JPWO2022180827A1 - - Google Patents

Info

Publication number
JPWO2022180827A1
JPWO2022180827A1 JP2023501987A JP2023501987A JPWO2022180827A1 JP WO2022180827 A1 JPWO2022180827 A1 JP WO2022180827A1 JP 2023501987 A JP2023501987 A JP 2023501987A JP 2023501987 A JP2023501987 A JP 2023501987A JP WO2022180827 A1 JPWO2022180827 A1 JP WO2022180827A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2023501987A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2022180827A1 publication Critical patent/JPWO2022180827A1/ja
Pending legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B6/13Integrated optical circuits characterised by the manufacturing method
    • G02B6/132Integrated optical circuits characterised by the manufacturing method by deposition of thin films
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Optics & Photonics (AREA)
  • Optical Integrated Circuits (AREA)
JP2023501987A 2021-02-26 2021-02-26 Pending JPWO2022180827A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2021/007509 WO2022180827A1 (en) 2021-02-26 2021-02-26 Ai prediction system for optical characteristics

Publications (1)

Publication Number Publication Date
JPWO2022180827A1 true JPWO2022180827A1 (en) 2022-09-01

Family

ID=83049045

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023501987A Pending JPWO2022180827A1 (en) 2021-02-26 2021-02-26

Country Status (2)

Country Link
JP (1) JPWO2022180827A1 (en)
WO (1) WO2022180827A1 (en)

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0616475B2 (en) * 1987-04-03 1994-03-02 三菱電機株式会社 Article manufacturing system and article manufacturing method
JPH10163080A (en) * 1996-11-27 1998-06-19 Matsushita Electron Corp Semiconductor manufacturing system
JP2003232948A (en) * 2001-12-03 2003-08-22 Furukawa Electric Co Ltd:The Method of manufacturing optical waveguide, optical waveguide device using the method, and waveguide type optical multiplexer/demultiplexer
JP2004206016A (en) * 2002-12-26 2004-07-22 Hitachi Chem Co Ltd Optical waveguide structure and its manufacturing method
US20050220984A1 (en) * 2004-04-02 2005-10-06 Applied Materials Inc., A Delaware Corporation Method and system for control of processing conditions in plasma processing systems
US20110296362A1 (en) * 2009-02-04 2011-12-01 Tamao Ishikawa Semiconductor defect integrated projection method and defect inspection support apparatus equipped with semiconductor defect integrated projection function
JP6796048B2 (en) * 2017-09-25 2020-12-02 日本電信電話株式会社 Si photonics optical circuit and its manufacturing method
CN112640038A (en) * 2018-09-03 2021-04-09 首选网络株式会社 Learning device, estimation device, and learning completion model

Also Published As

Publication number Publication date
WO2022180827A1 (en) 2022-09-01

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Legal Events

Date Code Title Description
A621 Written request for application examination

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Effective date: 20230608