KR100677994B1 - Center pin of a wafer stage of an exposure apparatus - Google Patents

Center pin of a wafer stage of an exposure apparatus Download PDF

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KR100677994B1
KR100677994B1 KR1020050130933A KR20050130933A KR100677994B1 KR 100677994 B1 KR100677994 B1 KR 100677994B1 KR 1020050130933 A KR1020050130933 A KR 1020050130933A KR 20050130933 A KR20050130933 A KR 20050130933A KR 100677994 B1 KR100677994 B1 KR 100677994B1
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wafer
rotation
wafer stage
center pin
amount
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KR1020050130933A
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Korean (ko)
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차성환
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동부일렉트로닉스 주식회사
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/707—Chucks, e.g. chucking or un-chucking operations or structural details
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70716—Stages
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

A wafer stage center pin for an exposure apparatus is provided to eliminate a limitation for an amount of rotation compensation of a wafer by rotating the wafer at a wanted angle, thereby shortening a time required for an exposure process. A body(110) is movably installed on a wafer stage(200) to support a center of a wafer at an upper end thereof. A lifting member(120) is provided on one side of the body to lift the body. A motor(130) has a rotation shaft connected to a lower portion of the body to rotate the body corresponding to a rotation angle of the rotation angle, thereby compensating a rotating amount of the wafer. The body has a vacuum hole for chucking the wafer at an upper end thereof.

Description

노광장비의 웨이퍼스테이지 센터핀{CENTER PIN OF A WAFER STAGE OF AN EXPOSURE APPARATUS}CENTER PIN OF A WAFER STAGE OF AN EXPOSURE APPARATUS}

도 1은 종래의 기술에 따른 노광장비의 웨이퍼 정렬방법을 도시한 흐름도이고,1 is a flow chart illustrating a wafer alignment method of an exposure apparatus according to the prior art,

도 2는 종래의 기술에 따른 노광장비의 웨이퍼스테이지 센터핀을 도시한 사시도이고,2 is a perspective view illustrating a wafer stage center pin of an exposure apparatus according to the prior art;

도 3은 본 발명에 따른 노광장비의 웨이퍼스테이지 센터핀을 도시한 사시도이고,3 is a perspective view illustrating a wafer stage center pin of the exposure apparatus according to the present invention;

도 4는 본 발명에 따른 노광장비의 웨이퍼스테이지 센터핀이 상승한 모습을 도시한 사시도이고,4 is a perspective view illustrating a state in which the wafer stage center pin of the exposure apparatus according to the present invention is raised;

도 5는 본 발명에 따른 노광장비의 웨이퍼 정렬방법을 도시한 흐름도이다.5 is a flowchart illustrating a wafer alignment method of the exposure apparatus according to the present invention.

< 도면의 주요 부분에 대한 부호의 설명 ><Description of Symbols for Main Parts of Drawings>

110 : 몸체 111 : 안착면110: body 111: seating surface

112 : 진공홀 113 : 지지패드112: vacuum hole 113: support pad

120 : 승강수단 121 : 승강모터120: lifting means 121: lifting motor

122 : 승강기어어셈블리 130 : 회전모터122: lifting gear assembly 130: rotary motor

131 : 회전기어어셈블리131: Rotating Gear Assembly

본 발명은 노광장비의 웨이퍼스테이지 센터핀에 관한 것으로서, 보다 상세하게는 웨이퍼를 원하는 각도로 회전시킬 수 있도록 함으로써 웨이퍼의 회전보정량에 대한 제한이 없도록 하여 웨이퍼를 재차 초기정렬시키지 않아도 되는 노광장비의 웨이퍼스테이지 센터핀에 관한 것이다.The present invention relates to a wafer stage center pin of an exposure apparatus, and more particularly, it is possible to rotate a wafer at a desired angle, so that there is no limitation on the rotation compensation amount of the wafer so that the wafer does not need to be aligned again. It is about a stage center pin.

일반적으로, 반도체 소자는 이온주입공정, 박막증착공정, 확산공정, 사진공정, 식각공정 등과 같은 다수의 단위공정들을 거쳐서 제조된다. 이러한 단위공정들중에서 원하는 패턴(pattern)을 형성하기 위한 사진공정(photo processing)은 반도체 소자 제조에 필수적으로 요구되는 공정이다.In general, semiconductor devices are manufactured through a plurality of unit processes such as ion implantation, thin film deposition, diffusion, photography, and etching. Among these unit processes, photo processing for forming a desired pattern is an essential step for manufacturing a semiconductor device.

사진공정은 크게, 웨이퍼 상에 포토레지스트를 도포하는 도포공정, 포토레지스트가 도포된 웨이퍼와 정해진 마스크를 서로 정렬시킨 후, 레이저 같은 빔을 마스크로 통과시켜서 웨이퍼 상의 포토레지스트에 조사되도록 하는 노광공정 및 노광공정이 완료된 웨이퍼의 포토레지스트를 현상하여 패터닝하는 현상공정으로 이루어진다. The photographing process is largely an application step of applying a photoresist on a wafer, an exposure step of aligning a wafer on which the photoresist is applied and a predetermined mask with each other, and then irradiating a photoresist on the wafer by passing a laser-like beam through the mask; It consists of a developing process of developing and patterning the photoresist of the wafer on which the exposure process is completed.

노광공정을 실시하는 장비는 웨이퍼에 패턴을 형성 후 이후의 패턴형성에는 이전에 형성된 패턴에 영향을 받게 된다. 따라서, 초기 이후의 패턴형성시 웨이퍼의 정렬을 실시하여야 한다.Equipment for performing the exposure process is affected by the previously formed pattern in the subsequent pattern formation after forming the pattern on the wafer. Therefore, the wafer alignment should be performed during pattern formation after the initial stage.

종래의 노광공정에서 웨이퍼를 정렬하는 방법을 첨부된 도면을 참조하여 설 명하면 다음과 같다. Referring to the accompanying drawings, a method of aligning a wafer in a conventional exposure process is as follows.

도 1은 종래의 노광공정의 웨이퍼 정렬방법을 도시한 흐름도이다. 도시된 바와 같이, 종래의 노광공정의 웨이퍼 정렬방법은 웨이퍼를 초기정렬장치로 이송하는 단계(S1)와, 웨이퍼를 초기정렬하는 단계(S2)와, 웨이퍼를 웨이퍼스테이지로 이송시키는 단계(S3)와, 웨이퍼의 회전량을 산출하는 단계(S4)와, 웨이퍼의 회전량 산출값과 허용값을 비교하는 단계(S5)와, 웨이퍼의 회전량을 보정하는 단계(S6)를 포함한다.1 is a flowchart illustrating a wafer alignment method of a conventional exposure process. As shown, the wafer alignment method of the conventional exposure process includes the step of transferring the wafer to the initial alignment device (S1), the initial alignment of the wafer (S2), and the step of transferring the wafer to the wafer stage (S3). And a step (S4) of calculating the rotation amount of the wafer, a step (S5) of comparing the rotation amount calculation value and the allowable value of the wafer, and a step (S6) of correcting the rotation amount of the wafer.

웨이퍼를 초기정렬장치로 이송하면(S1) 초기정렬장치는 웨이퍼의 노치를 감지하여 노치를 정렬함으로써 웨이퍼를 정렬시킨다(S2).When the wafer is transferred to the initial alignment apparatus (S1), the initial alignment apparatus detects the notch of the wafer and aligns the notches (S2).

웨이퍼의 초기정렬을 마치면(S2), 웨이퍼는 노광을 위하여 웨이퍼스테이지로 이송되며(S3), 웨이퍼에 마련되는 서치마크와 기준위치를 비교하여 웨이퍼의 회전량을 산출한다(S4). After the initial alignment of the wafer is finished (S2), the wafer is transferred to the wafer stage for exposure (S3), and the rotation amount of the wafer is calculated by comparing the search mark provided on the wafer with the reference position (S4).

웨이퍼의 회전량이 산출되면, 산출값과 허용값을 비교하게 되며(S5), 웨이퍼의 회전량 산출값이 허용값 이하이면 웨이퍼를 회전시켜서 웨이퍼의 회전량을 노광공정에 영향을 미치지 않는 범위내에 머물도록 보정시키며(S6), 웨이퍼의 회전량 산출값이 허용값을 초과하면 웨이퍼를 회전시키는데 한계가 있으므로 최대로 보정하여도 정상적인 노광공정을 실시할 수 없으므로 웨이퍼를 초기정렬장치로 반송하여(S1) 그 이후의 단계(S2∼S6)를 재실시하게 된다. When the rotational amount of the wafer is calculated, the calculated value and the allowable value are compared (S5). If the calculated rotational amount of the wafer is less than or equal to the allowable value, the wafer is rotated so that the rotational amount of the wafer remains within a range that does not affect the exposure process. The wafer is returned to the initial alignment device (S1) because the wafer is rotated if the calculated amount of rotation exceeds the allowable value. Subsequent steps S2 to S6 are repeated.

이와 같이, 웨이퍼의 회전량 보정시 웨이퍼를 회전시키는데 한계를 가짐으로써 웨이퍼의 회전량 산출값이 허용값을 초과시 초기정렬을 위한 단계(S1∼S2)들을 다시 실시하여하는 이유는 웨이퍼스테이지에서 웨이퍼를 보정하기 위해 회전시키는 센터핀의 구조에 기인한다.As such, the reason for performing the steps S1 to S2 for initial alignment when the calculated amount of the wafer exceeds the allowable value by limiting the rotation of the wafer when the amount of rotation of the wafer is corrected is that the wafer is moved in the wafer stage. It is due to the structure of the center pin that rotates to calibrate.

도 2는 종래의 기술에 따른 노광장비의 웨이퍼스테이지 센터핀을 도시한 사시도이다. 도시된 바와 같이, 종래의 웨이퍼스테이지 센터핀(10)은 웨이퍼스테이지(미도시)상에 승강 및 회전 가능하도록 설치되는 승강부재(11)와, 승강부재(11)를 승강시키도록 승강부재(11) 일측에 설치되는 승강수단(12)과, 승강부재(11)를 회전시키도록 승강부재(11)에 설치되는 회전수단(13)을 포함한다.2 is a perspective view illustrating a wafer stage center pin of an exposure apparatus according to the related art. As shown, the conventional wafer stage center pin 10 is a lifting member 11 which is installed on the wafer stage (not shown) to be lifted and rotated, and the lifting member 11 to lift the lifting member 11. A) lifting means (12) installed on one side, and rotating means (13) installed on the lifting member (11) to rotate the lifting member (11).

승강부재(11)는 상단에 웨이퍼의 중심부분이 안착되도록 두 개의 안착면(11a)이 형성된다.The elevating member 11 has two seating surfaces 11a formed at the top thereof so that the center portion of the wafer is seated.

승강수단(12)은 승강모터로서 승강모터의 회전력을 피니언과 래크 등의 기어부재들에 의해 승강부재(11)로 전달하여 승강부재(11)를 승강시킨다.Lifting means 12 is a lifting motor to transfer the rotational force of the lifting motor to the elevating member 11 by the gear members such as pinions and racks to elevate the elevating member (11).

회전수단(13)은 승강부재(11)가 수직방향으로 슬라이딩 결합되는 가이드부재(13a)와, 가이드부재(13a)의 일측에 수평되게 고정되는 고정바(13b)와, 고정바(13b)가 회전을 일으킨 후 복귀하도록 탄성력을 제공하는 복귀스프링(13c)과, 고정바(13b) 끝단에 걸리도록 걸림부(13d)가 형성됨과 아울러 수평방향으로 이동하도록 설치되는 수평이동부재(13e)와, 수평이동부재(13e)를 수평 이동시키는 모터(13f)를 포함한다.The rotating means 13 includes a guide member 13a to which the elevating member 11 is slidably coupled in the vertical direction, a fixing bar 13b fixed horizontally to one side of the guide member 13a, and a fixing bar 13b. A return spring 13c for providing an elastic force to return after rotation, and a latching portion 13d to be caught by the fixed bar 13b and a horizontal moving member 13e installed to move in a horizontal direction; And a motor 13f for horizontally moving the horizontal moving member 13e.

이와 같은 종래의 노광장비의 웨이퍼스테이지 센터핀(10)은 웨이퍼가 웨이퍼스테이지로 이송되면(S3) 승강수단(12)의 구동에 의해 상승된 승강부재(11) 상단에 웨이퍼가 놓여져서 승강부재(11)의 하강에 의해 웨이퍼가 웨이퍼스테이지상에 안착 된 다음 웨이퍼의 회전량을 산출하게 된다(S4).In the wafer stage center pin 10 of the conventional exposure apparatus, when the wafer is transferred to the wafer stage (S3), the wafer is placed on the top of the elevating member 11 lifted by the driving of the elevating means 12, and the elevating member ( The lowering of 11) causes the wafer to be seated on the wafer stage and then calculates the amount of rotation of the wafer (S4).

웨이퍼의 회전량을 보정하기 위하여 승강수단(12)의 구동에 의해 승강부재(11)가 웨이퍼를 상승시킨 상태에서 회전수단(13)의 모터(13f) 구동에 의해 수평이동부재(13e)가 고정바(13b) 끝단을 이동시킴으로써 가이드부재(13a)와 함께 승강부재(11)를 회전시켜서 웨이퍼의 회전량을 보정한다.In order to correct the amount of rotation of the wafer, the horizontal moving member 13e is fixed by driving the motor 13f of the rotating means 13 while the elevating member 11 raises the wafer by driving the elevating means 12. By moving the end of the bar 13b, the elevating member 11 is rotated together with the guide member 13a to correct the amount of rotation of the wafer.

이와 같이, 종래의 노광장비의 웨이퍼스테이지 센터핀(10)은 모터(13f)의 회전력을 승강부재(11)로 전달하는 수평이동부재(13e), 고정바(13b), 가이드부재(13a) 등의 구조로 인해 웨이퍼의 최대 회전보정량이 매우 미세하기 때문에 승강부재(11)에 놓여진 웨이퍼를 최대한 회전시키더도 정상적인 노광공정을 수행할 수 있을 정도로 보정되지 않는 경우에 상기한 바와 같이 웨이퍼를 초기정렬장치로 이송(S1)하여 초기정렬을 새로이 하게 된다(S2). As such, the wafer stage center pin 10 of the conventional exposure apparatus includes a horizontal moving member 13e, a fixed bar 13b, a guide member 13a, and the like, which transmits the rotational force of the motor 13f to the elevating member 11. Because the maximum rotation compensation amount of the wafer is very fine due to the structure of the wafer, the wafer is initially aligned as described above when the wafer placed on the elevating member 11 is not compensated enough to perform a normal exposure process. Transfer to the device (S1) is a new initial alignment (S2).

그러므로, 종래의 노광장비의 웨이퍼스테이지 센터핀(10)은 웨이퍼의 회전량보정시 그 구조적인 한계로 인하여 웨이퍼의 초기정렬을 다시 실시하는 경우가 빈번하게 발생하며, 이로 인해 노광공정의 생산성을 저하시키는 문제점을 가지고 있었다. Therefore, the wafer stage center pin 10 of the conventional exposure apparatus frequently performs the initial alignment of the wafer again due to the structural limitations when the rotation amount of the wafer is corrected, thereby lowering the productivity of the exposure process. Had a problem letting.

또한, 승강부재(11)상에 놓여진 웨이퍼가 진동 등으로 인해 쉽게 이탈되어 웨이퍼에 스크래치를 유발하거나 웨이퍼의 회전량 보정시 에러를 유발하여 수율을 저하시키는 원인이 되었다.In addition, the wafer placed on the elevating member 11 is easily detached due to vibration or the like, causing scratches on the wafer or causing an error in correcting the amount of rotation of the wafer, thereby lowering the yield.

본 발명은 상술한 종래의 문제점을 해결하기 위한 것으로서, 본 발명의 목적 은 웨이퍼를 원하는 각도로 회전시킬 수 있도록 함으로써 웨이퍼의 회전보정량에 대한 제한이 없도록 하여 웨이퍼를 재차 초기정렬시키지 않아도 되며, 이로 인해 노광공정시 소요되는 시간을 단축시키며, 웨이퍼를 회전량 보정시 진공으로 척킹할 수 있도록 함으로써 웨이퍼가 이탈로 인해 손상되는 것을 방지하여 수율 증대에 기여하는 노광장비의 웨이퍼스테이지 센터핀을 제공하는데 있다. The present invention is to solve the above-mentioned problems, the object of the present invention is to be able to rotate the wafer at a desired angle, so that there is no limitation on the rotation compensation amount of the wafer does not require the initial alignment of the wafer again, The present invention provides a wafer stage center pin of an exposure apparatus that shortens the time required during the exposure process and prevents the wafer from being damaged due to separation by allowing the wafer to be chucked with a vacuum during the rotation amount correction.

이와 같은 목적을 실현하기 위한 본 발명은, 노광장비의 웨이퍼스테이지상에 설치되는 센터핀에 있어서, 웨이퍼스테이지상에 승강 및 회전 가능하게 설치되며, 상단에 웨이퍼의 중심을 지지하는 몸체와, 몸체를 승강시키도록 몸체 일측에 마련되는 승강수단과, 몸체의 하측에 회전축이 연결되며, 회전축의 회전각도에 상응하게 몸체를 회전시킴으로써 웨이퍼의 회전량을 보정시키는 회전모터를 포함하는 것을 특징으로 한다.The present invention for realizing the above object, the center pin is installed on the wafer stage of the exposure equipment, the body is mounted on the wafer stage to be elevated and rotatable, the body for supporting the center of the wafer on the top, Lifting means provided on one side of the body to move up and down, the rotating shaft is connected to the lower side of the body, characterized in that it comprises a rotating motor for correcting the amount of rotation of the wafer by rotating the body corresponding to the rotation angle of the rotating shaft.

이하, 본 발명의 가장 바람직한 실시예를 첨부한 도면을 참조하여 본 발명의 기술분야에서 통상의 지식을 가진 자가 용이하게 실시할 수 있도록 더욱 상세히 설명하기로 한다.DETAILED DESCRIPTION Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings so that those skilled in the art may easily implement the present invention.

도 3은 본 발명에 따른 노광장비의 웨이퍼스테이지 센터핀을 도시한 사시도이다. 도시된 바와 같이, 본 발명에 따른 노광장비의 웨이퍼스테이지 센터핀(100)은 웨이퍼스테이지(200)상에 설치되는 몸체(110)와, 몸체(110)를 승강시키는 승강수단(120)과, 몸체(110)의 하측에 회전축이 연결되는 회전모터(130)를 포함한다.3 is a perspective view showing a wafer stage center pin of the exposure apparatus according to the present invention. As illustrated, the wafer stage center pin 100 of the exposure apparatus according to the present invention includes a body 110 installed on the wafer stage 200, elevating means 120 for elevating the body 110, and a body. The lower side of the 110 includes a rotating motor 130 is connected to the rotating shaft.

몸체(110)는 웨이퍼스테이지(200)상에 돌출 및 삽입을 반복할 수 있도록 승 강 가능하게 설치되고, 웨이퍼스테이지(200)상에 웨이퍼의 회전량을 보정하기 위하여 회전 가능하게 설치되며, 상단에 웨이퍼의 중심을 지지하도록 원형의 안착면(111)이 형성된다.The body 110 is installed to be elevated to repeat the protrusion and insertion on the wafer stage 200, and is rotatably installed on the wafer stage 200 to correct the amount of rotation of the wafer. A circular seating surface 111 is formed to support the center of the wafer.

몸체(110)는 안착면(111)에 외부의 진공공급부(미도시)로부터 진공이 공급됨으로써 웨이퍼를 진공으로 척킹하기 위한 다수의 진공홀(112)이 형성된다.The body 110 is provided with a plurality of vacuum holes 112 for chucking the wafer into a vacuum by supplying a vacuum from an external vacuum supply unit (not shown) to the seating surface 111.

몸체(110)는 상단에 웨이퍼를 지지함으로써 안착면(111)을 이루는 지지패드(113)가 교체 가능하게 설치된다. 따라서, 몸체(110)가 웨이퍼와 잦은 접촉으로 안착면(111)이 마모되더라도 지지패드(113)의 교체를 통해 이를 해결할 수 있다.Body 110 is supported by the wafer on the top support pad 113 constituting the mounting surface 111 is installed to be replaceable. Therefore, even if the mounting surface 111 is worn by the body 110 in frequent contact with the wafer, it can be solved by replacing the support pad 113.

승강수단(120)은 몸체(110)를 승강시키기 위하여 공압실린더 등이 사용될 수 있으며, 본 실시예에서는 승강모터(121)와 승강모터(121)의 회전력을 수직방향의 직선운동으로 전환하는 승강기어어셈블리(122)를 포함한다.The elevating means 120 may be a pneumatic cylinder or the like used to elevate the body 110, in this embodiment the elevating gear for converting the rotational force of the elevating motor 121 and the elevating motor 121 in a vertical linear motion Assembly 122.

회전모터(130)는 회전축(미도시)이 몸체(110)의 하측에 연결되며, 회전축의 회전각도에 상응하게 몸체(110)를 회전시킴으로써 웨이퍼의 회전량을 제한없이 보정시킨다. The rotary motor 130 has a rotating shaft (not shown) connected to the lower side of the body 110, and rotates the body 110 corresponding to the rotation angle of the rotating shaft to correct the amount of rotation of the wafer without limitation.

회전모터(130)의 회전축에 대한 회전각도를 제어하기 위하여 회전모터(130)를 스텝모터로 사용하거나, 회전모터(130)의 회전축에 대한 회전각을 측정하여 전기적인 신호로 출력하는 엔코더를 구비할 수도 있다.In order to control the rotation angle of the rotation motor 130 with respect to the rotation axis, the rotation motor 130 is used as a step motor, or the encoder is provided with an electrical signal which measures the rotation angle with respect to the rotation axis of the rotation motor 130 and outputs it as an electrical signal. You may.

회전모터(130)는 승강하는 몸체(110)를 회전시키기 위하여 몸체(110)와 함께 승강하되, 회전을 일으키지 않도록 웨이퍼스테이지(200)내에 가이드되는 구조를 가짐으로써 회전력을 몸체(110)에 전달하게 설치될 수 있으며, 다른 실시예로 회전모 터(130)는 웨이퍼스테이지(200) 내측에 고정된 상태에서 그 회전축과 몸체(110)가 함께 회전하도록 맞물리도록 함과 아울러 그 회전축과 몸체(110)가 상하로 슬라이딩 가능하게 결합시키는 회전기어어셈블리(131)에 의해 몸체(110)를 승강이 가능한 상태로 회전시키게 된다.The rotary motor 130 is moved up and down with the body 110 to rotate the lifting body 110, and has a structure that is guided in the wafer stage 200 so as not to cause rotation to transmit the rotational force to the body 110. In another embodiment, the rotating motor 130 is engaged with the rotating shaft and the body 110 to rotate together while being fixed to the inside of the wafer stage 200 and the rotating shaft and the body 110. Is rotated by the rotary gear assembly 131 to slidably up and down the body 110 in a liftable state.

이와 같은 구조로 이루어진 노광장비의 웨이퍼스테이지 센터핀의 동작은 다음과 같이 이루어진다.Operation of the wafer stage center pin of the exposure apparatus having such a structure is performed as follows.

도 5에 도시된 바와 같이, 웨이퍼를 초기정렬장치로 이송하여(S10), 초기정렬(S20)을 마친 웨이퍼가 웨이퍼스테이지(200)로 이송되면(S30), 웨이퍼에 마련된 서치마크와 기준위치의 좌표를 서로 비교함으로써 웨이퍼가 노광공정을 위해 필요한 만큼의 웨이퍼 회전량을 산출하며(S40), 산출된 웨이퍼의 회전량에 따라 보정하게 된다(S50). As shown in FIG. 5, when the wafer is transferred to the initial alignment device (S10), and the wafer after initial alignment (S20) is transferred to the wafer stage 200 (S30), the search mark and reference position provided on the wafer By comparing the coordinates with each other, the wafer calculates the amount of wafer rotation required for the exposure process (S40), and corrects it according to the calculated amount of rotation of the wafer (S50).

센터핀(100)이 웨이퍼의 회전량을 보정하기 위하여 구동하는 승강모터(121)의 회전력이 승강기어어셈블리(122)에 의해 수직운동으로 전환되어 몸체(110)에 전달됨으로써 도 4에 도시된 바와 같이, 몸체(110)가 웨이퍼스테이지(200)로부터 돌출되어 안착면(111)에 진공으로 척킹된 웨이퍼를 상승시키며, 회전모터(130)의 구동에 의해 회전기어어셈블리(131)를 통해 회전력이 전달되는 몸체(110)와 함께 웨이퍼를 산출된 회전량만큼 회전시킴으로써 웨이퍼의 회전량을 보정한다.The rotational force of the elevating motor 121 driven by the center pin 100 to correct the amount of rotation of the wafer is converted into vertical motion by the elevating gear assembly 122 and transmitted to the body 110, as shown in FIG. 4. Likewise, the body 110 protrudes from the wafer stage 200 to raise the wafer chucked by vacuum on the seating surface 111, and the rotational force is transmitted through the rotary gear assembly 131 by the rotation motor 130. The amount of rotation of the wafer is corrected by rotating the wafer by the calculated amount of rotation together with the body 110.

이상과 같이 본 발명의 바람직한 실시예에 따르면, 회전모터(130)로부터 웨이퍼를 원하는 각도로 회전시킬 수 있도록 함으로써 웨이퍼의 회전보정량에 대한 제한이 없도록 하여 웨이퍼를 재차 초기정렬시키지 않아도 되며, 이로 인해 노광공 정시 소요되는 시간을 단축시키며, 웨이퍼를 회전량 보정시 또는 웨이퍼스테이지(200)로의 안착시 진공으로 척킹할 수 있도록 함으로써 웨이퍼가 이탈로 인해 손상되는 것을 방지하여 수율 증대에 기여한다.According to the preferred embodiment of the present invention as described above, it is possible to rotate the wafer from the rotating motor 130 at a desired angle, so that there is no restriction on the rotation compensation amount of the wafer so that the wafer does not need to be initially aligned again. By reducing the time required during the process, by chucking the wafer during vacuum correction or when seated in the wafer stage 200 by vacuum prevents the wafer from being damaged due to departure contributes to increased yield.

상술한 바와 같이, 본 발명에 따른 노광장비의 웨이퍼스테이지 센터핀은 웨이퍼를 원하는 각도로 회전시킬 수 있도록 함으로써 웨이퍼의 회전보정량에 대한 제한이 없도록 하여 웨이퍼를 재차 초기정렬시키지 않아도 되며, 이로 인해 노광공정시 소요되는 시간을 단축시키며, 웨이퍼를 회전량 보정시 진공으로 척킹할 수 있도록 함으로써 웨이퍼가 이탈로 인해 손상되는 것을 방지하여 수율 증대에 기여하는 효과를 가지고 있다. As described above, the wafer stage center pin of the exposure apparatus according to the present invention allows the wafer to be rotated at a desired angle so that there is no limitation on the rotation compensation amount of the wafer so that the wafer does not need to be aligned again. By shortening the time required and by allowing the wafer to be chucked with a vacuum when the rotation amount is corrected, the wafer is prevented from being damaged due to detachment, thereby contributing to an increase in yield.

이상에서 설명한 것은 본 발명에 따른 노광장비의 웨이퍼스테이지 센터핀을 실시하기 위한 하나의 실시예에 불과한 것으로서, 본 발명은 상기한 실시예에 한정되지 않고, 이하의 특허청구범위에서 청구하는 바와 같이 본 발명의 요지를 벗어남이 없이 당해 발명이 속하는 분야에서 통상의 지식을 가진 자라면 누구든지 다양한 변경 실시가 가능한 범위까지 본 발명의 기술적 정신이 있다고 할 것이다.What has been described above is just one embodiment for performing the wafer stage center pin of the exposure apparatus according to the present invention, the present invention is not limited to the above embodiment, as claimed in the following claims Without departing from the gist of the invention, anyone of ordinary skill in the art to which the present invention will have the technical spirit of the present invention to the extent that various modifications can be made.

Claims (3)

노광장비의 웨이퍼스테이지상에 설치되는 센터핀에 있어서,In the center pin installed on the wafer stage of the exposure equipment, 상기 웨이퍼스테이지상에 승강 및 회전 가능하게 설치되며, 상단에 웨이퍼의 중심을 지지하는 몸체와,A body supporting the center of the wafer on the top of the wafer stage and being rotatably mounted and rotatable; 상기 몸체를 승강시키도록 상기 몸체 일측에 마련되는 승강수단과,Elevating means provided on one side of the body to elevate the body; 상기 몸체의 하측에 회전축이 연결되며, 상기 회전축의 회전각도에 상응하게 상기 몸체를 회전시킴으로써 상기 웨이퍼의 회전량을 보정시키는 회전모터Rotating shaft is connected to the lower side of the body, the rotation motor to correct the amount of rotation of the wafer by rotating the body corresponding to the rotation angle of the rotation axis 를 포함하는 노광장비의 웨이퍼스테이지 센터핀.Wafer stage center pin of the exposure equipment comprising a. 제 1 항에 있어서, The method of claim 1, 상기 몸체는,The body, 상단에 웨이퍼를 진공으로 척킹하기 위하여 진공홀이 형성되는 것Wherein vacuum holes are formed at the top to chuck the wafer into a vacuum 을 특징으로 하는 노광장비의 웨이퍼스테이지 센터핀.Wafer stage center pin of the exposure equipment, characterized in that. 제 1 항 또는 제 2 항에 있어서, The method according to claim 1 or 2, 상기 몸체는,The body, 상단에 웨이퍼를 지지하는 지지패드가 교체 가능하게 설치되는 것With support pads on the top for supporting wafers 을 특징으로 하는 노광장비의 웨이퍼스테이지 센터핀.Wafer stage center pin of the exposure equipment, characterized in that.
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Publication number Priority date Publication date Assignee Title
CN110677594A (en) * 2019-10-11 2020-01-10 北京富吉瑞光电科技有限公司 Compensation imaging method and device of photoelectric panoramic imaging system
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