KR100779691B1 - Metal plating method of stone surface - Google Patents
Metal plating method of stone surface Download PDFInfo
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- KR100779691B1 KR100779691B1 KR1020060120728A KR20060120728A KR100779691B1 KR 100779691 B1 KR100779691 B1 KR 100779691B1 KR 1020060120728 A KR1020060120728 A KR 1020060120728A KR 20060120728 A KR20060120728 A KR 20060120728A KR 100779691 B1 KR100779691 B1 KR 100779691B1
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1603—Process or apparatus coating on selected surface areas
- C23C18/1605—Process or apparatus coating on selected surface areas by masking
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
- C23C18/2013—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by mechanical pretreatment, e.g. grinding, sanding
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/22—Roughening, e.g. by etching
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/42—Coating with noble metals
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
- C23C28/02—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material
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- Organic Chemistry (AREA)
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- Electroplating Methods And Accessories (AREA)
Abstract
Description
도 1은 본 발명에 따른 석재 표면의 금속도금방법을 나타낸 블록도.1 is a block diagram showing a metal plating method of the stone surface according to the present invention.
도 2는 본 발명에 따른 함침친수방법을 나타낸 블록도.2 is a block diagram showing an impregnation hydrophilic method according to the present invention.
본 발명은 석재 표면의 금속도금방법에 관한 것으로, 더욱 세부적으로는 석재 표면에 화학적 방법으로 금속을 전착시키고, 상기 전착된 금속의 통전성을 이용하여 모재인 석재 표면에 전기도금을 행하는 석재 표면의 금속도금방법에 관한 것이다.The present invention relates to a metal plating method of the stone surface, and more particularly to the metal surface of the stone surface for electrodepositing the metal on the stone surface by a chemical method, and electroplating the surface of the base stone using the electrical conductivity of the electrodeposited metal It relates to a plating method.
화학도금이란, 약품의 이온화 경향차를 이용하여 소재표면에 금속을 석출시키는 방법으로서, 이때 석출되는 금속층은 대부분 박막으로서 외관이 떨어지고 내식성이 저하되므로, 여기에 전해도금을 행하여 미려한 외관과 충분한 도금 두께층을 형성함으로서 전기 통전성 등과 같은 금속의 특징을 부여하게 된다.Chemical plating is a method of depositing metal on the surface of a material by using a difference in the ionization tendency of chemicals. At this time, most of the deposited metal layers are thin films, which have poor appearance and corrosion resistance. Forming a layer imparts the characteristics of the metal, such as electrical conductivity.
석재와 같은 부도체에 금속을 석출 또는 코팅시키는 방법으로서 수지에 금속 분말을 섞어 도포하는 도장방법과, 수지상에 화학 및 전해를 이용한 도금방법이 있다.As a method of depositing or coating a metal on an insulator such as a stone, there are a coating method in which a metal powder is mixed and applied to a resin, and a plating method using chemical and electrolytic on a resin.
그러나, 상기와 같은 종래기술은 도장에 의한 도포나 수지상에 도금하는 방식으로 석재에 도금을 하면 외관 및 통전성이 떨어지는 문제점이 있다.However, the prior art as described above has a problem in that the appearance and current conduction are inferior when the stone is plated by coating or coating on resin.
상술한 바와 같은 문제점을 해결하기 위하여, 본 발명에서는 석재 표면상에 치밀하고 두터운 도금 층을 형성하여 통전성과 같은 금속 기능성이 좋고, 외관이 미려하도록 석재 표면의 다공질상(미세구멍)에 도금하는 석재 표면의 금속도금방법을 제공하는데 목적이 있다.In order to solve the problems described above, in the present invention, by forming a dense and thick plating layer on the stone surface, the metal is plated on the porous phase (fine hole) of the stone surface so that the metal functionality such as electrical conductivity is good and the appearance is beautiful. It is an object to provide a metal plating method of the surface.
목적을 달성하기 위한 구성으로는,In the structure to achieve the purpose,
석재 표면의 오염 및 이물질을 제거하는 탈지공정과; 상기 탈지공정 후 석재 층이 부분적으로 노출되도록 노출부위에 마스킹제를 사용하여 마스킹하는 마스킹공정과; 상기 마스킹공정 후 에칭 용액을 사용하여 35℃~50℃에서 20분간 침적시켜 균일한 에칭이 이루어지도록 하는 에칭공정과; 상기 에칭공정 후 석재 표면에 함침액를 함침시켜 다공질 층을 막고, 도금액과의 친수성을 높여주는 함침친수공정과; 상기 함침친수공정 후 팔라듐 또는 팔라듐, 석합금 수용액에 30℃~50℃ 온도에서 20분간 침적하여 화학 도금을 용이하게 하는 금속침착공정과; 상기 금속침착공정 후 수산화나트륨 수용액에 20분간 침적하여 화학도금층과 금속침착층과의 밀착성을 높이는 환원처리공정과; 상기 환원처리공정 후 동 또는 니켈의 무전해 도금액에 교반과 함께 20~30분간 침적하여 석재 표면에 전기 도전성을 부여하는 화학도금공정과; 상기 화학도금공정 후 하지 및 마무리 도금으로서 연성이 강한 광택제가 함유 된 황산구리 전해도금을 행하여 석재상에 광택과 도금두께를 부여하여 도전성을 향상시키는 전해 동도금공정과; 상기 전해 동도금공정 후 다른 하지 및 마무리 도금으로서 황산 니켈 수용액에서 광택 및 반광택 또는 무광택으로 도금하는 전해 니켈도금공정과; 상기 전해 니켈도금공정 후 또 다른 마무리 도금으로서 전해 금도금공정과; 상기 마무리 도금 공정 후 변색 방지제 또는 코팅제를 사용하여 10㎛ 이하 박막을 코팅하여 내식성 향상 및 도금 층의 변색 방지를 위한 코팅처리공정과; 상기 코팅처리공정 후 마스킹공정에서 부착된 마스킹제를 NMP(N-Methyl-2-Pyrrolidone) 또는 유기용제로 제거하는 마스킹 제거공정과; 상기 마스킹 제거공정 후 마무리 도금 색상과 하지 도금 색상차 또는 마무리 도금과 석재와의 색상차를 주도록 레이저 마킹기를 이용하여 도금층 위에 레이저로 박막을 제거하는 레이저 마킹공정을 포함한다.A degreasing step of removing contamination and foreign matter from the stone surface; A masking process for masking the exposed portion using a masking agent so that the stone layer is partially exposed after the degreasing step; An etching step of depositing 20 minutes at 35 ° C. to 50 ° C. for 20 minutes using an etching solution after the masking step to achieve uniform etching; An impregnation hydrophilic process that impregnates the surface of the stone with an impregnation solution after the etching process to prevent the porous layer and to increase the hydrophilicity with the plating solution; A metal deposition step of facilitating chemical plating by immersing in palladium or palladium and an aqueous solution of sintered alloy at a temperature of 30 ° C. to 50 ° C. for 20 minutes after the impregnation hydrophilic process; A reduction treatment step of increasing the adhesion between the chemical plating layer and the metal deposition layer by immersing in an aqueous sodium hydroxide solution for 20 minutes after the metal deposition step; A chemical plating process of imparting electrical conductivity to the stone surface by immersion for 20 to 30 minutes with stirring in an electroless plating solution of copper or nickel after the reduction treatment step; An electrolytic copper plating process to improve electroconductivity by giving copper sulfate electroplating containing a ductile strong polishing agent as the base and finish plating after the chemical plating process to impart gloss and plating thickness on the stone; An electrolytic nickel plating process for plating with glossy, semi-gloss or matte in nickel sulfate aqueous solution as another base and finish plating after the electrolytic copper plating process; An electrolytic gold plating process as another finishing plating after the electrolytic nickel plating process; A coating treatment process for improving corrosion resistance and preventing discoloration of the plating layer by coating a thin film of 10 μm or less using a discoloration inhibitor or a coating agent after the finishing plating process; A masking removing step of removing the masking agent attached in the masking step after the coating treatment step with N-Methyl-2-Pyrrolidone (NMP) or an organic solvent; After the masking removal process includes a laser marking process for removing the thin film with a laser on the plating layer using a laser marking machine to give a color difference between the finish plating color and the base plating color difference or the finish plating and stone.
본 발명의 다른 특징으로서, 상기 마스킹공정에서의 마스킹제는 마스킹 잉크 또는 마스킹 테이프를 선택적으로 사용하되, 상기 마스킹 잉크는 아크릴 수지 100g에 NMP(N-Methyl-2-Pyrrolidone) 100ml을 혼합하여 용해하고, 상기 용액에 아크릴 염료를 첨가하여 원하는 색상으로 조색된다.As another feature of the present invention, a masking agent in the masking process may optionally use a masking ink or a masking tape, and the masking ink is dissolved by mixing 100 ml of NMP (N-Methyl-2-Pyrrolidone) with 100 g of acrylic resin. To this solution, acrylic dye is added to color the desired color.
본 발명의 또 다른 특징으로서, 상기 함침친수공정은 아크릴 수지 100g을 NMP(N-Methyl-2-Pyrrolidone) 100ml에 용해하고, 물 1l를 첨가하여 함침액을 제조하는 함침액제조공정과; 상기 함침액에 석재를 넣은 후 상온 20℃에서 10분간 초음파 진동을 가하여 석재 표면 및 미세구멍까지 함침액을 침투시키는 함침공정과; 상기 함침액을 침투시킨 석재를 80℃ 온수에서 약 10분간 침적하여 아크릴 수지를 경 화시켜 석재 표면상의 다공질(미세구멍)을 밀봉시키는 밀봉공정과; 상기 밀봉된 석재를 상기 에칭공정의 에칭액에서 5분간 재처리한 후 Nonion 계면활성제 용액에서 30~40℃로 15분간 침적시켜 이후의 모든 약품들의 수세가 이루어지도록 하여 공정간 간섭에 의한 불량을 방지하는 친수공정을 포함한다.As another feature of the present invention, the impregnated hydrophilic process is an impregnating solution manufacturing process for dissolving 100g of acrylic resin in NMP (N-Methyl-2-Pyrrolidone) 100ml, to prepare an impregnation liquid by adding 1l of water; An impregnation process of impregnating the impregnation solution to the surface of the stone and the micropores by applying ultrasonic vibration at room temperature for 20 minutes after putting the stone in the impregnation solution; A sealing step of immersing the stone infiltrated with the impregnation solution at 80 ° C. hot water for about 10 minutes to cure the acrylic resin to seal the porous (fine pores) on the stone surface; The sealed stone was reprocessed in the etching solution of the etching process for 5 minutes and then immersed in a nonionic surfactant solution at 30 to 40 ° C. for 15 minutes to wash all subsequent chemicals so as to prevent defects due to inter-process interference. Hydrophilic process.
본 발명의 또 다른 특징으로서, 상기 금속침착공정에서의 팔라듐 수용액은 금속염(염화 팔라듐 12g/l, 브롬화 팔라듐 8g/l 혼합)과, 환원제(차아 인산 소다 100~250g/l, 하이드라진 100~150g/l, 트리 에틸 아민보탄 10ml/l 혼합) 및 치오 유기화합물 10ml/l을 혼합한 후, 수산화 암모늄과 염산으로 PH 8~12로 조정한다.As another feature of the present invention, the aqueous palladium solution in the metal deposition process is a metal salt (mixed palladium chloride 12g / l, palladium bromide 8g / l), reducing agent (sodium hypophosphite 100 ~ 250g / l, hydrazine 100 ~ 150g / 1, 10 ml / l of triethyl aminebotan) and 10 ml / l of an organic organic compound are mixed, and then adjusted to PH 8-12 with ammonium hydroxide and hydrochloric acid.
본 발명의 또 다른 특징으로서, 상기 화학도금공정 후 전해 동도금공정 또는 전해 니켈도금공정 또는 전해 금도금공정을 선택적으로 도금처리 한다.As another feature of the present invention, after the chemical plating process, the electrolytic copper plating process or the electrolytic nickel plating process or the electrolytic gold plating process is selectively plated.
도 1은 본 발명에 따른 석재 표면의 금속도금방법을 나타낸 블록도이고, 도 2는 본 발명에 따른 함침친수방법을 나타낸 블록도이다.1 is a block diagram showing a metal plating method of the stone surface according to the present invention, Figure 2 is a block diagram showing the impregnated hydrophilic method according to the present invention.
이하, 도면을 참고로 석재 표면의 금속도금방법을 상세하게 설명하면 다음과 같다.Hereinafter, the metal plating method of the stone surface with reference to the drawings in detail as follows.
도 1은 본 발명의 석재 표면의 금속도금방법을 나타낸 블록도로써, 탈지공정(S10)과, 마스킹공정(S20), 에칭공정(S30), 함침친수공정(S40), 금속침착공정(S50), 환원처리공정(S60), 화학도금공정(S70), 전해 동도금공정(S80), 전해 니켈도금공정(S90), 전해 금도금공정(S100), 코팅처리공정(S110), 마스킹 제거공정(S120) 및 레이저 마킹공정(S130)을 포함한다.1 is a block diagram showing the metal plating method of the stone surface of the present invention, a degreasing step (S10), masking step (S20), etching step (S30), impregnated hydrophilic step (S40), metal deposition step (S50) , Reduction process (S60), chemical plating process (S70), electrolytic copper plating process (S80), electrolytic nickel plating process (S90), electrolytic gold plating process (S100), coating treatment process (S110), masking removal process (S120) And laser marking process (S130).
먼저, 석재 표면에 묻어있는 오염 및 이물질을 제거하고(S10 공정), 상기 석 재 층이 부분적으로 노출되도록 하기 위하여 노출부위에 마스킹제를 사용하여 마스킹한다(S20 공정).First, to remove the contamination and foreign matter on the stone surface (S10 step), and masking using a masking agent on the exposed part in order to partially expose the stone layer (S20 step).
상기 마스킹공정(S20)에서의 마스킹제는 마스킹 잉크 또는 마스킹 테이프를 선택적으로 사용하는데, 상기 마스킹 잉크는 아크릴 수지 100g에 NMP(N-Methyl-2-Pyrrolidone) 100ml을 혼합하여 용해하고, 상기 용액에 아크릴 염료를 첨가하여 표식이 되도록 원하는 색상으로 조색되고, 상기 마스킹 테이프는 일반적으로 사용되는 마스킹 테이프를 사용하게 된다.The masking agent in the masking process (S20) optionally uses a masking ink or a masking tape, and the masking ink is dissolved by mixing 100 ml of NMP (N-Methyl-2-Pyrrolidone) with 100 g of acrylic resin, An acrylic dye is added to color the desired color to be a mark, and the masking tape uses a masking tape that is generally used.
상기 마스킹공정(S20) 후 에칭 용액을 사용하여 35℃~50℃에서 20분간 침적시켜 균일한 에칭이 이루어지도록 하는데, 상기 에칭 용액은 불산 5~10%와, 염화 제2철 10% 및 글리세린 0.2ml/l의 완충제를 혼합함으로써, 석재 표면적을 크게하여 밀착력을 높인다(S30 공정).After the masking process (S20) using an etching solution to be deposited for 20 minutes at 35 ℃ ~ 50 ℃ to achieve a uniform etching, the etching solution is 5-10% hydrofluoric acid, 10% ferric chloride and 0.2 glycerine By mixing the buffer of ml / l, the stone surface area is increased to increase the adhesion (S30 step).
상기 에칭공정(S30) 후 석재 표면에 함침액를 함침시켜 다공질 층을 막고, 도금액과의 친수성을 높여주기 위하여, 도 2와 같이 아크릴 수지 100g을 NMP(N-Methyl-2-Pyrrolidone) 100ml에 용해하고, 물 1l를 첨가하여 함침액을 제조하는 함침액제조공정(S41)과, 상기 함침액에 석재를 넣은 후 상온 20℃에서 10분간 초음파 진동을 가하여 석재 표면 및 미세구멍까지 함침액을 침투시키는 함침공정(S42)과, 상기 함침액을 침투시킨 석재를 80℃ 온수에서 약 10분간 침적하여 아크릴 수지를 경화시켜 석재 표면상의 다공질(미세구멍)을 밀봉시키는 밀봉공정(S43)과, 상기 밀봉된 석재를 상기 에칭공정(S30)의 에칭액에서 5분간 재처리한 후 Nonion 계면활성제 용액에서 30~40℃로 15분간 침적시켜 이후의 모든 약품들의 원활한 접촉이 이루 어지도록 하여 공정간 간섭에 의한 불량을 방지하는 친수공정(S44)을 포함한다(S40 공정).After the etching step (S30) to impregnate the surface of the stone by impregnating the porous layer, and in order to increase the hydrophilicity with the plating solution, as shown in Figure 2 100g of acrylic resin in NMP (N-Methyl-2-Pyrrolidone) 100ml Impregnating solution manufacturing process (S41) for preparing the impregnating solution by adding 1 l of water, and impregnating the impregnating solution to the stone surface and the micropores by applying ultrasonic vibration at room temperature for 20 minutes after putting the stone in the impregnating solution. Step (S42) and the sealing step (S43) for immersing the stone impregnated with the impregnation liquid at 80 ℃ hot water for about 10 minutes to cure the acrylic resin to seal the porous (micropores) on the stone surface, and the sealed stone After reprocessing for 5 minutes in the etching solution of the etching step (S30) and then immersed for 15 minutes at 30 ~ 40 ℃ in a non-ionic surfactant solution to ensure a smooth contact of all subsequent chemicals to prevent defects due to inter-process interference. It comprises a hydrophilic process (S44) to (S40 step).
상기 함침친수공정(S40) 후 팔라듐 또는 팔라듐, 석합금 수용액에 30℃~50℃ 온도에서 20분간 침적하여 차후의 화학 도금이 용이하도록 하는데, 상기 팔라듐 수용액은 금속염(염화 팔라듐 12g/l, 브롬화 팔라듐 8g/l 혼합)과, 환원제(차아 인산 소다 100~250g/l, 하이드라진 100~150g/l, 트리 에칠 아민보탄 10ml/l 혼합) 및 치오 유기화합물 10ml/l을 혼합한 후, 수산화 암모늄과 염산으로 PH 8~12로 조정한다(S50 공정).After the impregnated hydrophilic process (S40), it is immersed in palladium or palladium, an aqueous solution of sintered alloy for 20 minutes at 30 ° C. to 50 ° C. to facilitate subsequent chemical plating. 8 g / l mixed), a reducing agent (100-250 g / l hypophosphite, 100-150 g / l hydrazine, 10 ml / l of triethylaminebotan) and 10 ml / l of an organic organic compound, and then ammonium hydroxide and hydrochloric acid To pH 8-12 (step S50).
상기 금속침착공정(S50) 후 화학도금층과 금속침착층과의 밀착성을 높여주기 위하여 수산화나트륨 수용액에 20분간 침적하는데, 상기 수산화나트륨 수용액은 NaOH 450g/l로, 상기 금속침착공정(S50)에서의 팔라듐 도금층의 산화막이 제거되도록 하여 밀착력을 향상시킨다(S60 공정).After the metal deposition process (S50) to immerse in the sodium hydroxide aqueous solution for 20 minutes to improve the adhesion between the chemical plating layer and the metal deposition layer, the sodium hydroxide aqueous solution is NaOH 450g / l, in the metal deposition process (S50) The oxide film of the palladium plating layer is removed to improve the adhesion (S60 step).
상기 환원처리공정(S60) 후 동 또는 니켈의 무전해 도금액에 교반과 함께 20~30분간 침적하여 석재 표면에 전기 도전성을 부여하는데, 상기 무전해 니켈도금액은 황산니켈 25g/l, 초산나트륨 15g/l, DMAB(디멜틸아민보란) 4g/l, 초산납 0.002g/l를 혼합하고, 무전해 동도금액은 황산동 15g/l, 롯셀염 40g/l, 37% 포름알데히드 6ml/l, 산화바나듐 0.001g/l를 혼합한다(S70 공정).After the reduction treatment step (S60), the copper or nickel electroless plating solution was deposited with stirring for 20 to 30 minutes to give electrical conductivity to the stone surface. The electroless nickel plating solution is nickel sulfate 25g / l, sodium acetate 15g / l, DMAB (dimeltylamineborane) 4g / l, lead acetate 0.002g / l, and the electroless copper plating solution is copper sulfate 15g / l, lotel salt 40g / l, 37% formaldehyde 6ml / l, vanadium oxide 0.001 g / l is mixed (S70 process).
상기 화학도금공정(S70) 후 석재상의 광택과 도금두께를 부여하여 도전성을 향상시키기 위하여, 하지 및 마무리 도금으로서 연성이 강한 광택제(농도는 1%(v/v))가 함유된 황산구리 전해도금을 행하는데, 상기 황산구리 전해도금액은 황 산동 220g/l, 금속동 56g/l, 황산 75g/l, 염소이온(Cl-) 70ppm, 광택제(튜맥HS) 1%(v/v), 물(D.I수)을 혼합한다(S80 공정).After the chemical plating process (S70) in order to give the stone gloss and plating thickness to improve the conductivity, copper sulfate electroplating containing a ductile strong polish (concentration is 1% (v / v)) as the base and finish plating The copper sulfate electrolytic solution is copper sulfate 220g / l, metal copper 56g / l, sulfuric acid 75g / l, chlorine ion (Cl-) 70ppm, polisher (Tumac HS) 1% (v / v), water (DI Water) (step S80).
상기 전해 동도금공정(S80) 후 광택 및 반광택 또는 무광택으로 도금하기 위하여, 다른 하지 및 마무리 도금으로서 황산 니켈 수용액에서 도금하는데, 상기 황산니켈 수용액은 황산니켈 188g/l, 붕산 30g/l을 혼합 또는 황산니켈 300g/l, 염화니켈 60g/l, 붕산 37.5g/l을 혼합한다(S90 공정).After the electrolytic copper plating process (S80), in order to plate with gloss and semi-gloss or matte, it is plated in a nickel sulfate aqueous solution as another base and finish plating, the nickel sulfate aqueous solution is mixed or nickel nickel 188g / l, boric acid 30g / l Nickel sulfate 300g / l, nickel chloride 60g / l, boric acid 37.5g / l is mixed (step S90).
상기 전해 니켈도금공정(S90) 후 금색 빛깔의 미려함을 위하여, 또 다른 마무리 도금으로서 시안화 금 칼륨 8g/l, 구연산 60g/l, 코발트 0.2~0.5g/l로 조성되는 금도금을 실시한다(S100 공정).After the electrolytic nickel plating process (S90), in order to enhance the color of the gold color, gold plating consisting of 8 g / l of gold potassium cyanide, 60 g / l of citric acid, and 0.2 to 0.5 g / l of cobalt is performed as another finishing plating (S100 process). ).
상기 마무리 도금 공정 후 변색 방지제 또는 코팅제를 사용하여 10㎛ 이하 박막을 코팅(침적코팅 또는 스프레이 코팅 또는 전착 코팅 중 선택)하여 내식성 향상 및 도금 층의 변색 방지를 위한 코팅처리(S110 공정)와, 상기 코팅처리공정(S110) 후 마스킹공정(S20)에서 부착된 마스킹제를 NMP(N-Methyl-2-Pyrrolidone) 또는 유기용제로 제거하게 된다(S120 공정).After the finishing plating process by using a discoloration inhibitor or coating agent coating a thin film of 10㎛ or less (selection of deposition coating or spray coating or electrodeposition coating) to improve the corrosion resistance and to prevent the discoloration of the coating layer (S110 process), and After the coating treatment step S110, the masking agent attached in the masking step S20 is removed by NMP (N-Methyl-2-Pyrrolidone) or an organic solvent (step S120).
상기 마스킹 제거공정(S120) 후 마무리 도금 색상과 하지 도금 색상차 또는 마무리 도금과 석재와의 색상차가 이루어지도록 레이저 마킹기를 이용하여 도금층 위에 레이저로 박막을 제거한다(S130 공정).After the masking removing process (S120) to remove the thin film on the plated layer with a laser using a laser marking machine to achieve a color difference between the finish plating color and the underlying plating color or the finish plating and stone (S130 process).
또한, 상기 화학도금공정(S70) 후 전해 동도금공정(S80) 또는 전해 니켈도금공정(S90) 또는 전해 금도금공정(S100)을 선택적으로 도금처리한 후, 코팅처리공정(S110)과 마스킹 제거공정(S120) 및 레이저 마킹공정(S130)으로 마무리 할 수 있 다.In addition, after the chemical plating step (S70) after the electrolytic copper plating step (S80) or electrolytic nickel plating step (S90) or electrolytic gold plating step (S100) selectively plating, coating treatment step (S110) and masking removal step ( S120) and laser marking process (S130) can be finished.
제작하고자 하는 제품의 특성에 따라 상기 화학도금공정(S70) 후 동도금, 니켈도금, 금도금 이외에 은(KAg(CN)2) 65~85g/l, 유리시안화칼륨 60~120g/l로 조성되는 전해 은도금 또는 황산 제1주석 15~45g/l, 주석금속 7.5~22.5g/l, 황산 135~210g/l로 조성되는 전해 석도금 또는 크롬산 525g/l, 황산 1g/l, 규불산 7g/l로 조성되는 전해 크롬도금을 추가적으로 선택하여 도금처리 할 수 있다.Electrolytic silver plating composed of silver (KAg (CN) 2 ) 65 ~ 85g / l,
상기와 같은 석재 표면의 금속도금방법은 전도성을 요구하는 석재물 및 각종 기념비(기념탑)와 사찰의 부도탑, 사리탑, 석불, 석등 및 호랑이, 고래 등의 각종 동물상과 같은 석재 조형물에 응용하면 금속 기능성(통전성)이 좋고, 외관이 미려한 석재 조형물을 제작할 수 있다.The metal plating method of the stone surface as described above is applicable to stone materials requiring conductivity and various monuments (memorial towers) and stone sculptures such as Buddhist pagodas, stupas, stupas, stone lanterns, tigers, whales, and other animal sculptures. It has good electrical conductance and can produce a stone sculpture with a beautiful appearance.
본 발명은 특정의 실시 예와 관련하여 도시 및 설명하였지만, 첨부된 특허청구범위에 의해 나타난 발명의 사상 및 영역으로부터 벗어나지 않는 한도 내에서 다양한 개조 및 변화가 가능하다는 것을 당업계에서 통상의 지식을 가진 자라면 누구나 쉽게 알 수 있을 것이다.While the invention has been shown and described with respect to particular embodiments, it will be apparent to those skilled in the art that various modifications and variations can be made without departing from the spirit and scope of the invention as set forth in the appended claims. Anyone can grow up easily.
상기한 바와 같이, 본 발명은 석재 표면상에 치밀하고 두터운 도금 층을 형성하여 통전성과 같은 금속 기능성을 부여하고, 상기 석재 표면의 다공질상(미세구멍)에 금속도금을 실시함에 따라 외관이 미려해지는 효과가 있다.As described above, the present invention forms a dense and thick plating layer on the stone surface to impart metal functionality such as electrical conductivity, and the appearance is enhanced by applying metal plating to the porous phase (fine hole) of the stone surface. It works.
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WO2023028088A3 (en) * | 2021-08-24 | 2024-04-04 | Acs Enterprises, Llc | Copper treatment additive |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
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JPH05311449A (en) * | 1992-05-08 | 1993-11-22 | Nippon Kagaku Sangyo Kk | Method for forming metallic plating layer on surface of inorganic material building material product and this inorganic material building material product |
JPH08127981A (en) * | 1994-10-28 | 1996-05-21 | Canon Inc | Ink for ink-jet printing and ink-jet printing method |
KR20050072367A (en) * | 2004-01-06 | 2005-07-11 | 엘지전자 주식회사 | Electress plating method low temperature simultaneous plasticity of ceramic substrate |
KR20050078380A (en) * | 2004-01-29 | 2005-08-05 | 포맥스 주식회사 | Electroless plating method of stone |
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Publication number | Priority date | Publication date | Assignee | Title |
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JPH05311449A (en) * | 1992-05-08 | 1993-11-22 | Nippon Kagaku Sangyo Kk | Method for forming metallic plating layer on surface of inorganic material building material product and this inorganic material building material product |
JPH08127981A (en) * | 1994-10-28 | 1996-05-21 | Canon Inc | Ink for ink-jet printing and ink-jet printing method |
KR20050072367A (en) * | 2004-01-06 | 2005-07-11 | 엘지전자 주식회사 | Electress plating method low temperature simultaneous plasticity of ceramic substrate |
KR20050078380A (en) * | 2004-01-29 | 2005-08-05 | 포맥스 주식회사 | Electroless plating method of stone |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
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WO2023028088A3 (en) * | 2021-08-24 | 2024-04-04 | Acs Enterprises, Llc | Copper treatment additive |
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