KR100257793B1 - Washing apparatus for wafer - Google Patents

Washing apparatus for wafer Download PDF

Info

Publication number
KR100257793B1
KR100257793B1 KR1019970054841A KR19970054841A KR100257793B1 KR 100257793 B1 KR100257793 B1 KR 100257793B1 KR 1019970054841 A KR1019970054841 A KR 1019970054841A KR 19970054841 A KR19970054841 A KR 19970054841A KR 100257793 B1 KR100257793 B1 KR 100257793B1
Authority
KR
South Korea
Prior art keywords
wafer
washing
cleaning
washing water
tank
Prior art date
Application number
KR1019970054841A
Other languages
Korean (ko)
Other versions
KR19990033479A (en
Inventor
구교욱
Original Assignee
김광교
대한민국디엔에스주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 김광교, 대한민국디엔에스주식회사 filed Critical 김광교
Priority to KR1019970054841A priority Critical patent/KR100257793B1/en
Publication of KR19990033479A publication Critical patent/KR19990033479A/en
Application granted granted Critical
Publication of KR100257793B1 publication Critical patent/KR100257793B1/en

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67057—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)

Abstract

PURPOSE: A wafer cleaning device is provided to uniformly clean a wafer by allowing a liquid flow of a cleaning liquid generated in a cleaning tub to be uniformly applied to the wafer. CONSTITUTION: A wafer cleaning device comprises a cleaning tub(2) for accommodating a cleaning liquid(1). A plurality of wafers are vertically installed in the cleaning tub(2) by means of a pair of supporting bars(60) which are fixed to a supporting plate(50). A plurality of slots(31) are formed in a rotating shaft(30) which transfers a rotational force to the wafer. The slots(31) make contact with a periphery of the wafer. An impeller(40) is installed at an end of the rotating shaft(30). The impeller(40) is rotated by a liquid flow of the cleaning liquid(1) which is circulated by a pump(7).

Description

웨이퍼 세척장치Wafer Cleaning Equipment

본 발명은 웨이퍼 세척장치에 관한 것으로서, 더욱 상세하게는 웨이퍼를 회전시켜 균일하게 세척할 수 있도록 한 것이다.The present invention relates to a wafer cleaning apparatus, and more particularly, to rotate the wafer so that it can be uniformly cleaned.

일반적으로 반도체를 제조할 때에는 웨이퍼의 표면에 감광막을 도포하고 식각하게 되며 이때에는 상기 웨이퍼의 표면이 이물질에 의해서 오염되므로 상기 이물질을 제거하기 위하여 세척을 하고 있다.In general, when manufacturing a semiconductor, a photosensitive film is coated and etched on the surface of the wafer. At this time, the surface of the wafer is contaminated by foreign matters, and thus cleaning is performed to remove the foreign matters.

이러한 세척방식은 세척수를 웨이퍼의 표면에 분사시키는 분사식과 세척수가 담겨진 세척조에 웨이퍼를 넣는 세척조 방식이 있고 상기 방식중 세척조 방식이 널리 사용되고 있으며 웨이퍼의 표면에 부착된 이물질을 균일하게 제거할 수 있는 세척장치가 절실히 요구되고 있는 실정이다.This cleaning method includes a spraying method for spraying the washing water onto the surface of the wafer and a washing tank method for putting the wafer in the washing tank containing the washing water. Among the washing methods, the washing tank method is widely used, and the washing can remove the foreign substances attached to the surface of the wafer uniformly. There is an urgent need for a device.

종래에는 도 1 및 도 2에 도시된 바와같이 세척수(1)가 담겨진 세척조(2)의 저면 중앙에 공급관(3a)이 연결되어 있고 상기 공급관(3a)에는 세척수(1)에 포함된 이물질을 분리시키는 필터(4)가 설치되어 있다.In the related art, as shown in FIGS. 1 and 2, a supply pipe 3a is connected to a center of a bottom surface of the washing tank 2 in which the washing water 1 is contained, and the foreign matter contained in the washing water 1 is separated from the supply pipe 3a. The filter 4 to make it is provided.

그리고 상기 필터(4)의 타측에는 연결관(5)이 결합되어 있고 상기 연결관(5)의 중앙에는 히터(6)가 설치되어 있다.And the other side of the filter 4 is connected to the connection pipe 5, the heater 6 is provided in the center of the connection pipe (5).

한편 상기 연결관(5)의 타측에는 펌프(7)가 설치되어 있고 이의 타측에는 배수관(8a)이 설치되어 있다.On the other hand, the other side of the connecting pipe (5) is provided with a pump (7), the other side is provided with a drain pipe (8a).

그리고 상기 세척조(2)의 상측 둘레면에는 배수조(9a)가 설치되어 있고 이의 일측하부에는 연장부(10a)가 설치되어 있으며 상기 연장부(10a)의 저면에는 배수관(8a)이 설치되어 있다.In addition, a drainage tank 9a is provided on the upper circumferential surface of the washing tank 2, and an extension part 10a is installed on one lower side thereof, and a drain pipe 8a is installed on the bottom of the extension part 10a. .

따라서 웨이퍼(W)를 세척할 때에는 세척수(1)가 담겨진 세척조(2)의 내부에 웨이퍼(W)가 놓여진 지지대(20a)를 넣고 히터(6)에 전원을 인가한 상태에서 펌프(7)를 구동시키면 세척수(1)는 연결관(5)에 설치된 히터(6)를 통과하면서 가열된후 필터(4)에 의해서 이물질이 제거되어 세척조(2)의 하부에 설치된 공급관(3a)을 통해서 세척조(2)로 유입된다.Therefore, when washing the wafer (W), the support (20a) on which the wafer (W) is placed in the cleaning tank (2) containing the washing water (1) and the pump (7) while the power is applied to the heater (6) When driven, the washing water (1) is heated while passing through the heater (6) installed in the connecting pipe (5) and the foreign matter is removed by the filter (4) through the supply pipe (3a) installed in the lower portion of the washing tank (2) 2) flows into.

상기 세척조(2)로 세척수(1)가 공급되면 세척조(2)의 내부에 담겨진 세척수(1)에 수류가 형성되어 웨이퍼(W)의 표면에 부착된 이물질을 제거시키게 된다.When the washing water 1 is supplied to the washing tank 2, water flow is formed in the washing water 1 contained in the washing tank 2 to remove foreign matters attached to the surface of the wafer W.

상기 세척수(1)가 더욱더 공급되어 수위가 상승하게 되면 세척조(2)의 상부로 넘치게 되고 이는 배수조(9a)로 유입된다.When the washing water 1 is further supplied to raise the water level, the washing water 1 overflows to the upper part of the washing tank 2, which flows into the drain tank 9a.

이와같이 상기 배수조(9a)로 유입된 세척수(1)는 이의 일측 하부에 설치된 연장부(10a)를 통해서 배수관(8a)으로 배수되어 펌프(7)에 의해서 연속적으로 순환하면서 웨이퍼(W)의 표면에 부착된 이물질을 제거하게 되는 것이다.As such, the washing water 1 introduced into the drainage tank 9a is drained into the drain pipe 8a through an extension part 10a installed at one lower side of the drainage tank 9a and continuously circulated by the pump 7 to surface the wafer W. Foreign substances attached to the will be removed.

그러나 이러한 종래의 세척장치는 세척조(2) 상.하부에 수류가 불균일하게 형성되므로 웨이퍼(W)의 표면을 일정하게 세척할 수 없게되어 오염에의한 불량이 발생되었음은 물론 세척수(1)에 의해서 분리된 이물질이 세척조(2)의 하부에 침전되므로 세척수(1)가 오염되는 문제점이 있었다.However, such a conventional washing apparatus is because the water flow is formed non-uniformly in the upper and lower washing tank (2), so that the surface of the wafer (W) can not be constantly cleaned, the defect caused by contamination, as well as the washing water (1) Since the foreign matter separated by the sedimented in the lower portion of the washing tank (2) there was a problem that the washing water (1) is contaminated.

본 발명은 상기한 문제점을 해결하기 위하여 발명한 것으로서, 세척조에 형성되는 세척수의 수류가 웨이퍼에 균일하게 작용하도록 하여 웨이퍼를 균일하게 세척할 수 있는 웨이퍼 세척장치를 제공하는데 그 목적이 있다.The present invention has been made to solve the above problems, an object of the present invention is to provide a wafer cleaning apparatus capable of uniformly washing the wafer so that the water flow of the washing water formed in the cleaning tank acts uniformly on the wafer.

상기 목적을 달성하기위한 본 발명의 웨이퍼 세척장치는 지지판에 고정된 한쌍의 지지봉에 다수의 웨이퍼를 수직으로 기립되게 한 상태에서 세척하도록 세척수가 수용되는 세척조에 있어서, 상기 웨이퍼의 외주면이 접촉되게 다수의 협지홈이 구비되어 웨이퍼에 회전력을 전달하게 설치치된 회전축과, 상기 회전축의 단부에 설치되어 펌프에 의해 강제로 순환되는 세척수의 수류에 의해 회전되는 임펠러로 이루어진 것이다.The wafer cleaning apparatus of the present invention for achieving the above object is a washing tank in which a washing water is accommodated in a state in which a plurality of wafers are vertically stood on a pair of support rods fixed to a support plate, such that the outer circumferential surface of the wafer is in contact. The pinching groove is provided with a rotating shaft installed to transfer the rotational force to the wafer, and an impeller installed at the end of the rotating shaft to be rotated by the water flow of the washing water forcibly circulated by the pump.

도 1은 종래 세척장치를 도시한 단면도,1 is a cross-sectional view showing a conventional washing apparatus,

도 2는 도 1의 A - A선 단면도,2 is a cross-sectional view taken along the line A-A of FIG.

도 3은 본 발명에 따른 세척장치를 도시한 단면도,3 is a sectional view showing a washing apparatus according to the present invention;

도 4는 도 3의 B - B선 단면도.4 is a cross-sectional view taken along the line B-B in FIG.

<도면의 주요부분에 대한 부호의 설명><Description of the symbols for the main parts of the drawings>

W : 웨이퍼 1 : 세척수W: Wafer 1: Washing Water

2 : 세척조 30 : 회전축2: washing tank 30: rotating shaft

31, 61 : 협지홈 40 : 임펠러31, 61: Hedge groove 40: Impeller

50 : 지지판 60 : 지지봉50: support plate 60: support rod

이하 본 발명을 도시한 첨부도면 도 3 및 도 4를 참조하여 상세히 설명하면 다음과 같다.Hereinafter, the present invention will be described in detail with reference to FIGS. 3 and 4.

도 3은 본 발명에 따른 세척장치를 도시한 단면도이고, 도 4는 도 3의 B - B선 단면도로서, 본 발명은 세척수(1)가 수용되는 세척조(2)의 저면에 배수관(8)이 형성되어 있고, 상기 배수관(8)의 관로상에는 세척수를 강제로 순환되게 펌프(7)를 설치하되 이 펌프(7)의 토출구 측에는 세척조(2)로부터 펌핑된 세척수를 세척조(2)에 인접된 공급조(9)에 공급하게 연결관(5)이 설치되어 있다.3 is a cross-sectional view showing a washing apparatus according to the present invention, Figure 4 is a cross-sectional view taken along the line B-B of Figure 3, the present invention is a drain pipe (8) on the bottom surface of the washing tank (2) containing the washing water (1) The pump 7 is installed on the pipeline of the drain pipe 8 so as to circulate the washing water forcibly, and the washing water pumped from the washing tank 2 is supplied to the discharge port side of the pump 7 adjacent to the washing tank 2. The connection pipe 5 is provided so that it may supply to the tank 9.

상기 연결관(5)의 관로에는 세척수(1)를 적정온도로 가열하기 위한 히터(6)와 세척수(1)에 포함된 이물질을 포집하는 필터(4)가 각각 설치되고 이 필터(4)의 토출구측은 공급조(9)에 연결된 공급관(3)이 설치되어 있다.In the conduit of the connecting pipe (5), a heater (6) for heating the washing water (1) to a proper temperature and a filter (4) for collecting foreign substances contained in the washing water (1) are respectively installed and the filter (4) On the discharge port side, a supply pipe 3 connected to the supply tank 9 is provided.

상기 세척조(2)에 인접된 공급조(9)의 일측에는 연장부(10)가 설치되고, 이의 저면에 상기 공급관(3)이 연결되어 있다.An extension part 10 is installed at one side of the supply tank 9 adjacent to the washing tank 2, and the supply pipe 3 is connected to a bottom thereof.

상기 세척조(2)의 하부에는 회전축(30)이 삽입되어 있고 이의 둘레면에는 다수의 협지홈(31)이 등간격으로 형성되어 있으며 일측은 연장부(10)의 내부로 돌출되어 있다.Rotating shaft 30 is inserted into the lower portion of the washing tank 2 and a plurality of clamping grooves 31 are formed at equal intervals on one side thereof, and one side protrudes into the extension part 10.

상기 연장부(10)의 내부로 돌출된 회전축(30)에는 임펠러(40)가 설치되어 있고 상기 임펠러(40)는 세척수(1)에 의해서 회전되도록 공급관(3)의 직상방에 위치되어 있다.An impeller 40 is installed on the rotation shaft 30 protruding into the extension part 10, and the impeller 40 is located above the supply pipe 3 so as to be rotated by the washing water 1.

또한 상기 세척조(2)의 내부에 삽입되는 지지판(50)의 사이에는 한쌍의 지지봉(60)이 설치되어 있고 상기 각 지지봉(60)의 둘레면에는 웨이퍼(W)가 삽입되는 다수의 협지홈(61)이 형성되어 있다.In addition, a pair of support rods 60 are installed between the support plates 50 inserted into the washing tank 2, and a plurality of clamping grooves in which a wafer W is inserted into the circumferential surface of each support rod 60 ( 61) is formed.

이와같이 구성된 본 발명 세척장치로 웨이퍼(W)를 세척할 때에는 지지봉(60)에 형성된 다수의 협지홈(61)에 웨이퍼(W)를 각각 위치시킨후 상기 지지봉(60)이 설치된 지지판(50)을 세척수(1)가 수용된 세척조(2)에 삽입하되 상기 세척조(2)의 하부에 설치된 회전축(30)의 협지홈(31)에 웨이퍼(W)가 접속되도록 삽입한다.When cleaning the wafer (W) with the cleaning device of the present invention configured as described above, after placing the wafer (W) in each of the plurality of holding grooves (61) formed in the support rod (60), the support plate (60) provided with the support rod (60) is installed. The washing water 1 is inserted into the washing tank 2 accommodated therein, but the wafer W is inserted into the clamping groove 31 of the rotating shaft 30 installed at the lower portion of the washing tank 2.

이러한 상태에서 배수관(8)에 설치된 펌프(7)를 구동시키면 상기 세척조(2)에 담겨진 세척수(1)는 연결관(5)을 통해서 히터(6)로 이동되면서 가열된다.In this state, when the pump 7 installed in the drain pipe 8 is driven, the washing water 1 contained in the washing tank 2 is heated while being moved to the heater 6 through the connecting pipe 5.

상기 가열된 세척수(1)는 필터(4)를 통과하면서 이물질이 제거된상태로 공급관(3)을 통해서 연장부(10)로 이동하게 되어 연장부(10)에 설치된 임펠러(40)를 회전시키게 된다.The heated wash water 1 is moved to the extension part 10 through the supply pipe 3 while the foreign matter is removed while passing through the filter 4 to rotate the impeller 40 installed in the extension part 10. do.

상기 임펠러(40)가 회전하게 됨에 따라 세척조(2)의 하부에 설치된 회전축(30)이 함께 회전하게 되므로 상기 회전축(30)의 협지홈(31)에 삽입된 웨이퍼(W)는 상기 회전축(30)이 회전되는 반대방향으로 회전하게 된다.As the impeller 40 rotates, the rotating shaft 30 installed below the washing tank 2 rotates together, so that the wafer W inserted into the pinching groove 31 of the rotating shaft 30 is rotated. ) Rotates in the opposite direction of rotation.

한편 상기 웨이퍼(W)는 회전축(30)에 형성된 협지홈(31)은 물론 지지봉(60)에 형성된 협지홈(61)에 접속되어 있으므로 좌.우로 유동되지않은 상태에서 회전하게 된다.On the other hand, since the wafer W is connected to the gripping groove 31 formed on the support rod 60 as well as the gripping groove 31 formed on the rotation shaft 30, the wafer W rotates in a state in which the wafer W does not flow left and right.

또한 상기 펌프(7)에 의해서 연장부(10)로 이동된 세척수(1)의 수위가 세척조(2)보다 높게 되면 상기 세척수(1)는 세척조(2)로 유입되어 순환하게 되어 웨이퍼(W)의 표면을 세척하게 된다.In addition, when the water level of the washing water (1) moved to the extension portion 10 by the pump (7) is higher than the washing tank (2), the washing water (1) flows into the washing tank (2) to circulate the wafer (W) Will clean the surface.

이때 상기 세척조(2)내부에 담겨진 세척수(1)에 의해서 형성되는 상.하부의 수류는 서로 다르게 형성되지만 상기 세척조(2) 내부의 웨이퍼(W)가 연속적으로 회전하게 되므로 상기 웨이퍼(W)의 표면에는 균일한 수류가 작용하게 되어 웨이퍼(W)의 표면이 일정하게 세척된다.At this time, the upper and lower streams of water formed by the washing water 1 contained in the washing tank 2 are formed differently, but the wafer W inside the washing tank 2 is continuously rotated, Uniform water flow acts on the surface and the surface of the wafer W is constantly washed.

또는 상기 펌프(7)를 역방향으로 구동하여 세척조(2)의 하부로 세척수(1)가 공급되고 상부로 배수되도록 순환하여도 웨이퍼(W)가 회전하게 되므로 상기 웨이퍼(W)의 표면을 동일하게 세척할 수 있게 된다.Alternatively, the wafer W is rotated even when the pump 7 is driven in the reverse direction so that the washing water 1 is supplied to the lower part of the washing tank 2 and circulated to drain to the upper part, so that the surface of the wafer W is the same. It can be cleaned.

이상에서와 같이 본 발명은 별도의 구동력을 사용하지 않고도 세척조(2)내부의 웨이퍼(W)를 회전시켜 표면의 이물질을 균일하게 제거할 수 있게 되므로 세척불량에 의한 불량을 최소화 할 수 있게 된다.As described above, the present invention can minimize the defect due to poor cleaning because the foreign matter on the surface can be uniformly removed by rotating the wafer W inside the cleaning tank 2 without using a separate driving force.

또한 상기 세척수(1)는 세척조(2)의 하부로 배수되므로 세척수(1)에 잔존하는 이물질에 의한 웨이퍼(W)의 오염을 최소화 할 수 있게 되는 효과가 있다.In addition, since the washing water 1 is drained to the lower portion of the washing tank 2, there is an effect that it is possible to minimize the contamination of the wafer (W) by the foreign matter remaining in the washing water (1).

Claims (1)

지지판(50)에 고정된 한쌍의 지지봉(60)에 다수의 웨이퍼(W)를 수직으로 기립되게 한 상태에서 세척하도록 세척수(1)가 수용되는 세척조(2)에 있어서, 상기 웨이퍼(W)의 외주면이 접촉되게 다수의 협지홈(31)이 구비되어 웨이퍼(W)에 회전력을 전달하게 설치치된 회전축(30)과, 상기 회전축(30)의 단부에 설치되어 펌프(7)에 의해 강제로 순환되는 세척수(1)의 수류에 의해 회전되는 임펠러(40)로 이루어진 구성을 특징으로하는 웨이퍼 세척장치.In the washing tank (2) in which the washing water (1) is accommodated in a state in which the plurality of wafers (W) are standing upright on a pair of supporting rods (60) fixed to the supporting plate (50), the wafer (W) A plurality of clamping grooves 31 are provided to contact the outer circumferential surface thereof, and are provided at the end of the rotary shaft 30 and the rotary shaft 30 which is installed to transmit the rotational force to the wafer W, and is forced by the pump 7. Wafer cleaning apparatus, characterized in that the configuration consisting of an impeller (40) rotated by the water flow of the circulating washing water (1).
KR1019970054841A 1997-10-24 1997-10-24 Washing apparatus for wafer KR100257793B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019970054841A KR100257793B1 (en) 1997-10-24 1997-10-24 Washing apparatus for wafer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019970054841A KR100257793B1 (en) 1997-10-24 1997-10-24 Washing apparatus for wafer

Publications (2)

Publication Number Publication Date
KR19990033479A KR19990033479A (en) 1999-05-15
KR100257793B1 true KR100257793B1 (en) 2000-06-01

Family

ID=19523360

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019970054841A KR100257793B1 (en) 1997-10-24 1997-10-24 Washing apparatus for wafer

Country Status (1)

Country Link
KR (1) KR100257793B1 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4526374B2 (en) * 2004-03-30 2010-08-18 大日本スクリーン製造株式会社 Substrate processing equipment
KR101485581B1 (en) * 2013-06-27 2015-01-22 주식회사 케이씨텍 Apparatus for cleaning substrate
CN113113346B (en) * 2021-03-30 2024-06-21 北京北方华创微电子装备有限公司 Bearing device and semiconductor cleaning equipment

Also Published As

Publication number Publication date
KR19990033479A (en) 1999-05-15

Similar Documents

Publication Publication Date Title
US5556479A (en) Method and apparatus for drying semiconductor wafers
JP2003297795A (en) Cleaner and dryer, and cleaning and drying method of semiconductor wafer
KR0147043B1 (en) Cleaning device
KR100257793B1 (en) Washing apparatus for wafer
JPS6141800A (en) Apparatus for tube interior electropolishing
KR20010049878A (en) Wet processing apparatus
JP2920165B2 (en) Overflow tank for single wafer cleaning
KR101040746B1 (en) Wet type washing device of wafer and thereof method
CN114613696A (en) Indium phosphide cleaning device with high automation degree
JP4025146B2 (en) Processing liquid tank and processing apparatus
JP4766836B2 (en) Photomask substrate cleaning method
CN110031280B (en) Spore dyeing device
US7237967B2 (en) Developing apparatus and method
JP3386892B2 (en) Wash tank
KR0118693Y1 (en) Cleansing apparatus for wafer
JPS62156659A (en) Method and apparatus for cleaning
KR200177330Y1 (en) Apparatus for cleansing semiconductor wafer
KR100901491B1 (en) Cleaning brush unit and apparatus for cleaning substrate using the same
CN210995512U (en) Silicon wafer cleaning device
GB2074550A (en) Improvements in or relating to machines for washing drinking glasses
KR20080087519A (en) Apparatus for cleaning wafers
JP3065061B1 (en) Wafer cleaning equipment
KR20070037247A (en) Wafer roller guide
KR0178000B1 (en) Wafer cleaning apparatus
KR200275420Y1 (en) A wet station

Legal Events

Date Code Title Description
A201 Request for examination
E701 Decision to grant or registration of patent right
GRNT Written decision to grant
FPAY Annual fee payment

Payment date: 20090129

Year of fee payment: 10

LAPS Lapse due to unpaid annual fee