy plate 20: cyanide copper plating layer

30 : 유산동도금층 40 : 니켈도금층30: lactic acid copper plating layer 40: nickel plating layer

50 : 3가크롬도금층50: trivalent chromium plating layer

본 발명은 알루미늄과 망간, 아연, 철 및 구리 등이 함유되어 내구성이 강화된 마그네슘합금판재에 청화동, 유산동, 니켈, 3가크롬을 도금하는 도금방법에 관한 것으로서, 마그네슘합금판재의 표면을 세척 및 아연치환하여 청화동 및 유산동, 니켈, 3가크롬을 마그네슘합금판재의 표면에 순차적으로 도금 층을 형성한 마그네 슘판재를 안경테와 휴대폰 및 노트북 케이스로 제작 사용함으로써 발생하는 전자파를 차단하고, 염분이 포함된 사람의 땀에 의해 마그네슘합금이 부식되지 않고, 휴대폰 및 노트북에서 발생하는 열에 의해 마그네슘합금이 발화되지 않음과 동시에 외관이 미려한 마그네슘합금판재를 제공하기 위한 마그네슘합금판재의 도금방법에 관한 것이다.The present invention relates to a plating method for plating cyanide copper, copper lactate, nickel, trivalent chromium on a magnesium alloy sheet containing aluminum, manganese, zinc, iron, copper, etc. and having enhanced durability, and cleaning the surface of the magnesium alloy sheet. And zinc-substituted magnesium plate material, which has a plating layer sequentially formed on the surface of magnesium alloy plate material of cyanide copper, copper lactate, nickel, and trivalent chromium, to block the electromagnetic waves generated by using glasses frames, mobile phones, and laptop cases. The magnesium alloy is not corroded by the sweat of the person included, and the magnesium alloy is not ignited by heat generated from a mobile phone or a notebook, and at the same time, the magnesium alloy plate is provided for providing a magnesium alloy plate with a beautiful appearance. .

일반적으로 마그네슘합금판재는 일반적으로 비중이 1.74로 실용 금속 중 비중이 가장 작아 무게가 가장 작고 그 강도가 높음에 비해 고온에서 발화하기 쉬우며, 염분이 포함된 물에 접촉할 경우 강한 침식이 발생하여 부식되는 문제가 있는 마그네슘에 알루미늄과 망간, 아연, 규소, 베릴륨, 철, 니켈 및 구리 등을 혼합한 것으로, 비강도(인장 강도/비중)가 큰 경합금 재료로 가장 큰 이점이 있고, 주물로서의 인장 강도, 연신율, 충격값 등이 알루미늄 합금과 비슷할 뿐만 아니라, 절삭성이 좋아 부품의 경량화와 가공비의 절감에 큰 효과가 있는 금속이다.In general, magnesium alloy sheet material has a specific gravity of 1.74, which is the smallest specific gravity among practical metals, so it is easy to ignite at high temperature compared with the smallest weight and high strength, and strong erosion occurs when contacted with salt-containing water. It is a mixture of aluminum, manganese, zinc, silicon, beryllium, iron, nickel and copper, which has a problem of corrosion, and has the greatest advantage as a light alloy material having a large specific strength (tensile strength / specific gravity), and it is a tensile as a casting. Not only is the strength, elongation and impact value similar to that of aluminum alloy, but also the cutting property is good for weight reduction of parts and reduction of processing cost.

특히, 최소의 무게로 일정강도를 가진 장점으로 안경테와 휴대폰 케이스 및 노트북 케이스 용으로 주목받고 있다.In particular, it has attracted attention for eyeglass frames, mobile phone cases and notebook cases as an advantage of having a certain strength with a minimum weight.

하지만, 상기 마그네슘이 가지는 단점을 보완하기 위해 마그네슘합금판재의 표면에 고가의 제작비용이 드는 비전해 니켈도금법을 사용하여 내식성 및 내마모성이 강한 니켈도금층을 형성하여, 염분이 포함된 사람의 땀과 마그네슘합금판재가 접촉되어 마그네슘합금판재가 부식되는 문제를 해결하고 있으나, 상기 비전해 도금 법에 사용되는 비전해 니켈도금액의 생산단가가 고가임을 감안하면, 안경테와 휴대폰 케이스 및 노트북 케이스 용으로 니켈도금 층이 형성된 마그네슘합금판재를 대량생산하기에 적합하지 않은 문제점이 있다.However, to compensate for the drawbacks of magnesium, a nickel plating layer having a high corrosion resistance and abrasion resistance is formed on the surface of the magnesium alloy sheet by using an electroless nickel plating method, which is expensive, and sweat and magnesium of humans containing salt Although the alloy plate is in contact with each other, the magnesium alloy plate is corroded. However, considering the high production cost of the non-electrolytic nickel plating solution used in the non-electrolytic plating method, nickel plating is used for eyeglass frames, mobile phone cases, and notebook cases. There is a problem that is not suitable for mass production of the layered magnesium alloy sheet material.

특히, 산과 염분이 포함된 물에 강하게 부식하는 마그네슘의 특성상 상기 니켈도금층을 형성하기 위해서는 생산단가가 고가인 니켈도금법 만으로 도금층을 형성 할 수밖에 없으며, 전자파가 발생하는 노트북 및 휴대폰 등의 전자기기에 사용될 경우 전자파를 차단하는 동을 마그네슘합금판재에 형성할 수 없는 문제점이 있다.In particular, in order to form the nickel plated layer due to the characteristic of magnesium, which is strongly corroded to water containing acid and salt, the plated layer must be formed only by the nickel plating method, which is expensive in production, and used for electronic devices such as notebooks and mobile phones that generate electromagnetic waves. In this case, there is a problem that copper, which blocks electromagnetic waves, cannot be formed on a magnesium alloy sheet material.

또한, 내식성과 녹이 슬지않고 아름다운 광택표면을 유지하는 크롬은 현재 RoHS의 6대 환경 규제에 속하는 6가크롬을 사용하고 있는 실정이어서, 마그네슘합금판재를 사람의 피부와 직접적으로 접촉되는 안경테와 휴대폰 케이스 및 노트북 케이스용으로 제작하여 내식성과 광택표면을 유지되는 효과를 위해 RoHS의 규제에 속하는 6가크롬을 사용하기에는 적합하지 않은 문제가 있고, 산과 접촉하여 강하게 부식되는 마그네슘합금판재에 전자파를 차단하는 동을 습식전해도금을 할 수 없는 문제점이 있다.In addition, chromium, which maintains a beautiful glossy surface without corrosion and rust, is currently using hexavalent chromium, which is in compliance with the six major environmental regulations of RoHS. Therefore, the spectacle frame and the cell phone case of magnesium alloy plate are in direct contact with human skin. And it is not suitable to use hexavalent chromium, which belongs to the RoHS regulation for the effect of maintaining the corrosion resistance and gloss surface because it is manufactured for laptop case. There is a problem that can not be wet electroplating.

이에 본 발명은 마그네슘합금판재의 표면에 전자파를 차단하는 청화동, 유산 동도금층과, 생산비용이 저렴하고 내식성이 강한 니켈도금층과, 크롬 중 RoHS의 규제에 속하지 않으며 내식성과 내열성 및 외관이 미려한 3가크롬을 도금 비용이 현저히 낮은 습식전해도금액을 사용한 습식전해도금법으로 순차적으로 청화동, 유산동, 니켈, 3가크롬도금층을 형성시킨 마그네슘합금판재를 제공하는 것을 목적으로 한다.Therefore, the present invention is a cyanide copper, lactic acid copper plating layer to block electromagnetic waves on the surface of the magnesium alloy plate material, nickel plating layer having a low production cost and strong corrosion resistance, and chrome does not belong to the regulation of RoHS, corrosion resistance, heat resistance and appearance is beautiful 3 It is an object of the present invention to provide a magnesium alloy sheet material in which a blue chromium copper, a lactate copper, a nickel, and a trivalent chromium plating layer are sequentially formed by a wet electroplating method using a wet plating solution having a significantly low plating cost.

본 발명은 알루미늄과 망간, 아연, 철 및 구리 등이 함유되어 내구성이 강화된 마그네슘합금판재에 청화동, 유산동, 니켈, 3가크롬을 도금하는 도금방법에 관한 것으로서, 안경테와 휴대폰 및 노트북 케이스로 제작 사용함으로써 발생하는 전자파를 차단하고, 염분이 포함된 사람의 땀에 의해 마그네슘합금이 부식되지 않고, 휴대폰 및 노트북에서 발생하는 열에 의해 마그네슘합금이 발화되지 않음과 동시에 외관이 미려한 특징이 있다.The present invention relates to a plating method for plating blue, copper, lactic acid copper, nickel, trivalent chromium on a magnesium alloy sheet containing aluminum, manganese, zinc, iron, copper, etc., and having enhanced durability. It is characterized by blocking electromagnetic waves generated by using and manufacturing, magnesium alloy is not corroded by human sweat containing salt, magnesium alloy is not ignited by heat generated from mobile phones and laptops, and the appearance is beautiful.

본 발명의 대략적인 공정을 살펴보면, 세척액 속에 5 내지 7분간 침지하여 마그네슘합금판재 표면을 세척하는 제1공정과; 제1공정을 거친 마그네슘합금판재를 탄산염, 수산화나트륨, 인산염, 계면활성제, 가성소다, 청화소다로 혼합된 전해탈지액 속에 90 내지 150초간 침지하여 4.5 내지 5V로 전해탈지시켜 마그네슘합금판재 표면의 이물질을 제거하는 제2공정과; 제2공정을 거친 마그네슘합금판재를 황산, 질산, 불산, 인히비터, 산성탈지제, 슬파민산 산성불화암모늄로 혼합된 산성액 속에 5 내지 8초간 침지하여 산화시키는 제3공정과; 상기 제3공정을 거친 마그네슘합금 판재를 수산화나트륨용액에 구루코산나트륨 첨가된 70 내지 80℃의 엣칭액 속에 4 내지 6분간 침지하여 부착생성물질을 제거시키는 제4공정과; 제4공정을 거친 마그네슘합금판재를 70 내지 80℃의 무기산염, 무기아연염, 키래이트제, 불소화합물, 불화 칼륨으로 구성된 아연치환액 속에 2 내지 4분간 침지하여 아연치환시키는 제5공정과; 제5공정을 거친 마그네슘합금판재를 55 내지 60℃의 청화동, 유리청화소다, 탄산소다로 혼합된 청화동전해탈도금액 속에 침지하여 1.5 내지 3.5V로 20 내지 25분간 전해도금시키는 제6공정과; 제6공정을 거친 마그네슘합금판재를 25 내지 30℃의 유산동과 황산으로 혼합된 유산동 전해도금액 속에 침지하여 2 내지 4V로 10 내지 20분간 전해도금시키는 제7공정과; 제7공정을 거친 마그네슘합금판재를 55 내지 60℃의 유산니켈, 염화니켈, 붕산으로 혼합된 니켈 전해도금액 속에 침지하여 2.5 내지 4.5V로 12 내지 15분간 전해도금시키는 제8공정과; 제8공정을 거친 마그네슘합금판재를 55 내지 60℃의 envirochrome salt, envirochrome part 1, envirochrome initial, envirochrome wetter로 구성된 3가크롬전해도금액 속에 6 내지 10V로 10 내지 13분간 전해도금시키는 제9공정으로 그 대략적인 공정이 이루어진다.Looking at the general process of the present invention, the first step of washing the surface of the magnesium alloy plate material by immersing in the washing solution for 5 to 7 minutes; Magnesium alloy sheet material after the first step is immersed in the electrolytic degreasing solution mixed with carbonate, sodium hydroxide, phosphate, surfactant, caustic soda and blue soda for 90 to 150 seconds, and electrolytically degreased at 4.5 to 5V to remove foreign substances on the surface of the magnesium alloy sheet. A second step of removing; A third step of oxidizing the magnesium alloy plate material subjected to the second step by immersing for 5 to 8 seconds in an acid solution mixed with sulfuric acid, nitric acid, hydrofluoric acid, inhibitor, acidic degreaser, and ammonium sulfamic acid ammonium fluoride; A fourth step of immersing the magnesium alloy sheet material subjected to the third step in an etching solution at 70 to 80 ° C. in which sodium gurucoate is added to sodium hydroxide solution for 4 to 6 minutes to remove adhesion products; A fifth step of immersing the zinc alloy sheet material having undergone the fourth step in a zinc replacement solution composed of an inorganic acid salt, an inorganic zinc salt, a chelating agent, a fluorine compound, and potassium fluoride at 70 to 80 ° C. for 2 to 4 minutes to replace the zinc; A sixth step of immersing the magnesium alloy sheet having undergone the fifth step in a clarified copper electrolytic desalting solution mixed with 55 to 60 ° C of blue, blue and blue carbonic acid, and sodium carbonate and electroplating for 20 to 25 minutes at 1.5 to 3.5V; ; A seventh step of immersing the magnesium alloy plate material subjected to the sixth step in an electrolytic plating solution mixed with copper lactate and sulfuric acid at 25 to 30 ° C. for 10 to 20 minutes at 2 to 4 V; An eighth step of immersing the magnesium alloy sheet material subjected to the seventh step in a nickel electrolytic plating solution mixed with nickel lactate, nickel chloride, and boric acid at 55 to 60 ° C. for 12 to 15 minutes at 2.5 to 4.5 V; The ninth step of electroplating the magnesium alloy plate material, which has undergone the eighth step, in a trivalent chromium electrolytic solution consisting of envirochrome salt, envirochrome part 1, envirochrome initial, and envirochrome wetter at 55 to 60 ° C. at 6 to 10 V for 10 to 13 minutes. The approximate process is done.

이하 첨부된 본 발명의 실시 예에 따라 마그네슘합금(10)의 표면으로 청화동도금층(20), 유산동도금층(30), 니켈도금층(40), 3가크롬도금층(50)이 형성된 마그네슘합금판재의 단면도를 참고하여 구체적으로 설명한다.According to the embodiment of the present invention attached to the surface of the magnesium alloy (10) of the magnesium alloy plate material on which the cyanized copper plating layer 20, lactic acid copper plating layer 30, nickel plating layer 40, trivalent chromium plating layer 50 is formed It demonstrates concretely with reference to sectional drawing.

상기와 같이 본 발명은 습식전해도금법으로 청화동, 유산동, 니켈, 3가크롬도금층을 습식전해도금법으로 형성하는 것을 특징으로 각 공정이 끝난 후, 필수적으로 수세작업을 거쳐야 함은 통상의 지식을 가진 당업자라면 극히 일반적인 공정이기에 본 발명의 명세서에서는 본 발명의 용이한 설명을 위해 수세에 관한 공정을 생략하여 설명하였음을 밝힌다.As described above, the present invention is characterized in that the wet electroplating method forms a cyanide copper, copper lactate, nickel, and trivalent chromium plating layers by a wet electroplating method. It is apparent to those skilled in the art that the process of washing with water is omitted in the specification of the present invention because it is a very general process for easy description of the present invention.

상기 대략적인 구성에서와 같이, 본 발명의 마그네슘합금판재의 도금방법은 대략 9공정으로 이루어지는바 그 상세한 공정을 살펴보면,As in the above general configuration, the plating method of the magnesium alloy sheet material of the present invention consists of approximately nine steps.

제1공정은 알루미늄과 망간, 아연, 철 및 구리 등으로 구성된 마그네슘합금판재(10)를 50 내지 60℃의 세척액이 담긴 초음파세척기에 침지시킨 후, 5 내지 7분간 초음파 진동을 가하여 마그네슘합금판재(10)의 표면을 세척하는 것으로 구성된다.In the first step, the magnesium alloy sheet 10 composed of aluminum, manganese, zinc, iron and copper is immersed in an ultrasonic cleaner containing a washing solution at 50 to 60 ° C., and then subjected to ultrasonic vibration for 5 to 7 minutes to give magnesium alloy sheet ( 10) consists of washing the surface.

상기 세척액은 이미 상업적으로 성공한 아토텍 사에서 제조한 AL-47 제품을 사용하도록 하며, 이외에도 초음파세척기에 사용이 가능하고, 산성이 없는 다른 제품을 사용하여 실시하여 무방하다.The cleaning solution is to use the AL-47 product manufactured by Atotech Co., Ltd., which has already been commercially successful, and can be used in an ultrasonic cleaner and can be performed by using another product without acid.

상기 사용되는 초음파세척기는 초음파를 물속에 발생시켜, 초음파에 의해 생성된 초 당 3만~4만의 진동으로 특정 물체의 표면을 세척하는 장치이다.The ultrasonic cleaner to be used is a device for generating ultrasonic waves in water to clean the surface of a specific object with vibrations of 30,000 to 40,000 per second generated by the ultrasonic waves.

이는 초음파에 의한 진동으로 액체 입자나 고체를 파괴·분산시키는 작용을 응용한 것으로 의료분야 및 공업분야에서 특정 물체의 표면에 부착된 이물질을 제거하기 위해 통상적으로 사용되는 것이다.This is applied to the action of destroying and dispersing liquid particles or solids by vibration by ultrasonic waves, and is commonly used to remove foreign substances adhering to the surface of a specific object in the medical field and the industrial field.

제2공정은 상기 제1공정을 거친 마그네슘합금판재(10)를 (-)극으로 하고, 20 내지 30℃의 탄산염 50mg/l과 수산화나트륨 2mg/l, 인산염 2mg/l, 계면활성제 1mg/l, 가성소다 15mg/l 및 청화소다 30mg/l로 혼합 구성된 전해탈지액 속에 침지시킨 후, 마그네슘합금판재(10)와 전해탈지액이 화학적 전기반응이 이루어지도록 4.5 내지 5V의 전류를 90 내지 150초간 가하는 것으로 구성된다.In the second step, the magnesium alloy sheet 10 subjected to the first step is used as a negative electrode, and 50 mg / l of carbonate, 20 mg of sodium hydroxide, 2 mg / l of phosphate, 2 mg / l of surfactant, and 1 mg / l of surfactant at 20 to 30 ° C. After immersing in an electrolytic degreasing solution consisting of 15 mg / l caustic soda and 30 mg / l of cyanide, the magnesium alloy sheet 10 and the electrolytic degreasing solution is applied to a current of 4.5 to 5V for 90 to 150 seconds It consists of

상기 화학적 전기반응을 통하여 마그네슘합금판재(10)의 표면에 수소가 발생하여 수소 기포가 생성되고, 그 수소 기포가 마그네슘합금판재(10) 표면에서 떨어지는 힘에 의해 상기 제 1공정을 거친 마그네슘합금판재(10)의 표면에 남아있는 기름 및 이물질의 분자를 마그네슘합금판재(10) 표면에서 이탈시켜 마그네슘합금판재(10)의 표면에 이물질이 전혀 없는 마그네슘합금판재(10)를 형성할 수 있다.Hydrogen is generated on the surface of the magnesium alloy sheet material 10 through the chemical electrical reaction to generate hydrogen bubbles, and the magnesium alloy sheet material having undergone the first process by the force falling from the surface of the magnesium alloy sheet material 10 is produced. Molecules of oil and foreign matter remaining on the surface of (10) may be separated from the surface of the magnesium alloy plate material 10 to form the magnesium alloy plate material 10 having no foreign matter on the surface of the magnesium alloy plate material 10.

제3공정은 상기 제2공정을 거친 마그네슘합금판재(10)를 70 내지 80℃의 황산 30ml/l과 질산 30ml/l, 불산 15ml/l, 인히비터(inhibitor) 0.75ml/l, 산성탈지제 0.75ml/l, 슬파민산 1.75mg/l 및 산성불화암모늄 0.4mg/l로 혼합 구성된 산성액 속에 5 내지 8분간 침지하여 산화시킨 후, 산화된 마그네슘합금판재(10)의 표면을 부드러운 솔을 사용하여 흐르는 물에 세척하는 것으로 구성된다.
위 인히비터는 일반적으로 포르말린으로 구성되어 부식을 억제시키기 위해서 사용되는 부식억제재이다.In the third step, the magnesium alloy plate 10 subjected to the second step is 30 ml / l of sulfuric acid and 30 ml / l of nitric acid, 15 ml / l of hydrofluoric acid, inhibitor 0.75 ml / l, and acidic degreasing agent 0.75 at 70 to 80 ° C. After immersing for 5 to 8 minutes in an acid solution composed of ml / l, 1.75 mg / l of sulfamic acid and 0.4 mg / l of acidic ammonium fluoride, the surface of the oxidized magnesium alloy sheet 10 was squeezed using a soft brush. It consists of washing in running water.
The inhibitor is composed of formalin and is a corrosion inhibitor used to suppress corrosion.

제4공정은 상기 제3공정을 거친 마그네슘합금판재(10)를 70 내지 80℃의 150 내지 180g/l의 농도의 수산화나트륨용액에 구루코산나트륨 0.5 내지 2.0g/l이 첨가된 엣칭액 속에 4 내지 6분간 마그네슘합금판재(10)를 침지한 후, 엣칭액을 지속적으로 회전시켜 마그네슘합금판재(10)에 생성된 부착생성물질을 제거하는 것으로 구성된다.In the fourth step, the magnesium alloy sheet 10 subjected to the third step is added to an etching solution in which 0.5 to 2.0 g / l of sodium gurucoate is added to a sodium hydroxide solution having a concentration of 150 to 180 g / l at 70 to 80 ° C. After immersing the magnesium alloy plate material 10 for 6 minutes, the etching solution is continuously rotated to remove the adhesion-producing material generated in the magnesium alloy plate material 10.

상기 엣칭액 속에 침지된 마그네슘합금판재(10)의 표면은 수산화나트륨용액에 의해 용해되고, 이때 발생하는 수소가스에 의해 물리적으로 흡착하고 있는 기름 및 이물질이 제거되는 것으로, 이물질이 전혀 없는 마그네슘합금판재(10)를 형성하여 전해도금시 불량률을 감소시키는 목적으로 이루어진다.The surface of the magnesium alloy plate material 10 immersed in the etching solution is dissolved by sodium hydroxide solution, and the oil and foreign substances physically adsorbed by the hydrogen gas generated at this time are removed, and the magnesium alloy plate material has no foreign matter at all. (10) is formed to reduce the defective rate during electroplating.

제5공정은 상기 제4공정을 거친 마그네슘합금판재(10)를 70 내지 80℃의 무기산염과 무기아연염, 키래이트제, 불소화합물 및 불화칼륨으로 구성된 아연치환액 속에 2 내지 4분간 침지하는 것으로 구성된다.The fifth step is to immerse the magnesium alloy sheet material 10 passed through the fourth step in a zinc substitution solution composed of inorganic acid salts, inorganic zinc salts, chelating agents, fluorine compounds, and potassium fluoride at 70 to 80 minutes for 2 to 4 minutes. It consists of.

상기 아연치환액은 상업상 성공한 광일화공 사에서 제조한 N-100 제품을 사용하여 실시하는 것이 바람직하며, 무기산염과 무기아연염, 키래이트제, 불소화합물 및 불화칼륨으로 구성된 어떠한 아연치환액을 사용하여도 무방하다.The zinc replacement solution is preferably carried out using a N-100 product manufactured by Kwang Il Chemical Co., Ltd., a commercially successful company, and any zinc replacement solution composed of an inorganic acid salt, an inorganic zinc salt, a chelating agent, a fluorine compound, and potassium fluoride is used. You may use it.

이러한 공정의 구성에 의하여 (+)극이 된 아연이 부식되어 (-)극인 마그네슘합금판재(10)의 표면에 피막을 형성하여 희생 피막의 역할을 하게 된다. 즉 마그네슘합금판재(10)의 표면 대신 아연이 산화하면서 마그네슘합금판재(10)의 표면에 부착되어 마그네슘합금판재(10)의 표면이 아연으로 치환되는 것이다.By the construction of this process, zinc that becomes a positive electrode is corroded to form a film on the surface of the magnesium alloy plate material 10 that is a negative electrode to serve as a sacrificial film. In other words, zinc is oxidized instead of the surface of the magnesium alloy plate 10 and adheres to the surface of the magnesium alloy plate 10 so that the surface of the magnesium alloy plate 10 is replaced with zinc.

제6공정은 상기 제5공정에 의해 표면이 아연치환된 마그네슘합금판재(10)를 55 내지 60℃의 청화동 40mg/l와 유리청화소다 12mg/l 및 탄산소다 15mg/l로 혼합된 청화동전해탈지액 속에 침지하고, 마그네슘합금판재의 표면에 15 내지 25μm의 두께의 청화동도금층(20)이 형성되도록 20 내지 25분간 1.5 내지 3.5V의 전류를 가하여 전기적 화학반응을 발생시키는 것으로 구성된다.In the sixth step, the cyanide copper alloy in which the magnesium alloy sheet 10 whose surface is zinc-substituted by the fifth step is mixed with 40 mg / l of cyanide copper at 55 to 60 ° C., 12 mg / l of glass cyanide and 15 mg / l of sodium carbonate. It is immersed in the degreasing solution, and the electric chemical reaction is generated by applying a current of 1.5 to 3.5V for 20 to 25 minutes to form a cyanide copper plating layer 20 having a thickness of 15 to 25μm on the surface of the magnesium alloy sheet material.

이는 전기적 화학반응에 의해 청화동의 동 이온이 마그네슘합금판재(10) 표면에 습식전해도금되는 것으로, 상기 제5공정의 아연피막에 의해 마그네슘합금판재(10)의 표면이 부식되지 않고 청화동을 습식전해도금으로 청화동도금층(20)을 형성할 수 있는 것이다.This is because copper ions of cyanide copper are wet-electroplated on the surface of the magnesium alloy sheet 10 by an electrochemical reaction, and the surface of the magnesium alloy sheet 10 is not corroded by the zinc coating of the fifth step. It is possible to form a cyanide copper plating layer 20 by electroplating.

제7공정은 상기 제6공정을 거친 마그네슘합금판재(10)를 25 내지 30℃의 유산동 210 내지 230mg/l과 황산 50 내지 60mg/l로 혼합 구성된 유산동전해도금액 속에 침지하고, 청화동도금층(20)이 형성된 마그네슘합금판재(10) 표면으로 5 내지 15μm의 유산동도금층(30)이 형성되도록 2 내지 4V의 전류를 10 내지 20분간 가하여 청화동도금층(20)의 표면에 전기적 화학반응을 발생시키는 것으로 구성된다.In the seventh step, the magnesium alloy plate 10 subjected to the sixth step is immersed in a lactic acid copper plating solution composed of 210 to 230 mg / l of lactic acid copper and 50 to 60 mg / l of sulfuric acid at 25 to 30 ° C. 20) is applied to the surface of the magnesium alloy plate material 10 to form a 5 to 15μm lactic acid copper plating layer 30 by applying a current of 2 to 4V for 10 to 20 minutes to generate an electrical chemical reaction on the surface of the cyanide copper plating layer 20 It consists of.

제8공정은 상기 제7공정을 거친 마그네슘합금판재(10)를 55 내지 60℃의 유산니켈 250 내지 280mg/l과 염화니켈 45 내지 55mg/l 및 붕산 45 내지 55mg/l로 혼합된 니켈 전해도금액 속에 침지하고, 상기 유산동도금층(30)의 표면으로 5 내지 15μm의 니켈도금층(40)이 형성되도록 2.5 내지 4.5V의 전류를 12 내지 15분간 가하여 전기적 화학반응을 발생시키는 것으로 구성된다.In the eighth process, the nickel-electrolyte mixed with the magnesium alloy sheet 10 subjected to the seventh process is mixed with 250 to 280 mg / l nickel lactate, 45 to 55 mg / l nickel chloride, and 45 to 55 mg / l boric acid at 55 to 60 ° C. It is immersed in the amount of money, it is composed of the electrochemical reaction by applying a current of 2.5 to 4.5V for 12 to 15 minutes to form a nickel plating layer 40 of 5 to 15μm to the surface of the lactic copper plating layer 30.

이는 상기 제7공정에 의해 형성된 유산동도금층(30)에 의해 니켈이온이 용이하게 밀착되어 니켈도금층(40)이 마그네슘합금판재(10)의 표면에 더욱 견고하게 형성된다.This is because nickel ions are easily adhered by the lactic acid copper plating layer 30 formed by the seventh process, so that the nickel plating layer 40 is more firmly formed on the surface of the magnesium alloy sheet material 10.

제9공정은 상기 제8공정을 거친 마그네슘합금판재(10)를 55 내지 60℃의 envirochrome salt 300mg/l와 envirochrome part1 150mg/l, envirochrome initial 10mg/l 및 envirochrome wetter 1 내지 2mg/l로 혼합 구성된 3가크롬전해도금액에 침지하고, 니켈도금층(40)이 형성된 표면으로 0.3 내지 0.7μm의 3가크롬도금층(50)이 형성되도록 6 내지 10V의 전류를 10 내지 13분간 가하여 니켈도금층(40)에 전기적 화학반응을 발생시키는 것으로 구성된다.In the ninth step, the magnesium alloy sheet 10 subjected to the eighth step is mixed with envirochrome salt 300mg / l and envirochrome part1 150mg / l, envirochrome initial 10mg / l and envirochrome wetter 1 to 2mg / l at 55 to 60 ° C. The nickel plated layer 40 was immersed in a trivalent chromium electrolytic solution and applied with a current of 6 to 10 V for 10 to 13 minutes to form a trivalent chromium plated layer 50 having 0.3 to 0.7 μm on the surface where the nickel plated layer 40 was formed. Consists in generating an electrical chemical reaction.

상기 3가크롬전해도금액은 상업적으로 성공한 macdermid 사에서 제조한 envirochrome salt, envirochrome part1, envirochrome initial, envirochrome wetter제품을 혼합 사용하는 것이 바람직하다.The trivalent chromium electrolyte solution is preferably used by mixing envirochrome salt, envirochrome part1, envirochrome initial, envirochrome wetter products manufactured by commercially successful macdermid company.

상기와 같은 구성의 공정을 통하여, 산과 염분이 포함된 물에 강하게 부식되는 마그네슘합금판재(10)에 전자파를 차단하는 청화동과 유산동을 마그네슘합금판재(10)의 표면에 부식 없이 습식전해도금법으로 도금층을 형성할 수 있고, 내식성이 있는 니켈을 습식전해도금법으로 마그네슘합금판재(10)의 부식 없이 유산동도금 층(30)에 밀착된 니켈도금층(40)을 형성할 수 있고, 외관이 미려하고 내열성이 강하며 ROHS의 규제에 속하지 않는 3가크롬도금층을 습식전해도금법으로 형성할 수 있게 된다.Through the process of the above configuration, the cyanide copper and copper lactate to block the electromagnetic waves in the magnesium alloy plate material 10 which is strongly corroded to the water containing acid and salt by the wet electroplating method without corrosion on the surface of the magnesium alloy plate material (10) The plating layer can be formed, and the nickel plating layer 40 in close contact with the lactic acid copper plating layer 30 can be formed without corrosion of the magnesium alloy sheet material 10 by wet electroplating with nickel having corrosion resistance, and the appearance is beautiful and heat resistance. This strong and non-ROHS trivalent chromium plating layer can be formed by the wet electroplating method.

상기와 같이 구성된 본 발명은, 마그네슘합금판재의 도금방법으로 형성된 마그네슘합금판재는 청화동도금층 및 유산동도금층에 의해 휴대폰 및 노트북에서 발생하는 전자파를 용이하게 차단하여 사용자의 건강을 유지할 수 있는 효과가 있으며, 니켈도금층에 의해 사용자의 피부와 접촉하여 사용되는 안경 및 휴대폰 등에 염분을 포함한 사람의 땀으로 부식되지 않는 효과가 있고, 3가크롬도금층에 의해 휴대폰 및 노트북 등에서 발생하는 열에 의해 발화 및 폭발하지 않는 효과가 있음과 동시에 녹이 슬지않으며 광택에 의한 아름다운 제품의 표면을 유지할 수 있는 효과가 있다.The present invention configured as described above, the magnesium alloy plate material formed by the plating method of magnesium alloy plate material has the effect of easily blocking the electromagnetic waves generated in the mobile phone and notebook by the cyanide copper plating layer and lactic acid copper plating layer to maintain the user's health The nickel-plated layer does not corrode with human sweat, including salt, in glasses and mobile phones used in contact with the user's skin, and the trivalent chromium layer does not ignite or explode by heat generated from mobile phones and laptops. At the same time, it does not rust and maintains the surface of beautiful products by gloss.

Claims (4)

마그네슘합금판재에 청화동과 유산동, 니켈 및 3가크롬을 도금하는 방법에 있어서,In the method of plating cyanide copper, copper lactate, nickel and trivalent chromium on a magnesium alloy sheet material, 50 내지 60℃의 세척액 속에 5 내지 7분간 침지하여 마그네슘합금판재 표면을 세척하는 제1공정과;A first step of immersing the surface of the magnesium alloy sheet material by immersion for 5 to 7 minutes in a washing solution at 50 to 60 ° C .; 제1공정을 거친 마그네슘합금판재를 25 내지 30℃의 탄산염과 수산화나트륨, 인산염, 계면활성제, 가성소다 및 청화소다로 혼합된 전해탈지액 속에 90 내지 150초간 침지하여 4.5 내지 5V로 전해탈지시켜 마그네슘합금판재 표면의 이물질을 제거하는 제2공정과;The magnesium alloy sheet material subjected to the first step was immersed in an electrolytic degreasing solution mixed with carbonate at 25 to 30 ° C., sodium hydroxide, phosphate, surfactant, caustic soda, and blue soda for 90 to 150 seconds, and electrolytic degreasing at 4.5 to 5V to magnesium A second step of removing foreign matter from the surface of the alloy plate; 제2공정을 거친 마그네슘합금판재를 70 내지 80℃의 황산과 질산, 불산, 인히비터, 산성탈지제, 슬파민산 및 산성불화암모늄으로 혼합된 산성액 속에 5 내지 8초간 침지하여 산화시키는 제3공정과;A third step of oxidizing the magnesium alloy plate material subjected to the second step by immersing it in an acid solution mixed with sulfuric acid, nitric acid, hydrofluoric acid, inhibitor, acidic degreaser, sulfamic acid and ammonium fluoride at 70 to 80 ° C. for 5 to 8 seconds; ; 상기 제3공정을 거친 마그네슘합금판재를 농도 150 내지 180g/l로 구성된 수산화나트륨용액에 구루코산나트륨 0.5 내지 2.0g/l이 첨가된 70 내지 80℃의 엣칭액 속에 4 내지 6분간 침지하여 부착생성물질을 제거시키는 제4공정과;The magnesium alloy sheet material subjected to the third step was immersed for 4 to 6 minutes in an etching solution at 70 to 80 ° C. in which 0.5 to 2.0 g / l of sodium gurucoate was added to a sodium hydroxide solution having a concentration of 150 to 180 g / l. A fourth step of removing the substance; 제4공정을 거친 마그네슘합금판재를 70 내지 80℃의 무기산염과 무기아연염, 키래이트제, 불화 칼륨으로 구성된 아연치환액 속에 2 내지 4분간 침지하여 아연치환시키는 제5공정과;A fifth step of immersing the magnesium alloy sheet material having undergone the fourth step in a zinc substitution solution composed of an inorganic acid salt, an inorganic zinc salt, a chelate agent, and potassium fluoride at 70 to 80 ° C. for 2 to 4 minutes to replace the zinc; 제5공정을 거친 마그네슘합금판재를 55 내지 60℃의 청화동 40mg/l과 유리청화소다 12mg/l 및 탄산소다 15mg/l로 혼합된 청화동 전해탈액 속에 침지하여 1.5 내지 3.5V로 20 내지 25분간 전해도금시키는 제6공정과;The magnesium alloy plate material subjected to the fifth process was immersed in a blue and white copper electrolytic degreasing solution mixed with 40 mg / l of cyanide copper at 55 to 60 ° C., 12 mg / l of glass and blue soda and 15 mg / l of sodium carbonate. A sixth step of electroplating for 25 minutes; 제6공정을 거친 마그네슘합금판재를 25 내지 30℃의 유산동 210 내지 230mg/l과 황산 50 내지 60mg/l로 혼합된 유산동 전해도금액 속에 침지하여 2 내지 4V로 10 내지 20분간 전해도금시키는 제7공정과;The seventh step of immersing the magnesium alloy sheet material which passed through the sixth step in a lactic acid copper electrolytic plating solution mixed with 210 to 230 mg / l of sulfuric acid copper and 50 to 60 mg / l of sulfuric acid at 25 to 30 ℃ electrolytic plating at 2 to 4V for 10 to 20 minutes Process; 제7공정을 거친 마그네슘합금판재를 55 내지 60℃의 유산니켈과 염화니켈 및 붕산으로 혼합된 니켈 전해도금액 속에 침지하여 2.5 내지 4.5V로 12 내지 15분간 전해도금시키는 제8공정과;An eighth step of immersing the magnesium alloy plate material subjected to the seventh step in a nickel electrolytic plating solution mixed with nickel lactate, nickel chloride and boric acid at 55 to 60 ° C. for 12 to 15 minutes at 2.5 to 4.5 V; 제8공정을 거친 마그네슘합금판재를 55 내지 60℃의 3가크롬전해도금액 속에 6 내지 10V로 10 내지 13분간 전해도금시키는 제9공정으로 구성됨을 특징으로 하는 마그네슘합금판재의 도금방법.A ninth step of electroplating a magnesium alloy plate material having undergone the eighth step in a trivalent chromium electrolytic solution at 55 to 60 ° C. for 10 to 13 minutes at 6 to 10V. 제 1항에 있어서,The method of claim 1, 전해탈지액은 탄산염 50mg/l과 수산화나트륨 2mg/l, 인산염 2mg/l, 계면활성제 1mg/l, 가성소다 15mg/l 및 청화소다 30mg/l로 혼합 구성됨을 특징으로 하는 마그네슘합금판재의 도금방법.Electrolytic degreasing solution is a plating method of magnesium alloy sheet, characterized in that consisting of 50mg / carbonate and 2mg / l sodium hydroxide, 2mg / l phosphate, 1mg / l surfactant, 15mg / l caustic soda and 30mg / l cyanide . 상기 제 1항에 있어서,According to claim 1, 산성액은 황산 30ml/l과 질산 30ml/l, 불산 15ml/l, 인히비터 0.75ml/l, 산성탈지제 0.75ml/l, 슬파민산 1.75mg/l 및 산성불화암모늄 0.4mg/l로 혼합되어 구성됨을 특징으로 하는 마그네슘합금판재의 도금방법.The acid solution consists of 30 ml / l sulfuric acid, 30 ml / l nitric acid, 15 ml / l hydrofluoric acid, 0.75 ml / l inhibitor, 0.75 ml / l acidic degreaser, 1.75 mg / l sulfamic acid and 0.4 mg / l acidic ammonium fluoride Plating method of magnesium alloy sheet material characterized in that. 상기 제 1항에 있어서,According to claim 1, 니켈전해도금액은 유산니켈 250 내지 280mg/l과 염화니켈 45 내지 55mg/l 및 붕산 45 내지 55mg/l로 혼합되어 구성됨을 특징으로 하는 마그네슘합금판재의 도금방법.Nickel electrolytic solution is a plating method of magnesium alloy sheet material, characterized in that it is mixed with nickel lactate 250 to 280mg / l nickel chloride 45 to 55mg / l and boric acid 45 to 55mg / l.
KR1020070059807A 2007-06-19 2007-06-19 Method for electroplating with magnesium alloy a plate KR100881061B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020070059807A KR100881061B1 (en) 2007-06-19 2007-06-19 Method for electroplating with magnesium alloy a plate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020070059807A KR100881061B1 (en) 2007-06-19 2007-06-19 Method for electroplating with magnesium alloy a plate

Publications (2)

Publication Number Publication Date
KR20080111628A KR20080111628A (en) 2008-12-24
KR100881061B1 true KR100881061B1 (en) 2009-01-30

Family

ID=40369725

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020070059807A KR100881061B1 (en) 2007-06-19 2007-06-19 Method for electroplating with magnesium alloy a plate

Country Status (1)

Country Link
KR (1) KR100881061B1 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101217728B1 (en) * 2010-03-03 2013-01-02 이종현 High efficient plating method of magnesium material
KR101235556B1 (en) * 2010-10-01 2013-02-20 주식회사 동방플랜텍 Manufacturing method of the polarizing film manufacturing equipment guide roller using a multi-plating method
CN103938236A (en) * 2013-06-04 2014-07-23 无锡市锡山区鹅湖镇荡口青荡金属制品厂 Process for electroplating chromium on surface of magnesium alloy

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02149695A (en) * 1988-12-01 1990-06-08 Mitsubishi Electric Corp Surface treatment of magnesium material
JPH10287986A (en) 1997-04-15 1998-10-27 Kobe Steel Ltd Magnesium alloy member excellent in adhesion and its production
JP2000279368A (en) 1999-03-31 2000-10-10 Olympus Optical Co Ltd Endoscope device
KR20030075623A (en) * 2002-03-20 2003-09-26 박형진 Plating method for lusterless metal layer and products coated by the method

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02149695A (en) * 1988-12-01 1990-06-08 Mitsubishi Electric Corp Surface treatment of magnesium material
JPH10287986A (en) 1997-04-15 1998-10-27 Kobe Steel Ltd Magnesium alloy member excellent in adhesion and its production
JP2000279368A (en) 1999-03-31 2000-10-10 Olympus Optical Co Ltd Endoscope device
KR20030075623A (en) * 2002-03-20 2003-09-26 박형진 Plating method for lusterless metal layer and products coated by the method

Also Published As

Publication number Publication date
KR20080111628A (en) 2008-12-24

Similar Documents

Publication Publication Date Title
CN101638790A (en) Plating method of magnesium and magnesium alloy
US20130143071A1 (en) Process for the electroless copper plating of metallic substrates
CN102605400B (en) Steel strip continuous copper plating process
CN101643926A (en) Non-cyanide pre-plating copper plating solution
KR100881061B1 (en) Method for electroplating with magnesium alloy a plate
CN105349971A (en) Aluminum alloy surface modification technology
CN104562112A (en) Lead brass silver plating process
WO2017155469A1 (en) Semiconductor device and method of manufacture
US20040108211A1 (en) Surface treatment for a wrought copper foil for use on a flexible printed circuit board (FPCB)
CN101555611B (en) Method for electroplating nickel on surface of magnesium alloy
CN109440152A (en) A kind of iron embryo electroplating technology
JP3426800B2 (en) Pretreatment method for plating aluminum alloy material
JPS6357520B2 (en)
JP4949994B2 (en) Method for peeling a metal plate from a metal plate having a plurality of metal layers
TW201207154A (en) Sealing agent and sealing method
KR101217728B1 (en) High efficient plating method of magnesium material
CN110144609A (en) A kind of electroplating processing method of repeatedly heavy zinc
JPS62297492A (en) Method for plating aluminum by electrolytic activation
Zhu et al. Copper coating electrodeposited directly onto AZ31 magnesium alloy
JP2008248371A (en) High corrosion resistance, and gold plating member of high productivity
JP2007308779A (en) Plating pretreatment method and apparatus for city water made of lead-containing copper alloy
KR20140012415A (en) Electroless plating method and plating film obtained by the electroless plating method
KR101847439B1 (en) Direct zinc electroplating method on aluminium or aluminium alloys
JP2004068138A (en) Black alloy plating solution
JP2002061000A (en) Composite plating method and composite plated article

Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
AMND Amendment
E601 Decision to refuse application
J201 Request for trial against refusal decision
AMND Amendment
B701 Decision to grant
GRNT Written decision to grant
FPAY Annual fee payment

Payment date: 20120125

Year of fee payment: 4

LAPS Lapse due to unpaid annual fee