JPWO2023090197A1 - - Google Patents

Info

Publication number
JPWO2023090197A1
JPWO2023090197A1 JP2023561537A JP2023561537A JPWO2023090197A1 JP WO2023090197 A1 JPWO2023090197 A1 JP WO2023090197A1 JP 2023561537 A JP2023561537 A JP 2023561537A JP 2023561537 A JP2023561537 A JP 2023561537A JP WO2023090197 A1 JPWO2023090197 A1 JP WO2023090197A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2023561537A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2023090197A1 publication Critical patent/JPWO2023090197A1/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/30—Stacked capacitors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
JP2023561537A 2021-11-18 2022-11-08 Pending JPWO2023090197A1 (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021188035 2021-11-18
PCT/JP2022/041489 WO2023090197A1 (ja) 2021-11-18 2022-11-08 配線基板及びその製造方法

Publications (1)

Publication Number Publication Date
JPWO2023090197A1 true JPWO2023090197A1 (zh) 2023-05-25

Family

ID=86396965

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023561537A Pending JPWO2023090197A1 (zh) 2021-11-18 2022-11-08

Country Status (3)

Country Link
JP (1) JPWO2023090197A1 (zh)
TW (1) TW202331950A (zh)
WO (1) WO2023090197A1 (zh)

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8730647B2 (en) * 2008-02-07 2014-05-20 Ibiden Co., Ltd. Printed wiring board with capacitor
WO2018117111A1 (ja) * 2016-12-21 2018-06-28 大日本印刷株式会社 貫通電極基板、半導体装置及び貫通電極基板の製造方法
WO2019244382A1 (ja) * 2018-06-21 2019-12-26 大日本印刷株式会社 配線基板および半導体装置
JP2021100007A (ja) * 2019-12-19 2021-07-01 Tdk株式会社 電子部品及びその製造方法

Also Published As

Publication number Publication date
WO2023090197A1 (ja) 2023-05-25
TW202331950A (zh) 2023-08-01

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Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20240122