KR100208634B1 - 표면 실장형 반도체 장치 - Google Patents

표면 실장형 반도체 장치 Download PDF

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Publication number
KR100208634B1
KR100208634B1 KR1019940030738A KR19940030738A KR100208634B1 KR 100208634 B1 KR100208634 B1 KR 100208634B1 KR 1019940030738 A KR1019940030738 A KR 1019940030738A KR 19940030738 A KR19940030738 A KR 19940030738A KR 100208634 B1 KR100208634 B1 KR 100208634B1
Authority
KR
South Korea
Prior art keywords
lead
resin
thick portion
semiconductor device
thick
Prior art date
Application number
KR1019940030738A
Other languages
English (en)
Korean (ko)
Inventor
쯔또무 아노
다까요시 니시
Original Assignee
다카노 야스아키
산요 덴키 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 다카노 야스아키, 산요 덴키 가부시키가이샤 filed Critical 다카노 야스아키
Application granted granted Critical
Publication of KR100208634B1 publication Critical patent/KR100208634B1/ko

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
KR1019940030738A 1993-11-25 1994-11-22 표면 실장형 반도체 장치 KR100208634B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP93-295721 1993-11-25
JP29572193A JP2902919B2 (ja) 1993-11-25 1993-11-25 表面実装型半導体装置

Publications (1)

Publication Number Publication Date
KR100208634B1 true KR100208634B1 (ko) 1999-07-15

Family

ID=17824308

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019940030738A KR100208634B1 (ko) 1993-11-25 1994-11-22 표면 실장형 반도체 장치

Country Status (2)

Country Link
JP (1) JP2902919B2 (ja)
KR (1) KR100208634B1 (ja)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007184643A (ja) * 2007-03-28 2007-07-19 Toshiba Electronic Engineering Corp 光半導体パッケージ
JP5667820B2 (ja) * 2010-09-14 2015-02-12 東芝電子エンジニアリング株式会社 光半導体装置
JP5580723B2 (ja) * 2010-12-11 2014-08-27 エンゼル工業株式会社 被覆ダイオードと太陽電池モジュール用端子ボックス
JP5410465B2 (ja) * 2011-02-24 2014-02-05 ローム株式会社 半導体装置および半導体装置の製造方法
US9190606B2 (en) * 2013-03-15 2015-11-17 Allegro Micosystems, LLC Packaging for an electronic device
US10345343B2 (en) 2013-03-15 2019-07-09 Allegro Microsystems, Llc Current sensor isolation
JP5740458B2 (ja) * 2013-12-02 2015-06-24 東芝電子エンジニアリング株式会社 光半導体パッケージ
US11768230B1 (en) 2022-03-30 2023-09-26 Allegro Microsystems, Llc Current sensor integrated circuit with a dual gauge lead frame

Also Published As

Publication number Publication date
JP2902919B2 (ja) 1999-06-07
JPH07147360A (ja) 1995-06-06

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