KR100753393B1 - Thin Stack Flexible Printed Circuit Board and Manufacturing method thereof - Google Patents

Thin Stack Flexible Printed Circuit Board and Manufacturing method thereof Download PDF

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KR100753393B1
KR100753393B1 KR1020050104802A KR20050104802A KR100753393B1 KR 100753393 B1 KR100753393 B1 KR 100753393B1 KR 1020050104802 A KR1020050104802 A KR 1020050104802A KR 20050104802 A KR20050104802 A KR 20050104802A KR 100753393 B1 KR100753393 B1 KR 100753393B1
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circuit board
fpcb
cof
flexible circuit
layer
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KR1020050104802A
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Korean (ko)
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KR20070047921A (en
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이효영
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아이엔지플렉스(주)
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/118—Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4076—Through-connections; Vertical interconnect access [VIA] connections by thin-film techniques

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)

Abstract

본 발명은 연성회로기판의 적층구조를 단순화시킨 구조와 공법으로 변경하여 단가를 낮출 수 있을 뿐만 아니라, 두께를 얇게 함과 동시에 단선을 방지함으로서 제품 슬림화 및 신뢰성을 향상시키도록 한 박판적층 연성회로기판 및 그 제조방법에 관한 것이다. 본 발명은, COF(Chip On Film)와 FPCB(Flexible Printed Circuits Board)를 적층하여 연성회로기판을 제조하되, 상기 COF로 내층을 구성하고, 상기 FPCB로 외층을 구성하는 것을 특징으로 한다. 상기 COF와 상기 FPCB를 본딩시트를 이용하여 접착시키되, 상기 본딩 시트는 표면이 엠보싱 처리되며, 상기 COF와 상기 FPCB는 각각에 지그홀을 형성하고, 상기 지그홀을 관통하는 핀지그를 통하여 얼라인을 수행하는 것이 바람직하다. 또한, 상기의 방법에 의하여 상기 COF와 FPCB를 적층하여 제조되는 박판적층 연성회로기판을 특징으로 한다.The present invention can reduce the unit cost by changing the laminated structure of the flexible circuit board to a simplified structure and a method, as well as to reduce the thickness and at the same time to prevent the breakage of the thin laminated flexible circuit board to improve the product slim And to a method for producing the same. The present invention is to manufacture a flexible circuit board by stacking a Chip On Film (COF) and a Flexible Printed Circuits Board (FPCB), the inner layer of the COF and the outer layer of the FPCB. Bonding the COF and the FPCB using a bonding sheet, the bonding sheet is embossed on the surface, the COF and the FPCB forms a jig hole in each, aligns through the pin jig penetrating the jig hole It is preferable to carry out. In addition, it is characterized by a thin laminated flexible circuit board manufactured by laminating the COF and FPCB by the above method.

연성회로기판, 박판, 적층, COF, FPCB, 본딩시트, 엠보싱, 핀지그Flexible Circuit Board, Thin Plate, Lamination, COF, FPCB, Bonding Sheet, Embossing, Pin Jig

Description

박판적층 연성회로기판 및 그 제조방법{Thin Stack Flexible Printed Circuit Board and Manufacturing method thereof}Thin Stack Flexible Printed Circuit Board and Manufacturing Method

도 1은 종래의 연성회로기판을 나타낸 측단면도.1 is a side cross-sectional view showing a conventional flexible circuit board.

도 2는 본 발명에 따른 박판적층 연성회로기판의 일실시예를 나타낸 측단면도.Figure 2 is a side cross-sectional view showing an embodiment of a thin laminated flexible circuit board according to the present invention.

도 3은 본 발명에 따른 박판적층 연성회로기판의 제조방법을 설명하기 위한 도면.3 is a view for explaining a method for manufacturing a thin laminated flexible circuit board according to the present invention.

도 4는 본 발명에 따른 박판적층 연성회로기판의 다른 실시예를 나타낸 측단면도.Figure 4 is a side cross-sectional view showing another embodiment of a thin laminated flexible circuit board according to the present invention.

<도면의 주요부분에 대한 부호의 설명><Description of the symbols for the main parts of the drawings>

20 : GND(Ground)층 21 : 패턴층20: GND (Ground) layer 21: pattern layer

22 : COF(Chip On Film)층 23 : FPCB(Flexible Printed Circuits Board)층22: Chip On Film (COF) layer 23: Flexible Printed Circuits Board (FPCB) layer

24, 26, 28 : 지그홀 25 : 본딩시트24, 26, 28: jig hole 25: bonding sheet

27 : FCCL(Flexible Copper Clad Laminate) 29 : 핀
30 : 핀지그27: FCCL (Flexible Copper Clad Laminate) 29: Pin
30: pin jig

삭제delete

본 발명은 박판(薄板)적층(籍層) 연성회로기판(Thin Stack Flexible Printed Circuit Board : TS-FPCB)에 관한 것으로서, 더욱 상세하게는 연성회로기판의 적층구조를 단순화시킨 구조와 공법으로 변경하여 단가를 낮출 수 있을 뿐만 아니라, 두께를 얇게 함과 동시에 단선을 방지함으로서 제품 슬림(Slim)화 및 신뢰성을 향상시키도록 한 박판적층 연성회로기판 및 그 제조방법에 관한 것이다. The present invention relates to a thin stack flexible printed circuit board (TS-FPCB), and more particularly, by changing the laminated structure of the flexible circuit board to a simplified structure and method. The present invention relates to a thin laminated flexible circuit board and a method of manufacturing the same, which can reduce the unit cost and improve the product slimness and reliability by reducing thickness and preventing disconnection.

도 1은 종래의 연성회로기판을 나타낸 측단면도로서, 휴대폰의 경우를 예로서 나타내었다.1 is a side cross-sectional view showing a conventional flexible circuit board, showing a case of a mobile phone as an example.

도시된 바와 같이, 먼저 4층구조(a)를 살펴보면, 단순기능의 초기 휴대폰에서의 데이터 라인(Date Line)수를 층당 10~15개로 구현하여 총20~30라인(Line)을 구현하였다. 또한, 6층구조(b)에서는 컬러 디스플레이(color display) 및 카메라(Camera) 등의 적용으로 인한 데이터 라인 수= 층당10~15X4=40~60라인으로 증가하였다. 이후 8층구조(c)에서는 DMB(Digital Multimedia Broadcasting)등 다기능폰으로의 진화시 더 많은 층수의 구조가 필요하게 되었다.As shown, first look at the four-layer structure (a), a total of 20 to 30 lines (Line) by implementing the number of data lines (Date Line) in the initial mobile phone with a simple function of 10 to 15 per floor. In addition, in the six-layer structure (b), the number of data lines due to the application of a color display and a camera increased to 10-15X4 = 40-60 lines per floor. Later, in the eight-layer structure (c), more layers were needed to evolve into a multifunctional phone such as digital multimedia broadcasting (DMB).

여기서, 도면부호 10은 그라운드(GND)층, 도면부호 11은 패턴(pattern)층을 나타내며, 각각의 라인폭 및 간격은 80/80um 의 동일 조건이다.Here, reference numeral 10 denotes a ground (GND) layer, and reference numeral 11 denotes a pattern layer, and each line width and spacing are the same conditions of 80 / 80um.

이와 같이, 종래의 연성회로기판은, 기기의 다기능, 소형화 및 슬림화로 인하여 구동부가 있는 회로간의 연결이 이루어지기 위해서는 많은 데이터 라인(Data Line)과 전원 및 그라운드(Ground)가 필요하나 제한된 통로를 통하여 이를 모두 수용하기 위해서는 패턴폭 및 패턴간의 간격에 한계가 있어 6층 이상의 고 다층 FPCB(Flexible Printed Circuits Board)를 이용하였다.As described above, the conventional flexible circuit board requires many data lines, a power supply, and a ground in order to be connected between circuits having a driving unit due to the multifunction, miniaturization, and slimness of the device, but through limited passages. In order to accommodate all of these, there are limitations in pattern width and spacing between patterns, and thus, a multilayer multilayer printed circuit board (FPCB) of six or more layers is used.

특히, 휴대폰이나 DMB 등의 이동통신 기기나 휴대용 멀티미디어 기기의 단말기같은 굴곡이나 회전등 움직이는 부분의 전자 회로간 연결에 적용되며 제품설계를 연성회로기판 업체의 제조능력에 따라 라인의 폭 및 간격이 제한적일 수밖에 없어 6~8층의 다층으로 설계되고 있는 실정이다.In particular, it is applied to the connection between electronic circuits of moving parts such as bends and rotations such as mobile communication devices such as mobile phones or DMBs or portable multimedia devices, and the product design may be limited in line width and spacing depending on the manufacturing capacity of flexible circuit board manufacturers. There is no choice but to design a multi-layer of 6-8 layers.

그러나, 상기와 같은 종래의 기술의 연성회로기판에 있어서, 회로선폭과 두께를 80um(0.08mm)이하(일반적인 제조공정의 경우)로 구현하기가 어려우며, 이는 사용되어지는 자재와 생산 조건들의 한계에 기인한다. 이로 인하여 회로간의 데이터 라인을 모두 처리하기 위해 여러 층의 연성회로기판 구조로 이를 구현하고 있는바, 빈번한 개폐동작이나 회전동작 등이 발생할시 연성회로기판의 각 층간 회전반경이 상이함으로 인해 열화 및 응력이 특정부위에 가해지게 되고, 이로 인해 단선이 쉽게 일어나는 문제점이 있었다. 또한, 상기한 단선 문제는 층수가 많아질수록 더욱 심화되고, 층수가 증가할 때마다 단가가 높아져 제품 가격이 높아질 수밖에 없으며, 이동 통신기기의 새로운 기능이 추가될 때마다 연성회로기판의 층수를 더 늘리게 되는 문제점도 있었다.However, in the above-described flexible circuit board of the prior art, it is difficult to implement the circuit line width and thickness to 80um (0.08mm) or less (in the case of a general manufacturing process), which is limited by the materials and production conditions used. Is caused. Therefore, in order to process all data lines between circuits, the flexible circuit board structure of several layers is implemented. In case of frequent switching or rotation, the rotation radius of each layer of the flexible circuit board is different from each other. This particular part is applied to, and this causes a problem that the disconnection easily occurs. In addition, the disconnection problem is intensified as the number of floors increases, and as the number of floors increases, the unit price increases and the product price increases. As the new functions of the mobile communication device are added, the number of floors of the flexible circuit board increases. There were also problems that increased.

따라서, 본 발명은 상기한 종래의 문제점을 해결하기 위하여 안출된 것으로, 연성회로기판의 회로선폭과 간격을 기존보다 절반이하로 줄여 더욱 많은 회로량을 효과적으로 수용함으로, 기판의 적층수를 줄임으로 적층구조를 단순화시킨 구조와 공법으로 변경하여 단가를 낮출 수 있을 뿐만 아니라, 두께를 얇게 함과 동시에 단선을 방지함으로서 제품 슬림화 및 신뢰성을 향상시키도록 한 박판적층 연성회로기판 및 그 제조방법을 제공하는 데에 그 목적이 있다.Accordingly, the present invention has been made to solve the above-described problems, and by reducing the circuit line width and spacing of the flexible circuit board to less than half than conventionally to accommodate more circuitry, stacking by reducing the number of stacked substrates In order to provide a thin laminated flexible circuit board and a method of manufacturing the same, which can reduce the unit cost by changing the structure and the method to be simplified, and reduce the thickness and prevent the disconnection, thereby improving the slimming and reliability of the product. Has its purpose.

상기한 목적을 달성하기 위한 본 발명에 따른 박판적층 연성회로기판 및 그 제조방법은, COF(Chip On Film)와 FPCB(Flexible Printed Circuits Board)를 적층하여 연성회로기판을 제조하되, 상기 COF로 내층을 구성하고, 상기 FPCB로 외층을 구성하는 것을 특징으로 한다.In order to achieve the above object, a thin laminated flexible circuit board and a method of manufacturing the same according to the present invention may be manufactured by stacking a chip on film (FOF) and a flexible printed circuit board (FPCB) to produce a flexible circuit board, wherein the inner layer is formed of the COF. And an outer layer of the FPCB.

상기 COF와 상기 FPCB를 본딩시트를 이용하여 접착시키되, 상기 본딩 시트는 표면이 엠보싱 처리된 것이 바람직하다. Bonding the COF and the FPCB using a bonding sheet, the bonding sheet is preferably embossed surface.

상기 COF와 상기 FPCB는 각각에 지그홀을 형성하고, 상기 지그홀을 관통하는 핀지그를 통하여 얼라인을 수행하는 것이 더욱 바람직하다.It is more preferable that the COF and the FPCB form jig holes in each, and perform alignment through a pin jig penetrating the jig hole.

또한, 상기의 방법에 의하여 상기 COF와 FPCB를 적층하여 제조되는 박판적층 연성회로기판을 특징으로 한다.In addition, it is characterized by a thin laminated flexible circuit board manufactured by laminating the COF and FPCB by the above method.

이하, 첨부된 도면을 참조하여 본 발명의 박판적층 연성회로기판 및 그 제조방법의 바람직한 실시예를 상세히 설명한다.Hereinafter, with reference to the accompanying drawings will be described in detail a preferred embodiment of a thin laminated flexible circuit board of the present invention and a method of manufacturing the same.

도 2는 본 발명에 따른 박판적층 연성회로기판의 일실시예를 나타낸 측단면도로서, 종래의 6층을 4층으로 구성한 예를 나타낸다.Figure 2 is a side cross-sectional view showing an embodiment of a thin laminated flexible circuit board according to the present invention, showing an example in which the conventional six layers are composed of four layers.

도시된 바와 같이, 본 발명은 COF로 내층을 구성하고 FPCB로 외층을 구성하여 연성회로기판을 제조할 수 있다. 즉, 연성회로기판의 중앙에 COF층(22)을 형성하고, 그 상하측으로 각각의 패턴층(21)과 FPCB층(23)이 순차적으로 적층되고, 상기 각각의 FPCB층(23) 외측으로 GND층(20)이 형성된다. 이때, 패턴 굵기 및 간격은 최소(Min) 25 ~ 50um 인 것이 바람직하다.As shown, the present invention can form a flexible circuit board by configuring the inner layer of the COF and the outer layer of the FPCB. That is, the COF layer 22 is formed in the center of the flexible circuit board, and the pattern layers 21 and the FPCB layers 23 are sequentially stacked on the upper and lower sides thereof, and the GNDs are disposed outside the respective FPCB layers 23. Layer 20 is formed. At this time, the pattern thickness and spacing is preferably a minimum (Min) 25 ~ 50um.

도 3은 본 발명에 따른 박판적층 연성회로기판의 제조방법을 설명하기 위한 도면이다.
도시된 바와 같이 본 발명은, COF와 FPCB를 본딩시트(25)를 이용하여 접착시킬 수 있다. 즉, 연성회로기판의 중앙에 COF층(22)을 형성하되, 본딩시트(25)를 이용하여 양면으로 접착하고, 그 상하측으로 다시 본딩시트(25)를 이용하여 FCCL(Flexible Copper Clad Laminate)층(27)을 형성한다.
여기에서는 일실시예로서 COF층(22)의 상하측에 FCCL층(27)을 형성하는 것을 도시하였으나, 도 2에 도시된 바와 같이 FPCB층(23)을 상하측에 형성할 수도 있다.
상기와 같이 COF층(22)와 FCCL층(27)으로 형성된 연성회로기판은 각각의 지그홀(24)(26)(28)이 형성된다.3 is a view for explaining a method for manufacturing a thin laminated flexible circuit board according to the present invention.
As shown in the present invention, the COF and the FPCB may be bonded using the bonding sheet 25. That is, the COF layer 22 is formed in the center of the flexible circuit board, and the bonding sheet 25 is adhered to both sides, and the flexible copper clad laminate (FCCL) layer is bonded to the upper and lower sides using the bonding sheet 25 again. (27) is formed.
Here, although the FCCL layer 27 is formed on the upper and lower sides of the COF layer 22 as an embodiment, the FPCB layer 23 may be formed on the upper and lower sides as shown in FIG. 2.
As described above, each of the jig holes 24, 26, and 28 is formed of the flexible circuit board formed of the COF layer 22 and the FCCL layer 27.

또한, 핀지그(30)는 상기 지그홀(24)(26)(28)들을 관통하는 다수의 핀(29)을 통하여 상기 연성회로기판을 그 상단에 안착시키도록 구성된다.In addition, the pin jig 30 is configured to seat the flexible circuit board on top thereof through a plurality of pins 29 passing through the jig holes 24, 26, 28.

여기서, COF층(22)은 원단자체가 롤타입(Roll Type)이며 미세회로의 형성이 가능하고 두께가 얇다.Here, the COF layer 22 is a roll type (roll type) itself is possible to form a fine circuit and the thickness is thin.

본딩시트(Bonding Sheet)(25)는 각 층간의 접착을 위한 접착제로 가열,가압하여 접착한다. 또한, 상기 본딩시트(25)는 접착력 향상을 위해 표면에 엠보싱(Embossing) 처리가 되는 것이 바람직하다.The bonding sheet 25 is bonded by heating and pressing with an adhesive for bonding between the layers. In addition, the bonding sheet 25 is preferably embossed on the surface in order to improve the adhesion.

FCCL(27)는 FPCB(23)의 원자재로 폴리이미드(Polyimide)를 사용한다. The FCCL 27 uses polyimide as a raw material of the FPCB 23.

핀지그(30)는 각각의 핀(29)을 통하여 COF층(22) 및 FPCB층(23)의 재료를 정확하게 적층하기 위하여 사용된다.The pin jig 30 is used to accurately stack the material of the COF layer 22 and the FPCB layer 23 through each pin 29.

상기와 같이 구성된 본 발명의 작용을 더욱 상세히 설명하면 다음과 같다.Referring to the operation of the present invention configured as described in more detail as follows.

먼저, 종래의 COF 공정에서는 회로선폭의 두께와 간격을 25um ~ 50um (0.025mm ~ 0.05mm)로 구현하는 게 가능하나, FPCB공정으로는 이를 구현하기에는 공정상의 상이함으로 실현시키기에는 어려움이 있었다. 이와는 반대로 COF공정에서는 비아홀(Via Hole)을 형성하지 않으며, 따라서 적층을 하지 않는 구조로 단면만을 구성하는 공정이며 이는 제품자체에서 발생하는 노이즈(noise)나 외부에서 침투하는 노이즈를 효과적으로 차폐할 수 없는 구조가 될수 밖에 없었다.First, in the conventional COF process, it is possible to implement the thickness and spacing of the circuit line width to 25um ~ 50um (0.025mm ~ 0.05mm), but in the FPCB process it was difficult to realize the difference in the process. In contrast, the COF process does not form via holes, so it is a process that does not form a stack, and constitutes only a cross section, which cannot effectively shield noise generated from the product itself or noise penetrating from the outside. It was a rescue.

본 발명은 FPCB의 적층방법과 COF의 미세패턴 형성 및 얇은 두께 등의 장점만을 취합하여 최대의 효과를 기대하고자 제안되었으며 적층방법에 있어서 기존과는 좀 더 많은 고정핀(29)을 적용한 핀지그(PIN JIG)(30)를 사용하여 안정적인 적층을 이루었다.The present invention has been proposed to combine the advantages of FPCB lamination method and COF fine pattern formation and thin thickness to expect the maximum effect and pin jig applying a more fixed pin 29 in the lamination method ( PIN JIG) 30 was used to achieve stable lamination.

또한 FPCB(23)와 COF(22)간의 접착강도를 높이기 위해 엠보싱(Embossing) 처리한 본딩시트(25)를 사용하였다.In addition, an embossing bonding sheet 25 was used to increase the adhesive strength between the FPCB 23 and the COF 22.

따라서 종래의 제조방법으로 6~8층의 FPCB를 이루었다면 본 발명을 이용하여 4~5층 정도로도 구성이 가능하며, 내층을 이루고 있는 COF의 두께가 기존 FPCB의 두께에 비하여 상대적으로 얇음으로 회전반경의 차이가 크지 않아 굴곡 및 회전 등의 지속적이고 반복적인 충격으로부터 견딜 수 있는 한계가 종래보다 월등한 성능을 나타내고 있다.Therefore, if the FPCB of 6 to 8 layers is formed by the conventional manufacturing method, it is possible to configure the 4 to 5 layers using the present invention, and the thickness of the COF constituting the inner layer rotates relatively thinly compared to the thickness of the existing FPCB. Since the difference in radius is not large, the limit to withstand continuous and repeated impacts such as bending and rotation shows superior performance compared to the prior art.

또한, 도 4는 본 발명에 따른 박판적층 연성회로기판의 다른 실시예를 나타낸 측단면도로서, 보다 많은 수의 COF층(22) 및 FPCB층(23)을 적층한 박판적층 연성회로기판의 실시예를 나타내었다.4 is a side cross-sectional view showing another embodiment of a thin laminated flexible printed circuit board according to the present invention, which is an embodiment of a thin laminated flexible printed circuit board in which a larger number of COF layers 22 and FPCB layers 23 are laminated. Indicated.

여기서, COF층(22) 및 FPCB층(23)은 얼라인(aline)을 위하여 대략 8개 또는 그 이상의 핀(29)이 형성된 핀지그(30)를 사용하여 레이업(Layup)하고, 각각의 접착력 향상을 위해 엠보싱 처리로 가공된 본딩시트(25)를 사용하여 COF층(22) 및 FPCB층(23)을 접착시킨다.Here, the COF layer 22 and the FPCB layer 23 are laid up using a pin jig 30 having approximately eight or more fins 29 formed thereon for alignment. In order to improve adhesion, the COF layer 22 and the FPCB layer 23 are bonded using the bonding sheet 25 processed by the embossing process.

이와 같이 본 발명은 종래의 FPCB공정 방법으로는 구현할 수 없었던 미세패턴은 COF공정에서 실현하여 내층을 구성하고 외층은 FPCB공정에서 완성하여 적층을 하는 구조, 또는 이와 유사한 구조의 서로 다른 이종제품의 적층을 그 근간으로 하고 있다. 다만, 정확한 적층을 위하여 기존 적층방법을 보완한 핀지그(30)를 적용하여 정확도를 높이는 방법을 개발하였다. 이는 COF공정에서는 원자재의 폭이 105m/m로 FPCB공정에서의 최소폭이 250m/m인 것과 차이가 발생하여 적층시에 합지가 불가능한 구조에 따른 해결방법이다.As described above, the present invention realizes a fine pattern that cannot be realized by the conventional FPCB process method, and constitutes an inner layer by forming a COF process, and the outer layer is completed by laminating in an FPCB process, or a laminate of different heterogeneous products having a similar structure. Is based on that. However, for accurate lamination, a method of increasing accuracy by applying pin jig 30 complementing the existing lamination method was developed. This is a solution according to the structure where the width of the raw material is 105m / m in the COF process and the difference in the minimum width in the FPCB process is 250m / m, which is impossible to stack at the time of lamination.

이상에서는 본 발명의 바람직한 실시예에 대하여 도시하고 또한 설명하였으나, 본 발명은 상기한 실시예에 한정되지 아니하며, 청구범위에서 청구하는 본 발명의 요지를 벗어남이 없이 당해 본 발명이 속하는 분야에서 통상의 지식을 가진 자라면 누구든지 다양한 변형 실시가 가능한 것은 물론이고, 그와 같은 변경은 기재된 청구범위 내에 있게 된다.Although the preferred embodiments of the present invention have been illustrated and described above, the present invention is not limited to the above-described embodiments, and the present invention is not limited to the above-described embodiments without departing from the spirit of the present invention as claimed in the claims. Various modifications can be made by those skilled in the art, and such modifications are intended to fall within the scope of the appended claims.

이상에서 설명한 바와 같이 본 발명에 따른 박판적층 연성회로기판 및 그 제조방법에 의하면, 종래의 방법만으로는 구현할 수 없었던 데이터 라인(DATA Line)의 미세화(Fine Pattern)를 안정적으로 구현하여 연성회로기판의 적층구조를 단순화시켜 제품의 층수를 기존의 6~8층 구성을 4~5층으로 줄여 두께를 얇게 함과 동시에 단선을 방지함으로서 종래의 문제점을 해소하였으며 높은 신뢰도와 저렴한 비용으로 부품 공급이 가능한 효과가 있다.
또한, 본 발명의 다른 효과로는, 1)제품의 두께가 얇아짐으로 인해 제품의 신뢰성이 높아지고, 2)공정이 기존과 크게 다르지 않아 일반적인 생산시설에서도 적용이 가능하여 이식성이 높고, 3)원,부자재의 소요가 적어짐으로 인해 저렴한 가격을 실현할 수 있으며, 4)완제품의 슬림화에 기여하고 기구적 문제(공간)가 극복되고, 5) 공정의 리드타임(Leed Time) 단축으로 납기를 단축할 수 있는 효과 등이 있다.As described above, according to the thin laminated flexible circuit board and the manufacturing method thereof according to the present invention, stacking of the flexible circuit board by stably realizing the fine pattern of the data line which could not be realized by the conventional method alone. By simplifying the structure, the number of layers of the product is reduced to 4 to 5 layers by reducing the thickness of the existing 6 to 8 layers, and at the same time, it prevents disconnection and solves the conventional problem, and it is possible to supply parts at high reliability and low cost. have.
In addition, the other effects of the present invention, 1) the thickness of the product is thinner, the reliability of the product is increased, 2) the process is not very different from the existing, can be applied in a general production facility, high portability, 3) Low cost of subsidiary materials can be realized, 4) Contribution to slimming of finished products, mechanical problems (space) are overcome, 5) Shortening lead time by shortening lead time of process There is such an effect.

삭제delete

Claims (4)

COF(Chip On Film)와 FPCB(Flexible Printed Circuits Board)를 적층하여 연성회로기판을 제조하되, 상기 COF로 내층을 구성하고, 상기 FPCB로 외층을 구성하는 것을 특징으로 하는 박판적층 연성회로기판의 제조방법.Manufacturing a flexible printed circuit board by stacking a chip on film (COF) and a flexible printed circuit board (FPCB), wherein the inner layer is formed of the COF, and the outer layer is formed of the FPCB. Way. 제 1항에 있어서,The method of claim 1, 상기 COF와 상기 FPCB를 본딩시트를 이용하여 접착시키되, 상기 본딩 시트는 표면이 엠보싱 처리된 것을 특징으로 하는 박판적층 연성회로기판의 제조방법.Bonding the COF and the FPCB using a bonding sheet, the bonding sheet is a manufacturing method of a thin-layer laminated flexible circuit board, characterized in that the surface is embossed. 제 1항에 있어서,The method of claim 1, 상기 COF와 상기 FPCB는 각각에 지그홀을 형성하고, 상기 지그홀을 관통하는 핀지그를 통하여 얼라인을 수행하는 것을 특징으로 하는 박판적층 연성회로기판의 제조방법.And the COF and the FPCB each form a jig hole and perform alignment through a pin jig penetrating the jig hole. 제 1항의 방법에 의하여 상기 COF와 FPCB를 적층하여 제조되는 것을 특징으로 하는 박판적층 연성회로기판.A thin laminated flexible circuit board is manufactured by laminating the COF and the FPCB by the method of claim 1.
KR1020050104802A 2005-11-03 2005-11-03 Thin Stack Flexible Printed Circuit Board and Manufacturing method thereof KR100753393B1 (en)

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Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR960014473B1 (en) * 1991-06-03 1996-10-15 아메리칸 텔리폰 앤드 텔레그라프 캄파니 Improved uniformity of copper etching in the fabrication of multilayer pcb
KR20010023289A (en) * 1998-07-01 2001-03-26 야스카와 히데아키 Semiconductor device, method of manufacture thereof, circuit board, and electronic device

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR960014473B1 (en) * 1991-06-03 1996-10-15 아메리칸 텔리폰 앤드 텔레그라프 캄파니 Improved uniformity of copper etching in the fabrication of multilayer pcb
KR20010023289A (en) * 1998-07-01 2001-03-26 야스카와 히데아키 Semiconductor device, method of manufacture thereof, circuit board, and electronic device

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