JPWO2023190255A1 - - Google Patents
Info
- Publication number
- JPWO2023190255A1 JPWO2023190255A1 JP2023554004A JP2023554004A JPWO2023190255A1 JP WO2023190255 A1 JPWO2023190255 A1 JP WO2023190255A1 JP 2023554004 A JP2023554004 A JP 2023554004A JP 2023554004 A JP2023554004 A JP 2023554004A JP WO2023190255 A1 JPWO2023190255 A1 JP WO2023190255A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
- H01L23/13—Mountings, e.g. non-detachable insulating substrates characterised by the shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/07—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/18—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Structure Of Printed Boards (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2022060145 | 2022-03-31 | ||
PCT/JP2023/012018 WO2023190255A1 (en) | 2022-03-31 | 2023-03-24 | Circuit board, manufacturing method for same, and power module |
Publications (1)
Publication Number | Publication Date |
---|---|
JPWO2023190255A1 true JPWO2023190255A1 (en) | 2023-10-05 |
Family
ID=88201578
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2023554004A Pending JPWO2023190255A1 (en) | 2022-03-31 | 2023-03-24 |
Country Status (2)
Country | Link |
---|---|
JP (1) | JPWO2023190255A1 (en) |
WO (1) | WO2023190255A1 (en) |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4904916B2 (en) * | 2006-05-18 | 2012-03-28 | 三菱マテリアル株式会社 | Power module substrate, power module substrate manufacturing method, and power module |
JP2014120639A (en) * | 2012-12-18 | 2014-06-30 | Rohm Co Ltd | Power module semiconductor device |
CN110809910B (en) * | 2017-06-28 | 2022-11-25 | 京瓷株式会社 | Substrate for power module and power module |
JP2022000871A (en) * | 2018-07-31 | 2022-01-04 | 京セラ株式会社 | Electrical circuit board and power module |
JP7237647B2 (en) * | 2019-02-26 | 2023-03-13 | 京セラ株式会社 | Circuit boards and electronic devices |
JP7484268B2 (en) * | 2020-03-18 | 2024-05-16 | 三菱マテリアル株式会社 | METHOD FOR TEMPORARY FIXING OF METAL MEMBER, METHOD FOR MANUFACTURING JOINT BODY, AND METHOD FOR MANUFACTURING INSULATED CIRCUIT BOARD |
-
2023
- 2023-03-24 WO PCT/JP2023/012018 patent/WO2023190255A1/en active Application Filing
- 2023-03-24 JP JP2023554004A patent/JPWO2023190255A1/ja active Pending
Also Published As
Publication number | Publication date |
---|---|
WO2023190255A1 (en) | 2023-10-05 |
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