KR100671419B1 - 고주파 초음파 센서용 음향 정합층 및 그를 이용한 초음파센서의 제조 방법 - Google Patents
고주파 초음파 센서용 음향 정합층 및 그를 이용한 초음파센서의 제조 방법 Download PDFInfo
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- KR100671419B1 KR100671419B1 KR1020040069824A KR20040069824A KR100671419B1 KR 100671419 B1 KR100671419 B1 KR 100671419B1 KR 1020040069824 A KR1020040069824 A KR 1020040069824A KR 20040069824 A KR20040069824 A KR 20040069824A KR 100671419 B1 KR100671419 B1 KR 100671419B1
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- matching layer
- ultrasonic sensor
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- piezoelectric ceramic
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
- G01N29/22—Details, e.g. general constructional or apparatus details
- G01N29/24—Probes
- G01N29/2437—Piezoelectric probes
- G01N29/245—Ceramic probes, e.g. lead zirconate titanate [PZT] probes
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/9501—Semiconductor wafers
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
- G01N27/02—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance
- G01N27/04—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance
- G01N27/12—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance of a solid body in dependence upon absorption of a fluid; of a solid body in dependence upon reaction with a fluid, for detecting components in the fluid
- G01N27/128—Microapparatus
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- G—PHYSICS
- G10—MUSICAL INSTRUMENTS; ACOUSTICS
- G10K—SOUND-PRODUCING DEVICES; METHODS OR DEVICES FOR PROTECTING AGAINST, OR FOR DAMPING, NOISE OR OTHER ACOUSTIC WAVES IN GENERAL; ACOUSTICS NOT OTHERWISE PROVIDED FOR
- G10K11/00—Methods or devices for transmitting, conducting or directing sound in general; Methods or devices for protecting against, or for damping, noise or other acoustic waves in general
- G10K11/02—Mechanical acoustic impedances; Impedance matching, e.g. by horns; Acoustic resonators
- G10K11/025—Mechanical acoustic impedances; Impedance matching, e.g. by horns; Acoustic resonators horns for impedance matching
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- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Ceramic Engineering (AREA)
- Acoustics & Sound (AREA)
- Multimedia (AREA)
- Transducers For Ultrasonic Waves (AREA)
Abstract
Description
103, 204 : 후면재 104, 205 : 지연재
(여기서, Z1은 제1 정합층, Z2는 제2 정합층, Zd는 지연재, Zp는 압전 세라믹, Zc는 결합재의 임피던스를 의미한다.)
Claims (3)
- 압전 세라믹과, 상기 압전 세라믹의 후면에 도포되는 텅스턴이 섞인 고무 재질의 후면재와, 상기 압전 세라믹의 전면에 접합되고, 두께가 파장의 1/4인 제1 정합층과, 상기 제1 정합층의 전면에 접합되고, 두께가 파장의 1/4인 제2 정합층과, 상기 제2 정합층의 전면에 접합되고, 상기 제1 정합층보다 그 음향 임피던스 및 결합계수가 낮은 지연재와, 상기 지연재의 전면에 접합되는 결합재를 포함하여 구성되며, 상기 결합재와의 임피던스 정합을 위한 고주파 초음파 센서의 음향 정합층에 있어서,상기 제1 정합층은 실리콘 웨이퍼 재질로 구성되고,상기 제2 정합층은 에폭시 복합재 재질로 구성되며,상기 지연재는 플라스틱 재질로 구성되고,상기 각각은 하기의 식으로 표현되는 것을 특징으로 하는 고주파 초음파 센서의 음향 정합층.(여기서, Z1은 제1 정합층, Z2는 제2 정합층, Zd는 지연재, Zp는 압전 세라믹, Zc는 결합재의 임피던스를 의미한다.)
- 삭제
- 초음파 센서의 제조 방법에 있어서,실리콘 웨이퍼의 일면에 에폭시 복합재를 파장의 1/4 두께가 되도록 도포하여 형성하는 단계;상기 실리콘 웨이퍼를 파장의 1/4 두께가 되도록 연마하는 단계; 및연마된 면에 전극 패턴과 스크라이빙 라인을 형성하고, 상기 실리콘 웨이퍼에 도포한 후, 압전 세라믹을 부착하는 단계를 포함하는 초음파 센서의 제조 방법.
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KR1020040069824A KR100671419B1 (ko) | 2004-09-02 | 2004-09-02 | 고주파 초음파 센서용 음향 정합층 및 그를 이용한 초음파센서의 제조 방법 |
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KR1020040069824A KR100671419B1 (ko) | 2004-09-02 | 2004-09-02 | 고주파 초음파 센서용 음향 정합층 및 그를 이용한 초음파센서의 제조 방법 |
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KR20060021026A KR20060021026A (ko) | 2006-03-07 |
KR100671419B1 true KR100671419B1 (ko) | 2007-01-18 |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20200082147A (ko) | 2018-12-28 | 2020-07-08 | 현대자동차주식회사 | 차량용 초음파 센서 |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100794205B1 (ko) * | 2006-07-08 | 2008-01-11 | 센서텍(주) | 초음파 센서 |
US9945818B2 (en) * | 2014-02-23 | 2018-04-17 | Qualcomm Incorporated | Ultrasonic authenticating button |
KR101616510B1 (ko) | 2014-04-01 | 2016-04-28 | 알피니언메디칼시스템 주식회사 | 의료용 초음파 프로브 |
EP3341563B1 (en) | 2015-10-02 | 2023-03-08 | Halliburton Energy Services, Inc. | Ultrasonic transducer with improved backing element |
CN107227968B (zh) * | 2017-07-27 | 2023-06-16 | 贵州大学 | 一种自检锚杆及其使用方法 |
KR102272163B1 (ko) * | 2019-12-30 | 2021-07-05 | 한국원자력연구원 | 구조물 두께 측정 장치 및 방법 |
Citations (4)
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US4976150A (en) | 1986-12-30 | 1990-12-11 | Bethlehem Steel Corporation | Ultrasonic transducers |
US5488957A (en) | 1994-11-21 | 1996-02-06 | General Electric Company | System and method for promoting adhesion between lens and matching layer of ultrasonic transducer |
US5541468A (en) | 1994-11-21 | 1996-07-30 | General Electric Company | Monolithic transducer array case and method for its manufacture |
KR19990078789A (ko) * | 1999-08-07 | 1999-11-05 | 한진호 | 플라즈마 에칭을 이용한 의료용 초음파 탐촉자 |
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- 2004-09-02 KR KR1020040069824A patent/KR100671419B1/ko active IP Right Grant
Patent Citations (4)
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US4976150A (en) | 1986-12-30 | 1990-12-11 | Bethlehem Steel Corporation | Ultrasonic transducers |
US5488957A (en) | 1994-11-21 | 1996-02-06 | General Electric Company | System and method for promoting adhesion between lens and matching layer of ultrasonic transducer |
US5541468A (en) | 1994-11-21 | 1996-07-30 | General Electric Company | Monolithic transducer array case and method for its manufacture |
KR19990078789A (ko) * | 1999-08-07 | 1999-11-05 | 한진호 | 플라즈마 에칭을 이용한 의료용 초음파 탐촉자 |
Non-Patent Citations (1)
Title |
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04976150 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
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KR20200082147A (ko) | 2018-12-28 | 2020-07-08 | 현대자동차주식회사 | 차량용 초음파 센서 |
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