KR100810969B1 - TThe method of coating of the laminated ceramic condenser for manufacture extra-high voltage pressure jig board. - Google Patents
TThe method of coating of the laminated ceramic condenser for manufacture extra-high voltage pressure jig board. Download PDFInfo
- Publication number
- KR100810969B1 KR100810969B1 KR1020060057547A KR20060057547A KR100810969B1 KR 100810969 B1 KR100810969 B1 KR 100810969B1 KR 1020060057547 A KR1020060057547 A KR 1020060057547A KR 20060057547 A KR20060057547 A KR 20060057547A KR 100810969 B1 KR100810969 B1 KR 100810969B1
- Authority
- KR
- South Korea
- Prior art keywords
- coating
- plate
- coating composition
- stainless
- multilayer ceramic
- Prior art date
Links
- 238000000576 coating method Methods 0.000 title claims abstract description 20
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 19
- 239000011248 coating agent Substances 0.000 title claims abstract description 10
- 238000000034 method Methods 0.000 title abstract description 15
- 239000000919 ceramic Substances 0.000 title 1
- 239000008199 coating composition Substances 0.000 claims abstract description 27
- 238000001035 drying Methods 0.000 claims abstract description 17
- 238000010438 heat treatment Methods 0.000 claims abstract description 17
- 239000003985 ceramic capacitor Substances 0.000 claims abstract description 16
- 229910001220 stainless steel Inorganic materials 0.000 claims abstract description 12
- 239000010935 stainless steel Substances 0.000 claims abstract description 12
- 238000005406 washing Methods 0.000 claims abstract description 12
- 238000002788 crimping Methods 0.000 claims abstract description 9
- 238000005498 polishing Methods 0.000 claims abstract description 9
- 238000007654 immersion Methods 0.000 claims abstract description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 6
- 239000012153 distilled water Substances 0.000 claims abstract description 4
- 238000001179 sorption measurement Methods 0.000 claims abstract description 3
- 239000004576 sand Substances 0.000 claims description 2
- 238000003860 storage Methods 0.000 claims description 2
- 239000000203 mixture Substances 0.000 abstract description 10
- 229920001296 polysiloxane Polymers 0.000 abstract description 8
- 230000000694 effects Effects 0.000 abstract description 5
- 238000004506 ultrasonic cleaning Methods 0.000 abstract description 3
- 238000001723 curing Methods 0.000 description 6
- 238000003825 pressing Methods 0.000 description 6
- 239000000463 material Substances 0.000 description 5
- 239000011347 resin Substances 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 238000007598 dipping method Methods 0.000 description 3
- 238000007517 polishing process Methods 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- 239000003990 capacitor Substances 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 230000002950 deficient Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 229920002799 BoPET Polymers 0.000 description 1
- 230000000274 adsorptive effect Effects 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000002210 silicon-based material Substances 0.000 description 1
- 239000011877 solvent mixture Substances 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/06—Solid dielectrics
- H01G4/08—Inorganic dielectrics
- H01G4/12—Ceramic dielectrics
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G13/00—Apparatus specially adapted for manufacturing capacitors; Processes specially adapted for manufacturing capacitors not provided for in groups H01G4/00 - H01G11/00
- H01G13/04—Drying; Impregnating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G13/00—Apparatus specially adapted for manufacturing capacitors; Processes specially adapted for manufacturing capacitors not provided for in groups H01G4/00 - H01G11/00
- H01G13/06—Apparatus specially adapted for manufacturing capacitors; Processes specially adapted for manufacturing capacitors not provided for in groups H01G4/00 - H01G11/00 with provision for removing metal surfaces
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/30—Stacked capacitors
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Ceramic Capacitors (AREA)
Abstract
본 발명은 적층 세라믹 콘덴서의 제조공정에서 초고압으로 압착 공정에 사용되는 압착지그인 스테인레스 판의 이형효과를 반영구적으로 사용할 수 있는 적층 세라믹 콘덴서 제조용 초고압 압착지그 판의 코팅방법에 관한 것으로 스테인레스 판의 표면과 이면을 샌드 가공하는 연마공정(S1)과,상기 연마공정(S1)을 거친 스테인레스 판을 증류수를 이용하여 초음파 세척시키는 세척공정(S2)과,상기 세척공정(S2)을 거친 스테인레스 판에 코팅조성물의 균일한 흡착을 위하여 로에서 160-200℃의 온도로 가열시키는 가열공정(S3)과,상기 가열공정(S3)을 거친 스테인레스 판의 표면과 이면에 초음파 진동을 이용한 코팅조성물 저수조에 침지시키는 코팅조성물 침지공정(S4)과,상기 코팅조성물이 침지된 스테인레스 판을 실온에서 8-12분간 자연건조시키는 건조공정(S5)과,상기 건조공정(S5)을 거친 스테인레스 판을 다시 로에서 190-220℃의 온도로 15-25분간 열을 가하는 경화공정(S6)을 통하여 코팅시킬 수 있게 한 것을 특징으로 하는 적층 세라믹 콘덴서 제조용 초고압 압착지그 판의 코팅방법. The present invention relates to a coating method of a super high pressure crimping jig plate for manufacturing a multilayer ceramic capacitor which can semi-permanently use the release effect of a crimping jig stainless steel plate used in the crimping process at a high pressure in the manufacturing process of a multilayer ceramic capacitor. Polishing step (S1) for sand-processing the back surface, washing step (S2) for ultrasonic cleaning of the stainless plate subjected to the polishing step (S1) using distilled water, and coating composition on the stainless plate subjected to the washing step (S2) Heating process (S3) for heating at a temperature of 160-200 ° C in the furnace for uniform adsorption of the coating, and coating to be immersed in the coating composition reservoir using ultrasonic vibration on the surface and the back of the stainless plate subjected to the heating process (S3) Composition immersion step (S4), and drying step of naturally drying the stainless steel plate immersed in the coating composition for 8-12 minutes at room temperature (S5) And, laminated ceramic capacitors, characterized in that the stainless steel plate subjected to the drying step (S5) can be coated again through a curing step (S6) to apply heat for 15-25 minutes at a temperature of 190-220 ℃ in the furnace. Coating method of ultra high pressure jig plate for manufacturing.
적층 세라믹 콘덴서,압착지그,변성실리콘 조성물,코팅방법. Multilayer ceramic capacitor, crimping jig, modified silicone composition, coating method.
Description
도 1 은 본 발명의 순차적인 코팅공정을 도시한 블록 다이어그램도1 is a block diagram illustrating a sequential coating process of the present invention.
<도면 중 주요부분에 대한 부호의 설명><Description of Symbols for Major Parts of Drawings>
(S1) 연마공정 (S1) Polishing Process
(S2) 세척공정(S2) washing process
(S3) 가열공정(S3) heating process
(S4) 코팅조성물 침지공정(S4) Coating composition dipping process
(S5) 건조공정(S5) drying process
(S6) 경화공정(S6) Hardening Process
본 발명은 적층 세라믹 콘덴서(MLCC:Multi Layer Ceramic Capacitor)의 제조공정에서 초고압으로 압착 시 사용되는 압착지그인 스테인레스 판의 이형효과를 향상시킬 수 있는 적층 세라믹 콘덴서 제조용 초고압 압착지그 판의 코팅방법에 관한 것으로 더욱 상세하게는 압착지그로 사용되는 스테인레스 판의 표면에 변성실리콘,레진 및 솔벤트를 혼합한 조성물을 코팅시켜 스테인레스 판의 이형효과를 향상시키면서 반영구적으로 사용할 수 있게 한 코팅방법을 제공하기 위한 것이다. The present invention relates to a coating method of an ultra high pressure crimping jig plate for manufacturing a multilayer ceramic capacitor, which can improve the release effect of a stainless steel plate, which is a crimping jig used in the manufacturing process of a multilayer ceramic capacitor (MLCC). More specifically, to provide a coating method that can be used semi-permanently while improving the release effect of the stainless plate by coating the composition of the modified silicon, resin and solvent on the surface of the stainless plate used as a pressing jig.
일반적으로 콘덴서는 전압을 인가하여 유전체 물질의 두께와 전극 연결에 따라 전하를 축적하는 기능을 하는 수동 부품으로 적층 세라믹 콘덴서인 MLCC는 정전용량 및 정격전압의 용도에 따라 유전체층과 전극면적을 소형 박막으로 다층화한 칩 타입(Chip type)의 콘덴서로 리드 인덕턴스가 적고 고주파 특성이 좋아 주로 TV,VCR,PC,자동차 전장품 및 통신기기용으로 사용되고 있으며 세트동향과 밀접한 연관을 갖고 발전을 거듭하고 있어 최근 들어 이동통신기기를 중심으로 한 세트기기 소형화에 따라 급진적으로 발전하고 있으며 상기 MLCC의 정전용량도 유전체층 박막화와 다층화,유효면적의 확대.재료개선 등으로 증가하고 있는 실정이다. In general, a capacitor is a passive component that functions to accumulate charge depending on the thickness of the dielectric material and the electrode connection by applying a voltage. The MLCC, a multilayer ceramic capacitor, has a small thin film of dielectric layer and electrode area according to the use of capacitance and rated voltage. It is a multilayer chip type capacitor with low lead inductance and good high frequency characteristics. It is mainly used for TV, VCR, PC, automotive electronics and communication equipment. As the size of set devices centered on communication devices is miniaturized, the capacity of MLCC is also increasing due to the thinning and multilayering of dielectric layers, the expansion of effective area, and the improvement of materials.
종래의 적층 세라믹 콘덴서를 제조하기 위하여 사용되는 초고압 압착지그 판은 가로,세로 및 두께가 250mm 250mm 1t의 규격으로 제조된 스테인레스 판 사이 에 피압착물(세라믹콘덴서)을 삽입시켜 초고압(400℃에서 850ton의 압력으로 10분간 대기 후 배출)으로 압착시키는 방법으로 제조되고 있으며 상기 스테인레스 판 사이에 피압착물을 삽입시켜 압착시키기 전 공정으로 스테인레스 판의 피압착물이 접촉되는 면에 눌러 붙는 것을 방지하기 위하여 일 측면에 실리콘이 코팅(타측은 일반 비닐)된 이형지(분리지,PET 필름,매트 등)를 작업자가 수작업으로 일일이 부착시키고 그 사이에 피압착물을 삽입시켜 제조하였다. The ultra high pressure crimping jig plate used to manufacture a conventional multilayer ceramic capacitor has a high pressure (850 ton at 400 ° C) by inserting a material to be compressed (ceramic capacitor) between stainless steel plates manufactured in a size of 250mm 250mm 1t. Pressurized for 10 minutes at the pressure of) to be pressed, and to prevent the pressed object from being pressed against the contact surface of the stainless plate by inserting the pressed object between the stainless plates. One side was coated with silicone (on the other side of the normal vinyl) release paper (separation paper, PET film, mat, etc.) by the worker manually by hand to insert the material to be inserted therebetween.
상기한 종래의 제조방법은 압착지그 판의 표면에 이형지를 작업자가 수작업으로 부착시켜서 작업하므로 연속적인 작업을 수행하기 위한 작업공수의 투입이 다대하여 인건비 및 제품비용이 증대되는 단점이 있고 상기 이형지는 초고압에 재사용이 불가능한 소모품으로 재료비가 증대될 뿐만 아니라 이형지의 부착작업 시 숙련된 작업자라 할지라도 실수로 실리콘 코팅면을 반대로 부착시킬 경우 고가의 적층 세라믹 콘덴서의 불량이 다량으로 발생할 수 있는 문제가 항시 잔존하고 있는 것이다. The conventional manufacturing method has a disadvantage in that the labor cost and product cost is increased due to the large input of labor for performing continuous work because the worker attaches the release paper manually to the surface of the pressing jig plate. As a consumable that is not reusable at very high pressure, the material cost is increased and even if a skilled worker accidentally attaches the silicon coated surface in reverse when attaching the release paper, the problem of a large amount of expensive multilayer ceramic capacitors may occur. It remains.
따라서 본 발명은 상기와 같은 종래의 문제점을 해결하기 위한 목적으로 창출된 것으로 적층 세라믹 콘덴서를 제조하는 압착지그 판인 스테인레스 판의 표면과 이면에 변성실리콘 혼합조성물을 코팅하여 반영구적으로 사용이 가능케 하여 제작비용을 절감할 뿐만 아니라 생산효율을 향상시키고 이형지의 사용을 제거하여 작업인력의 축소와 소모품과 그 비용을 절감시킬 수 있으며 제품의 불량률 없이 경쟁력을 증대시킨 압착지그 판의 코팅방법을 제공하기 위한 것이다.Therefore, the present invention was created for the purpose of solving the conventional problems as described above by coating the modified silicone mixed composition on the surface and the back of the stainless plate, which is a pressing jig plate for manufacturing a multilayer ceramic capacitor, it is possible to use semi-permanent production cost In addition to improving the production efficiency and eliminating the use of release paper to reduce the labor force and consumables and their costs, and to provide a coating method of the compressed jig plate to increase the competitiveness without a defective rate of the product.
이하 발명의 요지를 첨부된 도면에 연계시켜 그 구성과 작용을 상세히 설명하면 다음과 같다. Hereinafter, the configuration and operation of the present invention will be described in detail with reference to the accompanying drawings.
도 1 은 본 발명의 순차적인 코팅공정을 도시한 블록 다이어그램도로 압착지그판인 스테인레스 판의 표면을 가공하는 연마공정과 연마된 스테인레스 판을 초음파 세척하는 세척공정과 세척된 스테인레스 판을 가열시키는 가열공정과 가열된 스테인레스 판을 초음파 진동을 이용한 코팅조성물을 저수조에 침지시키는 침지공정과 코팅조성물인 침지된 상태에서 건조시키는 건조공정과 경화공정을 통하여 제조되는 전 공정을 도시한 것이다. 1 is a block diagram showing a sequential coating process of the present invention, the polishing process for processing the surface of the stainless steel plate of the pressing jig plate and the cleaning process for ultrasonic cleaning the polished stainless plate and the heating process for heating the washed stainless plate It shows the entire process manufactured by the drying step and the curing step of the immersion process of immersing the coated composition using ultrasonic vibration in the water storage tank and the coated composition by immersing the superheated stainless plate.
삭제delete
삭제delete
적층 세라믹 콘덴서 제조용 압착지그 판에 코팅조성물를 코팅함에 있어서,In coating the coating composition on the crimping jig plate for manufacturing multilayer ceramic capacitors,
스테인레스 판의 표면과 이면을 샌드 가공하는 연마공정(S1)과;A polishing step (S1) for sand processing the front and back surfaces of the stainless plate;
상기 연마공정(S1)을 거친 스테인레스 판을 증류수를 이용하여 초음파 세척시키는 세척공정(S2)과;A washing step (S2) of ultrasonically washing the stainless plate that has undergone the polishing step (S1) using distilled water;
상기 세척공정(S2)을 거친 스테인레스 판에 코팅조성물의 균일한 흡착을 위하여 로에서 160-200℃의 온도로 가열시키는 가열공정(S3)과;A heating step (S3) of heating at a temperature of 160-200 ° C. in a furnace for uniform adsorption of the coating composition on the stainless plate which has undergone the washing step (S2);
상기 가열공정(S3)을 거친 스테인레스 판의 표면과 이면에 초음파 진동을 이용한 코팅조성물 저수조에 침지시키는 코팅조성물 침지공정(S4)과;A coating composition immersion step (S4) of immersing the coating composition reservoir using ultrasonic vibration on the surface and the back surface of the stainless plate which has undergone the heating step (S3);
상기 코팅조성물이 침지된 스테인레스 판을 실온에서 8-12분간 자연건조시키는 건조공정(S5)과;A drying step (S5) of naturally drying the stainless steel plate on which the coating composition is immersed at room temperature for 8-12 minutes;
상기 건조공정(S5)을 거친 스테인레스 판을 다시 로에서 190-220℃의 온도로 15-25분간 열을 가하는 경화공정(S6)을 통하여 코팅시킬 수 있게 하였다. The stainless plate subjected to the drying step (S5) was able to be coated again through a curing step (S6) by applying heat at a temperature of 190-220 ° C. for 15-25 minutes in a furnace.
이와 같이 된 본 발명은 고온과 초고압에서 압착시켜 제조되는 적층 세라믹 콘덴서를 제조하는 공정에서 압착지그 판의 표면과 이면에 변성실리콘 혼합조성물을 코팅시켜 이형효과를 향상시키고 반영구적인 사용이 가능하며 생산시간을 단축시키고 불량률을 제거하며 작업공수와 제조비용을 절감시켜 제품의 경쟁력을 향상시킬 수 있는 압착지그 판을 제공할 수 있게 한 것이다.The present invention as described above is coated with a modified silicone mixed composition on the surface and the back of the pressing jig plate in the process of manufacturing a multilayer ceramic capacitor manufactured by pressing at high temperature and ultra high pressure to improve the release effect and semi-permanent use and production time It can reduce the defect rate, eliminate the defect rate and reduce the labor cost and manufacturing cost.
상기한 압착지그 판을 제공하기 위하여 스테인레스 판의 표면과 이면에 코팅이 원활하게 이루어질 수 있게 실리콘 혼합물을 조성함에 있어 솔벤트에 변성실리콘과 레진을 혼합시켜 제조한 코팅조성물을 이용하여 용이하게 코팅되면서 반영구적으로 사용이 가능케 하였다.In order to provide the compression jig plate, the coating on the surface and the back of the stainless plate in order to form a silicone mixture in a smooth composition using a coating composition prepared by mixing the modified silicone and resin in a solvent and semi-permanent It can be used as.
상기한 코팅조성물을 효과적으로 코팅시키기 위하여 도 1 에 도시된 바와 같이 연마공정(S1),세척공정(S2),가열공정(S3),코팅조성물침지공정(S4),건조공정(S5) 및 경화공정(S6)을 통하여 코팅시킬 수 있게 하였다.In order to effectively coat the above coating composition, as shown in FIG. 1, a polishing process (S1), a cleaning process (S2), a heating process (S3), a coating composition dipping process (S4), a drying process (S5), and a curing process It was possible to coat through (S6).
상기 코팅방법을 순차적으로 설면하면 다음과 같다If the coating method sequentially described as follows:
연마공정(S1)은 규격(가로,세로,두께)이 250mm 250mm 1t인 스테인레스 판의 표면과 이면의 거칠기를 연마시키는 공정으로 샌드페이퍼를 이용하여 거칠기를 조정하여 연마시킨다.Polishing step (S1) is a process of polishing the surface and the back surface roughness of the stainless steel plate (standard, horizontal, vertical, thickness) of 250mm 250mm 1t to polish by adjusting the roughness using sandpaper.
세척공정(S2)은 상기 스테인레스 판의 표면과 이면의 거칠기를 조정하여 연마된 상태에서 증류수를 이용하여 초음파세척을 통하여 스테인레스 판을 세척신키는 것이다.The washing step (S2) is to wash the stainless plate by ultrasonic cleaning using distilled water in a polished state by adjusting the roughness of the surface and the back surface of the stainless plate.
가열공정(S3)은 상기 세척공정(S2)을 통과한 스테인레스 판을 후속공정에서 코팅조성물이 균일하게 도포될 수 있도록 함과 동시에 흡착력 향상을 위하여 온도를 조절하여 가열시키는 것으로 로에서 160-200℃의 온도조건으로 가열시켜 배출한다.The heating step (S3) is to heat the stainless steel plate that has passed through the washing step (S2) by controlling the temperature to improve the adsorptive power while allowing the coating composition to be uniformly applied in the subsequent step. Discharge by heating to the temperature condition of.
코팅조성물 침지공정(S4)는 변성실리콘,레진 및 솔벤트를 혼합한 코팅조성물을 스테인레스 판에 균일하게 도포하기 위한 것으로 선행공정에서 일정온도로 가열된 상태에서 표면과 이면에 균일하게 흡착시키기 위하여 초음파 기계의 진동을 이용한 코팅조성물 저수조에 침지시켜 코팅조성물을 도포시킨다.Coating composition immersion process (S4) is to uniformly apply the coating composition mixed with modified silicone, resin and solvent to the stainless steel plate. Coating composition by vibration of the coating composition is immersed in the reservoir.
건조공정(S5)은 스테인레스 판에 분사된 코팅 조성물을 건조시키는 공정으로 실온에서 약 8-12분간 자연건조시켜 후속공정에서 원활하게 경화시킬 수 있게 한 것이다. The drying step (S5) is a step of drying the coating composition sprayed on the stainless plate, which is allowed to dry naturally at room temperature for about 8-12 minutes so that it can be cured smoothly in a subsequent step.
경화공정(S6)은 스테인레스 판의 표면과 이면에 도포된 코팅조성물이 자연건조를 거친 상태에서 로에 진입시켜 190-220℃의 온도로 약 15-25분간 가열시켜 코팅조성물을 경화시켜 압착지그 판으로 완성되는 것이다.In the curing process (S6), the coating composition applied to the surface and the back of the stainless steel plate enters the furnace in the state of natural drying, and is heated for about 15-25 minutes at a temperature of 190-220 ° C. to cure the coating composition into a compressed jig plate. It is finished.
상기한 바와 같이 본 발명은 연마공정(S1),세척공정(S2),가열공정(S3),코팅조성물 침지공정(S4),건조공정(S5) 및 경화공정(S6)을 통하여 코팅시키므로 종래 스테인레스 판에 실리콘류의 물질이 코팅이 안 되던 것을 코팅이 될 수 있게 하였으며 이로 인한 압착지그 판의 반영구적 사용이 가능케 한 것이다. As described above, the present invention is conventional stainless because it is coated through a polishing step (S1), washing step (S2), heating step (S3), coating composition dipping step (S4), drying step (S5) and curing step (S6). Silicon coating material was not coated on the plate can be coated, thereby enabling the semi-permanent use of the compressed jig plate.
본 발명은 상술한 특정의 바람직한 실시예에 한정되지 아니하며, 청구범위에서 청구하는 본 발명의 요지를 벗어남이 없이 당해 발명이 속하는 기술분야에서 통상의 지식을 가진 자라면 누구든지 다양한 변형실시가 가능한 것은 물론이고, 그와 같은 변경은 청구범위 기재의 범위 내에 있게 된다.The present invention is not limited to the above-described specific preferred embodiments, and various modifications can be made by any person having ordinary skill in the art without departing from the gist of the present invention claimed in the claims. Of course, such changes will fall within the scope of the claims.
그러므로 본 발명은 종래 적층 세라믹 콘덴서를 제조하는 압착지그 판의 표면과 이면에 실리콘류의 물질을 코팅시키지 못하던 것을 변성실리콘,레진 및 솔벤트 혼합조성물을 제조하여 스테인레스 판의 표면과 이면을 연마,세척,가열,코팅조성물 침지,건조 및 경화공정을 통하여 코팅시켜 반영구적으로 사용이 가능케 하여 제작비용의 절감과 생산효율을 향상시키고 이형지의 사용을 제거하여 작업인력의 축소와 소모품과 제반 비용을 절감시킬 수 있게 하였으며 제품의 불량률 감소로 경쟁력을 증대시킨 등의 효과가 있는 것이다. Therefore, the present invention manufactures a modified silicone, resin, and solvent mixture composition that does not coat silicon materials on the surface and the back surface of the compressed jig plate that manufactures the conventional multilayer ceramic capacitor, and polishes, cleans, It can be used semi-permanently by coating through immersion, drying and curing process of heating, coating composition to reduce production cost, improve production efficiency, and eliminate the use of release paper to reduce workforce, consumables and overall costs. It has the effect of increasing the competitiveness by reducing the defective rate of the product.
Claims (2)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020060057547A KR100810969B1 (en) | 2006-06-26 | 2006-06-26 | TThe method of coating of the laminated ceramic condenser for manufacture extra-high voltage pressure jig board. |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020060057547A KR100810969B1 (en) | 2006-06-26 | 2006-06-26 | TThe method of coating of the laminated ceramic condenser for manufacture extra-high voltage pressure jig board. |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020070090219A Division KR100820094B1 (en) | 2007-09-06 | 2007-09-06 | The coating composition of the laminated ceramic condenser for manufacture extra-high voltage pressure jig board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20080000167A KR20080000167A (en) | 2008-01-02 |
| KR100810969B1 true KR100810969B1 (en) | 2008-03-10 |
Family
ID=39212521
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020060057547A KR100810969B1 (en) | 2006-06-26 | 2006-06-26 | TThe method of coating of the laminated ceramic condenser for manufacture extra-high voltage pressure jig board. |
Country Status (1)
| Country | Link |
|---|---|
| KR (1) | KR100810969B1 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101787895B1 (en) * | 2016-05-27 | 2017-10-18 | 강계수 | The radiator manufacturing method and car radiator for containing graphene |
| KR101787896B1 (en) * | 2016-05-27 | 2017-10-18 | 강계수 | The pipe manufacturing method and metal pipe for containing graphene |
| KR102289613B1 (en) * | 2021-03-30 | 2021-08-17 | 한성산업(주) | Coating method for compression jig of MLCC |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20020079523A (en) | 2001-04-13 | 2002-10-19 | 니뽄 가이시 가부시키가이샤 | Jig for firing electronic components |
-
2006
- 2006-06-26 KR KR1020060057547A patent/KR100810969B1/en active IP Right Grant
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20020079523A (en) | 2001-04-13 | 2002-10-19 | 니뽄 가이시 가부시키가이샤 | Jig for firing electronic components |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101787895B1 (en) * | 2016-05-27 | 2017-10-18 | 강계수 | The radiator manufacturing method and car radiator for containing graphene |
| KR101787896B1 (en) * | 2016-05-27 | 2017-10-18 | 강계수 | The pipe manufacturing method and metal pipe for containing graphene |
| KR102289613B1 (en) * | 2021-03-30 | 2021-08-17 | 한성산업(주) | Coating method for compression jig of MLCC |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20080000167A (en) | 2008-01-02 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR100810969B1 (en) | TThe method of coating of the laminated ceramic condenser for manufacture extra-high voltage pressure jig board. | |
| TWI293911B (en) | Polishing pad | |
| TW201000262A (en) | Polishing pad | |
| CN101722470B (en) | Method for manufacturing large-size ultra-thin laser crystal | |
| US2524932A (en) | Process for producing bonded mica | |
| CN113038731A (en) | Method for manufacturing circuit board bonding pad | |
| JP6921891B2 (en) | Package carrier tape base material and its manufacturing method | |
| TWI735628B (en) | Tapering method for poromeric polishing pad | |
| CN109940967B (en) | Top plate bonding composite process for railway vehicle | |
| CN107172820A (en) | The method that the copper-clad plates of 2.2≤Dk ＜ 6.5 are made using ion implanting plating mode | |
| US6792667B2 (en) | Fully automatic process for magnetic circuit assembly | |
| KR100820094B1 (en) | The coating composition of the laminated ceramic condenser for manufacture extra-high voltage pressure jig board | |
| TWI622459B (en) | Poly-urethane mounting pad | |
| US10322570B2 (en) | Laminate material bonding | |
| KR101317184B1 (en) | Board for using PCB using aluminium foil and method for manufacturing thereof | |
| US20110070814A1 (en) | Method for Manufacturing Polishing Pad and Polishing Pad | |
| TWI515238B (en) | Preparation method of poly-urethane mounting pad | |
| KR100683108B1 (en) | Method for manufacturing multi-layered printed circuit board | |
| KR101897609B1 (en) | Method for filling resin on circuit board | |
| WO2015009238A1 (en) | Method and apparatus for chip-to-wafer integration | |
| FI129541B (en) | Manufacturing composite electroceramics | |
| TWI409137B (en) | Polishing pad and the method of forming micro-structure thereof | |
| KR100579944B1 (en) | Method for Eliminating Difference of Bumps on Wafer or Die | |
| CN104493924A (en) | Indentation ironing method for multi-layer solid wood floor | |
| CN112135426A (en) | High-frequency microwave multilayer board resin hole plugging method |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A201 | Request for examination | ||
| E902 | Notification of reason for refusal | ||
| A107 | Divisional application of patent | ||
| E701 | Decision to grant or registration of patent right | ||
| GRNT | Written decision to grant | ||
| FPAY | Annual fee payment |
Payment date: 20130227 Year of fee payment: 6 |
|
| FPAY | Annual fee payment |
Payment date: 20140227 Year of fee payment: 7 |
|
| FPAY | Annual fee payment |
Payment date: 20150226 Year of fee payment: 8 |
|
| FPAY | Annual fee payment |
Payment date: 20160226 Year of fee payment: 9 |
|
| FPAY | Annual fee payment |
Payment date: 20200227 Year of fee payment: 13 |