JPWO2022102697A1 - - Google Patents

Info

Publication number: JPWO2022102697A1
Authority: JP; Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Granted

Application number

JP2022529571A

Other languages

Japanese (ja)

Other versions

JP7355241B2 (en

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2020-11-16

Filing date

2021-11-11

Publication date

2022-05-19

2021-11-11 Application filed filed Critical

2022-05-19 Publication of JPWO2022102697A1 publication Critical patent/JPWO2022102697A1/ja

2023-05-29 Priority to JP2023087477A priority Critical patent/JP2023109966A/en

2023-10-03 Application granted granted Critical

2023-10-03 Publication of JP7355241B2 publication Critical patent/JP7355241B2/en

Status Active legal-status Critical Current

2041-11-11 Anticipated expiration legal-status Critical

Links

Classifications

- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/62—Alcohols or phenols
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/62—Alcohols or phenols
- C08G59/621—Phenols
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2227—Oxides; Hydroxides of metals of aluminium

JP2022529571A 2020-11-16 2021-11-11 Resin composition for semiconductor encapsulation and semiconductor device Active JP7355241B2 (en)

Priority Applications (1)

Application Number	Priority Date	Filing Date	Title
JP2023087477A JP2023109966A (en)	2020-11-16	2023-05-29	Resin composition for semiconductor encapsulation and semiconductor device

Applications Claiming Priority (3)

Application Number	Priority Date	Filing Date	Title
JP2020190154		2020-11-16
JP2020190154		2020-11-16
PCT/JP2021/041498 WO2022102697A1 (en)	2020-11-16	2021-11-11	Resin composition for semiconductor encapsulation, and semiconductor device

Related Child Applications (1)

Application Number	Title	Priority Date	Filing Date
JP2023087477A Division JP2023109966A (en)	2020-11-16	2023-05-29	Resin composition for semiconductor encapsulation and semiconductor device

Publications (2)

Publication Number	Publication Date
JPWO2022102697A1 true JPWO2022102697A1 (en)	2022-05-19
JP7355241B2 JP7355241B2 (en)	2023-10-03

Family

ID=81601229

Family Applications (2)

Application Number	Title	Priority Date	Filing Date
JP2022529571A Active JP7355241B2 (en)	2020-11-16	2021-11-11	Resin composition for semiconductor encapsulation and semiconductor device
JP2023087477A Pending JP2023109966A (en)	2020-11-16	2023-05-29	Resin composition for semiconductor encapsulation and semiconductor device

Family Applications After (1)

Application Number	Title	Priority Date	Filing Date
JP2023087477A Pending JP2023109966A (en)	2020-11-16	2023-05-29	Resin composition for semiconductor encapsulation and semiconductor device

Country Status (5)

Country	Link
JP (2)	JP7355241B2 (en)
KR (1)	KR20230107646A (en)
CN (1)	CN116457387A (en)
TW (1)	TW202225244A (en)
WO (1)	WO2022102697A1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
CN117511426B (en) *	2024-01-05	2024-04-12	深圳市长松科技有限公司	Film for packaging and blocking water vapor, semiconductor film packaging method and structure

Citations (6)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPH09286613A (en) *	1996-04-19	1997-11-04	Nippon Steel Chem Co Ltd	Production of high purity alumina and mullite for electronic material
JPH1192136A (en) *	1997-09-18	1999-04-06	Adomatekkusu:Kk	Production of low alpha-dose alumina powder and low alpha-dose alumina powder
JP2003137627A (en) *	2001-11-05	2003-05-14	Denki Kagaku Kogyo Kk	Highly thermally conductive inorganic powder, resin composition and surface treatment agent composition
JP2014005359A (en) *	2012-06-25	2014-01-16	Sumitomo Bakelite Co Ltd	Epoxy resin composition and electronic component device
JP2014197649A (en) *	2013-03-29	2014-10-16	株式会社アドマテックス	Three-dimensional mount type semiconductor device, resin composition and method for manufacturing the same
JP2015093790A (en) *	2013-11-11	2015-05-18	住友ベークライト株式会社	Method for manufacturing organic compound modification inorganic filler and organic compound modification inorganic filler

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JP4631296B2 (en)	2004-03-05	2011-02-16	住友ベークライト株式会社	Epoxy resin composition and semiconductor device

2021
- 2021-11-11 CN CN202180077136.0A patent/CN116457387A/en active Pending
- 2021-11-11 WO PCT/JP2021/041498 patent/WO2022102697A1/en active Application Filing
- 2021-11-11 KR KR1020237019844A patent/KR20230107646A/en unknown
- 2021-11-11 JP JP2022529571A patent/JP7355241B2/en active Active
- 2021-11-16 TW TW110142571A patent/TW202225244A/en unknown
2023
- 2023-05-29 JP JP2023087477A patent/JP2023109966A/en active Pending

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPH09286613A (en) *	1996-04-19	1997-11-04	Nippon Steel Chem Co Ltd	Production of high purity alumina and mullite for electronic material
JPH1192136A (en) *	1997-09-18	1999-04-06	Adomatekkusu:Kk	Production of low alpha-dose alumina powder and low alpha-dose alumina powder
JP2003137627A (en) *	2001-11-05	2003-05-14	Denki Kagaku Kogyo Kk	Highly thermally conductive inorganic powder, resin composition and surface treatment agent composition
JP2014005359A (en) *	2012-06-25	2014-01-16	Sumitomo Bakelite Co Ltd	Epoxy resin composition and electronic component device
JP2014197649A (en) *	2013-03-29	2014-10-16	株式会社アドマテックス	Three-dimensional mount type semiconductor device, resin composition and method for manufacturing the same
JP2015093790A (en) *	2013-11-11	2015-05-18	住友ベークライト株式会社	Method for manufacturing organic compound modification inorganic filler and organic compound modification inorganic filler

Also Published As

Publication number	Publication date
TW202225244A (en)	2022-07-01
JP2023109966A (en)	2023-08-08
JP7355241B2 (en)	2023-10-03
CN116457387A (en)	2023-07-18
KR20230107646A (en)	2023-07-17
WO2022102697A1 (en)	2022-05-19

Legal Events

Date	Code	Title	Description
2022-05-20	A621	Written request for application examination	Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20220520
2022-05-20	A871	Explanation of circumstances concerning accelerated examination	Free format text: JAPANESE INTERMEDIATE CODE: A871 Effective date: 20220520
2022-07-12	A131	Notification of reasons for refusal	Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20220712
2022-09-12	A521	Request for written amendment filed	Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20220912
2022-11-08	A131	Notification of reasons for refusal	Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20221108
2023-01-10	A521	Request for written amendment filed	Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20230110
2023-02-28	A02	Decision of refusal	Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20230228
2023-05-29	A521	Request for written amendment filed	Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20230529
2023-06-06	A911	Transfer to examiner for re-examination before appeal (zenchi)	Free format text: JAPANESE INTERMEDIATE CODE: A911 Effective date: 20230605
2023-08-17	TRDD	Decision of grant or rejection written
2023-08-22	A01	Written decision to grant a patent or to grant a registration (utility model)	Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20230822
2023-09-25	A61	First payment of annual fees (during grant procedure)	Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20230904
2023-09-25	R151	Written notification of patent or utility model registration	Ref document number: 7355241 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R151

Publication	Publication Date	Title
BR112023005462A2 (en)	2023-05-30
BR112021014123A2 (en)	2021-12-07
BR112023012656A2 (en)	2023-10-03
JPWO2022102697A1 (en)	2022-05-19
BR102021018859A2 (en)	2021-11-30
BR102021015500A2 (en)	2021-11-09
BR112022009896A2 (en)	2023-06-27
BR102021007058A2 (en)	2021-11-23
BR102020022030A2 (en)	2021-10-05
BR112023011738A2 (en)	2023-07-04
BR112023016292A2 (en)	2023-09-05
BR112023004146A2 (en)	2023-06-27
BR112023011610A2 (en)	2023-07-04
BR112023011539A2 (en)	2023-07-04
BR112023008976A2 (en)	2023-06-27
BR112023009656A2 (en)	2023-07-11
BR112023006729A2 (en)	2023-05-16
BR102021020147A2 (en)	2021-12-28
BR102021018926A2 (en)	2021-11-30
BR102021018167A2 (en)	2021-09-13
BR102021017576A2 (en)	2021-11-30
BR102021016837A2 (en)	2021-11-09
BR102021016551A2 (en)	2021-11-09
BR102021016375A2 (en)	2021-11-30
BR102021016200A2 (en)	2021-12-28