KR100747363B1 - 열 계면 재료 - Google Patents
열 계면 재료 Download PDFInfo
- Publication number
- KR100747363B1 KR100747363B1 KR1020057003989A KR20057003989A KR100747363B1 KR 100747363 B1 KR100747363 B1 KR 100747363B1 KR 1020057003989 A KR1020057003989 A KR 1020057003989A KR 20057003989 A KR20057003989 A KR 20057003989A KR 100747363 B1 KR100747363 B1 KR 100747363B1
- Authority
- KR
- South Korea
- Prior art keywords
- thermal interface
- interface material
- rubber
- resin
- compound
- Prior art date
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Abstract
Description
조성(중량%) | A | B | C | D | E | F |
수소화된 폴리부틸렌 모노-올 | 7.5 | 6.3 | 10 | 11.33 | 5 | 18 |
수소화된 폴리부타디엔디올 | 없음 | 없음 | 2 | 없음 | 없음 | 없음 |
파라핀 왁스 | 3.1 | 2.2 | 없음 | 없음 | 없음 | 없음 |
부틸화된 멜라민 수지 | 1.7 | 0.4 | 1.33 | 2 | 1 | 4 |
유기티타네이트 | 1.5 | 1.0 | 6.67 | 6.67 | 4 | 8 |
설폰산 촉매 | 0.1 | 없음 | 없음 | 없음 | 없음 | 없음 |
페놀계 항산화제 | 0.1 | 0.1 | 없음 | 없음 | 없음 | 없음 |
알루미늄 분말 | 86 | 90 | 80 | 80 | 없음 | 없음 |
은 분말 | 없음 | 없음 | 없음 | 없음 | 90 | 없음 |
보론 니트리드 | 없음 | 없음 | 없음 | 없음 | 없음 | 70 |
생성물 형태 | 테이프 | 테이프 | 액체 | 액체 | 액체 | 액체 |
열 임피던스(℃ cm2/w) | 0.25 | 0.18 | 0.25 | 0.25 | 0.3 | 0.35 |
열전도도(w.m/℃) | 3.0 | 5.0 | 2.8 | 2.8 | 2.3 | 2.0 |
탄성 모듈러스, Pa | 300000 | 270000 | 500000 | 300000 | 280000 | 270000 |
점도, Pa.s | 측정불가 | 측정불가 | 200 | 160 | 150 | 220 |
Claims (44)
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US10/242,139 | 2002-09-09 | ||
US10/242,139 US6797382B2 (en) | 1999-12-01 | 2002-09-09 | Thermal interface materials |
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KR1020077014326A KR100854178B1 (ko) | 2002-09-09 | 2003-06-19 | 열 계면 재료 |
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US (1) | US6797382B2 (ko) |
EP (1) | EP1542862A4 (ko) |
JP (1) | JP2005538210A (ko) |
KR (4) | KR100773656B1 (ko) |
CN (1) | CN1307048C (ko) |
AU (1) | AU2003243715A1 (ko) |
WO (1) | WO2004022330A1 (ko) |
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ITUB20154204A1 (it) * | 2015-10-07 | 2017-04-07 | Bridgestone Corp | Pneumatico con migliorata resistenza alla degradazione termica |
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US10501671B2 (en) | 2016-07-26 | 2019-12-10 | Honeywell International Inc. | Gel-type thermal interface material |
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US10428256B2 (en) | 2017-10-23 | 2019-10-01 | Honeywell International Inc. | Releasable thermal gel |
US11072706B2 (en) | 2018-02-15 | 2021-07-27 | Honeywell International Inc. | Gel-type thermal interface material |
WO2020190350A1 (en) * | 2019-03-15 | 2020-09-24 | Insolcorp, Llc | Phase change material products |
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2002
- 2002-09-09 US US10/242,139 patent/US6797382B2/en not_active Expired - Lifetime
-
2003
- 2003-06-19 AU AU2003243715A patent/AU2003243715A1/en not_active Abandoned
- 2003-06-19 KR KR1020077002449A patent/KR100773656B1/ko active IP Right Grant
- 2003-06-19 CN CNB038245396A patent/CN1307048C/zh not_active Expired - Lifetime
- 2003-06-19 JP JP2004534230A patent/JP2005538210A/ja active Pending
- 2003-06-19 KR KR1020057003989A patent/KR100747363B1/ko active IP Right Grant
- 2003-06-19 EP EP03794427A patent/EP1542862A4/en not_active Withdrawn
- 2003-06-19 KR KR1020077027988A patent/KR20080006639A/ko not_active Application Discontinuation
- 2003-06-19 KR KR1020077014326A patent/KR100854178B1/ko active IP Right Grant
- 2003-06-19 WO PCT/US2003/019665 patent/WO2004022330A1/en active Application Filing
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Also Published As
Publication number | Publication date |
---|---|
KR20080006639A (ko) | 2008-01-16 |
US20030068487A1 (en) | 2003-04-10 |
AU2003243715A1 (en) | 2004-03-29 |
KR20070086591A (ko) | 2007-08-27 |
CN1688437A (zh) | 2005-10-26 |
US6797382B2 (en) | 2004-09-28 |
KR20050057278A (ko) | 2005-06-16 |
CN1307048C (zh) | 2007-03-28 |
KR20070020156A (ko) | 2007-02-16 |
KR100773656B1 (ko) | 2007-11-05 |
EP1542862A1 (en) | 2005-06-22 |
WO2004022330A1 (en) | 2004-03-18 |
JP2005538210A (ja) | 2005-12-15 |
KR100854178B1 (ko) | 2008-08-26 |
EP1542862A4 (en) | 2007-06-27 |
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