JPWO2022191240A1 - - Google Patents
Info
- Publication number
- JPWO2022191240A1 JPWO2022191240A1 JP2023505608A JP2023505608A JPWO2022191240A1 JP WO2022191240 A1 JPWO2022191240 A1 JP WO2022191240A1 JP 2023505608 A JP2023505608 A JP 2023505608A JP 2023505608 A JP2023505608 A JP 2023505608A JP WO2022191240 A1 JPWO2022191240 A1 JP WO2022191240A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Wire Bonding (AREA)
Applications Claiming Priority (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2021038465 | 2021-03-10 | ||
JP2021038444 | 2021-03-10 | ||
JP2021058317 | 2021-03-30 | ||
JP2021075258 | 2021-04-27 | ||
JP2021119907 | 2021-07-20 | ||
PCT/JP2022/010293 WO2022191240A1 (ja) | 2021-03-10 | 2022-03-09 | ベーパーチャンバ、ベーパーチャンバ用のウィックシート及び電子機器 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPWO2022191240A1 true JPWO2022191240A1 (ja) | 2022-09-15 |
Family
ID=83226768
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2023505608A Pending JPWO2022191240A1 (ja) | 2021-03-10 | 2022-03-09 |
Country Status (5)
Country | Link |
---|---|
US (1) | US20240172395A1 (ja) |
JP (1) | JPWO2022191240A1 (ja) |
KR (1) | KR20230156088A (ja) |
TW (1) | TW202238062A (ja) |
WO (1) | WO2022191240A1 (ja) |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6057952B2 (ja) | 2014-07-09 | 2017-01-11 | 東芝ホームテクノ株式会社 | シート型ヒートパイプ |
JP6853962B2 (ja) | 2017-02-24 | 2021-04-07 | 大日本印刷株式会社 | ベーパーチャンバ、電子機器およびベーパーチャンバの製造方法 |
JP7137783B2 (ja) * | 2017-08-24 | 2022-09-15 | 大日本印刷株式会社 | ベーパーチャンバ用のウィックシート、ベーパーチャンバおよびベーパーチャンバの製造方法 |
JP7145412B2 (ja) * | 2017-09-28 | 2022-10-03 | 大日本印刷株式会社 | ベーパーチャンバおよび電子機器 |
KR20240028552A (ko) * | 2019-03-11 | 2024-03-05 | 다이니폰 인사츠 가부시키가이샤 | 베이퍼 챔버, 전자 기기 및 베이퍼 챔버용 시트 |
-
2022
- 2022-03-09 US US18/281,118 patent/US20240172395A1/en active Pending
- 2022-03-09 KR KR1020237033812A patent/KR20230156088A/ko unknown
- 2022-03-09 WO PCT/JP2022/010293 patent/WO2022191240A1/ja active Application Filing
- 2022-03-09 JP JP2023505608A patent/JPWO2022191240A1/ja active Pending
- 2022-03-10 TW TW111108765A patent/TW202238062A/zh unknown
Also Published As
Publication number | Publication date |
---|---|
KR20230156088A (ko) | 2023-11-13 |
US20240172395A1 (en) | 2024-05-23 |
WO2022191240A1 (ja) | 2022-09-15 |
TW202238062A (zh) | 2022-10-01 |