KR100714263B1 - Device for sensing error by change of wind velocity semiconductor coating unit - Google Patents

Device for sensing error by change of wind velocity semiconductor coating unit Download PDF

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KR100714263B1
KR100714263B1 KR1020000066353A KR20000066353A KR100714263B1 KR 100714263 B1 KR100714263 B1 KR 100714263B1 KR 1020000066353 A KR1020000066353 A KR 1020000066353A KR 20000066353 A KR20000066353 A KR 20000066353A KR 100714263 B1 KR100714263 B1 KR 100714263B1
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wind speed
change
semiconductor coating
coating equipment
sensor
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KR20020036257A (en
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박종국
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삼성전자주식회사
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67248—Temperature monitoring

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Abstract

본 발명은 반도체 코팅설비에서 풍속의 변화에 따른 에러를 감지하는 풍속변화에 의한 에러감지장치에 관한 것이다.The present invention relates to an error detection device by a change in wind speed for detecting an error caused by a change in wind speed in a semiconductor coating equipment.

본 발명은 풍속을 공급하는 TCU설비의 오동작 및 크린룸내의 설비이설로 인한 레이아웃 변경 등으로 인해 코팅설비내에 역기류가 형성되어 코팅설비내의 디펙트가 아래로 다운되지 못하고 역기류에 의해 웨이퍼상에 떨어져 불량이 발생하는 것을 해결하기 위해 반도체 코팅설비에서 온도 콘트롤 유닛으로부터 제공되는 풍속의 변화를 감지하여 설정된 풍속이 유지되지 않고 변화가 있을 시 인터록을 발생하여 반도체 코팅설비의 동작을 정지시킨다.According to the present invention, a backflow is formed in the coating equipment due to a malfunction of the TCU equipment that supplies the wind speed and the layout change due to the installation of equipment in the clean room. In order to solve the defects, the semiconductor coating equipment detects a change in the wind speed provided from the temperature control unit, and when the set wind speed is not maintained, an interlock is generated to stop the operation of the semiconductor coating equipment.

풍속변화Wind speed

Description

반도체 코팅설비의 풍속변화에 의한 에러감지장치{DEVICE FOR SENSING ERROR BY CHANGE OF WIND VELOCITY SEMICONDUCTOR COATING UNIT} DEVICE FOR SENSING ERROR BY CHANGE OF WIND VELOCITY SEMICONDUCTOR COATING UNIT}             

도 1은 본 발명의 실시 예에 따른 반도체 코팅설비의 풍속변화에 의한 에러감지장치의 구성도
1 is a block diagram of an error detection apparatus according to the wind speed change of the semiconductor coating equipment according to an embodiment of the present invention

* 도면의 주요부분에 대한 부호의 설명 *              Explanation of symbols on the main parts of the drawings

10: 차콜필터 12: 울파필터10: charcoal filter 12: ulpa filter

14: 풍속감지센서 16: 센서고정부 14: Wind speed sensor 16: sensor

18: 웨이퍼 20: 스핀척
18: wafer 20: spin chuck

본 발명은 반도체 코팅설비에 관한 것으로, 특히 반도체 코팅설비에서 풍속의 변화에 따른 에러를 감지하는 풍속변화에 의한 에러감지장치에 관한 것이다.The present invention relates to a semiconductor coating equipment, and more particularly, to an error sensing device by a change in wind speed for detecting an error caused by a change in wind speed in a semiconductor coating equipment.

일반적으로 반도체 제조 프로세스에 있어서는, 다양한 장면(場面)으로 도포장 치가 사용되고, 그 대표적인 것은 포토레지스트의 도포 및 현상 시스템에 조립되어진 포토레지스트액의 도포장치이다. 포토레지스트액은 반도체 웨이퍼상의 반도체층, 절연층, 도전층을 패턴 에칭하는 경우, 대상이 되는 층의 위에 포토레지스트막을 형성하기 위해 도포된다. 포토레지스트막은 소정의 마스크를 통해 노광된 후에 현상되는 것으로, 마스크에 따라 패터닝된다. 다음에, 패터닝된 포토레지스트막이 마스크로서 사용되어 대상층의 에칭이 행해진다.In general, in the semiconductor manufacturing process, a coating apparatus is used in various scenes, and a representative apparatus is a coating apparatus for a photoresist liquid assembled into a photoresist coating and developing system. The photoresist liquid is applied to form a photoresist film on the target layer when pattern etching the semiconductor layer, the insulating layer, and the conductive layer on the semiconductor wafer. The photoresist film is developed after being exposed through a predetermined mask and is patterned according to the mask. Next, the patterned photoresist film is used as a mask to etch the target layer.

일본국 특개평 7-8879 호, 특개평 7-8880 호, 특개평 7-80384 호, 특개평 7-80385 호, 특개평 7-80386 호 등의 공보에는, 임의 타입의 포토레지스트액의 도포방법이 개시되어 있다. 이 방법에 있어서는, 피처리기판과, 포토레지스트액을 띠상으로 토출하는 노즐을 포토레지스트액의 띠와 직교하는 방향으로 상대적으로 이동시키는 것에 의해 피처리기판의 한쪽면 전체에 걸쳐 포토레지스트액을 도포한다.Japanese Patent Application Laid-Open Nos. 7-8879, 7-8880, 7-80384, 7-80385, 7-80386, etc., a method of applying a photoresist liquid of any type Is disclosed. In this method, the photoresist liquid is applied over one surface of the substrate to be processed by moving the substrate to be processed and the nozzle for discharging the photoresist liquid into a band in a direction orthogonal to the band of the photoresist liquid. do.

이와 같은 종래의 반도체 코팅설비는 풍속을 공급하는 TCU설비의 오동작 및 크린룸내의 환경변화 예를들어 설비이설로 인한 레이아웃 변경 등으로 인해 코팅설비내에 역기류가 형성된다. 그러므로 이 역기류에 의해 코팅설비내의 디펙트(DEFECTS)가 아래로 다운되지 못하고 역기류에 의해 웨이퍼상에 떨어져 불량이 발생하는 문제가 있었다.
Such a conventional semiconductor coating equipment is a reverse air flow is formed in the coating equipment due to the malfunction of the TCU equipment for supplying the wind speed and the environmental change in the clean room, for example, the layout change due to the relocation of equipment. Therefore, there was a problem that defects occurred on the wafer due to backflow and the defects in the coating equipment did not go down due to this backflow.

따라서 본 발명의 목적은 상기와 같은 문제를 해결하기 위해 반도체 코팅설비에서 풍속 변화를 자동으로 센싱하여 인터록을 발생하는 풍속변화에 의한 에러감 지장치를 제공함에 있다.
Accordingly, an object of the present invention is to provide an error detection device by the wind speed change to generate an interlock by automatically sensing the wind speed change in the semiconductor coating equipment to solve the above problems.

상기 목적을 달성하기 위한 본 발명의 반도체 코팅설비의 풍속변화에 의한 에러감지장치에 있어서, 풍속과 습도를 제어하는 온도콘트롤유닛과, 상기 온도콘트롤유닛으로부터 공급되는 풍속을 감지하는 풍속감지센서와, 상기 풍속감지센서를 고정하는 센서고정부와, 상기 풍속감지센서로부터 풍속변화를 감지할 시 인터록을 발생하여 설비의 동작을 정지시키는 콘트롤러를 구비함을 특징으로 한다.In the error detection apparatus according to the wind speed change of the semiconductor coating equipment of the present invention for achieving the above object, Temperature control unit for controlling the wind speed and humidity, Wind speed detection sensor for detecting the wind speed supplied from the temperature control unit, And a controller for fixing the wind speed sensor, and a controller for stopping an operation of the facility by generating an interlock when detecting a wind speed change from the wind speed sensor.

이하 본 발명에 따른 바람직한 실시 예를 첨부한 도면을 참조하여 상세히 설명한다. 그리고 본 발명을 설명함에 있어서, 관련된 공지 기능 혹은 구성에 대한 구체적인 설명이 본 발명의 요지를 불필요하게 흐릴 수 있다고 판단되는 경우 그 상세한 설명을 생략한다.Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings. In the following description of the present invention, if it is determined that a detailed description of a related known function or configuration may unnecessarily obscure the subject matter of the present invention, the detailed description thereof will be omitted.

도 1은 본 발명의 실시 예에 따른 반도체 코팅설비의 풍속변화에 의한 에러감지장치의 구성도이다. 1 is a block diagram of an error detection apparatus according to the wind speed change of the semiconductor coating equipment according to an embodiment of the present invention.

도시하지 않은 TCU(TEMPERATURE CONTROL UNIT)는 설비(spin unit)에 따로 분리되어 있으며 배관을 통해 바람을 전달하도록 되어 있다. 차콜필터(10)는 암모니아를 필터링한다. 울파(ULPA)필터(12)는 TCU로부터 전달된 바람으로부터 파티클을 필터링한다. 풍속감지센서(14)는 상기 울파필터(12)를 통해 공급되는 풍속을 감지한다. 센서고정부(16)는 설비내의 좌,우측벽에 고정되고 레일구조를 갖도록 하여 상기 풍속감지센서(14)를 상하, 좌,우측으로 이동 가능하도록 설치한다. 스핀척(20)은 상면부에 개구하는 진공배기통로(도시하지 않음)를 구비하고 있고 웨이퍼(18)를 흡착 유지하는 기능을 한다. TCU (TEMPERATURE CONTROL UNIT) (not shown) is separated by a spin unit and is configured to transmit wind through pipes. The charcoal filter 10 filters ammonia. The ULPA filter 12 filters the particles from the wind delivered from the TCU. The wind speed sensor 14 detects the wind speed supplied through the wool filter 12. The sensor fixing part 16 is fixed to the left and right walls in the installation and has a rail structure so that the wind speed sensor 14 is installed to be movable up and down, left and right. The spin chuck 20 is provided with a vacuum exhaust passage (not shown) which opens in the upper surface portion, and functions to suck and hold the wafer 18.

상술한 도 1을 참조하여 본 발명의 바람직한 실시예의 동작을 상세히 설명한다. Referring to FIG. 1 described above, the operation of the preferred embodiment of the present invention will be described in detail.

도시하지 않은 TCU(TEMPERATURE CONTROL UNIT)는 설비(spin unit)에 따로 분리되어 있으며 풍속과 습도를 제어하고 배관을 통해 바람을 전달하도록 되어 있다. 이때 차콜필터(10)는 배관을 통해 전달된 바람으로부터 암모니아를 필터링하여 통과시킨다. 울파필터(12)는 상기 차콜필터(10)를 통해 암모니아가 필터링된 바람으로부터 파티클을 필터링하여 통과시킨다. 이렇게 울파필터(12)를 통과한 바람은 설정된 속도로 일정하게 유지되어야 하며, 도시하지 않은 진공배기통로로 배기된다. 이때 풍속이 설정된 속도로 유지되지 않으면 역기류의 발생원인이 되므로 풍속감지센서(14)는 풍속을 감지하여 도시하지 않은 콘트롤러로 제공한다. 그러면 콘트롤러는 풍속감지센서(14)로부터 설정된 풍속의 속도가 유지되지 않고 변화가 발생되는지 판단하여 변화가 발생되면 에러발생으로 인식하여 인터록신호를 발생하여 코팅설비의 동작을 정지시킨다.
The TCU (TEMPERATURE CONTROL UNIT), not shown, is separated by a spin unit and controls wind speed and humidity and transmits wind through pipes. At this time, the charcoal filter 10 filters and passes ammonia from the wind delivered through the pipe. The Wolpa filter 12 filters the particles from the ammonia-filtered wind through the charcoal filter 10 to pass. The wind passing through the Ulpa filter 12 should be kept constant at a set speed, it is exhausted to a vacuum exhaust passage not shown. At this time, if the wind speed is not maintained at the set speed, it is the cause of backflow, so the wind speed sensor 14 detects the wind speed and provides it to a controller (not shown). Then, the controller determines whether a change occurs without maintaining the speed of the set wind speed from the wind speed sensor 14, and if a change occurs, recognizes that an error occurs and generates an interlock signal to stop the operation of the coating facility.

상술한 바와 같이 본 발명은 반도체 코팅설비에서 온도 콘트롤 유닛으로부터 제공되는 풍속의 변화를 감지하여 설정된 풍속이 유지되지 않고 변화가 있을 시 인터록을 발생하여 반도체 코팅설비의 동작을 정지시키므로써, 설비내의 역기류발생 에 의한 웨이퍼의 품질불량을 방지할 수 있는 이점이 있다.


















As described above, the present invention detects a change in the wind speed provided from the temperature control unit in the semiconductor coating equipment and stops the operation of the semiconductor coating equipment by generating an interlock when there is a change without maintaining the set wind speed. There is an advantage that can prevent the wafer quality defects caused by airflow.


















Claims (3)

반도체 코팅설비의 풍속변화에 의한 에러감지장치에 있어서,In the error detection device by the wind speed change of the semiconductor coating equipment, 풍속과 습도를 제어하는 온도콘트롤유닛과,A temperature control unit for controlling wind speed and humidity, 상기 온도콘트롤유닛으로부터 공급되는 풍속을 감지하는 풍속감지센서와,A wind speed sensor for sensing wind speed supplied from the temperature control unit; 상기 풍속감지센서를 고정하는 센서고정부와,A sensor fixing part to fix the wind speed sensor; 상기 풍속감지센서로부터 풍속변화를 감지할 시 인터록을 발생하여 설비의 동작을 정지시키는 콘트롤러를 구비함을 특징으로 하는 반도체 코팅설비의 풍속변화에 의한 에러감지장치.And a controller for generating an interlock to stop the operation of the facility when detecting the wind speed change from the wind speed sensor. 제1항에 있어서,The method of claim 1, 상기 센서고정부는 설비내의 좌우측벽에 고정되고 레일구조를 갖도록 하는 것을 특징으로 하는 반도체 코팅설비의 풍속변화에 의한 에러감지장치.The sensor fixing part is fixed to the left and right side walls in the facility, the error detection device according to the wind speed change of the semiconductor coating equipment, characterized in that it has a rail structure. 제2항에 있어서,The method of claim 2, 상기 센서고정부는 상기 풍속감지센서를 상하, 좌우측으로 이동 가능하도록 설치함을 특징으로 하는 반도체 코팅설비의 풍속변화에 의한 에러감지장치.The sensor fixing unit is installed in the error detection device according to the wind speed change of the semiconductor coating equipment, characterized in that the installation so as to move up and down, left and right.
KR1020000066353A 2000-11-09 2000-11-09 Device for sensing error by change of wind velocity semiconductor coating unit KR100714263B1 (en)

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