JPWO2022211042A1 - - Google Patents

Info

Publication number
JPWO2022211042A1
JPWO2022211042A1 JP2022562936A JP2022562936A JPWO2022211042A1 JP WO2022211042 A1 JPWO2022211042 A1 JP WO2022211042A1 JP 2022562936 A JP2022562936 A JP 2022562936A JP 2022562936 A JP2022562936 A JP 2022562936A JP WO2022211042 A1 JPWO2022211042 A1 JP WO2022211042A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2022562936A
Other languages
Japanese (ja)
Other versions
JPWO2022211042A5 (en
JP7298786B2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2022211042A1 publication Critical patent/JPWO2022211042A1/ja
Publication of JPWO2022211042A5 publication Critical patent/JPWO2022211042A5/ja
Application granted granted Critical
Publication of JP7298786B2 publication Critical patent/JP7298786B2/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
JP2022562936A 2021-03-31 2022-03-31 Laminate for printed wiring board and joined body for multilayer printed wiring board Active JP7298786B2 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021060003 2021-03-31
JP2021060003 2021-03-31
PCT/JP2022/016605 WO2022211042A1 (en) 2021-03-31 2022-03-31 Laminate for printed circuit board and junction for multilayer printed circuit board

Publications (3)

Publication Number Publication Date
JPWO2022211042A1 true JPWO2022211042A1 (en) 2022-10-06
JPWO2022211042A5 JPWO2022211042A5 (en) 2023-03-01
JP7298786B2 JP7298786B2 (en) 2023-06-27

Family

ID=83456643

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022562936A Active JP7298786B2 (en) 2021-03-31 2022-03-31 Laminate for printed wiring board and joined body for multilayer printed wiring board

Country Status (3)

Country Link
JP (1) JP7298786B2 (en)
TW (1) TW202246053A (en)
WO (1) WO2022211042A1 (en)

Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003136631A (en) * 2001-11-02 2003-05-14 Kanegafuchi Chem Ind Co Ltd Flexible copper-clad laminated sheet
JP2005167172A (en) * 2003-11-14 2005-06-23 Hitachi Chem Co Ltd Printed wiring board and its manufacturing method
JP2006210524A (en) * 2005-01-26 2006-08-10 Matsushita Electric Ind Co Ltd Multilayered circuit board and its manufacturing method
JP2011100846A (en) * 2009-11-05 2011-05-19 Sumitomo Metal Mining Co Ltd Two-layer flexible board, method of manufacturing the same, two-layer flexible wiring board, method of manufacturing the same, and plasma processing device
JP2015115334A (en) * 2013-12-09 2015-06-22 イビデン株式会社 Printed wiring board and method for manufacturing printed wiring board
WO2017029973A1 (en) * 2015-08-17 2017-02-23 住友電気工業株式会社 Printed wiring board and electronic component
JP2018041961A (en) * 2016-09-05 2018-03-15 荒川化学工業株式会社 Copper clad laminate sheet for flexible printed wiring board and flexible printed wiring board
JP2019029340A (en) * 2017-07-28 2019-02-21 旭化成株式会社 Production method of conductive pattern, and plasma treatment device
JP2019075486A (en) * 2017-10-18 2019-05-16 セイコーインスツル株式会社 Tape base material for wiring board, and manufacturing method of tape base material for wiring board
WO2019188087A1 (en) * 2018-03-30 2019-10-03 三井金属鉱業株式会社 Copper-clad laminate
WO2020066145A1 (en) * 2018-09-28 2020-04-02 日東電工株式会社 Low dielectric substrate material

Patent Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003136631A (en) * 2001-11-02 2003-05-14 Kanegafuchi Chem Ind Co Ltd Flexible copper-clad laminated sheet
JP2005167172A (en) * 2003-11-14 2005-06-23 Hitachi Chem Co Ltd Printed wiring board and its manufacturing method
JP2006210524A (en) * 2005-01-26 2006-08-10 Matsushita Electric Ind Co Ltd Multilayered circuit board and its manufacturing method
JP2011100846A (en) * 2009-11-05 2011-05-19 Sumitomo Metal Mining Co Ltd Two-layer flexible board, method of manufacturing the same, two-layer flexible wiring board, method of manufacturing the same, and plasma processing device
JP2015115334A (en) * 2013-12-09 2015-06-22 イビデン株式会社 Printed wiring board and method for manufacturing printed wiring board
WO2017029973A1 (en) * 2015-08-17 2017-02-23 住友電気工業株式会社 Printed wiring board and electronic component
JP2018041961A (en) * 2016-09-05 2018-03-15 荒川化学工業株式会社 Copper clad laminate sheet for flexible printed wiring board and flexible printed wiring board
JP2019029340A (en) * 2017-07-28 2019-02-21 旭化成株式会社 Production method of conductive pattern, and plasma treatment device
JP2019075486A (en) * 2017-10-18 2019-05-16 セイコーインスツル株式会社 Tape base material for wiring board, and manufacturing method of tape base material for wiring board
WO2019188087A1 (en) * 2018-03-30 2019-10-03 三井金属鉱業株式会社 Copper-clad laminate
WO2020066145A1 (en) * 2018-09-28 2020-04-02 日東電工株式会社 Low dielectric substrate material

Also Published As

Publication number Publication date
TW202246053A (en) 2022-12-01
JP7298786B2 (en) 2023-06-27
WO2022211042A1 (en) 2022-10-06

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