KR0141337B1 - A segment for a saw blade - Google Patents

A segment for a saw blade

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Publication number
KR0141337B1
KR0141337B1 KR1019940022268A KR19940022268A KR0141337B1 KR 0141337 B1 KR0141337 B1 KR 0141337B1 KR 1019940022268 A KR1019940022268 A KR 1019940022268A KR 19940022268 A KR19940022268 A KR 19940022268A KR 0141337 B1 KR0141337 B1 KR 0141337B1
Authority
KR
South Korea
Prior art keywords
segment
saw blade
silver lead
attached
silver
Prior art date
Application number
KR1019940022268A
Other languages
Korean (ko)
Other versions
KR960010160A (en
Inventor
한정수
김재우
Original Assignee
김수광
이화다이아몬드공업주식회사
김인호
제러럴 툴,. 인코퍼레이티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 김수광, 이화다이아몬드공업주식회사, 김인호, 제러럴 툴,. 인코퍼레이티드 filed Critical 김수광
Priority to KR1019940022268A priority Critical patent/KR0141337B1/en
Priority to BR9509199A priority patent/BR9509199A/en
Priority to CN95195682A priority patent/CN1160371A/en
Priority to JP8509385A priority patent/JPH10501185A/en
Priority to AU38346/95A priority patent/AU3834695A/en
Priority to PCT/KR1995/000044 priority patent/WO1996007521A1/en
Priority to EP95918196A priority patent/EP0781191A1/en
Priority to TW084113398A priority patent/TW302320B/zh
Publication of KR960010160A publication Critical patent/KR960010160A/en
Application granted granted Critical
Publication of KR0141337B1 publication Critical patent/KR0141337B1/en

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
    • B28D1/02—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by sawing
    • B28D1/12—Saw-blades or saw-discs specially adapted for working stone
    • B28D1/121—Circular saw blades
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
    • B28D1/02—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by sawing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
    • B23D61/00—Tools for sawing machines or sawing devices; Clamping devices for these tools
    • B23D61/02—Circular saw blades
    • B23D61/04—Circular saw blades with inserted saw teeth the teeth being individually inserted
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D5/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting only by their periphery; Bushings or mountings therefor
    • B24D5/12—Cut-off wheels
    • B24D5/123—Cut-off wheels having different cutting segments
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
    • B23K35/3006—Ag as the principal constituent

Abstract

본 발명은 석재 및 콘크리트를 절단하는 다이아몬드 소우블레이드에 부착되는 세그먼트에 관한 것으로 특히 소비자가 세그먼트를 직접 부착 사용하기가 편리하도록 은납을 기부착시킨 소우블레이드용 세그먼트에 관한 것이다.The present invention relates to a segment attached to a diamond saw blade for cutting stone and concrete, and more particularly, to a segment for a saw blade made of silver lead base so as to be convenient for a consumer to directly attach and use the segment.

일반적으로 새 제품으로 교환하여 사용함에 있어 직경이 큰 소우블레이드는 그만큼 철판의 가격 비중이 큼으로 마모된 세그먼트를 떼어내고 새로운 세그먼트를 부착시켜 철판 손실없이 소우블레이드를 재사용하고 있는데 따른 시간적, 물질적 손실을 가져오는 문제가 있다.In general, large-size saw blades are replaced with new products, and the size of steel plates is so large that the worn segments are removed and new segments are attached to reuse the saw blades without the loss of steel plates. There is a problem.

상기 목적을 달성하기 위해 본 발명은 다이아몬드 소우블레이드에 부착 설치할 수 있는 다이아몬드 세그먼트를 형성함에 있어서, 세그먼트(10)의 저면에 은납을 기부착 형성하여서 된 것을 특징으로 한 소우블레이드용 세그먼트로 된다.In order to achieve the above object, the present invention is to form a diamond segment that can be attached to the diamond saw blade, it is a segment for the saw blade, characterized in that the silver lead is formed on the bottom surface of the segment (10).

Description

소우블레이드용 세그먼트Saw Blade Segments

제1도는 일반적인 소우블레이드의 부분절취된 정면도 및 단면도1 is a partially cutaway front and cross-sectional view of a typical saw blade

제2도는 본 발명 세그먼트의 저면사시도 및 분리사시도로써,2 is a bottom perspective view and a separate perspective view of the segment of the present invention,

(a)(b)(c)(d)(e)(f)(g)는 본 발명의 여러 실시예를 보인 도면이고,(a) (b) (c) (d) (e) (f) (g) are views showing various embodiments of the present invention,

제3도 (a)(b)(c)(d)(e)는 제2도 각각에 따른 부착성형시의 단면도 및 정면도이다.(A) (b) (c) (d) (e) of FIG. 3 are sectional drawing and the front view at the time of attachment shaping | molding according to FIG.

*도면의 주요부분에 대한 부호의 설명* Explanation of symbols for main parts of the drawings

10:세그먼트(segment) 20:은납판(2도)10: segment 20: silver lead plate (2 degrees)

20A,20B:은납채널 20a,20b:고정절점20A, 20B: Silver lead channel 20a, 20b: Fixed node

12:홈 14:스크래치부12: Home 14: scratch part

본 발명은 석재 및 콘크리트를 절단하는 다이아몬드 소우블레이드에 부착되는 세그먼트에 관한 것으로 특히 소비자가 세그먼트를 직접 부착 사용하기가 편리하도록 은납을 기부착시킨 소우블레이드용 세그먼트에 관한 것이다.The present invention relates to a segment attached to a diamond saw blade for cutting stone and concrete, and more particularly, to a segment for a saw blade made of silver lead base so as to be convenient for a consumer to directly attach and use the segment.

일반적으로 소우블레이드는 제1도에서와 같이 원판형의 철판 외주연단에 다이아몬드입자를 함유한 세그먼트를 중간에 은납을 끼워 용융가열하여 녹여 부착하여 제품화하고 있으며, 직경이 작은 소우블레이드는 철판가격 역시 큰 비중을 차지하지 않음으로서 세그먼트의 완전 마모시 버리고 새 제품으로 교환하여 사용하는 것이 별 문제가 없으나 직경이 큰 소우블레이드는 그만큼 철판의 가격 비중이 큼으로 마모된 세그먼트를 떼어내고 새로운 세그먼트를 부착시켜 철판 손실없이 소우블레이드를 재사용하고 있다.In general, saw blades are manufactured by melting, heating, melting and attaching segments containing diamond particles to the outer edge of a disk-shaped iron plate, as shown in FIG. As it does not occupy specific gravity, it is not a problem to discard the complete wear of the segment and replace it with a new product.However, the large saw blade has a large price ratio of the steel sheet, so that the worn segment is removed and a new segment is attached. The saw blade is being reused without loss.

따라서 실제 소비자들은 일반적으로 직경이 큰 소우블레이드는 다이아몬드가 함유된 세그먼트가 완전마모된 철판을 다시 생산공장으로 보내 새로운 세그먼트를 재 용접하여 가져와야 하므로 시간적, 물직적 손실을 가져오는 문제도 있고, 같은 이유로 수출품에 있어 직경이 작은 제품은 세그먼트가 붙은 완제품상태로, 직경이 큰 제품은 세그먼트상태로 보내어 현지에서 철판에 부착 사용하는 것이 유리하다.As a result, consumers usually have large diameter saw blades, which have to be sent back to the manufacturing plant to re-weld new segments with diamond-containing segments to the production plant. For export products, small-diameter products are in segmented finished products, and large-diameter products are sent in segmented form, which is advantageous for attaching to steel plates locally.

따라서 본 발명은 이상과 같은 문제점을 감안하여 이루어진 것으로 본 발명의 목적은 소우블레이드에서 마모된 세그먼트를 떼어내고 새로운 세그먼트를 간단히 부착할 수 있게 은납이 기부착된 세그먼트를 제품으로 제공함으로서 실제 소비자도 다쓴 철판을 공장에 보내지 않고 쉽게 재 용접하여 사용함으로 시간적, 경제적 이득을 가져올 수 있으며 일반공장에서도 은납이 부착된 상태의 세그먼트임으로 용접에 있어 은납 주입장치가 필요없게 됨으로 생산성 향상 및 자동화도 쉽게 이룰 수 있게 하는데 그 목적이 있다.Accordingly, the present invention has been made in view of the above problems, and an object of the present invention is to provide a product in which silver lead is attached to the product so that the worn segment can be detached from the saw blade and simply attached to the new segment. It is easy to re-weld without sending the steel plate to the factory, which can bring time and economic benefits.In the general factory, it is a segment with silver lead attached so that no silver lead injection device is required for welding, so productivity can be improved and automation can be easily achieved. Its purpose is to.

상기 목적을 달성하기 위해 본발명은 세그먼트의 저면에 은납을 기부착해서 되는데, 부착방법은 은납판을 점성이 있는 플럭스를 이용 부착하거나 양단을 절곡한 은납채널로써 할 수도 있다. 그리고 세그먼트의 저면에 은납판이 매입 부착되도록 홈을 둘 수도 있으며, 스크래치부를 형성하여 접착력을 증가시킬 수도 있으며, 그리고 용융된 상태의 은납물에 세그먼트 저면을 담가 묻혀서 냉각 고형화시킬 수 있으며, 기부착된 은납판에약간의 열을 가하여 가용융 접착시켜 놓아 소우블레이드 세그먼트의 고온소결성형시 열에 의하여 재용융부착될 수도 있다.In order to achieve the above object, the present invention is made by depositing silver lead on the bottom of the segment, and the attaching method may be a silver lead channel attached to the silver lead plate using a viscous flux or bent both ends. In addition, the bottom of the segment may be provided with a groove for attaching the silver lead plate, the scratch may be formed to increase the adhesive force, and the surface of the segment may be immersed in the molten silver solder to solidify the cooling, and the base silver solder It may be remelted by heat during high temperature sintering of the saw blade segment by applying soluble heat to the plate by soluble bonding.

이하에서 이를 첨부 도면에 의해 상세히 설명하기로 한다.This will be described in detail with reference to the accompanying drawings.

제2도(a에서와 같이 세그먼트(10)의 저면에 일정두께의 은납판(20)을 점성이 있는 플럭스로 접착 구성시키는 것이 공정상 가장 간단한 방법으로 철판의 외주연에 기사용하여 마모된 세그먼트잔재를 떼어내고 청소한 후 사용자가 간단히 부착시킬 수 있다.As shown in FIG. 2 (a), it is the simplest method of forming the silver lead plate 20 having a certain thickness on the bottom of the segment 10 with a viscous flux. After removal and cleaning, the user can simply attach it.

그러나 이는 제품의 장기간 운반도중(해외수출시 등) 또는 취급중 은납판(20)이 떨어질 염려가 있으므로, 상기 제품조건에서 열을 가하여 가용융시킨 상태로 부착강도를 증대시키거나, 스포트 용접을 할 수 있으며(제2도(f)참조), 제2도(b)와 같이 세그먼트(10)의 저면에 은납판(20)을 끼워 넣을 수 있는 홈(12)을 형성하여 억지 끼워맞춤으로 은납판의 떨어질 염려를 배제할 수 있다. 한편 상기와 같은 목적으로 제2도(c)와 같이 세그먼트(10)의 저면에 스크래치부(14)를 형성 표면적을 넓힘으로 플럭스를 접착제로 은납판(20)을 부착할때 부착력을 증가시킬 수 있다. 물론 은납판에 스크래치부를 둘 수도 있다.However, this may cause the silver lead plate 20 to fall during the long-term transportation of the product (when exporting overseas) or during handling. Therefore, it is possible to increase the adhesive strength or to perform spot welding in the melted state by applying heat under the product conditions. (Refer to FIG. 2 (f)), and as shown in FIG. 2 (b), a groove 12 into which the silver lead plate 20 can be inserted is formed on the bottom of the segment 10, and the silver lead plate is inserted by an interference fit. You can eliminate the fear of falling. On the other hand, as shown in FIG. 2 (c), the scratch portion 14 is formed on the bottom surface of the segment 10 to increase the surface area, thereby increasing the adhesive force when attaching the silver lead plate 20 with the flux adhesive. have. Of course, you can put a scratch on the silver lead plate.

그러나 이는 세그먼트성형시 홈(12) 및 스크래치부(14)를 가공해야 하는 등 현재의 공정상 변화를 주어야 하기 때문에 보다 바람직하게는 제2도(d)(e)와 같이 세그먼트(10)의 길이방향 또는 폭방향으로 씌울 수 있는 은납채널(20A,20B)을 이용하고 플럭스도 도포함으로 접착력을 높힐 수도 있다. 이는 세그먼트(10)의 변경된 가공없이 은납이 세그먼트에서 떨어지는 것을 예방할 수 있으며, 특히 제3도(D)(E)와 같이 사용자가 접착할시 은납채널(20A,20B)의 절곡부위가 녹아 형성된 비이드가 고정절점(20a,20b)으로 되어 그 부착강도를 증대시키는 부가적인 작용을 갖는다.However, this is because the groove 12 and the scratch portion 14 should be processed when forming the segment. Therefore, the length of the segment 10 is more preferable as shown in FIG. 2 (d) (e). The adhesive force may be enhanced by using silver lead channels 20A and 20B which can be covered in the direction or the width direction, and also applying flux. This can prevent the silver lead from falling off the segment without the modified processing of the segment 10, in particular, the ratio formed by melting the bent portions of the silver lead channels 20A and 20B when the user bonds as shown in FIG. The id becomes the fixed nodes 20a and 20b and has an additional action of increasing the attachment strength thereof.

한편 본 발명의 또 다른 양태로써 액상의 실버페이스트(silver paste)를 세그먼트저면에 묻혀서 형성할 수도 있다.Meanwhile, as another embodiment of the present invention, liquid silver paste may be formed by being buried on the bottom of the segment.

한편 본 발명의 목적을 달성하기 위해 은납판의 스크래치부 또는 홈가공이나 은납판을 캡으로 형성 부착하는(제2도(g)참조) 등의 기술은 본 발명의 기술적 범주에 속하는 사항으로 간단할 설계변경적 사항에 속하며, 은납판 또는 세그먼트기저에 모래분사기에 의한 샌드블래스팅(sand blasting) 가공이나 연삭기에 의한 그라인딩(Grainding) 또는 숏블래스팅(shotblasting) 작업에 의한 면가공을 하는 것으로 본 발명의 스크래치 효과를 낼 수 있는 공정상의 사항이다.Meanwhile, in order to achieve the object of the present invention, techniques such as scratching or groove forming a silver lead plate or attaching a silver lead plate with a cap (see FIG. 2 (g)) are simple matters within the technical scope of the present invention. It belongs to the design change, and the surface processing by grinding or shot blasting by sand blasting or grinding machine by sand sprayer on silver lead plate or segment base This is a process issue that can produce a scratch effect.

이상과 같이 구성되고 작용되는 본 발명은 직경이 큰 소우블레이드에 있어서 자체 단가가 큰 철판을 재활용하는 면에서 소비자에게 원가부담을 더는 효과가 있으며, 기 사용한 철판을 생산처에 보내어 재활용할수 있게 하기 위한 운반 등의 문제점 또는 소비자가 은납을 일일히 절단하여 부착함으로써의 은납낭비 및 공정추가의 부담을 줄이고 부착공정에 따른 불량을 미연에 방지하는 등의 효과가 있으며, 이를 달성하는 과정이 매우 간단하며 특출난 효과가 있는 것으로, 특히 운반 및 취급중에 은납이 탈락되는 것을 배제되며 중요하게는 소우블레이드 다이아몬드 세그먼트를 부착하는 공정의 자동화 추진이 손쉽게 가능한 효과가 있다.The present invention constituted and operated as described above has a cost-effective effect on the consumer in terms of recycling the steel plate having a large unit cost in the sow blade having a large diameter. It is effective in reducing the waste of silver lead and the additional process of the process by carrying out the cutting of silver lead and attaching the silver lead all the time, and preventing the defects caused by the attaching process in advance, and the process of achieving this is very simple and special. It is difficult to remove silver lead, especially during transportation and handling, and importantly, it is easy to automate the process of attaching the saw blade diamond segment.

Claims (6)

다이아몬드 소우블레이드에 부착 설치할 수 있는 다이아몬드 세그먼트를 형성함에 있어서, 세그먼트(10)의 저면에 은납을 기부착 형성하여서 된 것을 특징으로한 소우블레이드용 세그먼트.Saw blade segment for forming a diamond segment that can be attached to the diamond saw blade, by forming a silver lead on the bottom surface of the segment (10). 제1항에 있어서, 기부착되는 은납은 은납판(20)으로 플럭스를 접착제로 사용 부착형성함을 특징으로한 소우블레이드용 세그먼트.The segment for saw blades according to claim 1, wherein the silver lead to be attached and attached is formed by using a flux as an adhesive with a silver lead plate (20). 제1항에 있어서, 기부착되는 은납은 은납채널(20A,20B)로써 세그먼트(10)의 저면을 길이방향 또는 폭방향으로 감싸거나 추가로 플럭스를 접착제로 사용 부착형성함을 특징으로한 소우블레이드용 세그먼트.The saw blade of claim 1, wherein the silver lead to be attached is wrapped around the bottom surface of the segment 10 in the longitudinal direction or the width direction by the silver lead channels 20A and 20B, or additionally, using the flux as an adhesive. Dragon segment. 제2항에 있어서, 기부착되는 은납판(20)이 세그먼트 저면에 형성된 홈(12)에 매입 돌출되게 부착됨을 특징으로한 소우블레이드용 세그먼트.The segment for saw blade according to claim 2, wherein the silver lead plate (20) to be attached and attached is attached to the groove (12) formed on the bottom of the segment so as to protrude. 제1항에 있어서, 기부착되는 은납을 용융시켜 세그먼트 저면을 담궈 용융은납물을 묻혀서 고화 부착시킨 것을 특징으로한 소우블레이드용 세그먼트.The segment for the saw blade according to claim 1, wherein the base solder is melted to immerse the bottom surface of the segment, and the molten silver lead is buried to solidify and adhere. 제1항에 있어서, 액상의 실버페이스트(silver paste)를 세그먼트 저면에 묻혀서 고화 부착시킨 것을 특징으로한 소우블레이드용 세그먼트.The segment for saw blade according to claim 1, wherein a liquid silver paste is buried on the bottom of the segment and solidified.
KR1019940022268A 1994-09-05 1994-09-05 A segment for a saw blade KR0141337B1 (en)

Priority Applications (8)

Application Number Priority Date Filing Date Title
KR1019940022268A KR0141337B1 (en) 1994-09-05 1994-09-05 A segment for a saw blade
BR9509199A BR9509199A (en) 1994-09-05 1995-05-02 Saw blade segment
CN95195682A CN1160371A (en) 1994-09-05 1995-05-02 Saw blade segment with silver solder
JP8509385A JPH10501185A (en) 1994-09-05 1995-05-02 Saw blade with silver brazing (SAW BLADE) segment
AU38346/95A AU3834695A (en) 1994-09-05 1995-05-02 Saw blade segment with silver solder
PCT/KR1995/000044 WO1996007521A1 (en) 1994-09-05 1995-05-02 Saw blade segment with silver solder
EP95918196A EP0781191A1 (en) 1994-09-05 1995-05-02 Saw blade segment with silver solder
TW084113398A TW302320B (en) 1994-09-05 1995-12-15

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019940022268A KR0141337B1 (en) 1994-09-05 1994-09-05 A segment for a saw blade

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KR960010160A KR960010160A (en) 1996-04-20
KR0141337B1 true KR0141337B1 (en) 1998-07-15

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BR (1) BR9509199A (en)
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US10632552B2 (en) 2015-06-15 2020-04-28 Shinhan Diamond Ind. Co., Ltd. Saw blade having noise and stress-reduction structure

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JP2005118826A (en) 2003-10-16 2005-05-12 Denso Corp Brazing method
CN106142360B (en) * 2015-04-04 2018-12-28 河北小蜜蜂工具集团有限公司 A kind of preparation method of large dimond annular saw flake products
CN105234572A (en) * 2015-11-03 2016-01-13 苏州新一磁业有限公司 Manufacturing and assembling method for metal LOGO
CN105290995A (en) * 2015-11-19 2016-02-03 福州市闽福石材磨具有限公司 Connecting process for diamond segments and iron sliding blocks of diamond grinding disc
WO2018155633A1 (en) * 2017-02-23 2018-08-30 国立大学法人大阪大学 Joining member, method for producing joining member, and method for producing joint structure
JP6844430B2 (en) * 2017-06-09 2021-03-17 信越化学工業株式会社 Peripheral cutting blade and its manufacturing method

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US10632552B2 (en) 2015-06-15 2020-04-28 Shinhan Diamond Ind. Co., Ltd. Saw blade having noise and stress-reduction structure

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AU3834695A (en) 1996-03-27
CN1160371A (en) 1997-09-24
EP0781191A1 (en) 1997-07-02
WO1996007521A1 (en) 1996-03-14
JPH10501185A (en) 1998-02-03
KR960010160A (en) 1996-04-20
BR9509199A (en) 1997-12-30

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