KR100241966B1 - Frame structure of saw - Google Patents
Frame structure of saw Download PDFInfo
- Publication number
- KR100241966B1 KR100241966B1 KR1019920001444A KR920001444A KR100241966B1 KR 100241966 B1 KR100241966 B1 KR 100241966B1 KR 1019920001444 A KR1019920001444 A KR 1019920001444A KR 920001444 A KR920001444 A KR 920001444A KR 100241966 B1 KR100241966 B1 KR 100241966B1
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- KR
- South Korea
- Prior art keywords
- pcb
- surface acoustic
- attached
- acoustic wave
- bottom plate
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/30—Time-delay networks
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- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
Abstract
본 발명은 압전기판을 이용하는 탄성표면파소자의 조립구조에 관한 것으로, 본 발명은 알루미나 패키지의 밑판(1a) 위에 액상 실리콘을 사용하여 PCB 기판(2)이 부착되고, 이 PCB 기판(2) 위에 IDT 전극이 인쇄된 칩(5)을 Ag페이스트가 사용되어 100℃ 내지 200℃에서 큐어링되어 접착되고, 상기 PCB기판(2)의 전극을 Al 연결선(4)과 상기 PCB기판(2)상의 리드핀(3)들이 밑판(1a)으로부터 돌출되도록 납땜되고, 이 구조 위에 상기 리드핀(3) 각각을 고정시키도록 형성된 알루미나 패키지의 덮개(1b)가 도전성 페이스트로 상기 밑판(1a)에 부착된 구조이다.The present invention relates to an assembly structure of a surface acoustic wave device using a piezoelectric plate, the present invention is a PCB substrate (2) is attached to the bottom plate (1a) of the alumina package using liquid silicon, the IDT on the PCB substrate (2) The electrode 5 is printed on the chip 5 using Ag paste and cured at 100 ° C. to 200 ° C., and the electrode of the PCB 2 is bonded to the Al connection line 4 and the lead pins on the PCB 2. (3) are soldered so as to protrude from the base plate 1a, and the lid 1b of the alumina package formed to fix each of the lead pins 3 on this structure is attached to the base plate 1a with a conductive paste. .
Description
제1도는 본 발명에 의한 탄성표면파소자의 조립구조를 나타낸 평면도.1 is a plan view showing the assembly structure of the surface acoustic wave device according to the present invention.
제2도는 본 발명에 의한 탄성표면파소자의 조립이 완성된 후의 단면도.2 is a cross-sectional view after the assembling of the surface acoustic wave device according to the present invention is completed.
* 도면의 주요부분에 대한 부호의 설명* Explanation of symbols for main parts of the drawings
1a : 알루미나 패키지(alumina package)의 밑판1a: base plate of alumina package
1b : 알루미나 패키지의 덮개 2 : PCB판1b: cover of alumina package 2: PCB board
3 : 리드 핀(lead pin) 4 : 연결선(bonding wire)3: lead pin 4: bonding wire
5 : 칩(chip) 6 : 도전성 페이스트(conductive paste)5 chip 6 conductive paste
본 발명은 탄성표면파를 이용한 압전소자(piezoelectric device)의 조립구조에 관한 것으로, 특히, SAW(surface acoustic wave)를 발생시키는 압전기판으로 니오브산리듐(LiNbO3), 탄탈산리듐(LiTaO3) 또는 수정(quartz)과 같은 압전 단결정을 사용한 탄성표면파소자의 조립구조에 관한 것이다.BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an assembling structure of a piezoelectric device using surface acoustic waves. In particular, a piezoelectric plate for generating a surface acoustic wave (SAW) includes lithium niobate (LiNbO 3 ), lithium tantalate (LiTaO 3 ), or the like. An assembly structure of a surface acoustic wave device using piezoelectric single crystal such as quartz.
통상적으로 사용되는 종래의 탄성표면파소자는 밑판(stem)과 덮개(shell)로 구성되는 금속캔(metal can)에 LiTaO3또는 수정과 같은 압전단결정 칩을 부착하여 조립한다.Conventionally used surface acoustic wave devices are assembled by attaching a piezoelectric single crystal chip such as LiTaO 3 or quartz to a metal can composed of a stem and a shell.
종래의 금속캔을 이용한 조립방법에 대하여 좀 더 구체적으로 설명하면 다음과 같다.The assembly method using a conventional metal can is described in more detail as follows.
먼저, 리드핀을 금속캔의 밑판에 부착하되, 각 리드핀과 밑판 상호간을 절연시키기 위하여 절연체를 삽입하여 부착한다.First, the lead pins are attached to the bottom plate of the metal can, and an insulator is inserted and attached to insulate the lead pins and the bottom plate from each other.
금속캔의 밑판상에 탄성표면파를 여기(excitation) 또는 검출하는 IDT(interdigital transducor) 전극이 인쇄되어있는 칩을 부착시킨 후, 이 칩을 알루미늄 도선(Al wire)으로 각 리드핀에 연결한다.After attaching a chip printed with an IDT (interdigital transducor) electrode that excites or detects surface acoustic waves on the bottom plate of the metal can, the chip is connected to each lead pin with an aluminum wire.
마지막으로 금속캔의 덮개와 밑판을 결합시켜 탄성표면파소자를 조립한다.Finally, the surface acoustic wave device is assembled by combining the cover and the bottom plate of the metal can.
상기한 종래의 금속캔형태의 탄성표면파소자는 특성은 우수하나 장치의 원가에 비해 금속캔의 가격이 차지하는 비율이 너무 크다는 결점이 있다.The conventional surface acoustic wave device in the form of a metal can is excellent in characteristics, but has a drawback that the ratio of the price of the metal can to the cost of the device is too large.
따라서, 본 발명의 목적은 종래의 금속캔형 소자의 조립구조의 결점을 해결하기 위한 것으로, 종래의 소자와 특성은 동일하면서도 제작비용을 획기적으로 절감할 수 있는 탄성표면파소자의 조립구조를 제공하는 것이다.Accordingly, it is an object of the present invention to solve the drawbacks of the assembly structure of a conventional metal can-type device, and to provide an assembly structure of a surface acoustic wave device which has the same characteristics as the conventional device but can drastically reduce the manufacturing cost. .
상기한 목적을 달성하기 위한 본 발명의 구조는, 압전기판을 이용하는 탄성표면파소자의 조립구조에 있어서, 알루미나 패키지의 밑판 위에 액상 실리콘을 사용하여 PCB판이 부착되고, 이 PCB 판 위에 IDT 전극이 인쇄된 칩을 Ag 페이스트가 사용되어 100℃ 내지 200℃에서 큐어링되어 접착되고, 상기 PCB기판의 전극을 Al 연결선(Bonding wire)과 상기 PCB판상의 리드핀(lead pin)들이 상기 밑판으로부터 돌출되도록 납땜되고, 이 구조 위에 상기 리드핀 각각을 고정시키도록 형성된 알루미나 패키지의 덮개가 도전성 페이스트(conductive paste)로 상기 밑판에 부착된 것을 특징으로 한다.The structure of the present invention for achieving the above object, in the assembly structure of the surface acoustic wave device using a piezoelectric plate, a PCB plate is attached to the bottom plate of the alumina package using liquid silicon, the IDT electrode is printed on the PCB plate The chip is cured and bonded at 100 ° C. to 200 ° C. using Ag paste, and the electrode of the PCB board is soldered to protrude from the bottom plate with Al bonding wires and lead pins on the PCB board. And a lid of the alumina package formed to fix each of the lead pins on the structure is attached to the bottom plate with a conductive paste.
이제부터 첨부된 도면을 참조하여 본 발명을 상세히 설명한다.Hereinafter, the present invention will be described in detail with reference to the accompanying drawings.
제1도 및 제2도는 본 발명에 의한 소자조립구조의 평면도 및 조립이 완성된 후의 단면도를 각각 나타낸 것으로서, 도면에서, 1a 및 1b는 알루미나 패키지(alumina package)의 밑판 및 덮개를 각각 나타낸 것이며, 2는 IDT전극이 인쇄된 칩을 리드핀(lead pin)과 연결할 수 있는 회로가 형성된 PCB(Printed Circuit Board)판을 나타낸 것이며, 3은 리드핀, 4는 칩과 리드핀(3)을 연결하는 연결선(bonding wire), 5는 칩(chip), 6은 도전성 페이스트(conductive paste)를 각각 나타낸 것이다.1 and 2 are a plan view and a cross-sectional view of the device assembly structure according to the present invention after the completion of the assembly, respectively, in the drawings, 1a and 1b are the bottom plate and cover of the alumina package (alumina package), respectively 2 shows a printed circuit board (PCB) board having a circuit for connecting a chip printed with an IDT electrode with a lead pin, 3 is a lead pin, and 4 is a chip connecting the lead pin 3. A bonding wire, 5 is a chip, and 6 is a conductive paste, respectively.
이하 소자의 조립방법을 설명하면 다음과 같다.Hereinafter, the method of assembling the device will be described.
먼저, IDT전극이 인쇄된 칩(5)을 리드핀(3)과 연결하는 회로가 인쇄되어 있는 PCB판(2)상에 부착시킨다.First, the chip 5 on which the IDT electrode is printed is attached onto the PCB board 2 on which the circuit connecting the lead pin 3 is printed.
이때, 칩(5)이 IDT전극이 형성된 부위를 PCB판(2)상에 Ag페이스트로 부착시킨 후 100℃ 내지 200℃에서 큐어링(curing)한다.At this time, the chip 5 attaches the portion where the IDT electrode is formed with Ag paste on the PCB plate 2 and then cures the coating at 100 ° C to 200 ° C.
이어, PCB판(2)의 본딩패드(bonding pad)에 있는 칩(5)의 전극을 알루미늄(Al)등으로 이루어진 연결선(4)을 사용하여 리드핀(3)과 접속한다.Subsequently, the electrode of the chip 5 in the bonding pad of the PCB board 2 is connected to the lead pin 3 using a connecting line 4 made of aluminum (Al) or the like.
그 후, PCB판(2)상에 각 리드핀(3)들을 납땜(soldering)하여 부착시킨다.Then, each lead pin 3 is soldered and attached to the PCB board 2.
이와같이 하여 칩(5)이 부착된 PCB판(2)을 알루미나 패키지의 밑판(1a)상에 액상실리콘(liquid phase silicon)을 사용하여 접착한다.In this way, the PCB plate 2 to which the chip 5 is attached is bonded onto the base plate 1a of the alumina package using liquid phase silicon.
마지막으로, 도전성 페이스트를 사용하여 상기 각 리드핀(3)을 고정시키도록 형성된 알루미나 패키지의 덮개(1b)를 밑판(1a)에 결합하여 부착한다.Finally, the cover 1b of the alumina package formed to fix the lead pins 3 using the conductive paste is bonded to the bottom plate 1a.
이상에서 설명된 바와같이 본 발명의 조립방법에 의하면, 압전기판에서 발생하는 표면파(SAW)를 억제시키지 않고 원래의 설계 특성을 유지하도록 하면서도 획기적으로 재료비를 절감할 수 있으며, 생산성의 향상에도 기여할 수 있다.As described above, according to the assembling method of the present invention, while maintaining the original design characteristics without suppressing the surface wave (SAW) generated in the piezoelectric plate, it is possible to drastically reduce the material cost and contribute to the improvement of productivity. have.
Claims (1)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1019920001444A KR100241966B1 (en) | 1992-01-31 | 1992-01-31 | Frame structure of saw |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1019920001444A KR100241966B1 (en) | 1992-01-31 | 1992-01-31 | Frame structure of saw |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR930017473A KR930017473A (en) | 1993-08-30 |
| KR100241966B1 true KR100241966B1 (en) | 2000-02-01 |
Family
ID=19328512
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1019920001444A KR100241966B1 (en) | 1992-01-31 | 1992-01-31 | Frame structure of saw |
Country Status (1)
| Country | Link |
|---|---|
| KR (1) | KR100241966B1 (en) |
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1992
- 1992-01-31 KR KR1019920001444A patent/KR100241966B1/en not_active IP Right Cessation
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| Publication number | Publication date |
|---|---|
| KR930017473A (en) | 1993-08-30 |
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