JPWO2022039121A1 - - Google Patents
Info
- Publication number
- JPWO2022039121A1 JPWO2022039121A1 JP2022543934A JP2022543934A JPWO2022039121A1 JP WO2022039121 A1 JPWO2022039121 A1 JP WO2022039121A1 JP 2022543934 A JP2022543934 A JP 2022543934A JP 2022543934 A JP2022543934 A JP 2022543934A JP WO2022039121 A1 JPWO2022039121 A1 JP WO2022039121A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F2/00—Processes of polymerisation
- C08F2/44—Polymerisation in the presence of compounding ingredients, e.g. plasticisers, dyestuffs, fillers
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D163/00—Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D4/00—Coating compositions, e.g. paints, varnishes or lacquers, based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; Coating compositions, based on monomers of macromolecular compounds of groups C09D183/00 - C09D183/16
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Wood Science & Technology (AREA)
- Epoxy Resins (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2020137443 | 2020-08-17 | ||
PCT/JP2021/029877 WO2022039121A2 (ja) | 2020-08-17 | 2021-08-16 | 熱硬化性樹脂組成物 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPWO2022039121A1 true JPWO2022039121A1 (ja) | 2022-02-24 |
Family
ID=80322822
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2022543934A Pending JPWO2022039121A1 (ja) | 2020-08-17 | 2021-08-16 |
Country Status (2)
Country | Link |
---|---|
JP (1) | JPWO2022039121A1 (ja) |
WO (1) | WO2022039121A2 (ja) |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5730719A (en) * | 1980-08-01 | 1982-02-19 | Mitsubishi Petrochem Co Ltd | Preparation of cured novolak type epoxy resin |
JPS5930818A (ja) * | 1982-06-14 | 1984-02-18 | シエル・インタ−ナシヨネイル・リサ−チ・マ−チヤツピイ・ベ−・ウイ | 熱硬化性エポキシ組成物および成形品を製造するに際してのそれの使用 |
JPS60155279A (ja) * | 1983-12-12 | 1985-08-15 | Somar Corp | 粉体塗料用樹脂組成物 |
JPS6112718A (ja) * | 1984-06-29 | 1986-01-21 | Mitsubishi Electric Corp | エポキシ含浸樹脂組成物 |
JPH0676473B2 (ja) * | 1986-05-12 | 1994-09-28 | 鐘淵化学工業株式会社 | 反応射出成形用熱硬化性樹脂組成物 |
JPH0739462B2 (ja) * | 1987-01-07 | 1995-05-01 | 広栄化学工業株式会社 | 硬化性樹脂組成物 |
JP4525079B2 (ja) * | 2004-01-13 | 2010-08-18 | 住友ベークライト株式会社 | 熱硬化性液状封止樹脂組成物及びそれを用いた半導体装置 |
JP2012116979A (ja) * | 2010-12-02 | 2012-06-21 | Hitachi Chemical Co Ltd | エポキシ樹脂組成物、半導体封止充てん用樹脂組成物及び半導体装置 |
CN103429658B (zh) * | 2011-03-03 | 2016-01-06 | 三菱丽阳株式会社 | 基体树脂组合物、预浸料及其制造方法、以及纤维强化复合材料 |
JP5738261B2 (ja) * | 2012-05-16 | 2015-06-17 | 株式会社日立産機システム | エポキシ‐ビニル共重合型液状樹脂組成物、その硬化物、製造方法及び硬化物を用いた絶縁材料、電子・電気機器 |
JP5340505B1 (ja) * | 2012-06-07 | 2013-11-13 | 積水化学工業株式会社 | 液晶滴下工法用シール剤、上下導通材料、及び、液晶表示素子 |
JP6451106B2 (ja) * | 2014-07-07 | 2019-01-16 | 三菱ケミカル株式会社 | 圧力容器の製造方法 |
US11155730B2 (en) * | 2015-10-08 | 2021-10-26 | Mitsubishi Electric Corporation | Solvent-free varnish composition, insulated coil, process for producing same, rotating machine, and closed electric compressor |
JP7075351B2 (ja) * | 2016-12-27 | 2022-05-25 | 日鉄ケミカル&マテリアル株式会社 | 硬化性エポキシ樹脂組成物、それを用いた繊維強化複合材料及び成形体 |
JP7238259B2 (ja) * | 2018-03-16 | 2023-03-14 | 三菱ケミカル株式会社 | プリプレグ |
JP6911806B2 (ja) * | 2018-03-29 | 2021-07-28 | 味の素株式会社 | 樹脂組成物、シート状積層材料、プリント配線板及び半導体装置 |
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2021
- 2021-08-16 WO PCT/JP2021/029877 patent/WO2022039121A2/ja active Application Filing
- 2021-08-16 JP JP2022543934A patent/JPWO2022039121A1/ja active Pending
Also Published As
Publication number | Publication date |
---|---|
WO2022039121A3 (ja) | 2022-04-21 |
WO2022039121A2 (ja) | 2022-02-24 |