JPWO2022180827A1 - - Google Patents
Info
- Publication number
- JPWO2022180827A1 JPWO2022180827A1 JP2023501987A JP2023501987A JPWO2022180827A1 JP WO2022180827 A1 JPWO2022180827 A1 JP WO2022180827A1 JP 2023501987 A JP2023501987 A JP 2023501987A JP 2023501987 A JP2023501987 A JP 2023501987A JP WO2022180827 A1 JPWO2022180827 A1 JP WO2022180827A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
- G02B6/13—Integrated optical circuits characterised by the manufacturing method
- G02B6/132—Integrated optical circuits characterised by the manufacturing method by deposition of thin films
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Optics & Photonics (AREA)
- Optical Integrated Circuits (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2021/007509 WO2022180827A1 (en) | 2021-02-26 | 2021-02-26 | Ai prediction system for optical characteristics |
Publications (1)
Publication Number | Publication Date |
---|---|
JPWO2022180827A1 true JPWO2022180827A1 (en) | 2022-09-01 |
Family
ID=83049045
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2023501987A Pending JPWO2022180827A1 (en) | 2021-02-26 | 2021-02-26 |
Country Status (2)
Country | Link |
---|---|
JP (1) | JPWO2022180827A1 (en) |
WO (1) | WO2022180827A1 (en) |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0616475B2 (en) * | 1987-04-03 | 1994-03-02 | 三菱電機株式会社 | Article manufacturing system and article manufacturing method |
JPH10163080A (en) * | 1996-11-27 | 1998-06-19 | Matsushita Electron Corp | Semiconductor manufacturing system |
JP2003232948A (en) * | 2001-12-03 | 2003-08-22 | Furukawa Electric Co Ltd:The | Method of manufacturing optical waveguide, optical waveguide device using the method, and waveguide type optical multiplexer/demultiplexer |
JP2004206016A (en) * | 2002-12-26 | 2004-07-22 | Hitachi Chem Co Ltd | Optical waveguide structure and its manufacturing method |
US20050220984A1 (en) * | 2004-04-02 | 2005-10-06 | Applied Materials Inc., A Delaware Corporation | Method and system for control of processing conditions in plasma processing systems |
US20110296362A1 (en) * | 2009-02-04 | 2011-12-01 | Tamao Ishikawa | Semiconductor defect integrated projection method and defect inspection support apparatus equipped with semiconductor defect integrated projection function |
JP6796048B2 (en) * | 2017-09-25 | 2020-12-02 | 日本電信電話株式会社 | Si photonics optical circuit and its manufacturing method |
CN112640038A (en) * | 2018-09-03 | 2021-04-09 | 首选网络株式会社 | Learning device, estimation device, and learning completion model |
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2021
- 2021-02-26 JP JP2023501987A patent/JPWO2022180827A1/ja active Pending
- 2021-02-26 WO PCT/JP2021/007509 patent/WO2022180827A1/en active Application Filing
Also Published As
Publication number | Publication date |
---|---|
WO2022180827A1 (en) | 2022-09-01 |
Similar Documents
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20230608 |