KR100439188B1 - 반도체 패키지 몰딩장치 - Google Patents
반도체 패키지 몰딩장치 Download PDFInfo
- Publication number
- KR100439188B1 KR100439188B1 KR10-2001-0058531A KR20010058531A KR100439188B1 KR 100439188 B1 KR100439188 B1 KR 100439188B1 KR 20010058531 A KR20010058531 A KR 20010058531A KR 100439188 B1 KR100439188 B1 KR 100439188B1
- Authority
- KR
- South Korea
- Prior art keywords
- semiconductor package
- molding
- upper die
- type
- lower die
- Prior art date
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 60
- 238000000465 moulding Methods 0.000 title claims abstract description 28
- 238000000034 method Methods 0.000 claims description 24
- 238000010438 heat treatment Methods 0.000 claims description 9
- 239000000463 material Substances 0.000 abstract description 5
- 150000001875 compounds Chemical class 0.000 abstract description 2
- 229920005989 resin Polymers 0.000 description 13
- 239000011347 resin Substances 0.000 description 13
- 229920001187 thermosetting polymer Polymers 0.000 description 13
- 238000004519 manufacturing process Methods 0.000 description 9
- 239000012790 adhesive layer Substances 0.000 description 4
- 239000007788 liquid Substances 0.000 description 3
- 230000001681 protective effect Effects 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 229920003002 synthetic resin Polymers 0.000 description 2
- 239000000057 synthetic resin Substances 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000002390 adhesive tape Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000005429 filling process Methods 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000011800 void material Substances 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
Description
Claims (6)
- 상기 반도체패키지가 안착되며, 상기 반도체패키지에 열을 공급하기 위한 가열부 및 상기 반도체패키지 방향으로 초음파를 공급하여 상기 공급된 초음파의 진동에 의해 상기 반도체패키지의 몰딩 공정 시 발생되는 기포를 제거하기 위한 제 1기포제거부를 가진 하부다이와,상기 하부다이와 일정간격으로 이격되도록 위치되며, 업/다운동작에 의해 상기 반도체패키지를 클램핑하는 상부다이와,상기 상부다이에 진공흡입구 형태로 형성되며, 진공흡입 방식에 의해 상기 반도체패키지의 몰딩 공정시 발생되는 기포를 제거하기 위한 제 2기포제거부와,상기 상부다이에 업/다운 구동력을 주기 위한 전원공급부를 포함하여 구성되는 것을 특징으로 하는 반도체패키지 몰딩장치.
- 삭제
- 제 1항에 있어서, 상기 반도체 패키지와 상기 제 1기포제거부 사이에 개재되어 상기 반도체패키지에 열을 공급하기 위한 가열부가 추가된 것을 특징으로 하는 반도체패키지 몰딩장치.
- 제 1항에 있어서, 상기 반도체패키지는 TBGA 타입 또는 EPBGA 타입인 것을 특징으로 하는 반도체패키지 몰딩장치.
- 삭제
- 삭제
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2001-0058531A KR100439188B1 (ko) | 2001-09-21 | 2001-09-21 | 반도체 패키지 몰딩장치 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2001-0058531A KR100439188B1 (ko) | 2001-09-21 | 2001-09-21 | 반도체 패키지 몰딩장치 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20030025484A KR20030025484A (ko) | 2003-03-29 |
KR100439188B1 true KR100439188B1 (ko) | 2004-07-07 |
Family
ID=27724982
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR10-2001-0058531A KR100439188B1 (ko) | 2001-09-21 | 2001-09-21 | 반도체 패키지 몰딩장치 |
Country Status (1)
Country | Link |
---|---|
KR (1) | KR100439188B1 (ko) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR200468411Y1 (ko) * | 2011-12-16 | 2013-08-09 | 세메스 주식회사 | 반도체 소자들을 건조하기 위한 장치 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH09139397A (ja) * | 1995-11-14 | 1997-05-27 | Rohm Co Ltd | 樹脂モールド装置及びこれを用いた半導体装置 |
JPH09312308A (ja) * | 1996-05-21 | 1997-12-02 | Oki Electric Ind Co Ltd | 半導体装置の製造方法及びその製造装置 |
KR19990085085A (ko) * | 1998-05-13 | 1999-12-06 | 김영환 | 반도체 패키지 제조용 몰딩장치 |
JP2000036520A (ja) * | 1998-05-15 | 2000-02-02 | Nec Corp | フリップチップ実装方法及び装置 |
JP2001144115A (ja) * | 1999-11-10 | 2001-05-25 | Mitsumi Electric Co Ltd | 集積回路パッケージング方法及び集積回路パッケージング装置 |
-
2001
- 2001-09-21 KR KR10-2001-0058531A patent/KR100439188B1/ko active IP Right Grant
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH09139397A (ja) * | 1995-11-14 | 1997-05-27 | Rohm Co Ltd | 樹脂モールド装置及びこれを用いた半導体装置 |
JPH09312308A (ja) * | 1996-05-21 | 1997-12-02 | Oki Electric Ind Co Ltd | 半導体装置の製造方法及びその製造装置 |
KR19990085085A (ko) * | 1998-05-13 | 1999-12-06 | 김영환 | 반도체 패키지 제조용 몰딩장치 |
JP2000036520A (ja) * | 1998-05-15 | 2000-02-02 | Nec Corp | フリップチップ実装方法及び装置 |
JP2001144115A (ja) * | 1999-11-10 | 2001-05-25 | Mitsumi Electric Co Ltd | 集積回路パッケージング方法及び集積回路パッケージング装置 |
Also Published As
Publication number | Publication date |
---|---|
KR20030025484A (ko) | 2003-03-29 |
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