KR100746575B1 - 기판 이송 장치 및 이를 이용한 기판의 이송 방법 - Google Patents
기판 이송 장치 및 이를 이용한 기판의 이송 방법 Download PDFInfo
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- KR100746575B1 KR100746575B1 KR1020060087651A KR20060087651A KR100746575B1 KR 100746575 B1 KR100746575 B1 KR 100746575B1 KR 1020060087651 A KR1020060087651 A KR 1020060087651A KR 20060087651 A KR20060087651 A KR 20060087651A KR 100746575 B1 KR100746575 B1 KR 100746575B1
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- horizontal support
- support member
- substrate
- driver
- driving
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67748—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a single workpiece
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67751—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber vertical transfer of a single workpiece
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S414/00—Material or article handling
- Y10S414/135—Associated with semiconductor wafer handling
- Y10S414/141—Associated with semiconductor wafer handling includes means for gripping wafer
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
Description
Claims (4)
- 반도체 기판의 이송 장치에 있어서,기판을 이송하는 이송 로봇과;상기 이송 로봇이 설치된 로드 형상의 수평 지지 부재와;상기 수평 지지 부재의 양단에 각각 연결되어 상기 수평 지지 부재의 상하 방향 이동을 안내하는 제 1 및 제 2 수직 가이드와;상기 제 1 및 제 2 수직 가이드에 각각 구비되며, 그리고, 동기 동작에 의해 상기 수평 지지 부재의 양단을 동일 높이로 상하 이동시키는 제 1 및 제 2 구동 부재;를 포함하는 것을 특징으로 하는 기판 이송 장치.
- 제 1 항에 있어서,상기 장치는,상기 제 1 구동 부재에 제 1 구동 신호를 전송하는 제 1 구동기와;상기 제 2 구동 부재에 상기 제 1 구동 신호와 동기된 제 2 구동 신호 및 기설정된 오프셋 신호를 전송하는 제 2 구동기;를 더 포함하는 것을 특징으로 하는 기판 이송 장치.
- 제 2 항에 있어서,상기 장치는,상기 제 1 구동기에 상기 제 1 구동 부재를 구동시키기 위한 제어 신호를 인가하며, 그리고 상기 제 1 구동기로부터 상기 제 2 구동기로 상기 제 1 구동 신호에 동기된 제 2 구동 신호를 전송하도록 상기 제 1 구동기를 제어하는 제어기;를 더 포함하는 것을 특징으로 하는 기판 이송 장치.
- 제 1 항의 장치를 이용하여 기판을 이송하는 방법에 있어서,제 1 구동 신호를 제 1 구동 부재로 전송하고, 상기 제 1 구동 신호에 동기된 제 2 구동 신호 및 수평 지지 부재의 양단 간의 높이 차를 보상하기 위해 기설정된 토크 오프셋 신호를 제 2 구동 부재로 전송하여, 상기 수평 지지 부재를 상하 방향으로 이동시키면서 기판을 이송하는 것을 특징으로 하는 기판 이송 방법.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020060087651A KR100746575B1 (ko) | 2006-09-11 | 2006-09-11 | 기판 이송 장치 및 이를 이용한 기판의 이송 방법 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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KR1020060087651A KR100746575B1 (ko) | 2006-09-11 | 2006-09-11 | 기판 이송 장치 및 이를 이용한 기판의 이송 방법 |
Publications (1)
Publication Number | Publication Date |
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KR100746575B1 true KR100746575B1 (ko) | 2007-08-06 |
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KR1020060087651A KR100746575B1 (ko) | 2006-09-11 | 2006-09-11 | 기판 이송 장치 및 이를 이용한 기판의 이송 방법 |
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Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100914739B1 (ko) * | 2007-08-08 | 2009-08-31 | 세메스 주식회사 | 반도체 제조 설비 |
KR101204255B1 (ko) | 2011-07-05 | 2012-11-23 | 주식회사 에스엠이씨 | 더블암식 이단 카세트 이송 로봇 |
WO2022092822A1 (ko) * | 2020-10-28 | 2022-05-05 | 주식회사 한화 | 복수의 확산로용 기판 로딩 장치 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20020038501A (ko) * | 2000-11-17 | 2002-05-23 | 도리고에 도시오 | 더블아암 기판 반송장치 |
JP2005079368A (ja) * | 2003-09-01 | 2005-03-24 | Nikon Corp | 磁気浮上式ステージ装置及び露光装置 |
KR20050032530A (ko) * | 2005-01-28 | 2005-04-07 | (주)포틱스테크놀로지 | 반도체 패키지용 기판의 자동 검사장치 |
KR20050073712A (ko) * | 2004-01-09 | 2005-07-18 | 박광오 | 반도체 패키지의 검사장치 |
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2006
- 2006-09-11 KR KR1020060087651A patent/KR100746575B1/ko active IP Right Grant
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20020038501A (ko) * | 2000-11-17 | 2002-05-23 | 도리고에 도시오 | 더블아암 기판 반송장치 |
JP2005079368A (ja) * | 2003-09-01 | 2005-03-24 | Nikon Corp | 磁気浮上式ステージ装置及び露光装置 |
KR20050073712A (ko) * | 2004-01-09 | 2005-07-18 | 박광오 | 반도체 패키지의 검사장치 |
KR20050032530A (ko) * | 2005-01-28 | 2005-04-07 | (주)포틱스테크놀로지 | 반도체 패키지용 기판의 자동 검사장치 |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100914739B1 (ko) * | 2007-08-08 | 2009-08-31 | 세메스 주식회사 | 반도체 제조 설비 |
KR101204255B1 (ko) | 2011-07-05 | 2012-11-23 | 주식회사 에스엠이씨 | 더블암식 이단 카세트 이송 로봇 |
WO2022092822A1 (ko) * | 2020-10-28 | 2022-05-05 | 주식회사 한화 | 복수의 확산로용 기판 로딩 장치 |
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