JPWO2022138468A1 - - Google Patents
Info
- Publication number
- JPWO2022138468A1 JPWO2022138468A1 JP2022571391A JP2022571391A JPWO2022138468A1 JP WO2022138468 A1 JPWO2022138468 A1 JP WO2022138468A1 JP 2022571391 A JP2022571391 A JP 2022571391A JP 2022571391 A JP2022571391 A JP 2022571391A JP WO2022138468 A1 JPWO2022138468 A1 JP WO2022138468A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/02—Physical, chemical or physicochemical properties
- B32B7/023—Optical properties
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/06—Interconnection of layers permitting easy separation
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
- G03F7/11—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having cover layers or intermediate layers, e.g. subbing layers
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Architecture (AREA)
- Structural Engineering (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Materials For Photolithography (AREA)
- Laminated Bodies (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020217656 | 2020-12-25 | ||
| PCT/JP2021/046631 WO2022138468A1 (en) | 2020-12-25 | 2021-12-16 | Transfer material and method for producing laminated body |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPWO2022138468A1 true JPWO2022138468A1 (en) | 2022-06-30 |
Family
ID=82157784
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022571391A Pending JPWO2022138468A1 (en) | 2020-12-25 | 2021-12-16 |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JPWO2022138468A1 (en) |
| CN (1) | CN116710845A (en) |
| TW (1) | TW202229012A (en) |
| WO (1) | WO2022138468A1 (en) |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109154774B (en) * | 2016-05-31 | 2022-05-13 | 富士胶片株式会社 | Photosensitive resin composition, transfer film, decorative pattern, touch panel, and method for producing pattern |
| JP6345855B1 (en) * | 2017-01-17 | 2018-06-20 | 太陽インキ製造株式会社 | Photosensitive film laminate and cured product formed using the same |
| CN113166323A (en) * | 2018-12-04 | 2021-07-23 | 富士胶片株式会社 | Transfer material, method for manufacturing resin pattern, method for manufacturing circuit wiring, and method for manufacturing touch panel |
| CN113348078A (en) * | 2019-01-29 | 2021-09-03 | 富士胶片株式会社 | Photosensitive transfer material, method for producing resin pattern, method for producing circuit wiring, method for producing touch panel, film, and method for producing film |
| JP7262408B2 (en) * | 2020-02-10 | 2023-04-21 | 富士フイルム株式会社 | Method for manufacturing resin pattern, method for manufacturing circuit wiring, method for manufacturing touch panel, and photosensitive transfer member |
-
2021
- 2021-12-16 WO PCT/JP2021/046631 patent/WO2022138468A1/en active Application Filing
- 2021-12-16 CN CN202180086959.XA patent/CN116710845A/en active Pending
- 2021-12-16 JP JP2022571391A patent/JPWO2022138468A1/ja active Pending
- 2021-12-22 TW TW110148256A patent/TW202229012A/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| TW202229012A (en) | 2022-08-01 |
| WO2022138468A1 (en) | 2022-06-30 |
| CN116710845A (en) | 2023-09-05 |