JPWO2022181419A1 - - Google Patents

Info

Publication number
JPWO2022181419A1
JPWO2022181419A1 JP2022510944A JP2022510944A JPWO2022181419A1 JP WO2022181419 A1 JPWO2022181419 A1 JP WO2022181419A1 JP 2022510944 A JP2022510944 A JP 2022510944A JP 2022510944 A JP2022510944 A JP 2022510944A JP WO2022181419 A1 JPWO2022181419 A1 JP WO2022181419A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2022510944A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2022181419A1 publication Critical patent/JPWO2022181419A1/ja
Pending legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/022Quinonediazides
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20Exposure; Apparatus therefor
    • G03F7/22Exposing sequentially with the same light pattern different positions of the same surface
    • GPHYSICS
    • G09EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09FDISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00Electroluminescent light sources
    • H05B33/12Light sources with substantially two-dimensional radiating surfaces
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10OLED displays
    • H10K59/12Active-matrix OLED [AMOLED] displays
    • H10K59/122Pixel-defining structures or layers, e.g. banks

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Electroluminescent Light Sources (AREA)
  • Materials For Photolithography (AREA)
JP2022510944A 2021-02-26 2022-02-16 Pending JPWO2022181419A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021029607 2021-02-26
PCT/JP2022/006162 WO2022181419A1 (en) 2021-02-26 2022-02-16 Photosensitive resin composition, cured product, display device, organic el display device, and semiconductor device

Publications (1)

Publication Number Publication Date
JPWO2022181419A1 true JPWO2022181419A1 (en) 2022-09-01

Family

ID=83049291

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022510944A Pending JPWO2022181419A1 (en) 2021-02-26 2022-02-16

Country Status (3)

Country Link
JP (1) JPWO2022181419A1 (en)
TW (1) TW202244611A (en)
WO (1) WO2022181419A1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW202412021A (en) * 2022-09-02 2024-03-16 日商Jsr股份有限公司 Manufacturing method for conductive film, liquid dispersion, radiation-sensitive resin composition, and light emitting element

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5061703B2 (en) * 2007-04-25 2012-10-31 東レ株式会社 Photosensitive resin composition
JP2009020246A (en) * 2007-07-11 2009-01-29 Toray Ind Inc Photosensitive resin composition, and manufacturing method for insulating resin pattern and organic electroluminescence element using it
US8530119B2 (en) * 2009-05-20 2013-09-10 Sumitomo Bakelite Co., Ltd. Positive photosensitive resin composition, cured film, protective film, interlayer insulating film, and semiconductor device and display element using the same
CN103250099B (en) * 2010-09-28 2015-07-22 普罗米鲁斯有限责任公司 Norbornane-based PAC Ballast and positive-one photosensitive resin composition encompassing the PAC
JP2016158863A (en) * 2015-03-02 2016-09-05 株式会社日立製作所 Medical image imaging device and imaging cross section adjustment method

Also Published As

Publication number Publication date
TW202244611A (en) 2022-11-16
WO2022181419A1 (en) 2022-09-01

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