JPWO2022080403A1 - - Google Patents
Info
- Publication number
- JPWO2022080403A1 JPWO2022080403A1 JP2022557036A JP2022557036A JPWO2022080403A1 JP WO2022080403 A1 JPWO2022080403 A1 JP WO2022080403A1 JP 2022557036 A JP2022557036 A JP 2022557036A JP 2022557036 A JP2022557036 A JP 2022557036A JP WO2022080403 A1 JPWO2022080403 A1 JP WO2022080403A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
- C08F290/02—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
- C08F290/06—Polymers provided for in subclass C08G
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/10—Esters; Ether-esters
- C08K5/101—Esters; Ether-esters of monocarboxylic acids
- C08K5/103—Esters; Ether-esters of monocarboxylic acids with polyalcohols
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/16—Nitrogen-containing compounds
- C08K5/34—Heterocyclic compounds having nitrogen in the ring
- C08K5/3467—Heterocyclic compounds having nitrogen in the ring having more than two nitrogen atoms in the ring
- C08K5/3477—Six-membered rings
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
- C08L71/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
- C08L71/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
- C08L71/12—Polyphenylene oxides
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020174699 | 2020-10-16 | ||
| PCT/JP2021/037857 WO2022080403A1 (en) | 2020-10-16 | 2021-10-13 | Heat curable composition and uses therefor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPWO2022080403A1 true JPWO2022080403A1 (en) | 2022-04-21 |
Family
ID=81209149
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022557036A Pending JPWO2022080403A1 (en) | 2020-10-16 | 2021-10-13 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JPWO2022080403A1 (en) |
| TW (1) | TW202227555A (en) |
| WO (1) | WO2022080403A1 (en) |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7226980B2 (en) * | 2003-08-07 | 2007-06-05 | General Electric Company | Thermoset composition, method for the preparation thereof, and articles prepared therefrom |
| JP4410540B2 (en) * | 2003-11-28 | 2010-02-03 | 大阪瓦斯株式会社 | Fluorene skeleton-containing resin composition and molded article thereof |
| JP6334236B2 (en) * | 2013-04-10 | 2018-05-30 | 大阪瓦斯株式会社 | Strength improver |
| CN106893092B (en) * | 2015-12-18 | 2019-02-01 | 台光电子材料(昆山)有限公司 | The polyphenylene oxide of phenol containing fluorenes |
| CN107163244B (en) * | 2016-03-07 | 2019-07-09 | 江苏和成新材料有限公司 | Copper-clad plate polyphenylene oxide resin |
| CN106633035B (en) * | 2016-12-17 | 2018-08-17 | 衢州普信新材料有限公司 | A kind of preparation method of the polyether compound as polyamide auxiliary agent |
| JP7165865B2 (en) * | 2019-02-21 | 2022-11-07 | パナソニックＩｐマネジメント株式会社 | Sealing material, laminated sheet, cured product, semiconductor device, and method for manufacturing semiconductor device |
| JP2021031530A (en) * | 2019-08-20 | 2021-03-01 | 信越化学工業株式会社 | Thermosetting resin composition, and adhesive, film, prepreg, laminate, circuit board and printed wiring board using the same |
| WO2021153315A1 (en) * | 2020-01-31 | 2021-08-05 | 京セラ株式会社 | Resin composition, prepreg, metal-clad laminate, and wiring board |
| JP7286569B2 (en) * | 2020-02-17 | 2023-06-05 | 信越化学工業株式会社 | Thermosetting resin composition, thermosetting adhesive, thermosetting resin film, and laminate, prepreg, and circuit board using the thermosetting resin composition |
| CN115135715A (en) * | 2020-02-18 | 2022-09-30 | 松下知识产权经营株式会社 | Thermosetting resin composition, resin sheet, metal foil with resin, metal-clad laminate, and printed wiring board |
-
2021
- 2021-10-13 JP JP2022557036A patent/JPWO2022080403A1/ja active Pending
- 2021-10-13 WO PCT/JP2021/037857 patent/WO2022080403A1/en active Application Filing
- 2021-10-15 TW TW110138390A patent/TW202227555A/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| WO2022080403A1 (en) | 2022-04-21 |
| TW202227555A (en) | 2022-07-16 |