JPWO2022196428A1 - - Google Patents
Info
- Publication number
- JPWO2022196428A1 JPWO2022196428A1 JP2023506989A JP2023506989A JPWO2022196428A1 JP WO2022196428 A1 JPWO2022196428 A1 JP WO2022196428A1 JP 2023506989 A JP2023506989 A JP 2023506989A JP 2023506989 A JP2023506989 A JP 2023506989A JP WO2022196428 A1 JPWO2022196428 A1 JP WO2022196428A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/70—SSIS architectures; Circuits associated therewith
Landscapes
- Engineering & Computer Science (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- Solid State Image Pick-Up Elements (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021041693 | 2021-03-15 | ||
| PCT/JP2022/009942 WO2022196428A1 (en) | 2021-03-15 | 2022-03-08 | Solid-state imaging device and electronic apparatus |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPWO2022196428A1 true JPWO2022196428A1 (en) | 2022-09-22 |
Family
ID=83320487
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023506989A Pending JPWO2022196428A1 (en) | 2021-03-15 | 2022-03-08 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JPWO2022196428A1 (en) |
| WO (1) | WO2022196428A1 (en) |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3868780B2 (en) * | 2001-09-28 | 2007-01-17 | 日本板硝子株式会社 | Optical writing head |
| JP2012069851A (en) * | 2010-09-27 | 2012-04-05 | Sony Corp | Method of manufacturing solid state image pickup device, and solid state image pickup device |
| WO2016031332A1 (en) * | 2014-08-26 | 2016-03-03 | シャープ株式会社 | Camera module |
| JP7163409B2 (en) * | 2018-11-28 | 2022-10-31 | 京セラ株式会社 | Substrate for mounting electronic device and electronic device |
-
2022
- 2022-03-08 JP JP2023506989A patent/JPWO2022196428A1/ja active Pending
- 2022-03-08 WO PCT/JP2022/009942 patent/WO2022196428A1/en active Application Filing
Also Published As
| Publication number | Publication date |
|---|---|
| WO2022196428A1 (en) | 2022-09-22 |