KR100340432B1 - A method for developing photo solder resist of bga board - Google Patents
A method for developing photo solder resist of bga board Download PDFInfo
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- KR100340432B1 KR100340432B1 KR1020000051139A KR20000051139A KR100340432B1 KR 100340432 B1 KR100340432 B1 KR 100340432B1 KR 1020000051139 A KR1020000051139 A KR 1020000051139A KR 20000051139 A KR20000051139 A KR 20000051139A KR 100340432 B1 KR100340432 B1 KR 100340432B1
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0023—Etching of the substrate by chemical or physical means by exposure and development of a photosensitive insulating layer
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- Microelectronics & Electronic Packaging (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Abstract
본 발명은 기판의 제조방법에 있어서, 컨베이어상에서 이루어지는 현상조와 회수및 수세와 건조및 열건조의 일괄공정에 의해 수행되는 포토솔더레지스트를 컨베이어의 일측에 설치되는 열경화부에 의해 열경화를 수행하고, 상기 열경화후 다시금 컨베이어상의 일괄공정으로 수세및 건조와 자외선경화를 수행토록 함으로써 기판상의 포토솔더레지스트를 완전경화 하여 포토솔더 레지스트의 과경화로 인한 들뜸과 이탈등을 방지하는 다층기판을 형성하는 다층기판의 포토솔더레지스트 현상방법에 관한 것이다.The present invention provides a method of manufacturing a substrate, the thermosetting is performed by a thermosetting unit provided on one side of the conveyor to the photosolder resist is carried out by a batch process of the developing tank and recovery and washing and drying and heat drying on the conveyor, After the thermosetting, the multi-layered board is formed to form a multi-layer board which prevents lifting and detachment due to over-curing of the photosolder resist by completely curing the photosolder resist on the substrate by performing washing, drying and ultraviolet curing in a batch process on the conveyor again. It relates to a photosolder developing method of.
Description
본 발명은 기판에 있어서, 컨베이어상에서 이루어지는 현상조투입, 회수및 수세와 건조및 열건조의 일괄공정에 의해 수행되는 기판상의 포토솔더레지스트 현상과 컨베이어의 일측에 설치되는 열경화부에 의해 열경화및 상기 열경화후 다시금 컨베이어상의 일괄공정으로 수세및 건조와 자외선경화를 수행토록 함으로써 기판상의 포토솔더레지스트를 적합하도록 경화하여 포토솔더레지스트의 과경화로 인한 들뜸과 이탈등을 방지하는 다층기판을 형성하는 다층기판의 포토솔더레지스트 현상방법에 관한 것이다.The present invention relates to a substrate, which is thermally cured and formed by a photosol resist development on a substrate and a thermosetting unit installed on one side of the conveyor, which is carried out by a batch process of feeding, recovering and washing with water and drying and heat drying on a conveyor. Multi-layer board which forms the multilayer board which prevents lifting and detachment due to over curing of photosolder resist by hardening to suit photosolder resist on the board by performing washing, drying and UV curing in batch process on conveyor again after thermosetting. It relates to a photosolder developing method of.
일반적으로 알려져있는 종래의 인쇄회로기판 제조방법은 도1에서와 같이, 일괄공정에 의해 포토솔더 레지스트(PSR:Photo Solder Resist)(1)가 도포되는 다층기판(2)이 투입되면 노즐(10A)이 설치되는 현상부(10)에서 현상액이 분사되고, 상기 현상액의 분사후 그 일측에 설치되는 회수및 수세부(20)에서 공기를 흡입하는 흡입기(20A)와 청정수를 분사하는 노즐(20B)에 의해 기판(2)상의 이물질을 제거하며, 상기 회수및 수세부(20)에서 이물질 제거 작업이 완료된 기판(2)은 그 일측의 상온공기를 분사토록 노즐(30A)이 설치되는 에어나이프(air knife)부(30)에 투입되어 상온에서 건조된다.A conventionally known method for manufacturing a printed circuit board is a nozzle 10A when a multilayer substrate 2 to which a photo solder resist (PSR) 1 is applied is applied by a batch process as shown in FIG. 1. The developer is injected from the developing part 10 to be installed, and the injector 20A for sucking air from the collecting and washing part 20 installed on one side after the injection of the developing solution is sprayed to the nozzle 20B for spraying clean water. The foreign substance on the substrate 2 is removed, and the substrate 2 on which the foreign matter removal operation is completed in the recovery and washing unit 20 has an air knife in which a nozzle 30A is installed to spray ambient temperature air on one side thereof. It is injected into the unit 30 and dried at room temperature.
그리고, 상기 에어나이프부(30)의 일측에 연결 설치되는 건조로(40A)및 자외선램프(40B)가 설치되는 건조부(40)에 투입되어 건조를 완료하고, 상기의 공정은 컨베이어상(60)에 각각 설치되어 일괄공정으로 수행되고, 상기 건조부(40)를 통과한 기판(2)을 열경화부(50)에 투입하여 기판을 현상을 완료하여 일정패턴(70)을 같는 완제품이 형성되는 것이다.Then, the drying furnace 40A and the ultraviolet lamp 40B are connected to one side of the air knife unit 30 and the drying unit 40 is installed to complete the drying, the above process is carried out on the conveyor 60 Each of which is installed in the c) is performed in a batch process, and the substrate 2 passing through the drying part 40 is introduced into the thermosetting part 50 to complete development of the substrate to form a finished product having the same pattern 70. will be.
그러나, 상기와 같은 인쇄회로기판의 제조방법은, 기판이 컨베이어등을 타고 진행하는 일괄공정에 의해 기판의 현상이 진행되어 생산성은 높으나 많은 불량요인을 가지고 있고, 현상및 U.V cure(자외선 경화)의 변수를 자유롭게 조절하지 못하여 포토솔더레지스트 잉크의 미현상및 들뜸과 이탈이발생함은 물론 변색등의 불량이 발생하게 되는 단점이 있는 것이다.However, in the method of manufacturing a printed circuit board as described above, the development of the substrate proceeds by a batch process in which the substrate proceeds on a conveyor or the like, and thus the productivity is high, but it has many defects. Unable to freely control the parameters of the photo-solder resist ink, such as undeveloped and lifted off, as well as defects such as discoloration occurs.
본 발명은 상기한 바와같은 종래의 여러 문제점들을 개선하기 위한 것으로서 그 목적은, 포토솔더레지스트 잉크의 과경화로 인한 들뜸과 이탈을 방지하고, 현상조건의 변수를 민족할수 있도록 한 다층기판의 포토솔더레지스트 현상방법을 제공하는데 있다.SUMMARY OF THE INVENTION The present invention has been made to solve various problems of the related art as described above, and an object thereof is to prevent lift and departure due to over-curing of photosolder ink, and photosolder resist of a multi-layer substrate to make the development conditions variable. It is to provide a developing method.
도1은 종래의 기판의 포토솔더레지스트 현상방법을 도시한 개략도1 is a schematic view showing a photosolder developing method for a conventional substrate
도2는 본 발명에 따른 기판의 포토솔더레지스트 현상방법을 도시한 개략도2 is a schematic view showing a method of developing a photosolder resist of a substrate according to the present invention;
* 도면의 주요 부분에 대한 부호의 설명 *Explanation of symbols on the main parts of the drawings
100...포토솔더레지스트 130...컨베이어100 Photo Solder Resist 130 Conveyor
150...외부회로패턴 200a...오븐150 ... external circuit pattern 200a ... oven
210a...노즐 230a...자외선램프210a ... Nozzle 230a ... UV Lamp
상기 목적을 달성하기 위한 기술적인 구성으로서 본 발명은, 포토솔더 레지스트가 도포되는 다층기판을 투입하는 단계,The present invention as a technical configuration for achieving the above object, the step of inputting a multi-layer substrate to which a photosolder resist is applied,
상기 다층기판을 다수의 노즐이 설치되는 현상부에서 현상액이 분사하는 단계,Spraying the developing solution on the multi-layer substrate in a developing part in which a plurality of nozzles are installed;
상기 현상액의 분사후 그 일측에 설치되는 흡입기와 청정수 분사용 노즐이 설치되는 회수및 수세부에서 기판상의 이물질을 제거하는 단계,Removing the foreign matter on the substrate from the collecting and washing section in which the inhaler and the nozzle for cleaning water are installed on one side of the developer after the injection of the developing solution,
상기 회수및 수세부에서 이물질 제거 작업이 완료된 기판을 에어나이프에 의해 상온에서 건조하는 단계,Drying the substrate in which the foreign matter removal operation is completed in the recovery and washing section at room temperature by air knife,
상기 기판을 건조로에서 건조하는 단계,Drying the substrate in a drying furnace,
상기 기판을 오븐에서 열 경화 하는 단계,Thermally curing the substrate in an oven,
상기 열경화 완료된 기판을 상기 수세및 에어나이프공정에 순차로 투입한후 자외선에 의해 경화하는 단계를 포함하여 포터 솔더 레지스토를 현상하는 다층기판의 포토솔더레지스트 현상방법을 마련함에 의한다.The method of developing a photosolder resist for developing a multi-layer substrate including the step of sequentially injecting the thermally cured substrate into the water washing and air knife process and curing by ultraviolet rays.
이하, 첨부된 도면에 의거하여 본 발명의 실시예를 상세하게 설명하면 다음과 같다.Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.
도2는 본 발명에 따른 기판의 포토솔더레지스트 현상방법을 도시한 개략도로서 본 발명은, 먼저 포토솔더 레지스트(100)가 도포되는 다층기판(120)을 1~3m/min 의 속도로 이송되는 컨베이어(130) 상에 투입한다.Figure 2 is a schematic diagram showing a method of developing a photosolder resist of a substrate according to the present invention, the present invention, first, a conveyor for transferring a multi-layer substrate 120 to which the photosolder resist 100 is applied at a speed of 1 ~ 3m / min Put on 130.
이때, 상기 컨베이어(130)의 이동속도가 1m/min 이하가 되면 과경화가 일어나 포토솔더레지스트가 기판에상에 들뜨거나 이탈되는 상태가 되고, 3m/min 이상이 되면 현상이나 건조및 경화 시간이 짧아 기판(120) 상측에 형성되는 회로패턴(150)의 형성이 불량품이 발생된다.At this time, when the moving speed of the conveyor 130 is 1m / min or less, overcuring occurs, and the photosolder resist enters or leaves the substrate, and when it is 3m / min or more, development, drying and curing time are short. Defective formation of the circuit pattern 150 formed on the substrate 120 is generated.
상기 다층기판(120)이 컨베이어(130)에 투입되면 컨베이어의 흐름중에 설치되면서 다수의 노즐(140A)이 설치되는 현상부(140)에서 현상액이 1.0~1.5kgf/cm2의 압력으로 분사되어 포토솔더레지스트(100)에 현상을 하여 다층기판(120)에 일정패턴을 갖는 외부회로패턴(150)이 형성된다.When the multi-layer substrate 120 is input to the conveyor 130, the developer is sprayed at a pressure of 1.0 ~ 1.5kg f / cm 2 in the developing unit 140 is installed in the flow of the conveyor, the plurality of nozzles 140A is installed By developing the photo solder resist 100, an external circuit pattern 150 having a predetermined pattern is formed on the multilayer substrate 120.
그리고, 상기 현상액의 분사압력이 1kgf/cm2이하가 되면 미 현상부분이 발생하여 불량품이 발생되고, 그 압력이 1.5kgf/cm2이상이 되면 과 현상이 되어 기판(120)에 손상이 발생토록 된다.When the injection pressure of the developer is 1 kg f / cm 2 or less, undeveloped parts are generated, and defective products are generated. When the pressure is 1.5 kg f / cm 2 or more, overdevelopment results in damage to the substrate 120. To occur.
이어서, 상기 현상부(140)의 일측에는 흡입기(160a)와 청정수 분사용 노즐(160b)이 설치되는 회수및 수세부(160)가 설치되어 현상후 기판(120)상의 이물질을 제거토록 한다.Subsequently, one side of the developing part 140 is provided with a collecting and washing part 160 provided with an inhaler 160a and a nozzle for cleaning water 160b to remove foreign substances on the substrate 120 after development.
계속하여, 상기 기판(120)의 이물질이 제거되면 회수및 수세부(160)의 일측에 설치되어 송풍기(170a)를 갖는 에어나이프부(170)에 의해 상온에서 기판(120)을 건조토록 한다.Subsequently, when the foreign matter of the substrate 120 is removed, the substrate 120 may be dried at room temperature by the air knife unit 170 having the blower 170a installed at one side of the recovery and washing unit 160.
그리고, 상기 에어나이프부(170)에 의해 물기등이 제거되면 컨베이어(130)에 의한 연속공정중 에어나이프부(170)의 일측에 설치되면서 코일(180a)이 설치되는 건조부(180)에서 기판(120)을 건조토록 한다.In addition, when water is removed by the air knife unit 170, the substrate may be installed in the drying unit 180 in which the coil 180a is installed while being installed at one side of the air knife unit 170 during the continuous process by the conveyor 130. Allow 120 to dry.
상기 동작에 의한 컨베이어(130)을 타고 진행하면서 연속공정을 수행하여 외부회로패턴(150)이 형성되는 기판(120)을 과경화나 불왼전 경화가 방지토록 되는 130~170도시의 오븐(200a)이 설치되는 열경화부(200)에서 열에 의한 경화를 수행한다.The oven (200a) of 130 ~ 170 shown to prevent the over-hardening or pre-hardening of the substrate 120, the external circuit pattern 150 is formed by performing a continuous process while proceeding on the conveyor 130 by the operation Curing by heat is performed in the thermosetting unit 200 to be installed.
상기 열경화가 완료된 기판(120)을 다시금 1~3m/min 속도로 이송하는 컨베이어(130a)에 투입하여 연속공정을 수행하고, 상기 컨베이어(130a) 상에는 노즐(210a)이 설치되는 수세부(210)및 송풍기(220a)를 갖는 에어나이프부(220)및 자외성램프(230a)가 설치되는 자와선경화부(230)가 순차로 설치되어 기판(120)상의포토 솔더 레지스터(100)에 완전경화시켜 외부회로패턴(150)을 형성토록 하는 것이다.The thermosetting-completed substrate 120 is again put into a conveyor 130a for transferring at a speed of 1 to 3 m / min to perform a continuous process, and a water washing unit 210 in which a nozzle 210a is installed on the conveyor 130a. And the air-knife portion 220 having the blower 220a and the ultraviolet ray curing portion 230, in which the ultraviolet lamp 230a is installed, are sequentially installed to completely cure the photo solder resistor 100 on the substrate 120. To form an external circuit pattern 150.
이상과 같이 본 발명에 따른 다층기판의 포토솔더레지스트 현상방법에 의하면, 현상조건과 자외선 건조의 조건을 자유롭게 조절하여 각 제품에 대한 안정된 조건을 제공하여 에칭의 신뢰성을 제공하고, 에칭 불량을 최소화 할수 있으며, PSR잉크의 미현상, 과경화로 인한 들뜸과 이탈및 변색등의 불량을 방지하는 등의 우수한 효과가 있는 것이다.As described above, according to the method of developing the photosolder resist of the multilayer board according to the present invention, by providing a stable condition for each product by freely adjusting the developing condition and the ultraviolet drying condition, the reliability of etching can be provided and the etching failure can be minimized. In addition, there is an excellent effect, such as to prevent the defects such as undeveloped PSR ink, lifting and departure and discoloration due to over-curing.
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JPH04303992A (en) * | 1991-04-01 | 1992-10-27 | Nec Corp | Manufacture of printed wiring board |
JPH07193361A (en) * | 1993-12-27 | 1995-07-28 | Taiyo Ink Mfg Ltd | Formation of solder resist using alkali developed solder resist ink |
JPH0951156A (en) * | 1995-08-07 | 1997-02-18 | Ibiden Co Ltd | Formation of solder resist in printed wiring board |
JP2000200960A (en) * | 1999-01-05 | 2000-07-18 | Sony Corp | Solder resist and forming method thereof |
KR20000036342A (en) * | 2000-02-11 | 2000-07-05 | 박종선 | Photo Solder Resist drying method of Printed Circuit Board |
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KR20020017656A (en) | 2002-03-07 |
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