KR0121186B1 - Solder device required document a hot blast equipment - Google Patents
Solder device required document a hot blast equipmentInfo
- Publication number
- KR0121186B1 KR0121186B1 KR1019890011485A KR890011485A KR0121186B1 KR 0121186 B1 KR0121186 B1 KR 0121186B1 KR 1019890011485 A KR1019890011485 A KR 1019890011485A KR 890011485 A KR890011485 A KR 890011485A KR 0121186 B1 KR0121186 B1 KR 0121186B1
- Authority
- KR
- South Korea
- Prior art keywords
- soldering
- hot air
- air blower
- blower
- main body
- Prior art date
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/04—Heating appliances
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16245—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
제1도는 본 발명에 의한 납땜기의 사시도.1 is a perspective view of a soldering machine according to the present invention.
제2도는 본 발명에 의한 납땜기의 내부 구성을 보인 개략도.2 is a schematic view showing an internal configuration of a soldering machine according to the present invention.
* 도면의 주요부분에 대한 부호의 설명* Explanation of symbols for main parts of the drawings
1 : 납땜기 본체 2 : 송풍기1: soldering machine body 2: blower
3 : 손잡이 4 : 피복선3: handle 4: covering wire
5 : 납땜장치 7 : 열풍가열기5: soldering device 7: hot air heater
8 : 송풍관 9 : 열선8: blower tube 9: heating wire
10 : 송풍구 10a : 송풍공10: blower 10a: blower
11 : 납땜스위치 12 : 열풍가열스위치11
본 발명은 납땜기에 관한 것으로, 특히 넓은 면적의 납땜에 적당하도록 한 열풍장치를 구비한 납땜기에 관한 것이다.TECHNICAL FIELD The present invention relates to a soldering machine, and more particularly, to a soldering machine having a hot air device adapted to solder a large area.
일반적으로 사용되는 납땜기는 인두의 팁(Tip)에 의하여 납땜을 함으로써 넓은 면적을 납땜하기 위하여는 많은 시간이 소요될 뿐만 아니라 표면 처리가 깨끗하지 못하게 되는 문제점이 있었다.In general, a soldering machine used to solder a large area by soldering by a tip of the iron is not only time-consuming but also has a problem in that the surface treatment is not clean.
본 발명의 목적은 상기한 바와 같은 문제점을 해소하기 위하여 납땜기에 송풍기 및 히터로 구성되는 열풍장치를 부설함으로써 넓은 면적의 납땜을 짧은 시간 동안에 가능하게 하고, 표면 처리를 깨끗하게 할 수 있도록 한 열풍장치를 구비한 납땜기를 제공함에 있다.SUMMARY OF THE INVENTION An object of the present invention is to provide a hot air device capable of brazing a large area for a short time and providing a clean surface treatment by installing a hot air device composed of a blower and a heater in a soldering machine to solve the above problems. It is to provide a soldering machine provided.
이하, 본 발명에 의한 열풍장치를 구비한 납땜기를 상세히 설명한다.EMBODIMENT OF THE INVENTION Hereinafter, the soldering machine provided with the hot air apparatus by this invention is demonstrated in detail.
제1도는 본 발명에 의한 납땜기의 사시도이고, 제2도는 동상의 내부 구성을 보인 개략도로서, 본체(1)의 내부 일측에는 송풍기(2)가 설치되어 있고, 상기 본체(1)의 손잡이(3)는 피복선(4)(제2도에는 도시하지 않았음)으로 연결되어 있으며, 상기 손잡이(3)에는 통상의 납땜장치(3)가 고정되어 있다.1 is a perspective view of a soldering machine according to the present invention, and FIG. 2 is a schematic view showing an internal configuration of an in-phase, and a blower 2 is provided on one side of the main body 1, and a
상기 납땜장치(5)에는 양측의 지지구(6.6')에 의하여 열풍가열기(7)가 지지되어 있으며, 상기 열풍가열기(7)는 도선(4) 및 손잡이(3)의 내부를 지나는 송풍관(8)에 의하여 송풍기(12)와 연결되어 있고, 상기 열풍가열기(7)의 일측에는 열선(9)이 설치되어 있으며, 상기 열풍가열기(7)의 선단부에는 송풍공(10a)을 구비한 송풍구(10)가 열풍의 방향을 조절할 수 있도록 착탈 가능하게 설치되어 있다.The
상기 본체(1)에는 납땜장치(5)와, 송풍기(2) 및 열풍가열기(7)를 구동시키기 위한 납땜 스위치(11)와 열풍가열 스위치(12)가 설치되어 있다.The main body 1 is provided with a
도면중 미설명 부호 1a는 본체(1)의 흡입공, 13,13'는 전원선을 각각 보인 것이다.In the figure, reference numeral 1a denotes a suction hole of the
상기한 바와 같은 본 발명에 의한 납땜기의 작용효과를 설명하면 다음과 같다.Referring to the operation and effect of the soldering machine according to the present invention as described above are as follows.
먼저, 납땜기 본체(1)에 교류전원(V1)을 연결하고 납땜 스위치(11) 및 열풍가열스위치(12)를 동시에 온(ON)시키게 되면, 납땜장치(5)가 구동되어 통상의 납땜작업을 수행할 수 있게 됨과 동시에 열풍가열기(7)의 열설(9)이 가동되고 송풍기(2)가 구동됨으로써 본체(1)의 흡입구(1a)를 통하여 흡입된 공기가 열선(9)에 의하여 가열된 후 송풍구(10)의 송풍공(10a)을 통하여 열풍으로서 토출된다.First, when the AC power source V1 is connected to the soldering machine main body 1 and the
이에 따라서 납땜장치(5)로 납을 녹이는 동시에 열풍으로도 납을 녹이게 되므로 넓은 면적을 짧은 시간내에 납땜할 수 있으며, 열풍에 의하여 녹여진 납을 고르게 펴게 함으로써 납땜의 표면을 깨끗하게 유지할 수 있게 된다.Accordingly, the solder is melted by the
이상에서 설명한 바와 같이 본 발명은 납땜기에 열풍장치를 부설함으로써 넓은 면적을 짧은 시간내에 납땜할 수 있으며, 또한 납땜부위의 표면을 깨끗하게 처리할 수 있는 효과가 있다.As described above, the present invention has the effect of being able to solder a large area in a short time by installing a hot air device in the soldering machine, and to clean the surface of the soldering portion.
Claims (1)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019890011485A KR0121186B1 (en) | 1989-08-11 | 1989-08-11 | Solder device required document a hot blast equipment |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019890011485A KR0121186B1 (en) | 1989-08-11 | 1989-08-11 | Solder device required document a hot blast equipment |
Publications (2)
Publication Number | Publication Date |
---|---|
KR910004291A KR910004291A (en) | 1991-03-28 |
KR0121186B1 true KR0121186B1 (en) | 1997-11-10 |
Family
ID=19288864
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019890011485A KR0121186B1 (en) | 1989-08-11 | 1989-08-11 | Solder device required document a hot blast equipment |
Country Status (1)
Country | Link |
---|---|
KR (1) | KR0121186B1 (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR200453591Y1 (en) * | 2010-10-06 | 2011-05-17 | 임채열 | Rework hot air device for SMD |
KR101337729B1 (en) * | 2011-12-29 | 2013-12-06 | 손만호 | Box type kit for soldering |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN115711481A (en) * | 2022-09-30 | 2023-02-24 | 深圳拓邦股份有限公司 | Rapid heating method and device for hot air gun, controller and storage medium |
CN117697260B (en) * | 2024-02-02 | 2024-05-24 | 国网山东省电力公司莱芜供电公司 | Block terminal box welding set that power supply was used |
-
1989
- 1989-08-11 KR KR1019890011485A patent/KR0121186B1/en not_active IP Right Cessation
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR200453591Y1 (en) * | 2010-10-06 | 2011-05-17 | 임채열 | Rework hot air device for SMD |
KR101337729B1 (en) * | 2011-12-29 | 2013-12-06 | 손만호 | Box type kit for soldering |
Also Published As
Publication number | Publication date |
---|---|
KR910004291A (en) | 1991-03-28 |
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Payment date: 20050718 Year of fee payment: 9 |
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