KR100774529B1 - Copper Plating Method for Flexible Printed Circuit Board - Google Patents

Copper Plating Method for Flexible Printed Circuit Board Download PDF

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KR100774529B1
KR100774529B1 KR1020060032471A KR20060032471A KR100774529B1 KR 100774529 B1 KR100774529 B1 KR 100774529B1 KR 1020060032471 A KR1020060032471 A KR 1020060032471A KR 20060032471 A KR20060032471 A KR 20060032471A KR 100774529 B1 KR100774529 B1 KR 100774529B1
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South Korea
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hole
layer plate
dynamic layer
copper
circuit board
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KR1020060032471A
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Korean (ko)
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KR20070101459A (en
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이봉준
고상준
김홍삼
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(주)인터플렉스
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0055—After-treatment, e.g. cleaning or desmearing of holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

본 발명은 연성인쇄회로기판의 동도금방법에 관한 것으로, 더욱 자세하게는 연성인쇄회로기판의 스루홀의 전기적 신뢰성을 높일 수 있는 연성인쇄회로기판의 동도금방법에 관한 것이다.The present invention relates to a copper plating method of a flexible printed circuit board, and more particularly, to a copper plating method of a flexible printed circuit board that can increase the electrical reliability of the through-hole of the flexible printed circuit board.

본 발명은, 폴리이미드 및 구리막을 순차적으로 증착하여 동적층판을 형성하는 동적층판 형성단계, 상기 동적층판에 비아홀 및 스루홀을 형성하는 홀 형성단계; 상기 비아홀 및 스루홀이 형성된 동적층판을 동도금하는 동도금단계, 상기 동도금된 동적층판의 비아홀 및 스루홀의 둘레부분에 드라이필름을 도포하는 드라이필름 도포단계 및 상기 동적층판의 드라이필름이 도포되지 않은 부분을 소정의 두께만 잔류하도록 에칭하는 하프에칭단계를 포함한다.The present invention provides a dynamic layer plate forming step of sequentially depositing a polyimide and a copper film to form a dynamic layer plate, a hole forming step of forming a via hole and a through hole in the dynamic layer plate; Copper plating step of copper plating the dynamic layer plate formed with the via hole and the through hole, dry film application step of applying a dry film to the circumferential portion of the via hole and the through hole of the copper plated dynamic layer plate and the dry film of the dynamic layer plate is not applied A half etching step of etching so that only a predetermined thickness remains.

본 발명에 따르면, 동적층판에 드라이필름을 도포하기 전에 도금을 실시하고, 비아홀 및 스루홀의 둘레부분을 제외한 동적층판의 하측면을 소정 두께의 구리막만 잔류하도록 하프에칭함으로써, 스루홀의 전기적 신뢰도를 크게 향상시킬 수 있다.According to the present invention, plating is applied before the dry film is applied to the dynamic layer plate, and half-etching the lower side of the dynamic layer plate except for the periphery of the via hole and the through hole so that only a copper film having a predetermined thickness remains, thereby improving the electrical reliability of the through hole. It can greatly improve.

FPCB, 도금, 하프에칭, 비아홀, 드라이필름 FPCB, Plating, Half Etching, Via Hole, Dry Film

Description

연성인쇄회로기판의 동도금방법{Copper Plating Method for Flexible Printed Circuit Board}Copper Plating Method for Flexible Printed Circuit Board

도 1은 종래의 발명에 따른 연성인쇄회로기판 동도금방법의 흐름도,1 is a flow chart of a flexible printed circuit board copper plating method according to the prior invention,

도 2a 내지 도 2d는 종래의 발명에 따른 연성인쇄회로기판의 도금과정을 나타낸 단면도,2A to 2D are cross-sectional views illustrating a plating process of a flexible printed circuit board according to the related art;

도 3은 본 발명의 바람직한 일 실시예에 따른 연성인쇄회로기판 동도금방법의 흐름도,3 is a flow chart of a flexible printed circuit board copper plating method according to an embodiment of the present invention;

도 4a 내지 도 4e는 본 발명의 바람직한 일 실시예에 따른 연성인쇄회로기판의 도금과정을 나타낸 단면도이다.4A through 4E are cross-sectional views illustrating a plating process of a flexible printed circuit board according to an exemplary embodiment of the present invention.

<도면 주요 부분에 대한 부호의 설명><Explanation of symbols for the main parts of the drawings>

201, 401 : 구리막 202, 402 : 폴리이미드201, 401: copper film 202, 402: polyimide

203, 403 : 비아홀 204, 404 : 스루홀203, 403: Via Hole 204, 404: Through Hole

205, 405 : 드라이필름 206, 406 : 도금층205 and 405 dry film 206 and 406 plating layer

본 발명은 연성인쇄회로기판의 동도금방법에 관한 것으로, 더욱 자세하게는 연성인쇄회로기판의 스루홀의 전기적 신뢰성을 높일 수 있는 연성인쇄회로기판의 동도금방법에 관한 것이다.The present invention relates to a copper plating method of a flexible printed circuit board, and more particularly, to a copper plating method of a flexible printed circuit board that can increase the electrical reliability of the through-hole of the flexible printed circuit board.

연성인쇄회로기판(FPCB : Flexible Printed Circuit Board)은, 집적 회로나 저항기 또는 스위치 등의 전기적 부품들이 납땜되는 얇은 판인 인쇄회로기판(PCB)의 일종으로서, 작업성이 뛰어나고 내열성, 내곡성 및 내약품성을 구비하여 휴대폰, 디지털카메라, 캠코더, CD플레이어, 게임기 등 다양한 전자기기의 핵심 소재로 사용되고 있다.Flexible Printed Circuit Board (FPCB) is a kind of printed circuit board (PCB), which is a thin plate to which electrical parts such as integrated circuits, resistors or switches are soldered, and has excellent workability, heat resistance, bending resistance, and chemical resistance. It is used as a core material of various electronic devices such as mobile phones, digital cameras, camcorders, CD players, game machines.

이러한 연성인쇄회로기판의 동도금과정을 도 1 및 도 2를 참조하여 살펴보도록 한다.The copper plating process of the flexible printed circuit board will be described with reference to FIGS. 1 and 2.

도 1은 종래의 발명에 따른 연성인쇄회로기판 동도금방법의 흐름도이고, 도 2는 종래의 발명에 따른 연성인쇄회로기판의 도금과정을 나타낸 단면도이다.1 is a flow chart of a flexible printed circuit board copper plating method according to the conventional invention, Figure 2 is a cross-sectional view showing a plating process of the flexible printed circuit board according to the conventional invention.

먼저, 폴리이미드(202) 및 구리막(201)을 순차적으로 증착하여 동적층판을 형성한다(S110).First, the polyimide 202 and the copper film 201 are sequentially deposited to form a dynamic layer (S110).

다음으로, 동적층판에 CNC드릴 등으로 비아홀(203) 및 스루홀(204)을 형성한 한다(S120).Next, via holes 203 and through holes 204 are formed in the dynamic lamination plate by using a CNC drill (S120).

그 후, 무전해 동도금을 실시하여 전해도금 시 필요한 촉매역할을 할 수 있도록 화학입자를 동적층판에 증착한다(S125)Thereafter, electroless copper plating is performed to deposit chemical particles on the dynamic layer plate so as to play a necessary catalyst role during electroplating (S125).

그리고 나서, 화학입자가 증착된 동적층판의 도금하고자 하는 측 반대면에 드라이필름(205)을 도포하고(S130), 전해 동도금을 실시하여 드라이필름(104)이 도포되지 않은 면에 도금층(206)을 형성한다(S140).Then, the dry film 205 is applied to the side opposite to the side of the dynamic layer plate on which the chemical particles are deposited (S130), and the electrolytic copper plating is applied to the plating layer 206 on the surface where the dry film 104 is not applied. To form (S140).

그러나, 상기한 바와 같은 종래의 발명에 따른 연성인쇄회로기판의 동도금방법은 도 2d에서 나타난 바와 같이 스루홀(204)의 도금층(206)이 드라이필름(205)에 가까워질수록 그 두께가 엷어져 연성인쇄회로기판의 층간 전기적 접속에 대한 신뢰도가 낮아지는 단점이 있다.However, in the copper plating method of the flexible printed circuit board according to the related art as described above, as the plating layer 206 of the through hole 204 gets closer to the dry film 205 as shown in FIG. 2D, the thickness thereof becomes thinner. There is a disadvantage that the reliability of the electrical connection between layers of the flexible printed circuit board is lowered.

본 발명은 상술한 문제점을 해결하기 위하여 창안된 것으로, 연성인쇄회로기판의 층간 전기적 접속에 대한 신뢰도를 높일 수 있는 연성인쇄회로기판의 동도금방법을 제공하는데 그 목적이 있다.The present invention has been made to solve the above problems, and an object thereof is to provide a copper plating method of a flexible printed circuit board which can increase the reliability of the electrical connection between layers of the flexible printed circuit board.

삭제delete

상기와 같은 목적을 달성하기 위한 본 발명은, 폴리이미드 및 구리막을 순차적으로 증착하여 동적층판을 형성하는 동적층판 형성단계, 상기 동적층판에 비아홀및 스루홀을 형성하는 홀 형성단계; 상기 비아홀 및 스루홀이 형성된 동적층판을 동도금하는 동도금단계, 상기 동도금된 동적층판의 비아홀 및 스루홀의 둘레부분에 드라이필름을 도포하는 드라이필름 도포단계 및 상기 동적층판의 드라이필름이 도포되지 않은 부분을 소정의 두께만 잔류하도록 에칭하는 하프에칭단계를 포함한다.The present invention for achieving the above object, a dynamic layer plate forming step of forming a dynamic layer by sequentially depositing a polyimide and a copper film, a hole forming step of forming a via hole and a through hole in the dynamic layer plate; Copper plating step of copper plating the dynamic layer plate formed with the via hole and the through hole, dry film application step of applying a dry film to the circumferential portion of the via hole and the through hole of the copper plated dynamic layer plate and the dry film of the dynamic layer plate is not applied A half etching step of etching so that only a predetermined thickness remains.

이하 첨부된 도면을 참조로 본 발명의 바람직한 실시예를 상세히 설명하기로 한다. 이에 앞서, 본 명세서 및 청구범위에 사용된 용어나 단어는 통상적이거나 사전적인 의미로 한정해서 해석되어서는 아니되며, 발명자는 그 자신의 발명을 가장 최선의 방법으로 설명하기 위해 용어의 개념을 적절하게 정의할 수 있다는 원칙에 입각하여 본 발명의 기술적 사상에 부합하는 의미와 개념으로 해석되어야만 한다.Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings. Prior to this, terms or words used in the specification and claims should not be construed as having a conventional or dictionary meaning, and the inventors should properly explain the concept of terms in order to best explain their own invention. Based on the principle that can be defined, it should be interpreted as meaning and concept corresponding to the technical idea of the present invention.

따라서, 본 명세서에 기재된 실시예와 도면에 도시된 구성은 본 발명의 가장 바람직한 일 실시예에 불과할 뿐이고 본 발명의 기술적 사상을 모두 대변하는 것은 아니므로, 본 출원시점에 있어서 이들을 대체할 수 있는 다양한 균등물과 변형예들이 있을 수 있음을 이해하여야 한다.Therefore, the embodiments described in the specification and the drawings shown in the drawings are only the most preferred embodiment of the present invention and do not represent all of the technical idea of the present invention, various modifications that can be replaced at the time of the present application It should be understood that there may be equivalents and variations.

이하에서는 도 3 및 도 4를 참조하여 본 발명의 바람직한 일 실시예에 따른 연성인쇄회로기판 동도금방법을 설명하기로 한다.Hereinafter, a flexible printed circuit board copper plating method according to an exemplary embodiment of the present invention will be described with reference to FIGS. 3 and 4.

도 3은 본 발명의 바람직한 일 실시예에 따른 연성인쇄회로기판 동도금방법의 흐름도이며, 도 4는 본 발명의 바람직한 일 실시예에 따른 연성인쇄회로기판의 도금과정을 나타낸 단면도이다.3 is a flow chart of a flexible printed circuit board copper plating method according to an embodiment of the present invention, Figure 4 is a cross-sectional view showing a plating process of a flexible printed circuit board according to an embodiment of the present invention.

먼저, 폴리이미드(402)와 상단 및 하단 구리막(401)을 순차적으로 증착하여 동적층판을 형성한다(S310). 동적층판은 인쇄회로기판용 기판재의 표면에 도체패턴을 형성하기 위해 사용되는 필름으로서, 내열성이 요구되지 않는 경우에는 폴리에 스테르를 사용하는 것도 가능하다.First, the polyimide 402 and the upper and lower copper films 401 are sequentially deposited to form a dynamic layer plate (S310). The dynamic layer plate is a film used for forming a conductor pattern on the surface of a substrate material for a printed circuit board, and if a heat resistance is not required, it is also possible to use polyester.

또한, 폴리이미드(402)를 증착하지 않고 1개의 구리막(401) 만으로 동적층판을 형성하는 것도 가능하다.It is also possible to form the dynamic layer plate using only one copper film 401 without depositing the polyimide 402.

다음으로, 동적층판에 비아홀(403) 및 스루홀(404)을 형성한다(S320).Next, the via hole 403 and the through hole 404 are formed in the dynamic layer plate (S320).

여기서, 비아홀(403) 및 스루홀(404)은 X-ray 드릴이나 센서 드릴을 사용하여 기준이 되는 기준홀을 가공한 후에 상기 기준홀을 기준으로 CNC(Computer Numerical Control) 드릴을 사용하여 회로상의 원하는 위치에 형성될 수 있다.Here, the via hole 403 and the through hole 404 are processed in a circuit using a CNC (Computer Numerical Control) drill based on the reference hole after the reference hole is processed using an X-ray drill or a sensor drill. It can be formed at the desired position.

또한, UV(Ultraviolet) 레이저나 CO2(Carbon dioxide) 레이저를 사용하여 홀을 형성하는 것도 가능하다.It is also possible to form holes using UV (ultraviolet) lasers or carbon dioxide (CO 2 ) lasers.

나아가, 비아홀(403) 및 스루홀(404)을 형성할 때 발생하는 열에 의해 인쇄회로기판을 구성하고 있는 폴리이미드 등의 수지가 녹아 비아홀(403) 및 스루홀(404)의 내벽에 스미어(Smear)가 발생하는 데, 이것은 비아홀(403) 및 스루홀(404)의 내벽에 대한 도금의 품질을 떨어뜨리는 결정적인 작용을 하므로 이를 제거해주는 디스미어 공정을 거쳐야한다(S330).Further, resins such as polyimide constituting the printed circuit board are melted by the heat generated when the via holes 403 and the through holes 404 are formed, and smears are formed on the inner walls of the via holes 403 and the through holes 404. ) Is generated, which has a determinative effect of degrading the quality of plating on the inner wall of the via hole 403 and the through hole 404 and thus has to go through a desmear process to remove it (S330).

그 후, 비아홀(403) 및 스루홀(404)이 형성된 동적층판 전체에 통전성(通電性)을 부여하기 위하여 동도금을 실시한다.Thereafter, copper plating is performed to impart conduction to the entire dynamic layer plate on which the via holes 403 and the through holes 404 are formed.

여기서, 동적층판은 부도체이므로 전해도금을 할 수 없기 때문에 촉매를 바른 후 무전해 동도금을 실시한다(S340).Here, since the dynamic layer plate is an insulator, electrolytic plating cannot be performed, and then electroless copper plating is performed after the catalyst is applied (S340).

이때, 무전해 동도금은 많은 시간이 소요되고 공정이 까다로워 신뢰성을 얻 을 만큼의 도금층을 적층할 수 없기 때문에, 무전해 도금된 동적층판에 전해도금을 실시하여 충분한 두께의 도금층을 얻도록 한다(S350).At this time, the electroless copper plating takes a long time and the process is difficult, so that the plating layer can not be laminated enough to obtain reliability, so that electroplating is performed on the electroless plated dynamic layer plate to obtain a plating layer having a sufficient thickness (S350). ).

다음으로, 도금된 동적층판의 비아홀(403) 및 스루홀(404)이 형성된 부분의 둘레만을 드라이필름(405)으로 도포(塗布)한다(S360).Next, only the periphery of the portion where the via hole 403 and the through hole 404 of the plated dynamic layer plate are formed is coated with the dry film 405 (S360).

그 후, 동적층판을 에칭하여 드라이필름(405)이 도포되지 않은 부분은 소정 두께의 구리막(401)만이 잔류하도록 한다(S370).Thereafter, the dynamic layer plate is etched so that only the copper film 401 having a predetermined thickness remains in the portion where the dry film 405 is not applied (S370).

상기 소정의 두께는 연성인쇄회로기판에 요구되는 굴곡성이나 유연성, 두께 등에 따라 연성인쇄회로기판의 생산자가 조절할 수 있다.The predetermined thickness may be adjusted by the producer of the flexible printed circuit board according to flexibility, flexibility, and thickness required for the flexible printed circuit board.

이렇게 소정 두께의 구리막(401)만이 잔류하도록 하프에칭된 동적층판은 드라이필름(405)이 박리(剝離)된 후, Coverlay, PSR, 표면처리, 타발 등과 같은 일반적인 후공정 및 회로형성과정을 거치게 된다.The dynamic layer plate half-etched such that only the copper film 401 having a predetermined thickness remains is subjected to general post-processing and circuit forming processes such as coverlay, PSR, surface treatment, punching, etc. after the dry film 405 is peeled off. do.

상기한 바와 같이, 비아홀(403) 및 스루홀(404)의 둘레부분을 제외한 동적층판의 상측면을 소정 두께의 구리막만 잔류하도록 하프에칭함으로써, 스루홀(404)의 전기적 신뢰도를 크게 향상시킬 수 있으며, 원하는 굴곡성, 유연성, 두께를 갖는 연성인쇄회로기판의 제조가 가능하고, 구리막에 미세회로를 형성하는 것 또한 가능해진다.As described above, by half-etching the upper surface of the dynamic layer plate except the peripheral portions of the via hole 403 and the through hole 404 so that only a predetermined thickness of copper film remains, the electrical reliability of the through hole 404 can be greatly improved. It is possible to manufacture a flexible printed circuit board having desired flexibility, flexibility, and thickness, and to form a fine circuit in a copper film.

이상과 같이, 본 발명은 비록 한정된 실시예와 도면에 의해 설명되었으나, 본 발명은 이것에 의해 한정되지 않으며 본 발명이 속하는 기술 분야에서 통상의 지식을 가진 자에 의해 본 발명의 기술 사상과 아래에 기재될 특허 청구범위의 균등 범위 내에서 다양한 수정 및 변형이 가능함은 물론이다.As mentioned above, although this invention was demonstrated by the limited embodiment and drawing, this invention is not limited by this, The person of ordinary skill in the art to which this invention belongs, Of course, various modifications and variations are possible within the scope of equivalent claims.

상술한 바와 같은 본 발명의 연성인쇄회로기판 동도금방법에 따르면, 동적층판에 드라이필름을 도포하기 전에 도금을 실시하고, 비아홀 및 스루홀의 둘레부분을 제외한 동적층판의 하측면을 소정 두께의 구리막만 잔류하도록 하프에칭함으로써, 스루홀의 전기적 신뢰도를 크게 향상시킬 수 있다.According to the flexible printed circuit board copper plating method of the present invention as described above, the plating is performed before the dry film is applied to the dynamic layer plate, and the lower side of the dynamic layer plate except for the circumferential portion of the via hole and the through hole has only a copper film having a predetermined thickness. By half etching to remain, the electrical reliability of the through hole can be greatly improved.

또한, 원하는 굴곡성, 유연성, 두께를 갖는 연성인쇄회로기판의 제조가 가능하며, 얇은 구리막에서의 미세회로 형성이 가능한 장점이 있다.In addition, it is possible to manufacture a flexible printed circuit board having desired flexibility, flexibility, and thickness, and there is an advantage in that fine circuits can be formed in a thin copper film.

덧붙여, 기존의 인쇄회로기판 제조방법에 비하여 특정 설비를 필요로 하지 않기 때문에 추가적인 비용소모가 발생하지 않는 장점이 있다.In addition, there is an advantage that does not require additional cost compared to the conventional printed circuit board manufacturing method because it does not require a specific equipment.

Claims (5)

폴리이미드와 구리막을 순차적으로 증착하여 동적층판을 형성하는 동적층판 형성단계;A dynamic layer plate forming step of sequentially depositing a polyimide and a copper film to form a dynamic layer plate; 상기 동적층판에 비아홀 및 스루홀을 형성하는 홀 형성단계;A hole forming step of forming a via hole and a through hole in the dynamic layer plate; 상기 비아홀 및 스루홀이 형성된 동적층판을 동도금하는 동도금단계;A copper plating step of copper plating the dynamic layer plate on which the via hole and the through hole are formed; 상기 동도금된 동적층판의 비아홀 및 스루홀의 둘레부분에 드라이필름을 도포하는 드라이필름 도포단계; 상기 동적층판의 드라이필름이 도포되지 않은 부분을 소정의 두께만 잔류하도록 에칭하는 하프에칭단계; 및A dry film applying step of applying a dry film to the circumferential portions of the via hole and the through hole of the copper plated dynamic layer plate; A half etching step of etching the portion of the dynamic layer plate to which the dry film is not applied so that only a predetermined thickness remains; And 상기 드라이필름의 일부 및 잔여를 제거하는 드라이필름 박리 단계를 포함하고,A dry film peeling step of removing a part and the remainder of the dry film, 상기 동도금단계는, 상기 비아홀 및 스루홀이 형성된 동적층판을 무전해 도금하는 무전해 도금단계; 및 상기 무전해 동도금된 동적층판을 전해 도금하는 전해 도금단계를 포함하며,The copper plating step may include: an electroless plating step of electroless plating a dynamic layer plate on which the via holes and through holes are formed; And an electroplating step of electroplating the electroless copper plated dynamic layer plate, 상기 홀 형성단계는, CNC드릴 또는 레이저를 이용하여 홀을 형성하고,The hole forming step, to form a hole using a CNC drill or laser, 상기 홀 형성단계 이후, 홀 형성시 마찰력에 의하여 발생 용융된 수지 또는 부스러기를 제거하는 디스미어단계를 더 포함하며,After the hole forming step, further comprises a desmear step of removing the molten resin or debris generated by the friction when forming the hole, 상기 동적층판 형성단계는, 하단 구리막, 폴리이미드 및 상단 구리막을 순차적으로 증착하여 하는 것을 특징으로 하는 연성인쇄회로기판의 동도금방법.The dynamic layer plate forming step, copper plating method of a flexible printed circuit board, characterized in that by depositing the lower copper film, polyimide and the upper copper film sequentially. 삭제delete 삭제delete 삭제delete 삭제delete
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